JP2008035175A - Piezoelectric oscillator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a piezoelectric oscillator with which a compact oscillator immune to the effect of an external environment can be obtained. <P>SOLUTION: In the piezoelectric oscillator: including a first package 10 with an electrode terminal 19 mounted on a mount circuit board wherein a semiconductor component 7 is mounted in a container package with a projection opening 15 at its upper part; and a second package 1 wherein a piezoelectric vibrator 5 formed by forming an exciting electrode to a piezoelectric raw plate is mounted in an enclosed package, and wherein the second package 1 is mounted on an opening upper part of the first package 10, and the package 1 and the package 10 are joined together with electric connection, a groove 20 is formed around the container package of the first package 10 for mounting the semiconductor component 7. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a piezoelectric oscillator used in an electronic device such as a portable communication device.

  Conventionally, piezoelectric oscillators have been used in electronic devices such as portable communication devices.

  As such a conventional piezoelectric oscillator, for example, as shown in FIG. 3, although not shown in the drawing, the second container 23 in which the piezoelectric vibrator is accommodated is placed in the cavity portion 25 with the above-mentioned piezoelectric oscillator. A piezoelectric oscillator having a structure attached to a first container 21 in which an electronic component element such as a semiconductor component 26 or a capacitor for controlling an oscillation output based on vibration of a vibrator is accommodated is known. Is mounted on the mounting circuit board by soldering external terminals provided on the lower surface of the first container 21 to the wiring of the mounting circuit board.

  The second container 23 and the first container 21 are usually formed of a ceramic material, and a wiring conductor is formed inside or on the surface, and a conventionally known ceramic green sheet lamination method or the like is adopted. It is manufactured by.

The semiconductor component 26 is provided with a temperature compensation circuit for correcting the oscillation frequency of the piezoelectric oscillator based on temperature compensation data created in accordance with the temperature characteristics of the piezoelectric vibrator. In order to store the temperature compensation data in the memory of the semiconductor component 26, a write control terminal 27 for writing temperature compensation data is provided on the lower surface and the outer surface of the first container 21. It was. The temperature compensation data is stored in the memory of the semiconductor component 26 by applying the probe needle of the temperature compensation data writing device to the write control terminal 27 and inputting the temperature compensation data into the memory in the semiconductor component 26.
JP 2004-129090 A

  The applicant has not found any prior art documents related to the present invention by the time of filing of the present application other than the prior art documents specified by the prior art document information described above.

  However, when the semiconductor component 26 of the conventional piezoelectric oscillator described above is disposed in the concave opening of the first container 21, the gap between the joint surfaces of the second container 23 and the first container 21 causes the external There is a disadvantage that fluctuations of the oscillation frequency of the piezoelectric oscillator occur due to intrusion of unnecessary materials such as a fill resin used for the insulation protection of the piezoelectric oscillator.

  The present invention has been conceived in view of the above-described drawbacks. Accordingly, an object of the present invention is to provide a piezoelectric oscillator capable of obtaining a stable oscillation characteristic of an oscillation frequency that is not affected by the external environment.

  The piezoelectric oscillator of the present invention includes a first container having an electrode terminal mounted on a mounting circuit board, a semiconductor container mounted on a storage container having a concave opening on the top, and a piezoelectric element having an excitation electrode formed on a piezoelectric base plate. In a piezoelectric container in which a vibrator is mounted in an airtight container, the second container is mounted on an upper part of the opening of the first container, and the piezoelectric oscillator is joined including an electrical connection. A groove is formed around the semiconductor component of the container.

  The piezoelectric oscillator of the present invention is characterized in that, in the above configuration, a groove is formed on at least a part of a joint surface of the first container with the second container.

  According to the piezoelectric oscillator of the present invention, the first container having the electrode terminal to be mounted on the mounting circuit board, the semiconductor container being mounted on the storage container having the recess opening on the upper part, and the excitation electrode formed on the piezoelectric element plate In a piezoelectric container in which the piezoelectric vibrator is mounted in an airtight container, the second container is mounted on the upper portion of the opening of the first container, and the piezoelectric oscillator is joined including electrical connection. Since the groove is formed around the semiconductor component in one container, the intrusion of unnecessary materials from the outside into the semiconductor component by allowing the intrusion of unnecessary materials from the outside into the groove around the container. It is possible to suppress fluctuations in the oscillation frequency of the piezoelectric oscillator due to the above.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. In addition, the same code | symbol in each figure shall show the same object.
FIG. 1 is a cross-sectional view of the piezoelectric oscillator according to the present invention taken along line XX ′ shown in FIG. 2, and FIG. 2 shows a first portion having an opening 15 showing one substrate region cut from an insulating ceramic wafer substrate. 1 is a top view of one container 10. FIG. In the piezoelectric oscillator shown in FIG. 1, the electrode terminal 19 is provided on the lower surface of the first container 10 having the opening 15 for accommodating the semiconductor component 7, and the first container 10 having the opening 15 for accommodating the semiconductor component 7. A semiconductor component 7 is mounted on the upper surface of the. The side wall surrounding the opening 15 of the first container 10 having the opening 15 for housing the semiconductor component 7 has a frame wall 13 and a plurality of write control terminals 11 on the outer surface of the frame wall 13. Is formed.

  Further, as shown in FIG. 1, the upper surface of the frame wall portion 13 has a structure in which the second container 1 in which the piezoelectric vibrator 5 is accommodated is placed and fixed. Further, in the piezoelectric oscillator of the present invention, the groove 201 is formed around the storage container on which the semiconductor component 7 of the first container 10 is mounted and on the upper surface of the frame wall 13.

  In FIG. 1, the second container 1 includes, for example, a substrate 2 made of a ceramic material such as glass-ceramic and alumina ceramic, a side wall 3 made of a ceramic material similar to the substrate 2, 42, alloy, Kovar, phosphor bronze, etc. The second container 1 is configured by attaching the side wall 3 to the upper surface of the substrate 2 and mounting and fixing the lid 4 on the upper surface of the substrate 2. A piezoelectric vibrator 5 is mounted on the upper surface of the substrate 2 located inside.

  The second container 1 accommodates the piezoelectric vibrator 5 in its interior, specifically, in a space surrounded by the upper surface of the substrate 2, the inner surface of the side wall 3, and the lower surface of the lid body 4. A pair of mounting pads connected to the vibration electrode of the piezoelectric vibrator 5 is connected to the upper surface of the substrate 2, and a frame wall portion 13 on the first container 10 described later is connected to the lower surface of the substrate 2. A plurality of connection terminals 17 are provided, and these pads and terminals are electrically connected to each other through wiring patterns on the surface of the substrate 2 and via holes embedded in the substrate. Has been.

  On the other hand, the piezoelectric vibrator 5 housed in the second container 1 is formed by attaching and forming a pair of vibration electrodes on both main surfaces of a piezoelectric element plate cut along a predetermined crystal axis, and from the outside. Is applied to the piezoelectric element plate via a pair of vibrating electrodes, thickness shear vibration occurs at a predetermined frequency.

  Here, the lid 4 of the second container 1 can be connected to the electrode terminal 19 for the ground terminal described later via the connection terminal 17 of the second container 1 and the connection terminal 18 of the first container 10. For example, since the lid 4 made of metal is connected to a reference potential during use, the shield function is provided, so that the piezoelectric vibrator 5 and the semiconductor component 7 can be satisfactorily prevented from unnecessary electrical action from the outside. Can be protected. Therefore, the lid 4 of the second container 1 is connected to the electrode terminal 19 for the ground terminal via the connection terminal 17 of the second container 1 and the connection terminal 18 of the first container 10. preferable.

  And the 1st container 10 which has the opening part 15 which accommodates the semiconductor component 7 in which the 2nd container 1 mentioned above is attached has comprised the substantially rectangular shape, and is a glass cloth base material epoxy resin, polycarbonate, epoxy. It is formed so as to have a flat plate shape by a resin material such as resin or polyimide resin, or a ceramic material such as glass-ceramic or alumina ceramic.

  The first container 10 having the opening 15 for accommodating the semiconductor component 7 has four electrode terminals 19 (power supply voltage terminal, ground terminal, oscillation output terminal, oscillation control terminal) formed at the four corners on the lower surface of the substrate region. The frame wall 13 is formed at the periphery of the four corners of the upper surface, the flip chip type semiconductor component 7 is formed at the central area of the upper surface, and the write control is performed on the outer side surface of the frame wall 13 between the four corners. A terminal 11 is provided.

  The four electrode terminals 19 provided on the lower surface of the first container 10 having the opening 15 for accommodating the semiconductor component 7 function as terminals for connecting the piezoelectric oscillator to a mounting circuit board such as a mother board. When the piezoelectric oscillator is mounted on the mounting circuit board, it is electrically connected to the circuit wiring of the mounting circuit board via a conductive bonding material such as solder.

  Further, the frame wall portion 13 provided on the upper surface of the first container 10 having the opening 15 for accommodating the semiconductor component 7 includes the first container 10 having the opening 15 for accommodating the semiconductor component 7 and the second container 10. The connection terminal 18 of the first container 10 having the opening 15 for accommodating the semiconductor component 7 is secured to the second container 18 while securing a predetermined interval necessary for arranging the semiconductor component 7 between the container 1 and the container 1. This is for connection to the connection terminal 17 of the container 1.

  Furthermore, a plurality of electrode pads are provided in the central region of the first container 10 having the opening 15 for accommodating the semiconductor component 7 described above, and the connection pads of the semiconductor component 7 are Au bumps on these electrode pads. The semiconductor component 7 is attached to a predetermined position on the first container 10 having the opening 15 by being electrically and mechanically connected through a conductive bonding material 8 such as solder, anisotropic conductive adhesive or the like. Worn.

  The semiconductor component 7 includes, on its circuit formation surface (lower surface), a temperature sensing element such as a thermistor for detecting the ambient temperature state, a memory for storing temperature compensation data for compensating temperature characteristics of the piezoelectric vibrator 5, and a memory in the memory. A temperature compensation circuit that corrects the vibration characteristics of the piezoelectric vibrator 5 according to temperature changes based on temperature compensation data, an oscillation circuit that is connected to the previous temperature compensation circuit and generates a predetermined oscillation output, and the like are provided. The oscillation output generated by this oscillation circuit is output to the outside and then used as a reference signal such as a clock signal.

  Here, as shown in FIG. 1 and FIG. 2, the characteristic part of the present invention is a first example in which the semiconductor component 7 is mounted in a storage container having an electrode terminal 19 mounted on a mounting circuit board and having a recess opening 15 in the upper part. The first container 10 and the second container 1 in which the piezoelectric vibrator 5 having an excitation electrode formed on the piezoelectric element plate is mounted in a sealed container, and the second container 1 is mounted on the opening 15 of the first container 10. In addition, in the piezoelectric oscillator joined including the electrical connection, the groove portion 202 is formed around the storage container on which the semiconductor component 7 of the first container 10 is mounted. Intrusion from the surroundings into the groove 202 around the housing container makes it possible to suppress fluctuations in the oscillation frequency of the piezoelectric oscillator due to intrusion of unwanted materials from the outside into the semiconductor component 7.

  In addition, this invention is not limited to the above-mentioned embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.

1 is a schematic cross-sectional view of a piezoelectric oscillator according to an embodiment of the present invention. It is a top view of the 1st container which has the opening part of the piezoelectric oscillator concerning the embodiment of the present invention. It is a schematic perspective view of a conventional piezoelectric oscillator.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... 2nd container 2 ... Board | substrate 3 ... Side wall 4 ... Cover body 5 ... Piezoelectric vibrator 7 ... Semiconductor component 8 ... Conductive joining material 10 ... 1st 1 container 11 ... writing control terminal 13 ... frame wall 15 ... opening 17 ... second container connection terminal 18 ... first container connection terminal 201・ Groove 202 ・ ・ Groove

Claims (1)

A first container having semiconductor terminals mounted in a storage container having an electrode terminal to be mounted on a mounting circuit board and having a recess opening on the top, and a piezoelectric vibrator having an excitation electrode formed on a piezoelectric element plate are mounted in a sealed container In the piezoelectric container in which the second container is mounted on the upper part of the opening of the first container and joined including electric connection,
A piezoelectric oscillator characterized in that a groove is formed around a semiconductor component of the first container.

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