JP2009033026A - 超音波振動を用いて実装部品を被実装部品に実装する実装装置 - Google Patents
超音波振動を用いて実装部品を被実装部品に実装する実装装置 Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/06—Soldering, e.g. brazing, or unsoldering making use of vibrations, e.g. supersonic vibrations
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- H—ELECTRICITY
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/75252—Means for applying energy, e.g. heating means in the upper part of the bonding apparatus, e.g. in the bonding head
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- H—ELECTRICITY
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- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75743—Suction holding means
- H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53183—Multilead component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53187—Multiple station assembly apparatus
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53252—Means to simultaneously fasten three or more parts
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53265—Means to assemble electrical device with work-holder for assembly
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- Wire Bonding (AREA)
Abstract
【解決手段】実装部品を保持する実装部品保持手段と、被実装部品を保持する被実装部品保持手段と、前記実装部品と前記被実装部品とが接触するように、少なくとも一方を他方に向けて移動させる移動手段と、前記実装部品と前記被実装部品との接触部に超音波振動を付与する振動発生手段と、前記実装部品と前記被実装部品との間に付勢力を付与する押圧手段と、前記実装部品保持手段に保持された前記実装部品の近傍である前記実装部品保持手段の部分を、非接触に取り囲むように移動可能に配置され前記実装部品保持手段を加熱する加熱手段と、前記加熱手段を前記実装部品保持手段に連動させる連動手段と、を備える。
【選択図】なし
Description
次に、加熱された電子部品809を保持する保持手段808をボンディングステージ803に近づけ、電子部品809の金電極809aと回路基板804の電極804aとが接触し押圧された状態で、振動子811からの超音波振動を金電極809aと電極804aとの間へ付与し、両者の接合を行い実装が完了する(図5(b))(特許文献1参照)。
発明者等は、鋭意研究の結果、加熱手段を実装部品保持手段に装着する実装装置では、加熱手段と実装部品保持手段との材質の違いに起因して、実装部品保持手段の振動特性が変化し、実装部品と被実装部品との間に所定の超音波振動を与えることが困難であるという知見を得ている。よって、振動特性の変化を受けない実装部品保持手段を備える実装装置が求められている。
さらに、レーザ装置を適用すると、実装装置の構造が複雑になったり、電子部品を搬送するために移動する保持手段にレーザ光を照射することは困難である。結果として、超音波接合に適した温度に電子部品を維持することが難しく、電子部品と回路基板の間の良好な接合ができない恐れがある。
図3は、第2の実施形態の実装装置の要部拡大部分断面図である。
第2の実施形態の実装装置は、ヒータ部109と、振動子107との間に、ヒータ部109から振動子107への熱を遮断するための熱遮蔽手段を備える。なお、熱遮蔽部材以外の構成要素は、図1、図2に示す第1の実施形態に係る実装装置と同じであるので詳細は割愛する。
第3の実施形態は、第1の実施形態の実装装置に、熱遮蔽手段であるエア供給部を設ける構成である。図4は、第3の実施形態に係る実装装置の要部拡大部分断面図である。熱遮蔽手段を構成するエア供給チューブ165は、図中において振動子107の上方に配置され、ヒータ支持部115に設けられたチューブ固定部163に固定されている。すなわち、エア供給チューブ165からのエアは、振動子107の上方から下方へのエアフローを形成する。この構成により、振動子107の冷却、すなわち、ヒータ部109から振動子107へ熱が伝わることを防止できる。
なお、第2の実施形態と第3の実施形態とを組み合わせた実装装置とすることができることは言うまでもない。
103 吸着ノズル
107 振動子
109 ヒータ部
111 回路基板
119 押圧部
123 ヒータ支持部
129 ストッパ
153 架橋部
183 保持部
Claims (8)
- 超音波振動を用いて実装部品を被実装部品に実装する実装装置であって、
前記実装部品を保持する実装部品保持手段と、
前記被実装部品を保持する被実装部品保持手段と、
前記実装部品と前記被実装部品とが接触するように、前記実装部品保持手段と前記被実装部品保持手段との少なくとも一方を他方に向けて移動させる移動手段と、
前記実装部品保持手段に保持された前記実装部品と前記被実装部品保持手段に保持された前記被実装部品との接触部に超音波振動を付与する振動発生手段と、
前記実装部品と前記被実装部品との間に付勢力を付与する押圧手段と、
前記実装部品保持手段に保持された前記実装部品の近傍である前記実装部品保持手段の部分を、非接触に取り囲むように移動可能に配置され前記実装部品保持手段を加熱する加熱手段と、
前記加熱手段を前記実装部品保持手段に連動させる連動手段と、を備える実装装置。 - 前記加熱手段と前記被実装部品を保持する前記被実装部品保持手段とが所定距離よりも互いに近接しないように前記加熱手段の連動を解除する連動解除手段を備える請求項1に記載の実装装置。
- 前記実装部材保持手段は吸引力により前記実装部品を保持する吸着ノズルであり、前記加熱手段は前記吸着ノズルの外周面を取り囲むようなドーナツ形状のヒータ部材である請求項1又は請求項2に記載の実装装置。
- 前記連動解除手段は、前記加熱手段を係止する規制部材である請求項1乃至請求項3のいずれかに記載の実装装置。
- さらに、前記加熱手段から前記振動発生手段への熱を遮蔽する熱遮蔽手段を備える請求項1乃至請求項4のいずれかに記載の実装装置。
- 前記熱遮蔽手段は、前記加熱手段と前記振動発生手段との間に延在する板状部材である請求項5に記載の実装装置。
- 前記熱遮蔽手段は、前記振動発生手段に対してエアを供給するエア供給部である請求項5に記載の実装装置。
- 前記熱遮蔽手段は、前記加熱手段と前記振動発生手段との間にエアフローを形成するエア供給部である請求項5に記載の実装装置。
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JP2007197423A JP4399869B2 (ja) | 2007-07-30 | 2007-07-30 | 超音波振動を用いて実装部品を被実装部品に実装する実装装置 |
US12/175,770 US7814645B2 (en) | 2007-07-30 | 2008-07-18 | Mounting apparatus mounting surface-mounted device on receiving device using ultrasonic vibration |
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JP2007197423A JP4399869B2 (ja) | 2007-07-30 | 2007-07-30 | 超音波振動を用いて実装部品を被実装部品に実装する実装装置 |
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JP2009210212A Division JP5095695B2 (ja) | 2009-09-11 | 2009-09-11 | 超音波振動を用いて実装部品を被実装部品に実装する実装装置 |
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KR101135335B1 (ko) * | 2009-03-02 | 2012-04-17 | 파나소닉 주식회사 | 본딩 툴, 전자부품 장착장치 및 전자부품 장착방법 |
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JP5313751B2 (ja) * | 2008-05-07 | 2013-10-09 | パナソニック株式会社 | 電子部品装着装置 |
JP2011151179A (ja) * | 2010-01-21 | 2011-08-04 | Shibuya Kogyo Co Ltd | ボンディング装置 |
DE102012207121B4 (de) | 2012-04-27 | 2018-09-06 | Hahn-Schickard-Gesellschaft für angewandte Forschung e.V. | Vorrichtung zum Ultraschallbonden |
US9776270B2 (en) * | 2013-10-01 | 2017-10-03 | Globalfoundries Inc. | Chip joining by induction heating |
CN109076729B (zh) | 2016-05-27 | 2021-06-15 | 环球仪器公司 | 具有喷嘴加热器设备的分配头、系统和方法 |
US20190103347A1 (en) * | 2017-09-29 | 2019-04-04 | Georg Seidemann | Electronic component alignment device and method |
WO2020112635A1 (en) | 2018-11-28 | 2020-06-04 | Kulicke And Soffa Industries, Inc. | Ultrasonic welding systems and methods of using the same |
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US4790067A (en) * | 1987-06-05 | 1988-12-13 | Teradyne, Inc. | Connecting coaxial cable to connector |
JP3368494B2 (ja) | 1998-07-22 | 2003-01-20 | 澁谷工業株式会社 | ボンディング装置 |
JP3747849B2 (ja) | 2001-12-25 | 2006-02-22 | 松下電器産業株式会社 | 電子部品のボンディング装置およびボンディング方法 |
JP4093781B2 (ja) | 2002-03-27 | 2008-06-04 | 松下電器産業株式会社 | 超音波ヘッド |
TWI230102B (en) * | 2002-03-27 | 2005-04-01 | Matsushita Electric Ind Co Ltd | Component mounting method, component mounting apparatus, and ultrasonic bonding head |
JP2004087610A (ja) | 2002-08-23 | 2004-03-18 | Toshiba Corp | 半導体装置の製造方法及びこれに用いられるマウント装置 |
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KR101135335B1 (ko) * | 2009-03-02 | 2012-04-17 | 파나소닉 주식회사 | 본딩 툴, 전자부품 장착장치 및 전자부품 장착방법 |
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US20090031558A1 (en) | 2009-02-05 |
JP4399869B2 (ja) | 2010-01-20 |
US7814645B2 (en) | 2010-10-19 |
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