JP5337635B2 - Electronic devices - Google Patents

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JP5337635B2
JP5337635B2 JP2009200805A JP2009200805A JP5337635B2 JP 5337635 B2 JP5337635 B2 JP 5337635B2 JP 2009200805 A JP2009200805 A JP 2009200805A JP 2009200805 A JP2009200805 A JP 2009200805A JP 5337635 B2 JP5337635 B2 JP 5337635B2
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recess
heat dissipation
integrated circuit
pattern
circuit element
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JP2011055146A (en
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元晴 安藤
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Kyocera Crystal Device Corp
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Kyocera Crystal Device Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic device which prevents variation in oscillation frequency. <P>SOLUTION: The electronic device includes: an element loading member which has a first recess and a second recess; a piezoelectric vibration element which is stored in the first recess and has electrodes for excitation on both principal planes of a piezoelectric element plate; an integrated circuit element which is stored in the second recess and at least has an oscillator circuit; a lid member which seals the first recess; and a heat dissipation substrate which is joined to the side of the second recess of the element loading member and has a pattern for heat dissipation to be provided at the center of one principal plane, frame connection terminals to be provided at four corners of the one principal plane, and external connection terminals to be provided at four corners of the other principal plane, wherein the surface of the pattern for heat dissipation is joined to the surface on the side opposite to a circuit formation surface of the integrated circuit element via conductive adhesives, the pattern for heat dissipation is connected to one of the frame connection terminals, and the frame connection terminal connected to the pattern for heat dissipation is connected to one of the external connection terminals. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

本発明は、電子機器等に用いられる電子デバイスに関するものである。   The present invention relates to an electronic device used for an electronic device or the like.

従来より、携帯用の通信機器等の電子機器には、各種電子デバイスが用いられている。
これら電子デバイスのうち、例えば、圧電発振器について説明する。
従来の電子デバイスである圧電発振器２００としては、図３に示すように、第一の凹部Ｋ１、第二の凹部Ｋ２を有する素子搭載部材２１０の第一の凹部Ｋ１内に、圧電振動素子２２０を実装して蓋部材２１４で気密封止され、前記第二の凹部Ｋ２内に、圧電振動素子２２０の例えば、発振回路や温度補償を行なうための回路を備えた集積回路素子２３０が収容された構造となっている。この圧電発振器２００は、電子デバイスであって、第二の凹部Ｋ２の基板部２１１の他方の主面に、バンプ２３１を介して基板部２１１と接続されている集積回路素子２３０の回路形成面を保護するために、基板部２１１と集積回路素子２３０との間に樹脂２４０が充填されている。 Conventionally, various electronic devices have been used in electronic devices such as portable communication devices.
Among these electronic devices, for example, a piezoelectric oscillator will be described.
As shown in FIG. 3, a piezoelectric oscillator 200 that is a conventional electronic device includes a piezoelectric vibration element 220 in a first recess K1 of an element mounting member 210 having a first recess K1 and a second recess K2. A structure which is mounted and hermetically sealed with a lid member 214, and an integrated circuit element 230 including, for example, an oscillation circuit or a circuit for performing temperature compensation of the piezoelectric vibration element 220 is accommodated in the second recess K2. It has become. The piezoelectric oscillator 200 is an electronic device, and a circuit forming surface of an integrated circuit element 230 connected to the substrate portion 211 via the bumps 231 is formed on the other main surface of the substrate portion 211 of the second recess K2. In order to protect, a resin 240 is filled between the substrate portion 211 and the integrated circuit element 230.

前述の従来の圧電発振器２００は、素子搭載部材２１０の基板部２１１の一方の主面に圧電振動素子２２０を実装し、当該基板部２１１の他方の主面に集積回路素子２３０を実装しているため、表面面積の小さい小型の電子デバイスを実現できる。また、従来の圧電発振器２００は、基板部２１１の一方の主面に圧電振動素子２２０を実装した後に、基板部２１１の他方の主面に集積回路素子２３０を実装しているので、圧電振動素子２２０の周波数安定化のために行なう熱処理が集積回路素子２３０に印加されず、集積回路素子２３０の動作信頼性や接続信頼性を高めることができる（例えば、特許文献１参照）。
また、この圧電発振器２００の第二の凹部Ｋ２の基板部２１１と接続されている集積回路素子２３０は、集積回路素子２３０の発振回路などを起動する際の起動電圧により、集積回路素子２３０が発熱することになる。その際、圧電発振器２００は、外部の実装基板に実装されており、集積回路素子２３０の搭載されている第二の凹部Ｋ２が外部の実装基板に実装された状態で閉ざされた空間となっている。その結果、集積回路素子２３０からの発熱は、実装基板と第二の凹部Ｋ２とで閉ざされた空間に熱が籠もることになる。 In the conventional piezoelectric oscillator 200 described above, the piezoelectric vibration element 220 is mounted on one main surface of the substrate portion 211 of the element mounting member 210, and the integrated circuit element 230 is mounted on the other main surface of the substrate portion 211. Therefore, a small electronic device having a small surface area can be realized. Further, since the conventional piezoelectric oscillator 200 has the piezoelectric vibration element 220 mounted on one main surface of the substrate portion 211 and then the integrated circuit element 230 mounted on the other main surface of the substrate portion 211, the piezoelectric vibration element The heat treatment performed to stabilize the frequency of 220 is not applied to the integrated circuit element 230, and the operation reliability and connection reliability of the integrated circuit element 230 can be improved (see, for example, Patent Document 1).
In addition, the integrated circuit element 230 connected to the substrate portion 211 of the second recess K2 of the piezoelectric oscillator 200 generates heat by the starting voltage when starting the oscillation circuit of the integrated circuit element 230 or the like. Will do. At that time, the piezoelectric oscillator 200 is mounted on an external mounting board, and the second recess K2 on which the integrated circuit element 230 is mounted is a closed space in a state of being mounted on the external mounting board. Yes. As a result, the heat generated from the integrated circuit element 230 is stored in the space closed by the mounting substrate and the second recess K2.

特開２０００−１３８５３３号公報（第６頁、図２）JP 2000-138533 A (page 6, FIG. 2)

しかしながら、従来の圧電発振器２００においては、上述のように圧電発振器を外部の実装基板に実装した際に、集積回路素子の搭載される第二の凹部Ｋ２が閉ざされた空間となることから、集積回路素子２３０の発熱が第二の凹部Ｋ２内の空間に籠もり集積回路素子の感温素子の感知する温度が上昇することになり、圧電発振器２００の第一の凹部Ｋ１に収容される圧電振動素子２２０の感知する温度と、第二の凹部Ｋ２に収容される集積回路素子２３０の感知する温度とに温度差が生じ、圧電発振器２００の発振周波数が変動するという課題があった。   However, in the conventional piezoelectric oscillator 200, when the piezoelectric oscillator is mounted on an external mounting board as described above, the second recess K2 in which the integrated circuit element is mounted becomes a closed space. The heat generated by the circuit element 230 is trapped in the space in the second recess K2 and the temperature sensed by the temperature sensing element of the integrated circuit element rises, and the piezoelectric vibration accommodated in the first recess K1 of the piezoelectric oscillator 200 is increased. There is a problem that a temperature difference occurs between the temperature sensed by the element 220 and the temperature sensed by the integrated circuit element 230 accommodated in the second recess K2, and the oscillation frequency of the piezoelectric oscillator 200 varies.

そこで、本発明の圧電発振器は、上記問題に鑑みてなされたものであり、集積回路素子の発熱により圧電発振器の発振周波数が変動することのない電子デバイスを提供することを課題とする。   Accordingly, the piezoelectric oscillator of the present invention has been made in view of the above problems, and an object of the present invention is to provide an electronic device in which the oscillation frequency of the piezoelectric oscillator does not fluctuate due to heat generated by the integrated circuit element.

本発明の電子デバイスは、第一の凹部と第二の凹部を有する素子搭載部材と、前記第一の凹部に収容され、圧電素板の両主面に励振用電極を備える圧電振動素子と、前記第二の凹部に収容され、少なくとも発振回路を備える集積回路素子と、前記第一の凹部を封止する蓋部材と、前記素子搭載部材の前記第二の凹部側に接合され、一方の主面の中央に設けられる放熱用パターンと一方の主面の四隅に設けられる枠部接続端子と他方の主面の四隅に設けられる外部接続端子とを備える放熱基板とを備え、前記放熱用パターンの表面と前記集積回路素子の回路形成面の反対側になる面とが導電性接着剤を介して接合さ
れ、前記放熱用パターンと前記枠部接続端子の一つとが接続され、前記放熱用パターンと接続された前記枠部接続端子と前記外部接続端子の一つとが接続されていることを特徴とするものである。 An electronic device of the present invention includes an element mounting member having a first recess and a second recess, a piezoelectric vibration element housed in the first recess, and provided with excitation electrodes on both main surfaces of the piezoelectric base plate, An integrated circuit element that is housed in the second recess and includes at least an oscillation circuit, a lid member that seals the first recess, and the main body that is joined to the second recess side of the element mounting member, A heat dissipating board provided with a heat dissipating pattern provided at the center of the surface, a frame connecting terminal provided at the four corners of one main surface, and an external connecting terminal provided at the four corners of the other main surface, The surface and the surface opposite to the circuit forming surface of the integrated circuit element are joined via a conductive adhesive, the heat dissipation pattern and one of the frame connection terminals are connected, and the heat dissipation pattern The frame connecting terminal connected to the outside It is characterized in that the one connection terminal is connected.

また、本発明の電子デバイスは、上記構成において、放熱用パターンと前記枠部接続端子を介して接続される前記外部接続端子がグランド端子として機能することを特徴とするものである。   In the electronic device according to the present invention, the external connection terminal connected to the heat dissipation pattern via the frame connection terminal functions as a ground terminal in the above configuration.

本発明の電子デバイスは、放熱用パターンの表面と前記集積回路素子の回路形成面の反対側になる面とが導電性接着剤を介して接合され、放熱用パターンと枠部接続端子の一つとが接続され、放熱用パターンと接続された枠部接続端子と外部接続端子の一つとが接続されていることによって、集積回路素子の搭載された第二の凹部内に籠もった熱が放熱基板に熱伝導され、第二の凹部内に籠もった集積回路素子の発熱による温度と、放熱基板の持つ温度とが熱交換され、第二の凹部内の温度上昇を抑えることができる。即ち、集積回路素子からの発熱が、集積回路素子の回路形成面の反対側になる面と接続された放熱基板の金属部分を伝わっていく。これにより集積回路素子からの発熱は、放熱基板の金属部分を伝わり広範囲に広がり、集積回路素子と接続された放熱基板の金属部分の外部に露出した部分が外気にさらされているため、外気で熱冷却され、外部に放熱されることになる。その結果、集積回路素子の感温素子が感知する温度の温度上昇を抑えることができ、第一の凹部に収容されている圧電振動素子の感知する温度と、第二の凹部に収容されている集積回路素子の感知する温度との温度差を小さくできるため圧電発振器の発振周波数の変動を防ぐことが可能となる。   In the electronic device according to the present invention, the surface of the heat dissipation pattern and the surface opposite to the circuit forming surface of the integrated circuit element are joined via a conductive adhesive, and the heat dissipation pattern and one of the frame connection terminals Is connected, and the frame connection terminal connected to the heat radiation pattern and one of the external connection terminals are connected, so that the heat trapped in the second concave portion on which the integrated circuit element is mounted is dissipated. The heat generated by the integrated circuit element trapped in the second recess and the temperature of the heat dissipation substrate are heat-exchanged, and the temperature rise in the second recess can be suppressed. That is, the heat generated from the integrated circuit element is transmitted through the metal portion of the heat dissipation substrate connected to the surface of the integrated circuit element opposite to the circuit formation surface. As a result, heat generated from the integrated circuit element spreads over a wide range through the metal part of the heat dissipation board, and the exposed part of the metal part of the heat dissipation board connected to the integrated circuit element is exposed to the outside air. It is cooled by heat and radiated to the outside. As a result, the temperature increase of the temperature sensed by the temperature sensing element of the integrated circuit element can be suppressed, and the temperature sensed by the piezoelectric vibration element housed in the first recess and the second recess is housed. Since the temperature difference from the temperature sensed by the integrated circuit element can be reduced, fluctuations in the oscillation frequency of the piezoelectric oscillator can be prevented.

電子デバイスは、放熱用パターンと枠部接続端子を介して接続される外部接続端子がグランド端子として機能することから、外部の実装基板と接続した際にグランド端子が外部のグランド電極と接続されることで放熱面積を大きくでき、放熱効果を上げることが可能となる。   In the electronic device, since the external connection terminal connected via the heat radiation pattern and the frame connection terminal functions as a ground terminal, the ground terminal is connected to the external ground electrode when connected to an external mounting board. As a result, the heat radiation area can be increased, and the heat radiation effect can be increased.

本発明の実施形態に係る電子デバイスの一例を示した断面図である。It is sectional drawing which showed an example of the electronic device which concerns on embodiment of this invention. （ａ）は図１の素子搭載部材と放熱基板を接続する前の素子搭載部材の第二の凹部側を示した平面図であり、（ｂ）は放熱基板の素子搭載部材の第二の枠部との接合面を示した平面図である。(A) is the top view which showed the 2nd recessed part side of the element mounting member before connecting the element mounting member and heat dissipation board of FIG. 1, (b) is the 2nd frame of the element mounting member of a heat dissipation board. It is the top view which showed the joint surface with a part. 従来の電子デバイスを示した断面図である。It is sectional drawing which showed the conventional electronic device.

以下、本発明を添付図面に基づいて詳細に説明する。なお、同一構成要素には同一符号を付し、重複する説明を省略する。なお、電子デバイスを圧電発振器として説明する。以下、本発明を添付図面に基づいて詳細に説明する。   Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. In addition, the same code | symbol is attached | subjected to the same component and the overlapping description is abbreviate | omitted. The electronic device will be described as a piezoelectric oscillator. Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

図１は、本発明の実施形態に係る電子デバイスの一例を示した断面図である。
図１に示したように、電子デバイスである圧電発振器１００は、素子搭載部材１０と、蓋部材１４、圧電振動素子２０、集積回路素子３０、放熱基板４０とで主に構成されている。 FIG. 1 is a cross-sectional view showing an example of an electronic device according to an embodiment of the present invention.
As shown in FIG. 1, the piezoelectric oscillator 100 that is an electronic device mainly includes an element mounting member 10, a lid member 14, a piezoelectric vibration element 20, an integrated circuit element 30, and a heat dissipation substrate 40.

図１に示したように、素子搭載部材１０は、第一の凹部Ｋ１と第二の凹部Ｋ２を有する構成となっており、基板部１１、第一の枠部１２、第二の枠部１３とから構成されている。
基板部１１は、第一の枠部１２、第二の枠部１３に挟まれた構造となっている。ここで、第一の枠部１２は、基板部１１に接合されて第一の凹部Ｋ１が形成される。また、第二の枠部１３は、基板部１１に接合されて第二の凹部Ｋ２が形成される。本発明における圧電発振器１００は、放熱基板４０側を向く第二の凹部Ｋ２側に集積回路素子３０が収容されている。また、蓋部材１４で封止される第一の凹部Ｋ１側には、圧電振動素子２０が収容されている。ここで、素子搭載部材１０を構成する基板部１１と第一の枠部１２、第二の枠部１３とは、例えば、ガラス−セラミック、アルミナセラミックス等のセラミック材料からなる。 As shown in FIG. 1, the element mounting member 10 has a first recess K <b> 1 and a second recess K <b> 2, and includes a substrate portion 11, a first frame portion 12, and a second frame portion 13. It consists of and.
The substrate part 11 has a structure sandwiched between the first frame part 12 and the second frame part 13. Here, the first frame portion 12 is joined to the substrate portion 11 to form the first concave portion K1. The second frame portion 13 is joined to the substrate portion 11 to form a second recess K2. In the piezoelectric oscillator 100 according to the present invention, the integrated circuit element 30 is accommodated on the second recess K2 side facing the heat dissipation substrate 40 side. In addition, the piezoelectric vibration element 20 is accommodated on the first concave portion K1 side sealed with the lid member 14. Here, the board | substrate part 11, the 1st frame part 12, and the 2nd frame part 13 which comprise the element mounting member 10 consist of ceramic materials, such as glass-ceramics and an alumina ceramic, for example.

蓋部材１４は、圧電振動素子２０の収容される第一の凹部Ｋ１を気密封止する構造となっている。また、蓋部材１４は、４２アロイやコバール、リン青銅等からなる。 The lid member 14 has a structure that hermetically seals the first recess K1 in which the piezoelectric vibration element 20 is accommodated. The lid member 14 is made of 42 alloy, Kovar, phosphor bronze, or the like.

圧電振動素子２０は、圧電素板の両主面に励振用電極(図示せず)を備える構造となっている。また、圧電振動素子２０は、所定の結晶軸でカットした圧電素板の両主面に形成された一対の励振用電極に、外部からの交番電圧が印加されると、所定の周波数で厚みすべり振動を起こす。圧電素板としては例えば水晶が用いられる。 The piezoelectric vibration element 20 has a structure in which excitation electrodes (not shown) are provided on both principal surfaces of the piezoelectric element plate. In addition, the piezoelectric vibration element 20 causes a thickness slip at a predetermined frequency when an external alternating voltage is applied to a pair of excitation electrodes formed on both main surfaces of the piezoelectric element plate cut along a predetermined crystal axis. Causes vibration. As the piezoelectric element plate, for example, quartz is used.

集積回路素子３０は、少なくとも発振回路を備える構成となっている。また、集積回路素子３０は、基板部１１の他方の主面に設けられた実装パターンにバンプ３１を介して実装されることで接合されている。ここで、集積回路素子３０の基板部１１側を向く面には、回路が形成されている。また、集積回路素子３０の収容される第二の凹部Ｋ２を形成する第二の枠部１３には、その四隅に放熱基板４０と接合される放熱基板接続端子１５が設けられている。また、第二の枠部１３の放熱基板接続端子１５と放熱基板４０の一方の主面の四隅に形成された枠部接続端子４５とは、電気的および機械的に接合され、かつ固定されている。
集積回路素子３０は、回路の形成された面に、周囲の温度状態を検知する感温素子、圧電振動素子２０の温度特性を補償する温度補償データを有し、温度補償データに基づいて前記圧電振動素子２０の振動特性を温度変化に応じて補正する温度補償回路、温度補償回路に接続されて所定の発振出力を生成する発振回路等が設けられている。前記発振回路で生成された発振出力は、外部に出力された後、例えばクロック信号等の基準信号として利用されることとなる。ここで圧電振動素子２０と集積回路素子３０は、基板部１１の内部に設けられた内層配線（図示せず）により接続されている。 The integrated circuit element 30 is configured to include at least an oscillation circuit. Further, the integrated circuit element 30 is bonded to a mounting pattern provided on the other main surface of the substrate portion 11 by being mounted via bumps 31. Here, a circuit is formed on the surface of the integrated circuit element 30 facing the substrate portion 11 side. In addition, the second frame portion 13 forming the second recess K2 in which the integrated circuit element 30 is accommodated is provided with the heat dissipation substrate connection terminals 15 joined to the heat dissipation substrate 40 at the four corners. Further, the heat dissipation board connection terminal 15 of the second frame 13 and the frame connection terminals 45 formed at the four corners of one main surface of the heat dissipation board 40 are electrically and mechanically joined and fixed. Yes.
The integrated circuit element 30 has, on the surface on which the circuit is formed, a temperature-sensitive element that detects the ambient temperature state, and temperature compensation data that compensates the temperature characteristics of the piezoelectric vibration element 20, and the piezoelectric circuit is based on the temperature compensation data. A temperature compensation circuit that corrects the vibration characteristics of the vibration element 20 according to a temperature change, an oscillation circuit that is connected to the temperature compensation circuit and generates a predetermined oscillation output, and the like are provided. The oscillation output generated by the oscillation circuit is output to the outside and then used as a reference signal such as a clock signal. Here, the piezoelectric vibration element 20 and the integrated circuit element 30 are connected by an inner layer wiring (not shown) provided inside the substrate portion 11.

放熱基板４０は、素子搭載部材１０の第二の凹部Ｋ２側に接合され、一方の主面の中央に設けられる放熱用パターン４１と一方の主面の四隅に設けられる枠部接続端子４５と他方の主面の四隅に設けられる外部接続端子４６とを備える構成となっている。
また、放熱基板４０は、集積回路素子３０の回路形成面の反対側と接する面に放熱用パターン４１が形成されている。この放熱用パターン４１は、放熱基板４０の一方主面の四隅に設けられた枠部接続端子４５の一つと接続されている。また、放熱基板４０の他方の主面の四隅に設けられた外部接続端子４６は、内層配線（図示せず）により向かい合っている端子が枠部接続端子４５と接続されている。尚、放熱基板４０の他方の主面の四隅に設けられた４つの外部接続端子４６は、それぞれＶＣＣ端子、ＶＣＯＮ端子、ＯＵＴ端子、グランド端子として機能している。
ここで、前記放熱用パターン４１と接続される枠部接続端子４５は、グランド端子として機能する外部接続端子４６と接続されている。尚、放熱基板４０の材質としては、例えば、フレキシブル基板やセラミック基板などが用いられる。また、放熱用パターン４１、枠部接続端子４５、外部接続端子４６の材質としては、例えば、金や銅などの熱伝導率の高い金属が用いられる。また、放熱基板接続端子１５と枠部接続端子４５は、放熱基板４０と第二の枠部１３との接続用端子として機能している。 The heat dissipation substrate 40 is joined to the second recess K2 side of the element mounting member 10, and the heat radiation pattern 41 provided at the center of one main surface, the frame connection terminals 45 provided at the four corners of one main surface, and the other. The external connection terminals 46 are provided at the four corners of the main surface.
Further, the heat dissipation substrate 40 has a heat dissipation pattern 41 formed on the surface in contact with the opposite side of the circuit formation surface of the integrated circuit element 30. The heat radiation pattern 41 is connected to one of the frame connection terminals 45 provided at the four corners of the one main surface of the heat radiation substrate 40. Further, the external connection terminals 46 provided at the four corners of the other main surface of the heat dissipation substrate 40 are connected to the frame connection terminals 45 at the terminals facing each other by inner layer wiring (not shown). The four external connection terminals 46 provided at the four corners of the other main surface of the heat dissipation board 40 function as a VCC terminal, a VCON terminal, an OUT terminal, and a ground terminal, respectively.
Here, the frame connection terminal 45 connected to the heat radiation pattern 41 is connected to an external connection terminal 46 that functions as a ground terminal. In addition, as a material of the thermal radiation board | substrate 40, a flexible substrate, a ceramic substrate, etc. are used, for example. Moreover, as a material of the heat radiation pattern 41, the frame connection terminal 45, and the external connection terminal 46, for example, a metal having high thermal conductivity such as gold or copper is used. Further, the heat dissipation board connection terminal 15 and the frame part connection terminal 45 function as a connection terminal between the heat dissipation board 40 and the second frame part 13.

以上より、集積回路素子３０は、第二の凹部Ｋ２の形成される第二の枠部１３を放熱基板４０と接合したときに、回路の形成された面の反対側の面とが放熱基板４０に設けられた放熱用パターン４１と導電性接着剤４２を介して接合されている。また、放熱用パターン４１は、放熱基板４０の一方の主面の四隅に設けられた枠部接続電極４５の一つと接続されている。前記放熱パターン４１と接続される一つの枠部接続端子４５は、放熱基板４０の他方の主面に設けられた一つの外部電極端子４６と接続されている。つまり、集積回路素子３０の回路の形成された面の反対側の面は、放熱基板４０の一方の主面の中央に設けられた放熱用パターン４１から放熱基板４０の一方の主面の四隅に設けられた一つの枠部接続端子４５を介して、放熱基板４０の他方の主面の四隅に設けられた一つの外部接続端子４６と接続されている。   As described above, in the integrated circuit element 30, when the second frame portion 13 in which the second recess K2 is formed is joined to the heat dissipation substrate 40, the surface opposite to the surface on which the circuit is formed is the heat dissipation substrate 40. The heat radiation pattern 41 and the conductive adhesive 42 are bonded to each other. Further, the heat radiation pattern 41 is connected to one of the frame connection electrodes 45 provided at the four corners of one main surface of the heat radiation substrate 40. One frame connection terminal 45 connected to the heat dissipation pattern 41 is connected to one external electrode terminal 46 provided on the other main surface of the heat dissipation substrate 40. That is, the surface opposite to the surface on which the circuit of the integrated circuit element 30 is formed is from the heat radiation pattern 41 provided at the center of one main surface of the heat dissipation substrate 40 to the four corners of one main surface of the heat dissipation substrate 40. It is connected to one external connection terminal 46 provided at the four corners of the other main surface of the heat radiating substrate 40 through one provided frame connection terminal 45.

したがって、本発明の圧電発振器１００は、集積回路素子３０の回路の形成された面の反対側となる面が導電性接着剤４２を介して放熱基板４０と接合したことにより、放熱基板４０が放熱板として機能する。その結果、本発明の圧電発振器１００は、集積回路素子３０の発熱により集積回路素子３０の感温素子の感知する温度の上昇を抑えることができ、圧電発振器１００の発振周波数の変動を防ぐことが可能となる。
即ち、本発明の圧電発振器１００においては、集積回路素子３０による発熱が導電性接着剤４２を介して放熱基板４０の一方の主面の中央に設けられた放熱用パターン４１に熱伝導される構造となっている。また、放熱用パターン４１は、放熱基板４０の一方の主面の四隅に設けられた枠部接続端子４５の一つと接続され、放熱基板４０の他方の主面の四隅に設けられた外部接続端子４６の一つに接続されている。これにより、本発明の圧電発振器１００においては、集積回路素子３０からの発熱が、集積回路素子３０と接続された放熱基板４０の導電性接着剤４２、放熱用パターン４１、枠部接続端子４５、外部接続端子４６の金属部分を伝わっていく。これにより集積回路素子３０からの発熱は、広範囲に広がり、集積回路素子３０と接続された放熱基板４０の金属部分の外部に露出した部分が外気にさらされているため、外気で熱冷却され、外部に放熱されることになる。 Therefore, in the piezoelectric oscillator 100 of the present invention, the surface opposite to the surface on which the circuit of the integrated circuit element 30 is formed is joined to the heat dissipation substrate 40 via the conductive adhesive 42, so that the heat dissipation substrate 40 dissipates heat. Functions as a board. As a result, the piezoelectric oscillator 100 of the present invention can suppress an increase in temperature sensed by the temperature-sensitive element of the integrated circuit element 30 due to heat generation of the integrated circuit element 30, and prevent fluctuations in the oscillation frequency of the piezoelectric oscillator 100. It becomes possible.
That is, in the piezoelectric oscillator 100 of the present invention, the heat generated by the integrated circuit element 30 is thermally conducted to the heat radiation pattern 41 provided at the center of one main surface of the heat radiation substrate 40 via the conductive adhesive 42. It has become. The heat radiation pattern 41 is connected to one of the frame connection terminals 45 provided at the four corners of one main surface of the heat dissipation board 40, and the external connection terminals provided at the four corners of the other main surface of the heat dissipation board 40. 46 is connected to one of them. Thereby, in the piezoelectric oscillator 100 of the present invention, the heat generated from the integrated circuit element 30 is generated by the conductive adhesive 42 of the heat dissipation substrate 40 connected to the integrated circuit element 30, the heat radiation pattern 41, the frame portion connection terminal 45, The metal part of the external connection terminal 46 is transmitted. As a result, the heat generated from the integrated circuit element 30 spreads over a wide area, and the exposed portion of the metal portion of the heat dissipation board 40 connected to the integrated circuit element 30 is exposed to the outside air. Heat will be radiated to the outside.

また、本発明の圧電発振器１００においては、集積回路素子３０の回路の形成された面と反対側と接続されたグランド端子として機能する外部接続端子４６が外部の実装基板のグランド電極と接合される構造となっている。このようにグランド端子が外部のグランド電極と接合された構造では、集積回路素子３０からの発熱をグランド端子として機能する外部接続端子４６から外部の実装基板のグランド電極に放熱できる。その際、圧電発振器のグランド端子として機能する外部接続端子４６と接合される外部の実装基板のグランド電極は、その面積を大きくすることで、放熱面積を大きくでき放熱効果を高めることができる。   In the piezoelectric oscillator 100 of the present invention, the external connection terminal 46 that functions as a ground terminal connected to the opposite side of the surface of the integrated circuit element 30 where the circuit is formed is joined to the ground electrode of the external mounting substrate. It has a structure. In such a structure in which the ground terminal is joined to the external ground electrode, heat generated from the integrated circuit element 30 can be radiated from the external connection terminal 46 functioning as the ground terminal to the ground electrode of the external mounting substrate. At that time, by increasing the area of the ground electrode of the external mounting substrate joined to the external connection terminal 46 functioning as the ground terminal of the piezoelectric oscillator, the heat dissipation area can be increased and the heat dissipation effect can be enhanced.

また、前記した実施形態以外にも、本発明の要旨を逸脱しない範囲において種々の変更、改良等が可能である。例えば、前記実施形態に示した電子デバイスは、圧電発振器１００の第一の凹部Ｋ１に搭載する圧電振動素子２０として、平面視矩形状の圧電素板の表面に励振用電極や、引出電極を設けた形態の圧電振動素子２０を示したが、これに限定することなく、例えば、平面視形状が円形や、音叉形の圧電素板に各種電極を設けた形態の圧電振動素子でもよく、又圧電振動素子に変えて弾性表面波素子を用いても構わない。   In addition to the above-described embodiments, various changes and improvements can be made without departing from the scope of the present invention. For example, in the electronic device shown in the above embodiment, as the piezoelectric vibration element 20 mounted in the first recess K1 of the piezoelectric oscillator 100, an excitation electrode and an extraction electrode are provided on the surface of a rectangular piezoelectric base plate in plan view. However, the present invention is not limited to this. For example, the piezoelectric vibration element 20 may have a circular shape in plan view, or a piezoelectric vibration element in which various electrodes are provided on a tuning fork-shaped piezoelectric element plate. A surface acoustic wave element may be used instead of the vibration element.

１０・・・素子搭載部材
１１・・・基板部
１２・・・第一の枠部
１３・・・第二の枠部
１４・・・蓋部材
１５・・・放熱基板接続端子
２０・・・圧電振動素子
３０・・・集積回路素子
３１・・・バンプ
４０・・・放熱基板
４１・・・放熱用パターン
４２・・・導電性接着剤
４５・・・枠部接続端子
４６・・・外部接続端子
Ｋ１・・・第一の凹部
Ｋ２・・・第二の凹部 DESCRIPTION OF SYMBOLS 10 ... Element mounting member 11 ... Board | substrate part 12 ... 1st frame part 13 ... 2nd frame part 14 ... Cover member 15 ... Radiation board connection terminal 20 ... Piezoelectric Vibration element 30 ... Integrated circuit element 31 ... Bump 40 ... Heat dissipation substrate 41 ... Heat dissipation pattern 42 ... Conductive adhesive 45 ... Frame connection terminal 46 ... External connection terminal K1 ... first recess K2 ... second recess

Claims (2)

第一の凹部と第二の凹部を有する素子搭載部材と、
前記第一の凹部に収容され、圧電素板の両主面に励振用電極を備える圧電振動素子と、
前記第二の凹部に収容され、少なくとも発振回路を備える集積回路素子と、
前記第一の凹部を封止する蓋部材と、
前記素子搭載部材の前記第二の凹部側に接合され、一方の主面の中央に設けられる放熱用パターンと一方の主面の四隅に設けられる枠部接続端子と他方の主面の四隅に設けられる外部接続端子とを備える放熱基板とを備え、
前記放熱用パターンの表面と前記集積回路素子の回路形成面の反対側になる面とが導電性接着剤を介して接合され、
前記放熱用パターンと前記枠部接続端子の一つとが接続され、
前記放熱用パターンと接続された前記枠部接続端子と前記外部接続端子の一つとが接続されていることを特徴とする電子デバイス。 An element mounting member having a first recess and a second recess;
A piezoelectric vibration element housed in the first recess, and provided with excitation electrodes on both principal surfaces of the piezoelectric element plate;
An integrated circuit element housed in the second recess and provided with at least an oscillation circuit;
A lid member for sealing the first recess;
Bonded to the second recess side of the element mounting member and provided at the center of one main surface, a heat radiation pattern provided at the four corners of one main surface, and provided at the four corners of the other main surface And a heat dissipation board provided with an external connection terminal,
The surface of the heat dissipation pattern and the surface opposite to the circuit forming surface of the integrated circuit element are bonded via a conductive adhesive,
The heat dissipation pattern and one of the frame connection terminals are connected,
The frame device connection terminal connected to the heat radiation pattern and one of the external connection terminals are connected. 前記放熱用パターンと前記枠部接続端子を介して接続される前記外部接続端子がグランド端子として機能することを特徴とする請求項１記載の電子デバイス。   The electronic device according to claim 1, wherein the external connection terminal connected to the heat radiation pattern via the frame connection terminal functions as a ground terminal.
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