JPH07336141A - Oscillator - Google Patents
OscillatorInfo
- Publication number
- JPH07336141A JPH07336141A JP6122453A JP12245394A JPH07336141A JP H07336141 A JPH07336141 A JP H07336141A JP 6122453 A JP6122453 A JP 6122453A JP 12245394 A JP12245394 A JP 12245394A JP H07336141 A JPH07336141 A JP H07336141A
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- control element
- oscillation
- control
- insulation resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、温度補償型の発振器に
関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a temperature compensation oscillator.
【0002】[0002]
【従来の技術】従来のこの発振器においては、基板上に
発振素子とその温度制御素子とを実装し、前記制御素子
に設けた温度検出部により、発振素子近傍の雰囲気温度
を検出し、それにより発振素子が温度に関わらず、ほぼ
一定の発振が行われるようにしていた。2. Description of the Related Art In this conventional oscillator, an oscillating element and its temperature control element are mounted on a substrate, and an ambient temperature in the vicinity of the oscillating element is detected by a temperature detecting section provided in the control element. The oscillation element is designed to oscillate almost constantly regardless of the temperature.
【0003】[0003]
【発明が解決しようとする課題】しかしながら、上記従
来のものにおいては、発振素子の急激な温度変化時にお
いて、正確な温度を瞬時に検出できず、温度制御による
発振の安定化が図れないという問題があった。即ち、制
御素子の温度検出部は、その近傍の雰囲気温度を検出し
ており、発振素子が急激に温度変化した時に雰囲気温度
が発振素子の温度に到達するまでに時間差を生じると、
発振素子の温度を必ずしも正しく検出していないものと
なるため、発振周波数を希望する値に保つ事が困難とな
ってしまうものであった。However, in the above-mentioned conventional device, the accurate temperature cannot be instantaneously detected when the temperature of the oscillating element suddenly changes, and the oscillation cannot be stabilized by the temperature control. was there. That is, the temperature detection unit of the control element detects the ambient temperature in the vicinity thereof, and when the oscillation element undergoes a rapid temperature change, if there is a time lag until the ambient temperature reaches the temperature of the oscillation element,
Since the temperature of the oscillation element is not always detected correctly, it is difficult to keep the oscillation frequency at a desired value.
【0004】そこで本発明は、発振素子の温度制御がよ
り正確に行われるようにする事を目的とするものであ
る。Therefore, the present invention has an object of more accurately controlling the temperature of the oscillation element.
【0005】[0005]
【課題を解決するための手段】そして、この目的を達成
するために、本発明は発振素子の表面上に制御素子を実
装すると共に、この制御素子の発振素子側の面には、温
度検出部を内蔵させたものである。In order to achieve this object, the present invention mounts a control element on the surface of an oscillating element, and the temperature detecting section is provided on the oscillating element side surface of the control element. Is built in.
【0006】[0006]
【作用】以上の構成とすれば、制御素子に設けた温度検
出部は、それに対向する発振素子温度を直接的に検出す
ることになるので、実際の発振素子の温度に基づいた適
切な温度制御が行われ、この結果として正確な温度制御
が行われるようになるのである。With the above-mentioned structure, the temperature detecting section provided in the control element directly detects the temperature of the oscillating element facing the temperature detecting section, so that the temperature is appropriately controlled based on the actual temperature of the oscillating element. As a result, accurate temperature control is performed.
【0007】[0007]
【実施例】図1において、1は水晶振動子でその上面か
ら入、出力電極2,3が引き出されている。この水晶振
動子1の上面には前記入、出力電極2,3以外にも複数
個の電極が設けられており、それらは側面を通って水晶
振動子1の下面に延長されている。これらの電極に制御
素子4に図2の如く設けた電極5が半田付けされている
(一般的にはこれをフリップチップ実装と言う)。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In FIG. 1, reference numeral 1 denotes a crystal oscillator, which is inserted from the upper surface and output electrodes 2 and 3 are drawn out. A plurality of electrodes are provided on the upper surface of the crystal resonator 1 in addition to the input and output electrodes 2 and 3, and these electrodes extend through the side surfaces to the lower surface of the crystal resonator 1. The electrodes 5 provided on the control element 4 as shown in FIG. 2 are soldered to these electrodes (generally referred to as flip-chip mounting).
【0008】尚、制御素子4は図2に示す如くその下面
中央部に温度検出部6が内蔵されており、その外周にA
Dコンバータ7、発振回路部8、電圧制御部9、DAコ
ンバータ10、電源レギュレーター部11、ROM部1
2が内蔵されている。As shown in FIG. 2, the control element 4 has a temperature detecting section 6 built in at the center of its lower surface, and has an A on its outer periphery.
D converter 7, oscillation circuit section 8, voltage control section 9, DA converter 10, power supply regulator section 11, ROM section 1
2 is built in.
【0009】これら、制御素子4の各部6〜12は図3
の如く接続されており、温度検出部6で水晶振動子1の
温度を検出すると、その検出温度に基づいて発振回路部
8を介して水晶振動子1の発振周波数を希望する発振周
波数とすべくフィード・バック制御するものである。These parts 6 to 12 of the control element 4 are shown in FIG.
When the temperature of the crystal unit 1 is detected by the temperature detection unit 6, the oscillation frequency of the crystal unit 1 is set to the desired oscillation frequency via the oscillation circuit unit 8 based on the detected temperature. It is for feedback control.
【0010】尚、図1において13は制御素子4と水晶
振動子1との間に設けた絶縁樹脂であり、この絶縁樹脂
13により両者の接着強度が強まると共に、この絶縁樹
脂13を介して水晶振動子1の熱が制御素子4の温度検
出部6に伝達され易くなっている。また、水晶振動子1
と制御素子4の外周に設けた絶縁樹脂14は制御素子4
自体の熱を放熱させる役目をもたせたものである。即
ち、制御素子4の発振回路部8と電源レギュレーター部
11とは発熱を伴うものであるので、それを樹脂14と
外周のシールド・カバー15を介して、外気へ放熱させ
ている。また、シールド・カバー15を設けたことによ
り、制御素子4と水晶振動子1へのシールド効果も発揮
させる。In FIG. 1, reference numeral 13 denotes an insulating resin provided between the control element 4 and the crystal unit 1. The insulating resin 13 enhances the bonding strength between the two, and at the same time, the crystal is interposed through the insulating resin 13. The heat of the vibrator 1 is easily transferred to the temperature detection unit 6 of the control element 4. Also, the crystal unit 1
And the insulating resin 14 provided on the outer periphery of the control element 4
It has the role of dissipating its own heat. That is, since the oscillation circuit section 8 of the control element 4 and the power supply regulator section 11 generate heat, they are radiated to the outside air via the resin 14 and the outer peripheral shield cover 15. Further, by providing the shield cover 15, the control element 4 and the crystal resonator 1 are also shielded.
【0011】[0011]
【発明の効果】以上のように本発明は、発振素子の表面
上に制御素子を実装すると共に、この制御素子の発振素
子側の面には、温度検出部を内蔵させたものである。As described above, according to the present invention, the control element is mounted on the surface of the oscillating element, and the temperature detecting section is built in the oscillating element side surface of the control element.
【0012】そして、以上の構成とすれば、制御素子に
設けた温度検出部は、それに対向する発振素子温度を直
接的に検出することになるので、実際の発振素子の温度
に基づいた適切な温度制御が行われ、この結果として正
確な温度制御が行われるようになるのである。With the above arrangement, the temperature detecting section provided in the control element directly detects the temperature of the oscillating element facing the temperature detecting section. Temperature control is performed, and as a result, accurate temperature control is performed.
【図1】本発明の一実施例の断面図FIG. 1 is a sectional view of an embodiment of the present invention.
【図2】その制御素子の斜視図FIG. 2 is a perspective view of the control element.
【図3】その制御素子の回路図FIG. 3 is a circuit diagram of the control element.
1 水晶振動子 4 制御素子 6 温度検出部 13 水晶振動子1と制御素子4との間に設けた絶縁樹
脂 14 水晶振動子1と制御素子4の外周に設けた絶縁樹
脂DESCRIPTION OF SYMBOLS 1 Crystal oscillator 4 Control element 6 Temperature detection part 13 Insulating resin provided between the crystal oscillator 1 and the control element 14 Insulating resin provided on the outer periphery of the crystal oscillator 1 and the control element 4
Claims (3)
装された制御素子とを備え、前記制御素子の発振素子側
の面には温度検出部を内蔵させた発振器。1. An oscillator comprising an oscillating element and a control element mounted on the surface of the oscillating element, wherein the surface of the control element on the oscillating element side has a built-in temperature detector.
介在させた請求項1に記載の発振器。2. The oscillator according to claim 1, wherein an insulating resin is interposed between the oscillation element and the control element.
を介して、シールド・カバーを設けた請求項1または2
に記載の発振器。3. The shield cover is provided around the oscillation element and the control element with an insulating resin interposed therebetween.
Oscillator.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6122453A JPH07336141A (en) | 1994-06-03 | 1994-06-03 | Oscillator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6122453A JPH07336141A (en) | 1994-06-03 | 1994-06-03 | Oscillator |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH07336141A true JPH07336141A (en) | 1995-12-22 |
Family
ID=14836228
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6122453A Pending JPH07336141A (en) | 1994-06-03 | 1994-06-03 | Oscillator |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH07336141A (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003060439A (en) * | 2001-08-08 | 2003-02-28 | Seiko Instruments Inc | Piezoelectric oscillator |
JP2003258554A (en) * | 2002-02-28 | 2003-09-12 | Kinseki Ltd | Temperature compensation type piezoelectric oscillator |
JP2006191517A (en) * | 2004-12-07 | 2006-07-20 | Seiko Epson Corp | Temperature compensated piezoelectric oscillator |
JP2006526928A (en) * | 2003-06-03 | 2006-11-24 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Low pass filter and electronic device |
JP2007006270A (en) * | 2005-06-24 | 2007-01-11 | Nippon Dempa Kogyo Co Ltd | Piezoelectric oscillator |
JP2007067967A (en) * | 2005-08-31 | 2007-03-15 | Kyocera Kinseki Corp | Temperature compensated crystal oscillator |
JP2007324880A (en) * | 2006-05-31 | 2007-12-13 | Kyocera Kinseki Corp | Piezoelectric oscillator |
JP2008294587A (en) * | 2007-05-22 | 2008-12-04 | Nippon Dempa Kogyo Co Ltd | Crystal oscillator for surface mounting |
JP2009027477A (en) * | 2007-07-19 | 2009-02-05 | Citizen Finetech Miyota Co Ltd | Piezoelectric oscillator |
JP2009065334A (en) * | 2007-09-05 | 2009-03-26 | Nippon Dempa Kogyo Co Ltd | Surface-mount crystal oscillator |
-
1994
- 1994-06-03 JP JP6122453A patent/JPH07336141A/en active Pending
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003060439A (en) * | 2001-08-08 | 2003-02-28 | Seiko Instruments Inc | Piezoelectric oscillator |
JP4689898B2 (en) * | 2001-08-08 | 2011-05-25 | セイコーインスツル株式会社 | Piezoelectric oscillator |
JP2003258554A (en) * | 2002-02-28 | 2003-09-12 | Kinseki Ltd | Temperature compensation type piezoelectric oscillator |
JP2006526928A (en) * | 2003-06-03 | 2006-11-24 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Low pass filter and electronic device |
JP2006191517A (en) * | 2004-12-07 | 2006-07-20 | Seiko Epson Corp | Temperature compensated piezoelectric oscillator |
JP2007006270A (en) * | 2005-06-24 | 2007-01-11 | Nippon Dempa Kogyo Co Ltd | Piezoelectric oscillator |
JP2007067967A (en) * | 2005-08-31 | 2007-03-15 | Kyocera Kinseki Corp | Temperature compensated crystal oscillator |
JP2007324880A (en) * | 2006-05-31 | 2007-12-13 | Kyocera Kinseki Corp | Piezoelectric oscillator |
JP2008294587A (en) * | 2007-05-22 | 2008-12-04 | Nippon Dempa Kogyo Co Ltd | Crystal oscillator for surface mounting |
JP2009027477A (en) * | 2007-07-19 | 2009-02-05 | Citizen Finetech Miyota Co Ltd | Piezoelectric oscillator |
JP2009065334A (en) * | 2007-09-05 | 2009-03-26 | Nippon Dempa Kogyo Co Ltd | Surface-mount crystal oscillator |
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