JP6168949B2 - Piezoelectric vibrating piece and piezoelectric vibrator - Google Patents

Description

  The present invention relates to a piezoelectric vibrating piece and a piezoelectric vibrator.

  For example, a cellular phone or a portable information terminal device often uses a piezoelectric vibrator using a crystal or the like as a device used for a time source, a timing source such as a control signal, a reference signal source, or the like. As this type of piezoelectric vibrator, a piezoelectric vibrator in which a piezoelectric vibrating piece is hermetically sealed in a package in which a cavity is formed is known.

As the piezoelectric vibrating piece, for example, a pair of vibrating arm portions, a base portion that connects one end in the longitudinal direction of the pair of vibrating arm portions, and a base portion that is connected between the pair of vibrating arm portions in the longitudinal direction. And a support portion extending along the line (see, for example, Patent Document 1). When a voltage is applied to the excitation electrode formed on each vibrating arm portion, the piezoelectric vibrating piece vibrates at a predetermined frequency so that the pair of vibrating arm portions approach and separate from each other.
In this piezoelectric vibrating piece, a pair of mount electrodes (mount portions) formed on a support portion is bonded to a connection electrode formed on a substrate of a package, for example, with a conductive adhesive.

  By the way, due to the recent demand for miniaturization of cellular phones, portable information terminal devices, etc., miniaturization is also required for the piezoelectric vibrating reed housed in the package. At this time, as the piezoelectric vibrating piece is reduced in size, the support portion on which the mount electrode is formed is also reduced in size.

  Further, it is known that when a piezoelectric vibrating piece is operated, an event (hereinafter referred to as “vibration leakage”) in which vibration leaks to the outside of the package through the support portion occurs. Since this vibration leakage leads to an increase in CI value (Crystal Impedance), it is necessary to suppress it as much as possible. In general, by ensuring a long separation distance between the mount electrode of the support portion and the vibrating arm portion, the vibration of the vibrating arm portion can be attenuated between the mount electrode of the support portion and the vibrating arm portion, and vibration leakage can be suppressed. It has been known.

JP 2006-345517 A

However, in the prior art, the distance between the pair of mount electrodes is shortened by downsizing the support portion. For this reason, when the piezoelectric vibrating piece is mounted on the substrate of the package, the conductive adhesive may spread and the pair of mount electrodes may be short-circuited.
In addition, since the piezoelectric vibrating piece is downsized, the separation distance between the mount electrode of the support portion and the vibrating arm portion cannot be ensured sufficiently long, and therefore, vibration leakage may not be effectively suppressed.

  Therefore, the present invention has been made in view of the above circumstances, and it is an object to provide a piezoelectric vibrating piece that can prevent a short circuit failure of the mount portion and suppress vibration leakage and a piezoelectric vibrator including the piezoelectric vibrating piece. To do.

  In order to solve the above-described problem, a piezoelectric vibrating piece according to the present invention includes a pair of vibrating arm portions, a base portion that connects one end portions in the longitudinal direction of the pair of vibrating arm portions, and the pair of vibrating arms. And a support portion connected to the base portion and extending along the longitudinal direction. The support portion includes a pair of mount portions, and the pair of mount portions. An opening that penetrates the support portion is formed between the two.

According to the present invention, since the opening penetrating the support portion is formed between the pair of mount portions, when mounting the piezoelectric vibrating reed on the substrate using the conductive adhesive, in the vicinity of the mount portion. The spread conductive adhesive can penetrate into the opening. Thereby, it is possible to prevent the pair of mount parts from being connected to each other by the conductive adhesive, and thus it is possible to prevent a short circuit failure of the mount part. In addition, since the rigidity of the support portion is reduced by providing the opening that penetrates the support portion, the vibration transmitted from the vibrating arm portion to the support portion can be attenuated by the support portion. Therefore, vibration leakage from the piezoelectric vibrating piece can be suppressed.
Further, since the conductive adhesive enters the opening, the adhesion area of the conductive adhesive to the piezoelectric vibrating piece increases, so that the fixing force when the piezoelectric vibrating piece is mounted on the substrate can be increased. Therefore, the impact resistance when the piezoelectric vibrating piece is mounted on the substrate can be improved.

  Further, the support portion is provided with a pair of mount portions at different positions in the longitudinal direction.

  According to the present invention, the support portion is provided with the pair of mount portions at different positions in the longitudinal direction, so that it is possible to prevent the pair of mount portions from being connected to each other by the conductive adhesive. It is possible to reliably prevent short circuit defects.

  The opening may be a slit that extends along the longitudinal direction and divides the support into a first support and a second support in a width direction orthogonal to the longitudinal direction. Yes.

  According to the present invention, since the opening is a slit that divides the support portion, the first mount portion provided in the first support portion and the second mount portion provided in the second support portion are electrically conductive. Can be suppressed by the adhesive.

  In the slit, a wall portion connecting the first support portion and the second support portion is provided along the width direction, and the wall portion is the pair of mount portions in the longitudinal direction. It is characterized by being provided between.

According to the present invention, since the wall portion in the slit is provided between the pair of mount portions in the longitudinal direction, one conductive adhesive for bonding the first mount portion to the substrate, and the second Even if the other conductive adhesive that adheres the mount part to the substrate enters the slits, the wall part causes one conductive adhesive and the other conductive adhesive to It can be surely prevented from being connected. Accordingly, it is possible to reliably prevent a short circuit failure of the mount portion.
Furthermore, by adjusting the width and shape of the wall portion, the rigidity of the support portion and the degree of suppression of vibration leakage by the support portion can be set to desired values.

  In addition, the pair of mount portions are respectively provided at a distal end portion of the first support portion and a distal end portion of the second support portion, and the first support portion and the second support portion have a length from each other. It is characterized by being different.

  According to the present invention, the separation distance between the pair of mount portions can be sufficiently ensured along the longitudinal direction of the vibrating arm portion. Therefore, since it is possible to reliably prevent the pair of mount portions from being connected to each other, it is possible to reliably prevent a short-circuit failure of the mount portions.

  In addition, the piezoelectric vibrator of the present invention is characterized in that the above-described piezoelectric vibrating piece is housed in a package.

  According to the present invention, since the piezoelectric vibrating piece that can prevent a short circuit failure of the mount portion and suppress vibration leakage is housed in the package, it is possible to obtain a high-performance piezoelectric vibrator having excellent reliability. it can.

According to the present invention, since the opening penetrating the support portion is formed between the pair of mount portions, when mounting the piezoelectric vibrating reed on the substrate using the conductive adhesive, in the vicinity of the mount portion. The spread conductive adhesive can penetrate into the opening. Thereby, it is possible to prevent the pair of mount parts from being connected to each other by the conductive adhesive, and thus it is possible to prevent a short circuit failure of the mount part. In addition, since the rigidity of the support portion is reduced by providing the opening that penetrates the support portion, the vibration transmitted from the vibrating arm portion to the support portion can be attenuated by the support portion. Therefore, vibration leakage from the piezoelectric vibrating piece can be suppressed.
Further, since the conductive adhesive enters the opening, the adhesion area of the conductive adhesive to the piezoelectric vibrating piece increases, so that the fixing force when the piezoelectric vibrating piece is mounted on the substrate can be increased. Therefore, the impact resistance when the piezoelectric vibrating piece is mounted on the substrate can be improved.

1 is an external perspective view of a piezoelectric vibrator according to an embodiment. It is an internal block diagram of the piezoelectric vibrator shown in FIG. It is sectional drawing which follows the AA line of the piezoelectric vibrator shown in FIG. FIG. 2 is an exploded perspective view of the piezoelectric vibrator shown in FIG. 1. It is a top view of the piezoelectric vibrating piece according to the embodiment. It is sectional drawing along the BB line of FIG. It is a top view of the piezoelectric vibrating piece which concerns on the 1st modification of embodiment. It is a top view of the piezoelectric vibrating piece which concerns on the 2nd modification of embodiment. FIG. 10 is a plan view of a piezoelectric vibrating piece according to another modification of the embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following, first, the piezoelectric vibrator will be described, and then the piezoelectric vibrating piece housed in the piezoelectric vibrator will be described.
FIG. 1 is an external perspective view of a piezoelectric vibrator 1 according to the embodiment, and FIG. 2 is an internal configuration diagram of the piezoelectric vibrator 1 in a state where a sealing plate 6 (see FIG. 1) is removed. 3A is a top view of FIG. 3, FIG. 3 is a cross-sectional view taken along the line AA of the piezoelectric vibrator 1 shown in FIG. 2, and FIG. 4 is an exploded perspective view of the piezoelectric vibrator 1 shown in FIG. 1. It is.
As shown in FIGS. 1 to 4, the piezoelectric vibrator 1 of the present embodiment includes a package 2 having a cavity C hermetically sealed therein, and a piezoelectric vibrating piece 3 </ b> A housed in the cavity C. This is a so-called ceramic package type surface-mount type vibrator.

  The piezoelectric vibrator 1 is formed in a substantially rectangular parallelepiped shape. In the following description, the length direction of the piezoelectric vibrator 1 in a plan view is referred to as a longitudinal direction L, and the short direction of the piezoelectric vibrator 1 perpendicular to the longitudinal direction is referred to as a width direction W. A direction orthogonal to the direction W is referred to as a thickness direction T.

The package 2 includes a package body 5 and a sealing plate 6 that is bonded to the package body 5 and forms a cavity C between the package body 5 and the package body 5.
The package body 5 includes a first base substrate 10 and a second base substrate 11 that are joined together in a state of being overlaid on each other, and a seal ring 12 that is joined onto the second base substrate 11.
The first base substrate 10 is a ceramic substrate formed in a substantially rectangular shape in plan view. The second base substrate 11 is a ceramic substrate formed in a substantially rectangular shape in plan view having the same outer shape as the first base substrate 10, and is sintered in a state of being stacked on the first base substrate 10. Etc. are integrally joined together.

At the four corners of the first base substrate 10 and the second base substrate 11, cut-out portions 15 having a ¼ arc shape in plan view are formed over the entire thickness direction T of the first base substrate 10 and the second base substrate 11. ing. The first base substrate 10 and the second base substrate 11 are, for example, formed by stacking two wafer-shaped ceramic substrates and joining them, and then forming a plurality of through-holes penetrating both ceramic substrates in a matrix, and then forming each through-hole. It is produced by cutting both ceramic substrates into a grid while using the reference. At this time, the through hole is divided into four parts, thereby forming the cutout part 15.
The upper surface of the second base substrate 11 is a mounting surface 11a corresponding to the inner wall on which the piezoelectric vibrating piece 3A is mounted.

  Although the first base substrate 10 and the second base substrate 11 are made of ceramics, specific ceramic materials include, for example, alumina HTCC (High Temperature Co-Fired Ceramic), glass ceramics LTCC (LTCC ( Low Temperature Co-Fired Ceramic) and the like.

  The seal ring 12 is a conductive frame-like member that is slightly smaller than the outer shape of the first base substrate 10 and the second base substrate 11, and is bonded to the mounting surface 11 a of the second base substrate 11. Specifically, the seal ring 12 is bonded onto the mounting surface 11a by baking with a brazing material such as silver brazing or a solder material, or mounted by, for example, evaporation or sputtering other than electrolytic plating or electroless plating. It is joined by welding or the like to the metal joining layer formed on 11a.

  Examples of the material of the seal ring 12 include a nickel-based alloy, and specifically, may be selected from Kovar, Elinvar, Invar, 42-alloy, and the like. In particular, as the material of the seal ring 12, it is preferable to select a material having a thermal expansion coefficient close to that of the first base substrate 10 and the second base substrate 11 made of ceramics. For example, when alumina having a thermal expansion coefficient of 6.8 × 10 −6 / ° C. is used as the first base substrate 10 and the second base substrate 11, the thermal expansion coefficient is 5.2 × 10 − as the seal ring 12. It is preferable to use 6 / ° C. Kovar, 42-alloy having a thermal expansion coefficient of 4.5 to 6.5 × 10 −6 / ° C., or the like.

The sealing plate 6 is a conductive substrate stacked on the seal ring 12, and is hermetically bonded to the package body 5 by bonding to the seal ring 12. A space defined by the sealing plate 6, the seal ring 12, and the mounting surface 11a of the second base substrate 11 functions as the cavity C (see FIG. 3) hermetically sealed.
In addition, as a welding method of the sealing board 6, seam welding by making a roller electrode contact, laser welding, ultrasonic welding, etc. are mentioned, for example. Moreover, in order to make the welding of the sealing plate 6 and the seal ring 12 more reliable, a bonding layer such as nickel or gold that is familiar to each other is provided at least on the lower surface of the sealing plate 6 and the upper surface of the seal ring 12. It is preferable to form.

On the mounting surface 11 a of the second base substrate 11, a pair of electrode pads 20 </ b> A and 20 </ b> B that are connection electrodes with the piezoelectric vibrating piece 3 </ b> A are formed at different positions shifted from each other in the longitudinal direction L and the width direction W. A pair of external electrodes 21 </ b> A and 21 </ b> B are formed on the lower surface of the first base substrate 10 with an interval in the longitudinal direction L.
The electrode pads 20A and 20B and the external electrodes 21A and 21B are, for example, a single layer film made of a single metal formed by vapor deposition or sputtering, or a stacked film in which different metals are stacked, and are electrically connected to each other.

  As shown in FIG. 3, the first base substrate 10 is formed with one first through electrode 22 </ b> A that is electrically connected to one external electrode 21 </ b> A and penetrates the first base substrate 10 in the thickness direction T. The second base substrate 11 is formed with one second through electrode 23A that is electrically connected to one electrode pad 20A and penetrates the second base substrate 11 in the thickness direction T. And between the 1st base substrate 10 and the 2nd base substrate 11, one connection electrode 24A which connects one 1st penetration electrode 22A and one 2nd penetration electrode 23A is formed. Thereby, one electrode pad 20A and one external electrode 21A are electrically connected to each other.

The first base substrate 10 is formed with the other first through electrode 22B that is electrically connected to the other external electrode 21B and penetrates the first base substrate 10 in the thickness direction T. The second base substrate 11 is formed with the other second through electrode 23B that is electrically connected to the other electrode pad 20B and penetrates the second base substrate 11 in the thickness direction T. And between the 1st base substrate 10 and the 2nd base substrate 11, the other connection electrode 24B which connects the other 1st penetration electrode 22B and the other 2nd penetration electrode 23B is formed. Thereby, the other electrode pad 20B and the other external electrode 21B are electrically connected to each other.
The other connection electrode 24B is patterned so as to extend, for example, below the seal ring 12 along the seal ring 12 so as to avoid a recess 40 described later.

  As shown in FIG. 2, a recess 40 is formed in the mounting surface 11a of the second base substrate 11 at a portion facing the tip portions 30a and 31a of a pair of vibrating arm portions 30 and 31 of a piezoelectric vibrating piece 3A described later. Has been. For example, when the vibrating arm portions 30 and 31 are displaced in the thickness direction T (bending deformation) due to an impact caused by dropping or the like, the concave portion 40 and the distal end portions 30a and 31a of the vibrating arm portions 30 and 31 and the second base are provided. It is formed to avoid contact with the substrate 11. The recess 40 is a through-hole penetrating the second base substrate 11, and is formed in a rectangular shape in plan view with four corners rounded inside the seal ring 12.

(Piezoelectric vibrating piece)
The piezoelectric vibrating piece 3A is a vibrating piece formed of a piezoelectric material such as quartz, lithium tantalate, or lithium niobate, and has a pair of vibrating arm portions 30 and 31 arranged along the longitudinal direction L, and a pair of The base 32 connecting the base end portions 30b and 31b of the vibrating arm portions 30 and 31, and the extending direction of the pair of vibrating arm portions 30 and 31 are connected to the base portion 32 between the pair of vibrating arm portions 30 and 31. And a support portion 33 extending along the line. The longitudinal direction of the vibrating arm portions 30 and 31 coincides with the longitudinal direction L of the piezoelectric vibrator 1, the width direction of the vibrating arm portions 30 and 31 coincides with the width direction W of the piezoelectric vibrator 1, and the vibrating arm portions 30 and 31. The thickness direction of this corresponds to the thickness direction T of the piezoelectric vibrator 1.
In addition, the shape of the piezoelectric vibrating piece 3A is not limited to this, and for example, the vibrating arm portions 30 and 31 may be extended with an inclination of about 5 degrees at the maximum with respect to the longitudinal direction L. Good. That is, the piezoelectric vibrating reed 3 </ b> A has a shape in which the vibrating arms 30 and 31 are provided apart from each other in the width direction W of the base 32 and the support 33 is provided so as to extend along the longitudinal direction L therebetween. The shape of is not particularly limited.

The pair of vibrating arm portions 30 and 31 is, for example, a so-called hammer head type in which the width dimension on the distal end portions 30a and 31a side is larger than that on the proximal end portions 30b and 31b side. The weight on the tip portions 30a, 31a side and the moment of inertia during vibration are increased. As a result, the vibrating arm portions 30 and 31 are likely to vibrate, so that the overall length of the vibrating arm portions 30 and 31 is shortened to reduce the size.
The shape of the pair of vibrating arm portions 30 and 31 is not limited to a so-called hammer head type.

The pair of vibrating arm portions 30 and 31 includes groove portions 37 formed along the longitudinal direction L of the vibrating arm portions 30 and 31 on both main surfaces 30c and 31c, respectively.
The groove portion 37 is formed, for example, from the base end portions 30b and 31b of the vibrating arm portions 30 and 31 to the vicinity of the center.

The pair of vibrating arms 30 and 31 includes a weight metal film (not shown) coated on the outer surface for frequency adjustment for adjusting its own vibration state so as to vibrate within a predetermined frequency range. Yes. The weight metal film includes, for example, a coarse adjustment film (not shown) for coarsely adjusting the frequency and a fine adjustment film (not shown) for fine adjustment.
The frequency adjustment is performed by adjusting the weights of the coarse adjustment film and the fine adjustment film, and the frequency of the pair of vibrating arm portions 30 and 31 is adjusted to be within a predetermined target frequency range.

FIG. 5 is a plan view of the piezoelectric vibrating piece, and FIG. 6 is a cross-sectional view taken along line BB in FIG.
As shown in FIGS. 5 and 6, the pair of vibrating arm portions 30 and 31 includes a pair of excitation electrodes (a first excitation electrode 35 and a second excitation electrode 36) that vibrate the pair of vibration arm portions 30 and 31. Is provided on the surface of the piezoelectric plate 34 made of a piezoelectric material.

The excitation electrodes composed of the first excitation electrode 35 and the second excitation electrode 36 are patterned on the outer surfaces of the pair of vibrating arm portions 30 and 31 while being electrically insulated from each other, and the pair of vibrating arm portions 30. , 31 are vibrated at a predetermined frequency in a direction toward or away from each other.
For example, the first excitation electrode 35 is mainly formed on the groove portion 37 of the vibrating arm portion 30 on one side (right side in FIG. 5) and on both side surfaces of the vibrating arm portion 31 on the other side (left side in FIG. 5). It is continuously provided along the longitudinal direction L of the vibrating arm portions 30 and 31, respectively, on 31d. The second excitation electrode 36 is mainly formed on both side surfaces 30d of the vibrating arm portion 30 on one side and on the groove portion 37 of the vibrating arm portion 31 on the other side. It is provided continuously along the direction L.

On the outer surface of the support portion 33, a pair of mount electrodes 38A and 38B are provided as a mount portion for mounting the piezoelectric vibrating piece 3A.
The first mount electrode 38A has a rectangular shape in plan view, and on the other side in the width direction W (left side in FIG. 5), is closer to the base end portion 33b than the intermediate portion in the longitudinal direction L of the support portion 33. Is provided. The first mount electrode 38A is formed by patterning the first excitation electrode 35 continuously.
Further, the second mount electrode 38B has a rectangular shape in plan view, and on one side in the width direction W (right side in FIG. 5), the tip portion 33a side of the intermediate portion in the longitudinal direction L of the support portion 33. Is provided. The second mount electrode 38B is formed by patterning the second excitation electrode 36 continuously.
Thus, the pair of mount electrodes 38A and 38B are provided at different positions in the longitudinal direction L and the width direction W, respectively.
The mount electrodes 38A and 38B are electrically connected to the electrode pads 20A and 20B (see FIG. 4) when the piezoelectric vibrating piece 3A is mounted, so that the first electrodes are connected to the first electrodes from the external electrodes 21A and 21B (see FIG. 4). The excitation electrode 35 and the second excitation electrode 36 can be fed.

  A slit 50 is formed between the pair of mount electrodes 38A and 38B so as to penetrate the support portion 33 in the thickness direction T. The slit 50 extends along the longitudinal direction L from the distal end portion 33a to the proximal end portion 33b of the support portion 33 and divides the support portion 33 into the first support portion 33A and the second support portion 33B in the width direction W. Yes. Accordingly, the first mount electrode 38A is disposed on the proximal end side of the first support portion 33A, and the second mount electrode 38B is disposed on the distal end side of the second support portion 33B.

As shown in FIG. 4, in the step of mounting the piezoelectric vibrating piece 3A on the mounting surface 11a of the second base substrate 11, first, a conductive adhesive 45 is applied to the surfaces of the pair of electrode pads 20A and 20B.
Next, with the pair of mount electrodes 38A and 38B of the piezoelectric vibrating piece 3A and the pair of electrode pads 20A and 20B of the second base substrate 11 superimposed, the piezoelectric vibrating piece 3A faces the second base substrate 11. And press.
Finally, the step of mounting the piezoelectric vibrating piece 3 </ b> A on the mounting surface 11 a of the second base substrate 11 is completed by curing the conductive adhesive 45.

  Here, since the slit 50 is formed between the pair of mount electrodes 38A and 38B, when the piezoelectric vibrating piece 3A is pressed toward the second base substrate 11, the pair of mount electrodes 38A and 38B and The conductive adhesive 45 squeezed between the pair of electrode pads 20 </ b> A and 20 </ b> B enters the slit 50. This prevents the pair of mount electrodes 38A and 38B from being electrically connected via the expanded conductive adhesive 45.

(effect)
According to the present embodiment, since the slit 50 (opening) that penetrates the support portion 33 is formed between the pair of mount electrodes 38A and 38B, the piezoelectric vibrating reed 3A is attached using the conductive adhesive 45. When mounted on the second base substrate 11, the conductive adhesive 45 spreading near the mount electrodes 38 </ b> A and 38 </ b> B can enter the slit 50. Accordingly, the pair of mount electrodes 38A and 38B can be prevented from being connected to each other by the conductive adhesive 45, so that a short circuit failure of the mount electrodes 38A and 38B can be prevented. Moreover, since the rigidity of the support part 33 falls by providing the slit 50 which penetrates the support part 33, the vibration transmitted to the support part 33 from the vibrating arm parts 30 and 31 can be attenuated by the support part 33. Therefore, vibration leakage from the piezoelectric vibrating piece 3A can be suppressed.
Furthermore, since the adhesive area of the conductive adhesive 45 with respect to the piezoelectric vibrating piece 3A increases due to the conductive adhesive entering the slit 50, the adhesion force when the piezoelectric vibrating piece 3A is mounted on the second base substrate 11 is increased. Can be increased. Therefore, impact resistance when the piezoelectric vibrating piece 3A is mounted on the second base substrate 11 can be improved.

  Moreover, since the opening part formed in the support part 33 is the slit 50 which divides the support part 33 into the 1st support part 33A and the 2nd support part 33B, the 1st support part 33A provided with the 1st It is possible to reliably suppress the mounting electrode 38A and the second mounting electrode 38B provided on the second support portion 33B from being connected by the conductive adhesive 45.

  In addition, according to the present embodiment, the above-described piezoelectric vibrating reed 3 </ b> A capable of preventing the short-circuit failure of the mount electrodes 38 </ b> A and 38 </ b> B and suppressing vibration leakage is housed in the package 2, so that it has excellent reliability. A high-performance piezoelectric vibrator 1 can be obtained.

(Modification of the embodiment)
FIG. 7 is a plan view of a piezoelectric vibrating piece 3B according to a first modification of the embodiment.
FIG. 8 is a plan view of a piezoelectric vibrating piece 3C according to a second modification of the embodiment.
Subsequently, each modification of the embodiment will be described.
In the piezoelectric vibrating piece 3A according to the embodiment, a slit 50 penetrating the support portion 33 is provided, and the first support portion 33A in which the support portion 33 includes the first mount electrode 38A by the slit 50, and the second mount electrode It was divided into a second support portion 33B having 38B.
On the other hand, the shapes of the support portion 33, the slit 50, and the like are not limited to the above-described embodiments, and may be the following modifications. In the following, description of the same configuration as that of the embodiment will be omitted.

  As shown in FIG. 7, in the piezoelectric vibrating piece 3 </ b> B according to the first modification of the embodiment, a slit 50 that penetrates the support portion 33 in the thickness direction T is formed along the longitudinal direction L. A wall portion 51 is formed in the slit 50 of the support portion 33 along the width direction W. The slit 50 is divided into a first slit 50 a and a second slit 50 b in the longitudinal direction L by the wall portion 51.

  The wall portion 51 connects the first support portion 33A and the second support portion 33B at an intermediate portion in the longitudinal direction L of the support portion 33. Thus, the slit 50 is interposed in the width direction W and the wall portion 51 is interposed in the longitudinal direction L between the first mount electrode 38A and the second mount electrode 38B formed on the support portion 33. .

According to the first modification of the embodiment, since the wall portion 51 in the slit 50 is provided between the pair of mount electrodes 38A and 38B in the longitudinal direction L, the first mount electrode 38A is used as the second base substrate. 11 (see FIG. 4), the conductive adhesive 45 (see FIG. 4) applied to one electrode pad 20A (see FIG. 4) and the second mount electrode 38B are attached to the second base substrate. Even when the conductive adhesive 45 (see FIG. 4) applied to the other electrode pad 20B (see FIG. 4) enters the slit 50, the wall portion 51 can reliably prevent one conductive adhesive 45 and the other conductive adhesive 45 from being connected. Therefore, it is possible to reliably prevent a short circuit failure of the mount electrodes 38A and 38B.
Furthermore, by adjusting the width and shape of the wall portion 51, the rigidity of the support portion 33 and the degree of suppression of vibration leakage by the support portion 33 can be set to desired values.

  As shown in FIG. 8, the piezoelectric vibrating piece 3 </ b> C according to the second modification of the embodiment is formed with a slit 50 extending along the longitudinal direction L through the support portion 33 in the thickness direction T. The support part 33 is divided by the slit 50 into a first support part 33A and a second support part 33B. Accordingly, the slit 50 is interposed in the width direction W between the first mount electrode 38A and the second mount electrode 38B.

The first mount electrode 38A is provided at the tip of the first support portion 33A. The second mount electrode 38B is provided at the tip of the second support portion 33B.
Here, the first support portion 33A and the second support portion 33B are formed to have different lengths. In the present modification, the first support portion 33A is formed to have a shorter overall length than the second support portion 33B. Thus, the first mount electrode 38A is provided closer to the base 32 than the second mount electrode 38B. Therefore, the first mount electrode 38A and the second mount electrode 38B are arranged apart from each other in the longitudinal direction L.

  According to the second modification of the embodiment, the separation distance between the pair of mount electrodes 38A and 38B can be sufficiently secured along the longitudinal direction L of the pair of vibrating arm portions 30 and 31. Therefore, since the pair of mount electrodes 38A and 38B can be reliably prevented from being connected to each other, a short circuit failure of the mount electrodes 38A and 38B can be reliably prevented.

  The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.

FIG. 9 is a plan view of a piezoelectric vibrating piece 3D according to another modification of the embodiment.
The shapes of the support portion 33, the slit 50, and the like are not limited to the embodiment and the modifications of the embodiment, and can be variously changed.
For example, as shown in FIG. 9, the first support portion 33 </ b> A and the second support portion 33 </ b> B may be formed in a bellows shape in plan view and may be formed in a symmetrical shape with the slit 50 interposed therebetween. Also in this case, similarly to the embodiment, short circuit failure of the mount electrodes 38A and 38B can be prevented, and vibration leakage can be suppressed by bending the first support portion 33A and the second support portion 33B.

  In the above-described embodiment, the ceramic package type piezoelectric vibrator 1 is taken as an example of the piezoelectric vibrator, but is not limited thereto. Therefore, the piezoelectric vibrator may be, for example, a glass package type piezoelectric vibrator, a surface mount type piezoelectric vibrator, or a cylinder package type piezoelectric vibrator.

  In the piezoelectric vibrating piece 3 </ b> A of the embodiment, the opening formed in the support portion 33 was the slit 50 along the longitudinal direction L. On the other hand, the opening formed in the support portion 33 is not limited to the slit 50. Therefore, for example, the opening may be a through hole. Further, the number of openings formed in the support portion 33 is not limited to one.

  In addition, it is possible to appropriately replace the components in the above-described embodiments with known components without departing from the spirit of the present invention.

DESCRIPTION OF SYMBOLS 1 ... Piezoelectric vibrator 2 ... Package 3A, 3B, 3C, 3D ... Piezoelectric vibrating piece 30, 31 ... Vibrating arm part 30b, 31b ... Base end part (end part) 32 .. · Base 33 ··· Support portion 33A · · · First support portion 33B · · · Second support portion L · · · Longitudinal direction 38A and 38B · Mount electrode (mount portion) · 50 · Slit (opening portion) ... Wall section

Claims (4)

A pair of vibrating arms;
A base for connecting ends on one side in the longitudinal direction of the pair of vibrating arms; and
A support portion connected to the base portion between the pair of vibrating arm portions and extending along the longitudinal direction;
A piezoelectric vibrating piece with
The support portion is provided with a pair of mount portions,
Between the pair of mount parts, an opening that penetrates the support part is formed ,
The opening is a slit that extends along the longitudinal direction and divides the supporting part into a first supporting part and a second supporting part in a width direction orthogonal to the longitudinal direction,
In the slit, a wall portion connecting the first support portion and the second support portion is provided along the width direction,
The piezoelectric vibrating piece according to claim 1, wherein the wall portion is provided between the pair of mount portions in the longitudinal direction . A pair of vibrating arms;
A base for connecting ends on one side in the longitudinal direction of the pair of vibrating arms; and
A support portion connected to the base portion between the pair of vibrating arm portions and extending along the longitudinal direction;
A piezoelectric vibrating piece with
The support portion is provided with a pair of mount portions,
Between the pair of mount parts, an opening that penetrates the support part is formed,
The opening is a slit that extends along the longitudinal direction and divides the supporting part into a first supporting part and a second supporting part in a width direction orthogonal to the longitudinal direction,
The pair of mount portions are respectively provided at a tip portion of the first support portion and a tip portion of the second support portion,
The first vibrating portion and the second supporting portion have different lengths from each other. The piezoelectric vibrating piece according to claim 1 or 2 ,
The piezoelectric vibrating piece according to claim 1, wherein the pair of mount portions are provided at different positions in the longitudinal direction on the support portion. A piezoelectric vibrator, wherein the piezoelectric vibrating piece according to any one of claims 1 to 3 is accommodated in a package.

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