JP2009004584A5 - - Google Patents

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Publication number
JP2009004584A5
JP2009004584A5 JP2007164440A JP2007164440A JP2009004584A5 JP 2009004584 A5 JP2009004584 A5 JP 2009004584A5 JP 2007164440 A JP2007164440 A JP 2007164440A JP 2007164440 A JP2007164440 A JP 2007164440A JP 2009004584 A5 JP2009004584 A5 JP 2009004584A5
Authority
JP
Japan
Prior art keywords
wiring board
insulating layer
inner via
electrical insulating
component built
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007164440A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009004584A (ja
JP5127315B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007164440A priority Critical patent/JP5127315B2/ja
Priority claimed from JP2007164440A external-priority patent/JP5127315B2/ja
Publication of JP2009004584A publication Critical patent/JP2009004584A/ja
Publication of JP2009004584A5 publication Critical patent/JP2009004584A5/ja
Application granted granted Critical
Publication of JP5127315B2 publication Critical patent/JP5127315B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2007164440A 2007-06-22 2007-06-22 部品内蔵モジュール Expired - Fee Related JP5127315B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007164440A JP5127315B2 (ja) 2007-06-22 2007-06-22 部品内蔵モジュール

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007164440A JP5127315B2 (ja) 2007-06-22 2007-06-22 部品内蔵モジュール

Publications (3)

Publication Number Publication Date
JP2009004584A JP2009004584A (ja) 2009-01-08
JP2009004584A5 true JP2009004584A5 (enrdf_load_stackoverflow) 2010-05-13
JP5127315B2 JP5127315B2 (ja) 2013-01-23

Family

ID=40320642

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007164440A Expired - Fee Related JP5127315B2 (ja) 2007-06-22 2007-06-22 部品内蔵モジュール

Country Status (1)

Country Link
JP (1) JP5127315B2 (enrdf_load_stackoverflow)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5692217B2 (ja) * 2010-03-16 2015-04-01 日本電気株式会社 機能素子内蔵基板
JP5360425B2 (ja) * 2010-04-08 2013-12-04 株式会社村田製作所 回路モジュール、および回路モジュールの製造方法
JP2012049260A (ja) * 2010-08-25 2012-03-08 Ricoh Microelectronics Co Ltd 切断方法及び切断装置
JP5285819B1 (ja) * 2012-11-07 2013-09-11 太陽誘電株式会社 電子回路モジュール
KR102166048B1 (ko) * 2014-03-20 2020-10-15 엘지디스플레이 주식회사 다층회로기판
CN104270885A (zh) * 2014-05-05 2015-01-07 珠海越亚封装基板技术股份有限公司 具有聚合物基质的插件框架及其制造方法
JP6443458B2 (ja) * 2015-01-30 2018-12-26 株式会社村田製作所 電子回路モジュール
CN107535080B (zh) 2015-05-14 2019-08-06 株式会社村田制作所 电子电路模块
KR101828317B1 (ko) 2017-07-20 2018-02-12 최현길 크기가 상이한 인쇄회로기판을 고정부재를 이용하여 고정하고 인쇄회로기판의 조립 공정을 실시간으로 모니터링하는 방법 및 장치
CN113851431A (zh) * 2021-08-11 2021-12-28 日月光半导体制造股份有限公司 半导体封装结构及其形成方法
CN115884526B (zh) * 2022-09-06 2023-09-15 珠海越亚半导体股份有限公司 一种高散热混合基板制作方法及半导体结构

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2976049B2 (ja) * 1992-07-27 1999-11-10 株式会社村田製作所 積層電子部品
JP2006210870A (ja) * 2004-12-28 2006-08-10 Matsushita Electric Ind Co Ltd 部品内蔵モジュール及びその製造方法
WO2007060784A1 (ja) * 2005-11-28 2007-05-31 Murata Manufacturing Co., Ltd. 回路モジュールの製造方法および回路モジュール

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