JP2009001628A - 異方導電接着剤 - Google Patents

異方導電接着剤 Download PDF

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Publication number
JP2009001628A
JP2009001628A JP2007162214A JP2007162214A JP2009001628A JP 2009001628 A JP2009001628 A JP 2009001628A JP 2007162214 A JP2007162214 A JP 2007162214A JP 2007162214 A JP2007162214 A JP 2007162214A JP 2009001628 A JP2009001628 A JP 2009001628A
Authority
JP
Japan
Prior art keywords
anisotropic conductive
conductive adhesive
film
adhesive
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2007162214A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009001628A5 (https=
Inventor
Katsuhiko Tomisaka
克彦 富坂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP2007162214A priority Critical patent/JP2009001628A/ja
Publication of JP2009001628A publication Critical patent/JP2009001628A/ja
Publication of JP2009001628A5 publication Critical patent/JP2009001628A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Non-Insulated Conductors (AREA)
JP2007162214A 2007-06-20 2007-06-20 異方導電接着剤 Withdrawn JP2009001628A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007162214A JP2009001628A (ja) 2007-06-20 2007-06-20 異方導電接着剤

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007162214A JP2009001628A (ja) 2007-06-20 2007-06-20 異方導電接着剤

Publications (2)

Publication Number Publication Date
JP2009001628A true JP2009001628A (ja) 2009-01-08
JP2009001628A5 JP2009001628A5 (https=) 2009-08-13

Family

ID=40318385

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007162214A Withdrawn JP2009001628A (ja) 2007-06-20 2007-06-20 異方導電接着剤

Country Status (1)

Country Link
JP (1) JP2009001628A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9354464B2 (en) 2014-02-04 2016-05-31 Samsung Display Co., Ltd. Liquid crystal display apparatus having improved light leakage characteristics

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9354464B2 (en) 2014-02-04 2016-05-31 Samsung Display Co., Ltd. Liquid crystal display apparatus having improved light leakage characteristics

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