JP5826503B2 - Led電球 - Google Patents
Led電球 Download PDFInfo
- Publication number
- JP5826503B2 JP5826503B2 JP2011047043A JP2011047043A JP5826503B2 JP 5826503 B2 JP5826503 B2 JP 5826503B2 JP 2011047043 A JP2011047043 A JP 2011047043A JP 2011047043 A JP2011047043 A JP 2011047043A JP 5826503 B2 JP5826503 B2 JP 5826503B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- led
- sealing member
- light source
- led chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
- F21V3/062—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being plastics
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/10—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
- F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
Description
(a)LEDパッケージ6の封止部材19を光源基板5のチップ実装面5aから盛り上がるように成形したので、LEDチップ18の発光をパッケージ6の外周を含む広角に放射し、図1に矢印で示すように、LED電球1の側方領域を明るく照明できる。
(b)特に、封止部材19を半球ドーム形に成形し、その側面投影面積を正面投影面積の50%に設定したので、図6に示すように、放射角度90°地点におけるLED電球1の相対照度を0.4とすることができ、既存の白熱電球とほぼ同等の配光パターンが得られる。
(d)特に、上記波長域の蛍光体24,25は、黄色発光の第2蛍光体25が第1蛍光体24の青色光をほとんど吸収しないため、封止部材19を盛り上がり形状とした場合でも、多重励起(カスケード励起)による発光色の変動を抑制できるという利点もある。
(e)透光カバー4は、内面に光拡散層8が設けられているので、LEDパッケージ6の発光を効率よく透過して、LED電球1の周囲へ均一に拡散できる。
(1)図7に示すように、光源基板5上に複数のLEDパッケージ31を環状に配列し、灯具ボディ2の外周部から均等量の可視光を照射できるように構成すること。
(2)図8に示すように、LEDパッケージ32の封止部材を立方体または角柱形に成形すること。
(3)その他、封止支部材を円柱形、円錐形、円錐台形、角錐形、多面体など、各種の盛り上がり形状で成形すること。
2 灯具ボディ
3 口金
4 透光カバー
5 光源基板
5a チップ実装面
6,31,32 LEDパッケージ
8 光拡散層
11 放熱部
14 電源回路
18 LEDチップ
19 封止部材
24,25 蛍光体
Claims (4)
- 灯具ボディの一端に口金を備え、口金と反対側の灯具ボディに透光カバーを設け、透光カバーの内側に光源基板を設置し、光源基板上にLEDパッケージを装着し、LEDパッケージがLEDチップと、LEDチップを封止し、且つLEDチップの発光を白色可視光に変換する蛍光体を含有する光透過性の封止部材とを備え、LEDチップが前記光源基板に実装され、該光源基板が灯具ボディの端面部に接する状態で取り付けられ、封止部材が光源基板のチップ実装面から盛り上がるように成形され、前記チップ実装面の延長方向からみた封止部材の投影面積がチップ実装面と対向する方向からみた封止部材の投影面積の30%〜125%であり、前記LEDパッケージがLEDチップの発光を封止部材の表面全体から該パッケージの外周域を含む広角に放射し、放射角度0°地点の照度を1としたとき、放射角度70°地点の相対照度が0.5〜1であることを特徴とするLED電球。
- 前記LEDチップが紫外または近紫外可視光を発生し、前記封止部材が光透過性材料中にLEDチップの発光を白色可視光に波長変換する複数種の蛍光体を含む請求項1記載のLED電球。
- 前記光源基板上に複数のLEDパッケージを環状に配列した請求項1または2記載のLED電球。
- 前記透光カバーの内面に光拡散層を設けた請求項1〜3の何れか一項に記載のLED電球。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011047043A JP5826503B2 (ja) | 2011-03-04 | 2011-03-04 | Led電球 |
US13/410,713 US8657455B2 (en) | 2011-03-04 | 2012-03-02 | LED lamp |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011047043A JP5826503B2 (ja) | 2011-03-04 | 2011-03-04 | Led電球 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012185946A JP2012185946A (ja) | 2012-09-27 |
JP5826503B2 true JP5826503B2 (ja) | 2015-12-02 |
Family
ID=46753182
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011047043A Expired - Fee Related JP5826503B2 (ja) | 2011-03-04 | 2011-03-04 | Led電球 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8657455B2 (ja) |
JP (1) | JP5826503B2 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101344513B1 (ko) * | 2012-02-07 | 2013-12-23 | 엘이디라이텍(주) | 엘이디 램프 조립체 |
JP2014060070A (ja) * | 2012-09-18 | 2014-04-03 | Toshiba Lighting & Technology Corp | 照明装置 |
US9570661B2 (en) | 2013-01-10 | 2017-02-14 | Cree, Inc. | Protective coating for LED lamp |
US9657922B2 (en) * | 2013-03-15 | 2017-05-23 | Cree, Inc. | Electrically insulative coatings for LED lamp and elements |
TW201517316A (zh) * | 2013-10-22 | 2015-05-01 | Lextar Electronics Corp | 發光二極體封裝結構以及發光二極體封裝模組 |
CN103672811A (zh) * | 2013-12-05 | 2014-03-26 | 长兴恒动光电有限公司 | 球泡形led灯散热器 |
CN103791286B (zh) * | 2014-02-21 | 2017-03-29 | 中山星耀照明有限公司 | 线状led光源和线状led灯 |
US10642087B2 (en) | 2014-05-23 | 2020-05-05 | Eyesafe, Llc | Light emission reducing compounds for electronic devices |
CN105135239A (zh) * | 2015-08-07 | 2015-12-09 | 苏州晶雷光电照明科技有限公司 | 一种具有弧形散热片的led灯 |
US11810532B2 (en) | 2018-11-28 | 2023-11-07 | Eyesafe Inc. | Systems for monitoring and regulating harmful blue light exposure from digital devices |
US11592701B2 (en) | 2018-11-28 | 2023-02-28 | Eyesafe Inc. | Backlight unit with emission modification |
US10971660B2 (en) * | 2019-08-09 | 2021-04-06 | Eyesafe Inc. | White LED light source and method of making same |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3065258B2 (ja) | 1996-09-30 | 2000-07-17 | 日亜化学工業株式会社 | 発光装置及びそれを用いた表示装置 |
JP4135485B2 (ja) * | 2002-12-06 | 2008-08-20 | 東芝ライテック株式会社 | 発光ダイオード光源及び発光ダイオード照明器具 |
JP2005108700A (ja) * | 2003-09-30 | 2005-04-21 | Toshiba Lighting & Technology Corp | 光源 |
KR100724591B1 (ko) * | 2005-09-30 | 2007-06-04 | 서울반도체 주식회사 | 발광 소자 및 이를 포함한 led 백라이트 |
JP2007165811A (ja) * | 2005-12-16 | 2007-06-28 | Nichia Chem Ind Ltd | 発光装置 |
US7976182B2 (en) * | 2007-03-21 | 2011-07-12 | International Rectifier Corporation | LED lamp assembly with temperature control and method of making the same |
JP5218751B2 (ja) | 2008-07-30 | 2013-06-26 | 東芝ライテック株式会社 | 電球型ランプ |
JP2010103241A (ja) * | 2008-10-22 | 2010-05-06 | Panasonic Corp | ランプ |
DE202009018419U1 (de) * | 2009-03-09 | 2011-08-17 | Tridonic Jennersdorf Gmbh | LED-Modul mit verbesserter Lichtleistung |
JP2010278246A (ja) * | 2009-05-28 | 2010-12-09 | Toshiba Lighting & Technology Corp | 発光モジュール及びその製造方法 |
JP2010282838A (ja) * | 2009-06-04 | 2010-12-16 | Sharp Corp | 照明装置 |
US20110157896A1 (en) * | 2009-12-31 | 2011-06-30 | Chih-Ming Yu | Color led lamp |
US8058782B2 (en) * | 2010-03-10 | 2011-11-15 | Chicony Power Technology Co., Ltd. | Bulb-type LED lamp |
-
2011
- 2011-03-04 JP JP2011047043A patent/JP5826503B2/ja not_active Expired - Fee Related
-
2012
- 2012-03-02 US US13/410,713 patent/US8657455B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20120224352A1 (en) | 2012-09-06 |
JP2012185946A (ja) | 2012-09-27 |
US8657455B2 (en) | 2014-02-25 |
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