JP2009027477A - Piezoelectric oscillator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a compact piezoelectric oscillator, and further to provide a piezoelectric oscillator having a temperature compensation function excellent in followup ability. <P>SOLUTION: This piezoelectric oscillator is composed at least of: a piezoelectric vibrating chip 35 in which an exciting electrode 46 is formed; a package bottom part 31 for housing the piezoelectric vibrating chip 35 therein; and a cover body 39 bonded with the package bottom part 31 for air-tightly sealing the piezoelectric vibrating chip 35. Wherein, the package bottom part 31 and the cover body 39 are constituted of semiconductor substrates, circuit patterns 32, 40 are formed on surfaces of the package bottom part 31 and the cover body 39 by a semiconductor integrated circuit process and further, a temperature detection section 43 is disposed at a position closest to the exciting electrode 46 in the piezoelectric vibrating chip 35. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a piezoelectric oscillator having a piezoelectric vibrating piece therein, and more particularly to a package whose semiconductor is made of a semiconductor.

  Many of the recent electronic devices have a microcontroller or the like in the control unit, and the piezoelectric vibrator and the piezoelectric oscillator are indispensable electronic components for generating the reference clock. Among these, the piezoelectric oscillator is provided as a single package by integrating the piezoelectric resonator element and the oscillation circuit. For the user, frequency adjustment and oscillation stability, which are generally considered difficult, are provided. Is ensured by the manufacturer in advance, so that the user can avoid the difficulty. Furthermore, in applications such as cellular phones, which are now the major customers of piezoelectric oscillators, high-accuracy frequency stability is required over a wide temperature range. In general, a temperature compensated piezoelectric oscillator having a temperature compensation function is used.

  Since cellular phones require high-density mounting of electronic circuit boards for miniaturization and high functionality, the piezoelectric oscillators used for them are required to be constantly miniaturized. However, a piezoelectric oscillator generally has a structure in which a piezoelectric vibrating piece and a semiconductor integrated circuit constituting an oscillation circuit are housed in a ceramic package or the like and hermetically sealed with a lid made of metal or glass. Due to the limitations of miniaturization of integrated circuits and the need to ensure the strength of the package that houses them, miniaturization is reaching the limit.

  4A and 4B are explanatory views of a piezoelectric oscillator having a general configuration according to the prior art. FIG. 4A is a top view and FIG. 4B is a cross-sectional view taken along line AA in FIG. The elements that determine the outer shape bottom area of the piezoelectric oscillator 10 in FIG. 4 are the bottom area of the semiconductor integrated circuit 12 incorporating the oscillation circuit, the package bottom 13 that requires a size to maintain sufficient mechanical strength, and the package bottom. Reference numeral 13 denotes a work space required when the piezoelectric vibrating reed 11 and the semiconductor integrated circuit 12 are mounted. Although these elements make the utmost efforts for miniaturization, there are limitations in terms of constraints from manufacturing equipment and ensuring the mechanical strength of the package. In the case of a high-performance piezoelectric oscillator having a temperature compensation function and a voltage control function, since these functions are built in the semiconductor integrated circuit 12, the scale of the oscillation circuit increases and the area of the semiconductor integrated circuit 12 increases. This is dominant in determining the outer bottom area of the piezoelectric oscillator 10.

  As a conventional technique for solving the above-mentioned limitation of miniaturization, there is a piezoelectric oscillator disclosed in Patent Document 1. FIG. 5 is an explanatory view of an embodiment of the piezoelectric oscillator 20 disclosed in Patent Document 1, wherein (1) is a top view and (2) is a cross-sectional view taken along line AA of (1). As a means for achieving miniaturization, a cavity 27 is formed in which a circuit pattern 22 of an integrated circuit element 26 is formed on one side of a flat plate 21 made of an electrically insulating material, and a piezoelectric vibrating piece 25 is mounted on the other side of the flat plate 21. The piezoelectric vibrating piece 25 is mounted in the cavity 27. An external connection electrode pad 23 is connected to the circuit pattern 22, and the surface of the circuit pattern 22 excluding the electrode pad 23 is protected by a polyimide coating 24. A lid 28 is sealed on the upper surface of the flat plate 21 via an adhesive 29 to constitute a piezoelectric oscillator. However, even with the technique according to Patent Document 1, the area required for the integrated circuit is dominant in determining the outer bottom area, and in the case of the piezoelectric oscillator having the temperature compensation function and the voltage control function described above, the integrated circuit Since the circuit pattern 22 of the element 26 is large and the area increases, there is still a limit to downsizing.

In addition, a piezoelectric oscillator having a temperature compensation function requires a temperature detection unit. However, since the temperature compensation function is a function for compensating for a change in the oscillation frequency of the piezoelectric vibration piece due to a temperature change, the temperature detection unit has a piezoelectric vibration piece. It is desirable to place it closest to. However, in the piezoelectric oscillator according to the prior art disclosed in Patent Document 1, the temperature detection unit can be installed in the circuit pattern unit of the integrated circuit element, which is the opposite surface of the piezoelectric vibrating piece across the bottom surface of the package. End up. In such a configuration, when there is a change in ambient temperature, the temperature change detected by the temperature detection unit cannot sufficiently follow the temperature change of the piezoelectric vibrating piece, and accurate temperature compensation cannot be performed. Further, in the general piezoelectric oscillator 10 shown in FIG. 1, the temperature detector provided in the semiconductor integrated circuit 12 has a problem in circuit arrangement restriction, and can be installed at the optimum position, that is, closest to the piezoelectric vibrating piece. Not necessarily.
JP 2004-214787 A

  In view of the above-described problems in the prior art, an object of the present invention is to provide a small piezoelectric oscillator and a piezoelectric oscillator having a temperature compensation function with excellent followability.

  In order to achieve the above object, a piezoelectric oscillator according to the present invention includes at least a piezoelectric vibrating piece on which an excitation electrode is formed, a package bottom that accommodates the piezoelectric vibrating piece, and a package bottom that is joined to the piezoelectric vibrating piece. A piezoelectric oscillator comprising a hermetically sealed lid, wherein the package bottom and lid are formed of a semiconductor substrate, and a circuit pattern is formed on a surface of the package bottom and lid by a semiconductor integrated circuit process. It is characterized by being.

  Furthermore, in the piezoelectric oscillator according to the present invention, the circuit pattern includes a temperature detection unit, and the temperature detection unit is formed on the bottom of the package or the lid that is exposed in a space in which the piezoelectric vibrating piece is hermetically sealed. It is formed on a part of the surface.

  Furthermore, the piezoelectric oscillator according to the present invention is characterized in that the temperature detection unit is disposed at a position closest to the excitation electrode of the piezoelectric vibrating piece.

  Furthermore, the piezoelectric oscillator according to the present invention has a wiring pattern in which each of the circuit patterns formed on the surface of the package bottom and the surface of the lid extends to the joint surface between the package bottom and the lid. The wiring patterns are connected to each other by joining the package bottom and the lid.

  Furthermore, in the piezoelectric oscillator according to the present invention, an external connection electrode that is connected to the outside is formed on the bottom of the package and / or the outer surface of the lid, and the external connection electrode and the circuit pattern include It is connected through a through hole formed in the package bottom and / or the lid and / or a wiring pattern formed in the package bottom and / or the lid.

  Furthermore, the piezoelectric oscillator according to the present invention includes at least a piezoelectric vibrating piece on which an excitation electrode is formed, a package bottom portion that accommodates the piezoelectric vibrating piece, and a lid that is joined to the package bottom portion and hermetically seals the piezoelectric vibrating piece. A piezoelectric oscillator comprising a body, wherein the bottom of the package is a cavity structure for accommodating the piezoelectric vibrating reed, and the lid is formed of a flat semiconductor substrate on both main surfaces of the flat semiconductor substrate. Is characterized in that a circuit pattern is formed by a semiconductor integrated circuit process.

  Furthermore, in the piezoelectric oscillator according to the present invention, the circuit pattern has a temperature detection unit, and the temperature detection unit is formed on a surface of the flat semiconductor substrate exposed in a space in which the piezoelectric vibrating piece is hermetically sealed. It is formed in a part.

  Furthermore, the piezoelectric oscillator according to the present invention is characterized in that the temperature detection unit is disposed so as to be closest to the excitation electrode of the piezoelectric vibrating piece.

  Furthermore, in the piezoelectric oscillator according to the present invention, the package bottom has a wiring pattern extending to a joint between the package bottom and the lid, and the circuit pattern formed on the surface of the lid is the package. It has a wiring pattern extending to the joint surface between the bottom and the lid, and each of the wiring patterns is connected by joining the bottom of the package and the lid.

  Furthermore, the piezoelectric oscillator according to the present invention is characterized in that the circuit patterns formed on both main surfaces of the flat semiconductor substrate are connected to each other through through holes formed in the flat semiconductor substrate. And

  Furthermore, in the piezoelectric oscillator according to the present invention, an external connection electrode that is connected to the outside is formed on the outer surface of the lid, and the external connection electrode and the circuit pattern are formed on the lid. It is connected through a through hole and / or a wiring pattern formed in the lid.

  Furthermore, the piezoelectric oscillator according to the present invention includes at least a piezoelectric vibrating piece on which an excitation electrode is formed, a package bottom portion that accommodates the piezoelectric vibrating piece, and a lid that is joined to the package bottom portion and hermetically seals the piezoelectric vibrating piece. A piezoelectric oscillator comprising a body, wherein the lid body is a cavity structure for accommodating the piezoelectric vibrating piece, and the bottom of the package is formed of a flat semiconductor substrate on both main surfaces of the flat semiconductor substrate. Is characterized in that a circuit pattern is formed by a semiconductor integrated circuit process.

  Furthermore, in the piezoelectric oscillator according to the present invention, the circuit pattern has a temperature detection unit, and the temperature detection unit is formed on a surface of the flat semiconductor substrate exposed in a space in which the piezoelectric vibrating piece is hermetically sealed. It is formed in a part.

  Furthermore, the piezoelectric oscillator according to the present invention is characterized in that the temperature detection unit is disposed at a position closest to the excitation electrode of the piezoelectric vibrating piece.

  Furthermore, the piezoelectric oscillator according to the present invention is characterized in that the circuit patterns formed on both main surfaces of the flat semiconductor substrate are connected to each other through through holes formed in the flat semiconductor substrate. And

  Further, in the piezoelectric oscillator according to the present invention, an external connection electrode that is connected to the outside is formed on the outer surface of the package bottom, and the external connection electrode and the circuit pattern are formed on the bottom of the package. It is connected through a through hole and / or a wiring pattern formed on the bottom of the package.

  According to the present invention, the package bottom and lid of the piezoelectric oscillator are formed of a semiconductor substrate, and a circuit pattern is formed on the surface of the package bottom and lid by a semiconductor integrated circuit process. It is done. Furthermore, according to the above-described configuration, it is possible to provide a piezoelectric oscillator having a temperature compensation function that can arrange circuit patterns in accordance with functions and has excellent followability.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS The best mode of a piezoelectric oscillator according to the present invention will be described with reference to explanatory diagrams showing examples.

  FIG. 1 is an explanatory view of a piezoelectric oscillator according to a first embodiment of the present invention, in which (1) is a top view and (2) is an AA cross-sectional view of (1). The piezoelectric oscillator of this embodiment will be described as a piezoelectric oscillator having a temperature compensation function (hereinafter referred to as TCXO). In the TCXO 30 of this embodiment, a circuit pattern 32 including an oscillation circuit is formed on a first main surface of a package bottom 31 formed of a semiconductor material by a semiconductor process, and further, the circuit pattern 32 is protected on the upper portion. A protective coating 33 for connecting the TCXO 30 to an external electronic circuit, and a wiring pattern (not shown) for electrically connecting the circuit pattern 32 and the external connection electrode 34 are provided. Yes. A cavity 36 for storing the piezoelectric vibrating piece 35 is formed on the second main surface of the package bottom 31 opposite to the surface on which the circuit pattern 32 is formed. A wiring pattern 37 is provided in the cavity 36. Further, the piezoelectric vibrating piece 35 is mechanically held, and the excitation electrode 46 of the piezoelectric vibrating piece 35 and the wiring pattern 37 are electrically connected. A target mount electrode 45 is provided. A piezoelectric vibrating piece 35 is bonded and fixed on the mount electrode 45. As a method of bonding, a conductive adhesive is generally used, but metal brazing material bonding, pressure welding using metal bonding, or the like is also conceivable, but is not limited thereto.

  The wiring pattern 37 in the cavity 36 and a circuit pattern (not shown) formed on the first main surface of the package bottom 31 are electrically connected through a through hole 38 formed in the package bottom 31. The through hole 38 is generally formed by forming a through hole by a semiconductor etching technique and plating a metal on the inner surface thereof. However, a metal thin film is formed by mechanical machining, vacuum deposition or sputtering technique. This is not the case.

  In the TCXO 30 of the present embodiment, the lid 39 is made of a semiconductor material, and the circuit pattern 40 is formed on the first main surface of the lid 39 by a semiconductor process. Furthermore, a protective film 41 for protecting the circuit pattern 40 and a wiring pattern 42 for connecting the circuit pattern 40 to another electronic circuit are provided on the upper part. The circuit pattern 40 is provided with a temperature detection unit 43 necessary for realizing a temperature compensation function. The temperature detector 43 is preferably arranged in the circuit pattern 40 so as to be in the vicinity of the piezoelectric vibrating piece 35 in order to detect the temperature change of the piezoelectric vibrating piece 35 without delay. However, this is not the case.

  The package bottom 31 and the lid 39 on which the piezoelectric vibrating piece 35 is mounted are sealed at the joint 44 in order to keep the cavity 36 of the package bottom 31 airtight. Various conventional techniques can be employed as the sealing method, for example, welding using a metal brazing material, bonding using an interatomic bond that is crimped after cleaning the bonding surface with an ion beam, etc. This is not the case.

  The wiring pattern 37 in the cavity 36 formed on the package bottom 31 and the wiring pattern 42 formed on the first main surface of the lid 39 are respectively sealed by the package bottom 31 and the lid 39. Are extended to the bonding portion 44 at the time of the bonding, and the bonding electrodes (not connected) are provided at the ends of the wiring patterns 37 and 42 at positions where they contact each other when the package bottom 31 and the lid 39 are sealed. (Shown) is provided. When the package bottom 31 and the lid 39 are sealed, the bonding electrodes of the package bottom 31 and the lid 39 are electrically joined by pressure welding or metal brazing material, and are formed in the package bottom 31. The internal wiring pattern 37 and the wiring pattern 42 formed on the first main surface of the lid 39 are electrically connected. As a joining method, pressure welding or a metal brazing material has been described as an example, but various methods can be adopted and are not limited thereto.

  A general TCXO requires an oscillation circuit for oscillating a piezoelectric vibrating piece, a circuit for realizing a temperature compensation function, a temperature detection unit for detecting temperature, a control circuit, an output circuit, and the like. In the piezoelectric oscillator shown in Patent Document 1 (see FIG. 5), the necessary electronic circuit described above is incorporated only in the circuit pattern 22 formed on the flat plate 21 constituting the bottom of the package. Since the area is dominant with respect to the size of the piezoelectric oscillator 20, the miniaturization of the piezoelectric oscillator 20 is to be restricted. On the other hand, in the TCXO 30 of this embodiment, a necessary electronic circuit is included in either the circuit pattern 32 formed on the package bottom 31 or the circuit pattern 40 formed on the lid 39. Therefore, the area of each circuit pattern can be reduced, and the TCXO 30 can be downsized.

  In the TCXO 30 of the present embodiment, whether the necessary electronic circuit is arranged in either the circuit pattern 32 formed on the package bottom 31 or the circuit pattern 40 formed on the lid 39 is the same as in the present embodiment. Since the TCXO 30 has a higher degree of freedom in arrangement than the piezoelectric oscillator configured as in Patent Document 1, the temperature detection unit 43 is arranged in the vicinity of the piezoelectric vibrating piece 36 to optimize the follow-up performance of the temperature compensation function. Has been achieved. In addition, it is desirable that the oscillation circuit for exciting the piezoelectric vibrating piece 35 be disposed in the vicinity of the mount electrode so that the wiring to the piezoelectric vibrating piece 35 is shortest in consideration of the oscillation characteristics.

  FIG. 2 is an explanatory diagram of a piezoelectric oscillator, particularly a TCXO 50, according to the second embodiment of the present invention. The package bottom 51 and the lid 59 are made of a semiconductor material, and the package bottom 51 has a cavity 56 for storing the piezoelectric vibrating piece 55 and the wiring pattern 57 connected to the mount electrode 65 in the cavity 56 is an embodiment. 1 is the same. In the TCXO 50 of the present embodiment, circuit patterns 52 and 60 are formed on both main surfaces of the lid 59, and the space between them is connected by a through hole 58. The surfaces of the circuit patterns 52 and 60 are protected by protective coatings 53 and 61. The temperature detector 63 is located in the circuit pattern 52 so as to be closest to the piezoelectric vibrating piece 55 on the first main surface of the lid 59 facing the space of the cavity 56 in which the piezoelectric vibrating piece 55 is stored. Is arranged. The external connection electrode 54 is disposed on the second main surface of the lid 59 opposite to the first main surface. However, the arrangement of the external connection electrode 54 is not limited to this, and the external connection electrode 54 may be provided on the first main surface of the package bottom 51 opposite to the side where the cavity 56 is formed. In this case, a through hole (not shown) is provided in the package bottom 51 and connected to the wiring pattern 57 in the cavity 56. Similarly to the TCXO 30 of the first embodiment, the TCXO 50 of the present embodiment is downsized by optimally dividing a necessary electronic circuit, and a temperature compensation function by arranging the temperature detection unit 63 in the nearest vicinity of the piezoelectric vibrating piece 55. Improvements in followability have been achieved.

  The package bottom 51 and the lid 59 on which the piezoelectric vibrating piece 55 is mounted are sealed at the joint 64 in order to keep the cavity 56 of the package bottom 51 airtight. Various conventional techniques can be employed as the sealing method, for example, welding using a metal brazing material, bonding using an interatomic bond that is crimped after cleaning the bonding surface with an ion beam, etc. This is not the case.

  The above-described wiring pattern 57 in the cavity 56 formed in the package bottom 51 and the wiring pattern 62 formed on the first main surface of the lid 59 are sealed by the package bottom 51 and the lid 59, respectively. The joint electrodes 64 extend to the joining portion 64 at the time of being formed, and are connected to the ends of the wiring patterns 57 and 62 at positions where they contact each other when the package bottom 51 and the lid 59 are sealed. (Shown) is provided. When the package bottom 51 and the lid 59 are sealed, the bonding electrodes of the package bottom 51 and the lid 59 are electrically joined by pressure welding or a metal brazing material, and the cavity 56 formed in the package bottom 51 is formed. The internal wiring pattern 57 and the wiring pattern 62 formed on the first main surface of the lid 59 are electrically connected. As a joining method, pressure welding or a metal brazing material has been described as an example, but various methods can be adopted and are not limited thereto.

  FIG. 3 is an explanatory diagram of a piezoelectric oscillator, particularly TCXO 70, according to a third embodiment of the present invention. The package bottom 71 is made of a flat semiconductor material, and circuit patterns 72 and 80 are formed on both main surfaces thereof. The surfaces of the circuit patterns 72 and 80 are protected by protective coatings 73 and 81. An external connection electrode 74 is formed on the first main surface of the package bottom 71. A piezoelectric vibrating piece 75 is mounted on the mount electrode 85 on the second main surface of the package bottom 71 opposite to the first main surface. The circuit pattern 72 and the mount electrode 85 are electrically connected via a wiring pattern 77. The circuit patterns 72 and 80 on the first main surface and the second main surface are electrically connected through the through holes 78, respectively. The temperature detector 83 is disposed at a position closest to the piezoelectric vibrating piece 75 in the circuit pattern 72 formed on the second main surface of the package bottom 71. The lid 79 has a cavity 76 for securing a space for housing the piezoelectric vibrating piece 75. The package bottom 71 and the lid 79 are joined at a joint 84. In the first and second embodiments, the lid is made of a semiconductor material. However, in the TCXO 70 of this embodiment, the lid 79 may be made of a semiconductor material, but may be made of other materials. good. Similarly to the TCXO 30 of the first embodiment or the TCXO 50 of the second embodiment, the TCXO 70 of the present embodiment is reduced in size by optimally dividing a necessary electronic circuit, and the temperature detection unit is disposed in the vicinity of the piezoelectric vibrating piece. Improvement of the followability of the temperature compensation function has been achieved.

Explanatory drawing of the 1st Example of the piezoelectric oscillator by this invention Explanatory drawing of 2nd Example of the piezoelectric oscillator by this invention Explanatory drawing Explanatory drawing of the third embodiment of the piezoelectric oscillator according to the present invention. Explanatory drawing of a general-purpose piezoelectric oscillator according to the prior art Explanatory drawing of the piezoelectric oscillator shown in Patent Document 1

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Piezoelectric oscillator 11 Piezoelectric vibration piece 12 Semiconductor integrated circuit 13 Package bottom part 20 Piezoelectric oscillator 21 Flat plate 22 Circuit pattern 23 Electrode pad 24 Polyimide film 25 Piezoelectric vibration piece 26 Integrated circuit element 27 Cavity 28 Lid 29 Adhesive 30 TCXO
31 Package Bottom 32 Circuit Pattern 33 Protective Film 34 External Connection Electrode 35 Piezoelectric Vibrating Piece 36 Cavity 37 Wiring Pattern 38 Through Hole 39 Lid 40 Circuit Pattern 41 Protective Film 42 Wiring Pattern 43 Temperature Detection Section 44 Junction 45 Mount Electrode 46 Excitation Electrode 50 TCXO
51 Package Bottom 52 Circuit Pattern 53 Protective Film 54 External Connection Electrode 55 Piezoelectric Vibrating Piece 56 Cavity 57 Wiring Pattern 58 Through Hole 59 Lid 60 Circuit Pattern 61 Protective Film 62 Wiring Pattern 63 Temperature Detector 64 Junction 65 Mount Electrode 70 TCXO
71 Package Bottom 72 Circuit Pattern 73 Protective Film 74 External Connection Electrode 75 Piezoelectric Vibrating Piece 76 Cavity 77 Wiring Pattern 78 Through Hole 79 Lid 80 Circuit Pattern 81 Protective Film 83 Temperature Detector 84 Bonding Section 85 Mount Electrode

Claims (16)

A piezoelectric oscillator comprising at least a piezoelectric vibrating piece on which an excitation electrode is formed, a package bottom that accommodates the piezoelectric vibrating piece, and a lid that is bonded to the package bottom and hermetically seals the piezoelectric vibrating piece. ,
2. The piezoelectric oscillator according to claim 1, wherein the package bottom and the lid are formed of a semiconductor substrate, and a circuit pattern is formed on a surface of the package bottom and the lid by a semiconductor integrated circuit process.   The circuit pattern includes a temperature detection unit, and the temperature detection unit is formed on the bottom of the package exposed in a space in which the piezoelectric vibrating piece is hermetically sealed or a part of the surface of the lid. The piezoelectric oscillator according to claim 1.   3. The piezoelectric oscillator according to claim 2, wherein the temperature detection unit is disposed at a position closest to the excitation electrode of the piezoelectric vibrating piece.   Each of the circuit patterns formed on the bottom surface of the package and the surface of the lid has a wiring pattern extending to a joint surface between the package bottom and the lid, and the package bottom and the lid The piezoelectric oscillator according to claim 1, wherein each of the wiring patterns is connected by bonding to the piezoelectric oscillator.   An external connection electrode that is connected to the outside is formed on the outer surface of the package bottom and / or the lid, and the external connection electrode and the circuit pattern include the package bottom and / or the lid. 5. The connection according to claim 1, wherein the connection is made through a through-hole formed in the wiring and / or a wiring pattern formed in the bottom of the package and / or the lid. 6. Piezoelectric oscillator. A piezoelectric oscillator comprising at least a piezoelectric vibrating piece on which an excitation electrode is formed, a package bottom that accommodates the piezoelectric vibrating piece, and a lid that is bonded to the package bottom and hermetically seals the piezoelectric vibrating piece. ,
The bottom of the package is a cavity structure for accommodating the piezoelectric vibrating piece, and the lid is made of a flat semiconductor substrate, and a circuit pattern is formed on both main surfaces of the flat semiconductor substrate by a semiconductor integrated circuit process. A piezoelectric oscillator characterized by being formed.   The circuit pattern includes a temperature detection unit, and the temperature detection unit is formed on a part of the surface of the flat semiconductor substrate exposed in a space in which the piezoelectric vibrating piece is hermetically sealed. The piezoelectric oscillator according to claim 6.   The piezoelectric oscillator according to claim 7, wherein the temperature detection unit is disposed so as to be closest to an excitation electrode of the piezoelectric vibrating piece.   The package bottom has a wiring pattern that extends to a junction between the package bottom and the lid, and the lid has a wiring pattern that extends to a junction between the package bottom and the lid. The piezoelectric oscillator according to any one of claims 6 to 8, wherein each of the wiring patterns is connected by joining the bottom of the package and the lid.   The circuit patterns formed on both main surfaces of the lid are connected to each other through through holes formed in the flat semiconductor substrate. The piezoelectric oscillator according to item   An external connection electrode that is connected to the outside is formed on the outer surface of the lid, and the external connection electrode and the circuit pattern include a through-hole formed in the lid and / or the The piezoelectric oscillator according to claim 6, wherein the piezoelectric oscillator is connected via a wiring pattern formed on the lid. A piezoelectric oscillator comprising at least a piezoelectric vibrating piece on which an excitation electrode is formed, a package bottom that accommodates the piezoelectric vibrating piece, and a lid that is bonded to the package bottom and hermetically seals the piezoelectric vibrating piece. ,
The lid has a cavity structure for accommodating the piezoelectric vibrating piece, and the bottom of the package is made of a flat semiconductor substrate, and a circuit pattern is formed on both main surfaces of the flat semiconductor substrate by a semiconductor integrated circuit process. A piezoelectric oscillator characterized by being formed.   The circuit pattern includes a temperature detection unit, and the temperature detection unit is formed on a part of the surface of the flat semiconductor substrate exposed in a space in which the piezoelectric vibrating piece is hermetically sealed. The piezoelectric oscillator according to claim 12.   The piezoelectric oscillator according to claim 13, wherein the temperature detection unit is disposed at a position that is closest to the excitation electrode of the piezoelectric vibrating piece.   15. The circuit patterns formed on both main surfaces of the flat semiconductor substrate are connected through through holes formed in the flat semiconductor substrate. The piezoelectric oscillator according to claim 1   An external connection electrode that is connected to the outside is formed on the outer surface of the bottom of the package, and the external connection electrode and the circuit pattern include a through hole formed in the bottom of the package and / or the The piezoelectric oscillator according to any one of claims 12 to 15, wherein the piezoelectric oscillator is connected via a wiring pattern formed on the bottom of the package.

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