CN104467730B - Piezoelectric vibration piece and piezoelectric vibrator - Google Patents
Piezoelectric vibration piece and piezoelectric vibrator Download PDFInfo
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- CN104467730B CN104467730B CN201410496154.4A CN201410496154A CN104467730B CN 104467730 B CN104467730 B CN 104467730B CN 201410496154 A CN201410496154 A CN 201410496154A CN 104467730 B CN104467730 B CN 104467730B
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Abstract
The poor short circuit that can prevent department of assembly is provided and the piezoelectric vibration piece of leakage of vibration can be suppressed and possess the piezoelectric vibrator of the piezoelectric vibration piece.Piezoelectric vibration piece（3A）Possess：A pair of vibration arm（30、31）；A pair of of vibration arm of connection（30、31）Long side direction（L）Base end part（30b、31b）Mutual base portion（32）；And vibrate arm in a pair（30、31）Between with base portion（32）Connect and along long side direction（L）The supporting part of extension（33）, it is characterised in that：In supporting part（33）Electrode is assembled equipped with a pair（38A、38B）, electrode is assembled in a pair（38A、38B）Between, formed with perforation supporting part（33）Gap（50）.
Description
Technical field
The present invention relates to piezoelectric vibration piece and piezoelectric vibrator.
Background technology
For example, in portable phone or portable information terminal equipment, as the timing for moment source, control signal etc.
The device of source, derived reference signal etc., often using the piezoelectric vibrator using quartz etc..As this piezoelectric vibrator, it is known that
The piezoelectric vibrator of gas-tight seal piezoelectric vibration piece in the packaging part formed with cavity.
As piezoelectric vibration piece, it is known that on the long side direction for for example possessing a pair of of vibration arm, a pair of of vibration arm of connection
Side the mutual base portion in end and a pair of of vibration arm between be connected with base portion and along the support of long side direction extension
The piezoelectric vibration piece in portion（For example, referring to patent document 1）.Piezoelectric vibration piece is applied in voltage and is formed in swashing for each vibration arm
Shake electrode when, vibrated in a manner of approaching a pair of of vibration arm and is separated according to regulation frequency.
The piezoelectric vibration piece, such as shape is bonded to the connection electrode being formed on the substrate of packaging part with conductive adhesive
Into a pair of of assembling electrode in supporting part（Department of assembly）.
However, with the small form factor requirements of portable phone in recent years or portable information terminal equipment etc., for being accommodated in envelope
Piezoelectric vibration piece in piece installing also requires to minimize.At this time, with the miniaturization of piezoelectric vibration piece, the support of assembling electrode is formed
Portion is also miniaturized.
In addition, people are known when making piezoelectric vibration piece work, it may occur that vibration passes through outside of the supporting part to packaging part
The phenomenon of leakage（Hereinafter referred to as " leakage of vibration ".）.The leakage of vibration and CI values（Crystal impedance：Crystal Impedance）
Rising it is related, it is therefore desirable to suppress as far as possible.It is well known that generally by longer ensure assembling electrode and the vibration of supporting part
The distance of arm phase separation, makes the vibration of vibration arm decay between the assembling electrode and vibration arm of supporting part, so as to
Enough suppress leakage of vibration.
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2006-345517 publications.
The content of the invention
But in the prior art, because of the miniaturization of supporting part, the separating distance of a pair of of assembling electrode is also shortened.Cause
This, when installing piezoelectric vibration piece on the substrate of packaging part, conductive bonding agent extends and makes a pair of of assembling electrode short each other
The worry on road.
In addition, because the miniaturization of piezoelectric vibration piece, separation of the assembling electrode of supporting part with vibrating arm can not be ensured
Apart from long enough, therefore in the worry that can not effectively inhibit leakage of vibration.
Therefore, the present invention conceives in view of the foregoing, its problem is to provide the poor short circuit that can prevent department of assembly
And the piezoelectric vibration piece of leakage of vibration can be suppressed and possess the piezoelectric vibrator of the piezoelectric vibration piece.
In order to solve the above problems, piezoelectric vibration piece of the invention, possesses：A pair of vibration arm；Base portion, connection described one
The side end on long side direction to vibrating arm is each other；And supporting part, it is the pair of vibration arm between with it is described
Base portion connects, and extends along the long side direction, and the piezoelectric vibration piece is characterized in that：One is equipped with the supporting part
To department of assembly, between the pair of department of assembly, formed with the opening portion for penetrating through the supporting part.
According to the present invention, due to the opening portion formed with perforation supporting part between a pair of of department of assembly, so being led utilizing
When piezoelectric vibration piece is installed to substrate by electrical bonding agent, the conductive adhesive spread around in department of assembly can enter opening
In portion.Thereby, it is possible to prevent because of conductive adhesive and situation that a pair of of department of assembly is connected to each other, therefore it can prevent department of assembly
Poor short circuit.In addition, penetrating through the opening portion of supporting part by setting, the rigidity of supporting part is reduced, therefore can be with supporting part
Decay and the vibration of supporting part is delivered to from vibration arm.Thus, it is possible to suppress the leakage of vibration from piezoelectric vibration piece.
Moreover, electric conductivity adhesives is entered in opening portion, so as to increase conductive adhesive for piezoelectric vibration piece
Bond area, therefore affixed power when piezoelectric vibration piece to be installed to substrate can be increased.Piezoelectricity is shaken thus, it is possible to improve
Movable plate is installed on impact resistance during substrate.
In addition, it is characterized in that：In the supporting part, a pair of of department of assembly is respectively provided at position different on the long side direction
Put.
According to the present invention, since in supporting part, a pair of of department of assembly is respectively provided at position different on long side direction, therefore energy
Enough prevent a pair of of department of assembly from being connected each other by conductive adhesive, and can reliably prevent the poor short circuit of department of assembly.
In addition, it is characterized in that：The opening portion is gap, which extends along the long side direction, and with institute
State on the orthogonal width of long side direction, the supporting part is blocked as the first supporting part and the second supporting part.
According to the present invention, since opening portion is the gap of blocking supporting part, institute so as to suppressing to be arranged on the first supporting part
First department of assembly is connected with the second department of assembly arranged on the second supporting part using conductive adhesive.
In addition, it is characterized in that：In the gap, it is equipped with along the width and connects first supporting part and institute
The wall portion of the second supporting part is stated, the wall portion is located on the long side direction between the pair of department of assembly.
The foundation present invention, between a pair of of department of assembly is located on long side direction due to the wall portion in gap, so, even if right
The conductive adhesive of one side of the first department of assembly of substrate bonding and the opposing party's electric conductivity to the second department of assembly of substrate bonding are glued
Connect in the case that agent respectively enterd in gap, also can reliably prevent the conductive adhesive of a side and the opposing party from leading by wall portion
Electrical bonding agent connection.Thus, it is possible to reliably prevent the poor short circuit of department of assembly.
Moreover, width, shape by adjusting wall portion etc., can be by the rigidity of supporting part and the vibration by supporting part
The inhibition level of leakage is set as desirable value.
In addition, it is characterized in that：The pair of department of assembly is respectively provided at the front end and described second of first supporting part
The front end of supporting part, first supporting part and the second supporting part length are different from each other.
The foundation present invention, can fully ensure the separating distance of a pair of of department of assembly along the long side direction of vibration arm.
Thus, it is possible to reliably prevent the situation that a pair of of department of assembly is connected to each other, therefore it is reliably prevented from the short circuit of department of assembly not
It is good.
In addition, the piezoelectric vibrator of the present invention, it is characterised in that：Above-mentioned piezoelectric vibration is accommodated with the inside of packaging part
Piece.
According to the present invention, due to that can not only prevent the poor short circuit of department of assembly in the storage of the inside of packaging part and can press down
The piezoelectric vibration piece of leakage of vibration processed, so as to obtaining high performance piezoelectric vibrator excellent in reliability.
Invention effect
According to the present invention, due to the opening portion formed with perforation supporting part between a pair of of department of assembly, so being led utilizing
When piezoelectric vibration piece is installed on substrate by electrical bonding agent, the conductive adhesive spread around in department of assembly can enter out
In oral area.Thereby, it is possible to prevent a pair of of department of assembly to be connected to each other by conductive adhesive, therefore it can prevent the short of department of assembly
Road is bad.In addition, the opening portion by setting perforation supporting part, reduces the rigidity of supporting part, therefore can decay with supporting part
The vibration of supporting part is delivered to from vibration arm.Thus, it is possible to suppress the leakage of vibration from piezoelectric vibration piece.
Moreover, electric conductivity adhesives enters in opening portion, so as to increase conductive adhesive relative to piezoelectric vibration piece
Bond area, therefore affixed power when piezoelectric vibration piece to be installed on to substrate can be increased.Piezoelectricity is shaken thus, it is possible to improve
Movable plate is installed on impact resistance during substrate.
Brief description of the drawings
Fig. 1 is the stereoscopic figure of the piezoelectric vibrator involved by embodiment；
Fig. 2 is the internal structure figure of the piezoelectric vibrator shown in Fig. 1；
Fig. 3 is the sectional view along the line A-A of the piezoelectric vibrator shown in Fig. 2；
Fig. 4 is the exploded perspective view of the piezoelectric vibrator shown in Fig. 1；
Fig. 5 is the plan of the piezoelectric vibration piece involved by embodiment；
Fig. 6 is the sectional view along the line B-B of Fig. 5；
Fig. 7 is the plan of the piezoelectric vibration piece involved by the first variation of embodiment；
Fig. 8 is the plan of the piezoelectric vibration piece involved by the second variation of embodiment；
Fig. 9 is the plan of the piezoelectric vibration piece involved by the variation of he of embodiment.
Embodiment
Hereinafter, referring to the drawings, embodiments of the present invention are illustrated.In addition, it is following first to piezoelectric vibrator into
After row explanation, the piezoelectric vibration piece for being accommodated in piezoelectric vibrator is illustrated.
Fig. 1 is the stereoscopic figure of the piezoelectric vibrator 1 involved by embodiment, and Fig. 2 is the inside structure of piezoelectric vibrator 1
Cheng Tu, is to pull down hush panel 6（With reference to Fig. 1）In the state of piezoelectric vibration piece 3A seen from above figure, Fig. 3 is along Fig. 2
The sectional view of the line A-A of shown piezoelectric vibrator 1, Fig. 4 are the exploded perspective views of the piezoelectric vibrator 1 shown in Fig. 1.
As shown in Figures 1 to 4, the piezoelectric vibrator 1 of present embodiment is that possess inside to have gas-tight seal cavity C
The surface installing type vibrator of packaging part 2 and piezoelectric vibration piece 3A, the so-called ceramic package type being accommodated in inside cavity C.
Piezoelectric vibrator 1 is shaped generally as straight cube shape.In addition, in the following description, by piezoelectric vibrator 1 during vertical view
Length direction be known as long side direction L, the short side direction of the piezoelectric vibrator 1 orthogonal with long side direction is known as width W,
The direction orthogonal with long side direction L and width W is known as thickness direction T.
Packaging part 2 possesses：Package body 5；And engaged for the package body 5 and with package body 5
Between formed cavity C hush panel 6.
Package body 5 possesses：The first basal substrate 10 and the second basal substrate 11 that are engaged with the state that is mutually superimposed,
With the sealing ring 12 being joined on the second basal substrate 11.
First basal substrate 10 is arranged to be shaped generally as the substrate of the ceramic system of oblong-shaped when overlooking.Second substrate base
Plate 11 is arranged to be formed as the outer shape identical with the first basal substrate 10 and overlooks ceramic system for substantially rectangular shape
Substrate, is integrally bonded in the state of overlapping onto on the first basal substrate 10 by sintering etc..
In the corner of the first basal substrate 10 and the second basal substrate 11, throughout the first basal substrate 10 and the second substrate base
The entirety of the thickness direction T of plate 11 and formed with overlook for 1/4 arc-shaped notch 15.These first basal substrates 10 and
Two basal substrates 11 are, such as by the way that by the overlapping two panels of the ceramic substrate of disc-shaped and after engaging, two are penetrated through with rectangular formed
Multiple through holes of ceramic substrate, then, on the basis of each through hole, and cut off two ceramic substrates with clathrate and make.This
When, through hole is divided into 4 parts, so as to become notch 15.
In addition, it is the mounting surface corresponding with inner wall of assembling piezoelectric vibration piece 3A in the upper surface of the second basal substrate 11
11a。
Furthermore the first basal substrate 10 and the second basal substrate 11 are made of ceramics, but as the specific material of the ceramics
Material, can enumerate the HTCC for for example aoxidizing aluminum（High-temperature co-fired ceramics：High Temperature Co-Fired Ceramic）、
The LTCC of glass ceramics（Low-temperature co-fired ceramics：Low Temperature Co-Fired Ceramic）Deng.
Sealing ring 12 is the frame-shaped of the electric conductivity of a circle smaller than the shape of the first basal substrate 10 and the second basal substrate 11
Component, is joined to the mounting surface 11a of the second basal substrate 11.Specifically, the solder or soft that sealing ring 12 passes through silver solder etc.
Solder etc. freezes to be joined on mounting surface 11a, is for example plated alternatively, being joined to by welding etc. with electrolysis, outside chemical plating,
Evaporation, sputter etc. are come the metallic bond layer that is formed on mounting surface 11a.
As the material of sealing ring 12, for example, nickel-base alloy etc., specifically from Kovar alloy, Eyring Wa Er
Alloy, invar alloy, 42- alloys etc. select.Particularly, the material as sealing ring 12, preferably selects thermal coefficient of expansion
Close to the first basal substrate 10 of ceramic system and the material of the second basal substrate 11.For example, as the first basal substrate 10 and
Two basal substrates 11, using thermal coefficient of expansion 6.8 × 10- 6/ DEG C aluminium oxide in the case of, as sealing ring 12, it is preferred to use
Thermal coefficient of expansion 5.2 × 10- 6/ DEG C Kovar alloy or thermal coefficient of expansion 4.5~6.5 × 10- 6/ DEG C 42- alloys etc..
Hush panel 6 is the conductive board overlapped on sealing ring 12, by the engagement to sealing ring 12 come to packaging part
5 airtight joint of main body.Also, the space being divided into by the mounting surface 11a of the hush panel 6, sealing ring 12, the second basal substrate 11,
As gas-tight seal above-mentioned cavity C（With reference to Fig. 3）Work.
Furthermore as the welding method of hush panel 6, for example, the roll welding for carrying out the contact of rolling disc type electrode,
Laser welding, ultrasonic bonding etc..In addition, in order to make hush panel 6 and the welding of sealing ring 12 relatively reliable, will preferably fit each other
The bonding layer of the good nickel of answering property, gold etc., is at least respectively formed at the lower surface of hush panel 6 and the upper surface of sealing ring 12.
In the mounting surface 11a of the second basal substrate 11, a pair of electrodes as the connection electrode with piezoelectric vibration piece 3A is welded
Disk 20A, 20B are formed in the different positions being mutually staggered on long side direction L and width W.In addition, in the first basal substrate
10 lower surface, a pair of external electrodes 21A, 21B are formed in long side direction L across interval.
Electrode pad 20A, 20B and outer electrode 21A, 21B, are with single gold such as the formation with evaporation or sputtering method
Belong to the stacked film of the monofilm formed or different metal stackings, turn on separately from each other.
As shown in figure 3, in the first basal substrate 10 formed with being turned on and with thickness direction T with an outer electrode 21A
Penetrate through a first through electrode 22A of the first basal substrate 10.In addition, the second basal substrate 11 formed with an electrode
Pad 20A is turned on and a second through electrode 23A of second basal substrate 11 is penetrated through with thickness direction T.Then,
Between one basal substrate 10 and the second basal substrate 11, formed with one the first through electrode 22A of connection and one second perforation
A connection electrode 24A of electrode 23A.Thus, an electrode pad 20A and an outer electrode 21A are mutually conducted.
In addition, the first basal substrate 10 formed with turned on another outer electrode 21B and with thickness direction T perforation should
Another first through electrode 22B of first basal substrate 10.In addition, the second basal substrate 11 formed with another electrode pad
20B is turned on and another second through electrode 23B of second basal substrate 11 is penetrated through with thickness direction T.Then, in the first base
Between 10 and second basal substrate 11 of substrate, formed with another first through electrode 22B of connection and another second through electrode
Another connection electrode 24B of 23B.Thus, another electrode pad 20B and another outer electrode 21B are turned on each other.
Furthermore in a manner of avoiding recess 40 described later, for example so that the lower section of sealing ring 12 along the sealing ring 12 and
Another connection electrode 24B of the mode composition of extension.
As shown in Fig. 2, in the mounting surface 11a of the second basal substrate 11, vibrated with a pair of piezoelectric vibration piece 3A described later
Front end 30a, 31a of arm 30,31 it is opposed be formed in part with recess 40.Recess 40 is in order to avoid the production such as because falling
The influence of raw collision and vibrate arm 30,31 through-thickness T displacement（Deflection deformation）The front end of Shi Zhendong arms 30,31
30a, 31a contact with the second basal substrate 11 and formed.Recess 40 serves not only as the perforation of the second basal substrate 11 of perforation
Hole, and be formed as corner with circularity in the inner side of sealing ring 12 and overlook to be rectangular-shaped.
（Piezoelectric vibration piece）
Piezoelectric vibration piece 3A is for example by quartz（Crystal）Or the vibration that the piezoelectric of lithium tantalate, lithium niobate etc. is formed
Piece, possesses：Along a pair of of vibration arm 30,31 of long side direction L configurations；Each base end part of a pair of of vibration arm 30,31 of connection
The base portion 32 of 30b, 31b；And a pair vibrate arm 30,31 between be connected with base portion 32 and with along a pair vibrate arm
30th, the supporting part 33 that the mode of 31 extending direction extends.Vibrate the long side direction of arm 30,31 and the length of piezoelectric vibrator 1
Edge direction L is consistent, and the width of vibration arm 30,31 is consistent with the width W of piezoelectric vibrator 1, vibrates arm 30,31
Thickness direction it is consistent with the thickness direction T of piezoelectric vibrator 1.
In addition, it's not limited to that for the shape of piezoelectric vibration piece 3A, such as it is alternatively vibration arm 30,31 relatively short side sides
Shape as extending to 5 degree or so of L maximum inclinations.That is, as long as to be set in the width W of base portion 32 phase separation
Arm 30,31 is vibrated, and is equipped with shape as the supporting part 33 extended in a manner of along long side direction L between them
Shape, the shape of piezoelectric vibration piece 3A are just not particularly limited.
A pair of vibration arm 30,31 is, for example, that the width dimensions of front end 30a, 31a sides expand than base end part 30b, 31b sides
So-called tup type, the weight and moment of inertia during vibration of front end 30a, 31a sides of increase vibration arm 30,31.Thus,
Vibration arm 30,31 becomes easily to vibrate, therefore shortens the whole length of vibration arm 30,31 and can seek to minimize.
Furthermore the shape of a pair of vibration arm 30,31 is not limited to so-called tup type.
A pair of vibration arm 30,31 possesses the long side direction L along vibration arm 30,31 on its two interarea 30c, 31c
The groove portion 37 formed respectively.
Groove portion 37 is for example formed in from the part near base end part 30b, 31b sides to substantial middle of vibration arm 30,31.
A pair of vibration arm 30,31 possesses for being adjusted to the vibrational state of itself to shake in the range of assigned frequency
Dynamic frequency adjustment use and envelope in the weight metal film (not shown) on outer surface.Weight metal films such as possess for coarse adjustment
The coarse adjustment film (not shown) of frequency and the fine setting film (not shown) for fine setting.
Frequency adjustment is adjusted by the weight of coarse adjustment film and fine setting film to carry out, so that a pair of of vibration arm 30,31
Frequency converge on as defined in mode in the range of target frequency be adjusted.
Fig. 5 is the plan of piezoelectric vibration piece, and Fig. 6 is the sectional view along the line B-B of Fig. 5.
As shown in Figures 5 and 6, a pair of of vibration arm 30,31 has on the surface for the piezoelectric board 34 being made of piezoelectric
Standby a pair of of the excitation electrode for vibrating a pair of of vibration arm 30,31（First excitation electrode 35 and the second excitation electrode 36）.
The excitation electrode being made of the first excitation electrode 35 and the second excitation electrode 36, is patterned to vibrate arm in a pair
30th, the state being electrically insulated from each other on 31 outer surface, make a pair of of vibration arm 30,31 along close to each other or separated direction with
Assigned frequency is vibrated.
For example, the first excitation electrode 35 is mainly in side（Right in Fig. 5）Vibration arm 30 groove portion 37 on and it is another
Side（Left in Fig. 5）Vibration arm 31 two sides 31d on, respectively along vibration arm 30,31 long side direction L and
It is continuous to set.In addition, the second excitation electrode 36 mainly vibration on the two sides 30d of the vibration arm 30 of side with opposite side
Continuously set respectively along the long side direction L of vibration arm 30,31 in the groove portion 37 of arm 31.
On the outer surface of supporting part 33, when assembling electrode 38A, 38B as installation piezoelectric vibration piece 3A equipped with a pair
Department of assembly.
First assembling electrode 38A is overlooked to be rectangular-shaped, in the opposite side of width W（Left in Fig. 5）, compare supporting part
The center section of 33 long side direction L is set closer to base end part 33b sides.First assembling electrode 38A is by swashing with first
Shake electrode 35 continuously composition and formed.
In addition, the second assembling electrode 38B is overlooked to be rectangular-shaped, in the side of width W（Right in Fig. 5）, than branch
The center section of the long side direction L of support part 33 is set closer to front end 33a sides.Second assembling electrode 38B is by with the
Two excitation electrodes 36 continuously composition and formed.
In this way, it is located at different positions on each leisure long side direction L and width W of a pair of of assembling electrode 38A, 38B.
Electrode 38A, 38B are assembled when installing piezoelectric vibration piece 3A, with electrode pad 20A, 20B（With reference to Fig. 4）It is electrically connected,
So as to from outer electrode 21A, 21B（With reference to Fig. 4）Power to the first excitation electrode 35 and the second excitation electrode 36.
Between a pair of assembling electrode 38A, 38B, the gap 50 formed with through-thickness T perforation supporting parts 33.Gap
50 extend throughout from the front end 33a of supporting part 33 to base end part 33b along long side direction L, and will branch on width W
Support part 33 is truncated into the first supporting part 33A and the second supporting part 33B.Thus, it is configured with the base end side of the first supporting part 33A
One assembling electrode 38A, the second assembling electrode 38B is configured with the front of the second supporting part 33B.
As shown in figure 4, in the process that piezoelectric vibration piece 3A is installed on to the mounting surface 11a of the second basal substrate 11, it is first
First, conductive adhesive 45 is applied to the surface of a pair of electrodes pad 20A, 20B.
Then, in a pair of electrodes for a pair of of assembling electrode 38A, the 38B and the second basal substrate 11 for making piezoelectric vibration piece 3A
In the state of pad 20A, 20B are overlapped respectively, piezoelectric vibration piece 3A is pressed towards the second basal substrate 11.
Finally, harden conductive adhesive 45, so as to complete piezoelectric vibration piece 3A being installed on the second basal substrate 11
Mounting surface 11a process.
Here, have the gap 50 due to being formed between a pair of assembling electrode 38A, 38B, when by piezoelectric vibration piece 3A towards the
When two basal substrates 11 press, it is extruded and is unfolded between a pair of assembling electrode 38A, 38B and a pair of electrodes pad 20A, 20B
Conductive adhesive 45 enter gap 50 in.Thus, it is therefore prevented that a pair of assembling electrode 38A, 38B are unfolded via being extruded
The situation that conductive adhesive 45 is electrically connected.
（Effect）
According to present embodiment, due to the gap formed with perforation supporting part 33 between a pair of of assembling electrode 38A, 38B
50（Opening portion）, therefore when piezoelectric vibration piece 3A is installed on the second basal substrate 11 with conductive adhesive 45, assembling
The conductive adhesive 45 that electrode 38A, 38B are spread around can be entered in gap 50.Thereby, it is possible to prevent a pair of of assembling electricity
The situation that pole 38A, 38B are connected to each other by conductive adhesive 45, therefore can prevent the short circuit of assembling electrode 38A, 38B not
It is good.In addition, the rigidity reduction of supporting part 33 because of the gap 50 for setting perforation supporting part 33, therefore can be decayed with supporting part 33
The vibration of supporting part 33 is delivered to from vibration arm 30,31.Thus, it is possible to suppress the leakage of vibration from piezoelectric vibration piece 3A.
Also, electric conductivity adhesives is entered in gap 50, shake so as to increase conductive adhesive 45 relative to piezoelectricity
The bond area of movable plate 3A, therefore affixed power when piezoelectric vibration piece 3A to be installed on to the second basal substrate 11 can be increased.Cause
And, it is possible to increase piezoelectric vibration piece 3A is installed on to impact resistance during the second basal substrate 11.
Further, since the opening portion for being formed in supporting part 33 is that supporting part 33 is truncated into the first supporting part 33A and second
The gap 50 of supporting part 33B, therefore the first assembling electrode 38A for being located at the first supporting part 33A can be reliably suppressed and be located at
The situation that the second assembling electrode 38B of second supporting part 33B is connected by conductive adhesive 45.
In addition, according to present embodiment, assembling electrode 38A, 38B are not only prevented due to having been stored in the inside of packaging part 2
Poor short circuit and also the above-mentioned piezoelectric vibration piece 3A of leakage of vibration can be suppressed, therefore high property excellent in reliability can be obtained
Can piezoelectric vibrator 1.
（The variation of embodiment）
Fig. 7 is the plan of the piezoelectric vibration piece 3B involved by the first variation of embodiment.
Fig. 8 is the plan of the piezoelectric vibration piece 3C involved by the second variation of embodiment.
Then, each variation of embodiment is illustrated.
Piezoelectric vibration piece 3A involved by embodiment, the gap 50 equipped with perforation supporting part 33, and 33 quilt of supporting part
Gap 50 is blocked as the first supporting part 33A with the first assembling electrode 38A and the second support with the second assembling electrode 38B
Portion 33B.
In contrast, the shape in supporting part 33, gap 50 etc., is not limited to above-mentioned embodiment, or as follows
Each variation mode.In addition, omitted the description below for the composition same with embodiment.
As shown in fig. 7, the piezoelectric vibration piece 3B involved by first variation in embodiment, along long side direction L-shaped
Into have with thickness direction T perforation supporting part 33 gap 50.In the gap 50 of supporting part 33, with along the side of width W
Formula is formed with wall portion 51.On long side direction L, gap 50 is divided into the first gap 50a and the second gap 50b by wall portion 51.
Wall portion 51 is in the center section of the long side direction L of supporting part 33, the first supporting part 33A of connection and the second supporting part
33B.Thus, electrode is assembled in gap 50 between the first assembling electrode 38A and second for being formed in supporting part 33 on width W
Between 38B, and in long side direction L upper wall portions 51 between the first assembling electrode 38A and the second assembling for being formed in supporting part 33
Between electrode 38B.
According to the first variation of embodiment, since the wall portion 51 in gap 50 is arranged on a pair of of dress on long side direction L
With between electrode 38A, 38B, even if in order to the second basal substrate 11（With reference to Fig. 4）Bonding first is assembled electrode 38A and is applied
In an electrode pad 20A（With reference to Fig. 4）Conductive adhesive 45（With reference to Fig. 4）With in order to be bonded to the second basal substrate 11
Second assembles electrode 38B and is coated in another electrode pad 20B（With reference to Fig. 4）Conductive adhesive 45（With reference to Fig. 4）, respectively
In the case of in into gap 50, wall portion 51 can be also utilized reliably to prevent that the conductive adhesive 45 of a side and the opposing party are conductive
Property bonding agent 45 connects.Thus, it is possible to reliably prevent the poor short circuit of assembling electrode 38A, 38B.
Also, width, shape by adjusting wall portion 51 etc., can suppress by the rigidity of supporting part 33 and by supporting part 33
The degree of leakage of vibration is set in desirable value.
As shown in figure 8, the piezoelectric vibration piece 3C involved by the second variation in embodiment, along long side direction L-shaped
Into have with thickness direction T perforation supporting part 33 gap 50.Supporting part 33 is blocked as the first supporting part 33A and second by gap 50
Supporting part 33B.Thus, on width W gap 50 between the first assembling electrode 38A and the second assembling electrode 38B.
First assembling electrode 38A is arranged on the front end of the first supporting part 33A.In addition, the second assembling electrode 38B is arranged on second
The front end of supporting part 33B.
Here, the first supporting part 33A and the second supporting part 33B are formed in a manner of length different from each other.In this variation,
It is shorter than the second supporting part 33B that first supporting part 33A is formed as total length.Thus, the first assembling electrode 38A is than the second assembling electrode
38B is set closer to 32 side of base portion.Thus, the first assembling electrode 38A and second assembles electrode 38B, mutual in long side direction L
Discretely configure.
, can be fully true along the long side direction L of a pair of of vibration arm 30,31 according to the second variation of embodiment
Protect the separating distance of a pair of of assembling electrode 38A, 38B.Thus, it is possible to reliably prevent a pair of of assembling electrode 38A, 38B from connecting each other
Connect, therefore be reliably prevented from the poor short circuit of assembling electrode 38A, 38B.
Furthermore technical scope of the invention is not limited to above-mentioned embodiment, in the model for the purport for not departing from the present invention
It can be made various changes in enclosing.
Fig. 9 is the plan of the piezoelectric vibration piece 3D involved by the variation of he of embodiment.
The shape in supporting part 33, gap 50 etc. is not limited to each variation of embodiment and embodiment, can carry out
Various changes.
For example, as shown in figure 9, by the first supporting part 33A and the second supporting part 33B be formed as overlook when be in snake abdomen shape, and
And formed in a manner of clipping gap 50 as symmetric shape and also may be used.In this case, it is also same with embodiment, it can prevent
The poor short circuit of electrode 38A, 38B are assembled, and can be suppressed by the flexure of the first supporting part 33A and the second supporting part 33B
Leakage of vibration.
In the above-described embodiment, an example as piezoelectric vibrator, illustrates the piezoelectric vibrator of ceramic package type
1, but it's not limited to that.Thus, piezoelectric vibrator is alternatively the piezoelectric vibrator or surface installing type of such as glass-encapsulated type
Piezoelectric vibrator, the piezoelectric vibrator of pillar encapsulation type.
In the piezoelectric vibration piece 3A of embodiment, the opening portion for being formed in supporting part 33 is along the gap of long side direction L
50.In contrast, the opening portion for being formed in supporting part 33 is not limited to gap 50.Thus, for example, opening portion also may be used for through hole.
In addition, the number in the opening portion that supporting part 33 is formed is not limited to one.
In addition, can suitably be put without departing from the spirit and scope of the invention with well-known inscape
Change the inscape in the embodiment stated.
Label declaration
1 piezoelectric vibrator；2 packaging parts；3A, 3B, 3C, 3D piezoelectric vibration piece；30,31 vibration arms；30b、31b
Base end part（End）；32 base portions；33 supporting parts；The first supporting parts of 33A；The second supporting parts of 33B；L long side directions；38A,
38B assembles electrode（Department of assembly）；50 gaps（Opening portion）；51 wall portions.
Claims (4)
1. a kind of piezoelectric vibration piece, possesses：
A pair of vibration arm；
Base portion, connect it is the pair of vibration arm long side direction on a side end each other；And
Supporting part, is connected between the pair of vibration arm with the base portion, and extends along the long side direction,
The piezoelectric vibration piece is characterized in that：
A pair of of department of assembly is equipped with the supporting part,
Between the pair of department of assembly, the opening portion formed with the perforation supporting part,
The opening portion is gap, which extends along the long side direction, and in the width orthogonal with the long side direction
Spend on direction, the supporting part blocked as the first supporting part and the second supporting part,
In the gap, the wall for connecting first supporting part and second supporting part is equipped with along the width
Portion,
The wall portion is located on the long side direction between the pair of department of assembly.
2. a kind of piezoelectric vibration piece, possesses：
A pair of vibration arm；
Base portion, connect it is the pair of vibration arm long side direction on a side end each other；And
Supporting part, is connected between the pair of vibration arm with the base portion, and extends along the long side direction,
The piezoelectric vibration piece is characterized in that：
A pair of of department of assembly is equipped with the supporting part,
Between the pair of department of assembly, the opening portion formed with the perforation supporting part,
The opening portion is gap, which extends along the long side direction, and in the width orthogonal with the long side direction
Spend on direction, the supporting part blocked as the first supporting part and the second supporting part,
The pair of department of assembly is respectively provided at the front end of first supporting part and the front end of second supporting part,
First supporting part and the second supporting part length are different from each other.
3. piezoelectric vibration piece according to claim 1 or 2, it is characterised in that：In the supporting part, the pair of department of assembly
It is respectively provided at position different on the long side direction.
A kind of 4. piezoelectric vibrator, it is characterised in that：Shake in the piezoelectricity that the inside of packaging part is accommodated with described in claim 1 or 2
Movable plate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-198757 | 2013-09-25 | ||
| JP2013198757A JP6168949B2 (en) | 2013-09-25 | 2013-09-25 | Piezoelectric vibrating piece and piezoelectric vibrator |
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| Publication Number | Publication Date |
|---|---|
| CN104467730A CN104467730A (en) | 2015-03-25 |
| CN104467730B true CN104467730B (en) | 2018-04-17 |
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| CN201410496154.4A Active CN104467730B (en) | 2013-09-25 | 2014-09-25 | Piezoelectric vibration piece and piezoelectric vibrator |
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| JP (1) | JP6168949B2 (en) |
| CN (1) | CN104467730B (en) |
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| CN114785308B (en) * | 2022-04-10 | 2022-12-20 | 合肥同晶电子有限公司 | Quartz crystal packaging structure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102355226A (en) * | 2003-05-16 | 2012-02-15 | 精工爱普生株式会社 | Tuning-fork-type piezoelectric vibrating reed and tuning-fork-type piezoelectric vibrator |
| CN102668598A (en) * | 2009-12-15 | 2012-09-12 | 日本电气株式会社 | Actuator, piezoelectric actuator, electronic device, and method for attenuating vibration and converting vibration direction |
| CN103684338A (en) * | 2012-09-13 | 2014-03-26 | 精工爱普生株式会社 | Resonator element, resonator, oscillator, electronic apparatus, and mobile object |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5849460U (en) * | 1981-09-28 | 1983-04-04 | 東芝ライテック株式会社 | printed wiring board equipment |
| JPH03151707A (en) * | 1989-11-08 | 1991-06-27 | Seiko Electronic Components Ltd | Surface mounting type crystal resonator |
| JP2002064356A (en) * | 2000-08-17 | 2002-02-28 | Toyo Commun Equip Co Ltd | Piezoelectric vibrator |
| ATE421799T1 (en) * | 2005-06-09 | 2009-02-15 | Eta Sa Mft Horlogere Suisse | COMPACT PIEZOELECTRIC RESONATOR |
| EP1732220B1 (en) * | 2005-06-09 | 2008-03-26 | ETA SA Manufacture Horlogère Suisse | Small-sized piezoelectric resonator |
| JP5476964B2 (en) * | 2009-12-09 | 2014-04-23 | セイコーエプソン株式会社 | Vibrators, oscillators, gyros and electronic equipment |
| WO2012052267A1 (en) * | 2010-10-21 | 2012-04-26 | Micro Crystal Ag | Method for mounting a piezoelectric resonator in a case and packaged piezoelectric resonator |
| JP6145288B2 (en) * | 2013-03-15 | 2017-06-07 | エスアイアイ・クリスタルテクノロジー株式会社 | Piezoelectric vibrating piece, piezoelectric vibrator, oscillator, electronic device, and radio timepiece |
| JP6182998B2 (en) * | 2013-06-24 | 2017-08-23 | セイコーエプソン株式会社 | Quartz crystal resonator element, vibrator, electronic device, electronic equipment, and moving object |
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- 2013-09-25 JP JP2013198757A patent/JP6168949B2/en active Active
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102355226A (en) * | 2003-05-16 | 2012-02-15 | 精工爱普生株式会社 | Tuning-fork-type piezoelectric vibrating reed and tuning-fork-type piezoelectric vibrator |
| CN102668598A (en) * | 2009-12-15 | 2012-09-12 | 日本电气株式会社 | Actuator, piezoelectric actuator, electronic device, and method for attenuating vibration and converting vibration direction |
| CN103684338A (en) * | 2012-09-13 | 2014-03-26 | 精工爱普生株式会社 | Resonator element, resonator, oscillator, electronic apparatus, and mobile object |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104467730A (en) | 2015-03-25 |
| JP6168949B2 (en) | 2017-07-26 |
| JP2015065589A (en) | 2015-04-09 |
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