JP2008547227A - マンガンドープトチタン酸バリウム薄膜組成物、キャパシタ、およびその製造方法 - Google Patents

マンガンドープトチタン酸バリウム薄膜組成物、キャパシタ、およびその製造方法 Download PDF

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Publication number
JP2008547227A
JP2008547227A JP2008518322A JP2008518322A JP2008547227A JP 2008547227 A JP2008547227 A JP 2008547227A JP 2008518322 A JP2008518322 A JP 2008518322A JP 2008518322 A JP2008518322 A JP 2008518322A JP 2008547227 A JP2008547227 A JP 2008547227A
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Prior art keywords
dielectric
thin film
capacitor
film composition
barium
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JP2008547227A5 (https=
Inventor
ジェイ.ボーランド ウィリアム
バーン イアン
フレドリック イーレフェルド ジョン
マリア ジョン−ポール
セイギ スー
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EIDP Inc
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EI Du Pont de Nemours and Co
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69Inorganic materials
    • H10P14/692Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
    • H10P14/6938Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides
    • H10P14/69398Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides the material having a perovskite structure, e.g. BaTiO3
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01GCOMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G23/00Compounds of titanium
    • C01G23/003Titanates
    • C01G23/006Alkaline earth titanates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/10Metal-oxide dielectrics
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/12Ceramic dielectrics
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/12Ceramic dielectrics
    • H01G4/1209Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H01G4/1227Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/33Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/65Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
    • H10P14/6516Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials
    • H10P14/6529Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by exposure to a gas or vapour
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/80Particles consisting of a mixture of two or more inorganic phases
    • C01P2004/82Particles consisting of a mixture of two or more inorganic phases two phases having the same anion, e.g. both oxidic phases
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/40Electric properties
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0137Materials
    • H05K2201/0175Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0137Materials
    • H05K2201/0179Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0355Metal foils
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/43Electric condenser making
    • Y10T29/435Solid dielectric type
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31678Of metal

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Organic Chemistry (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Formation Of Insulating Films (AREA)
  • Inorganic Insulating Materials (AREA)
JP2008518322A 2005-06-21 2006-06-21 マンガンドープトチタン酸バリウム薄膜組成物、キャパシタ、およびその製造方法 Withdrawn JP2008547227A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/157,621 US20060287188A1 (en) 2005-06-21 2005-06-21 Manganese doped barium titanate thin film compositions, capacitors, and methods of making thereof
PCT/US2006/024008 WO2007002107A1 (en) 2005-06-21 2006-06-21 Manganese doped barium titanate thin film compositions, capacitors, and methods of making thereof

Publications (2)

Publication Number Publication Date
JP2008547227A true JP2008547227A (ja) 2008-12-25
JP2008547227A5 JP2008547227A5 (https=) 2009-08-06

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JP2008518322A Withdrawn JP2008547227A (ja) 2005-06-21 2006-06-21 マンガンドープトチタン酸バリウム薄膜組成物、キャパシタ、およびその製造方法

Country Status (7)

Country Link
US (3) US20060287188A1 (https=)
EP (1) EP1897103A1 (https=)
JP (1) JP2008547227A (https=)
KR (1) KR100949254B1 (https=)
CN (1) CN101199033A (https=)
TW (1) TW200715324A (https=)
WO (1) WO2007002107A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013129588A (ja) * 2011-12-20 2013-07-04 Mitsubishi Materials Corp 誘電体薄膜形成用組成物、誘電体薄膜の形成方法及び該方法により形成された誘電体薄膜
JP2016060690A (ja) * 2014-09-12 2016-04-25 Tdk株式会社 誘電体膜および誘電体素子

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7795663B2 (en) * 2005-06-21 2010-09-14 E. I. Du Pont De Nemours And Company Acceptor doped barium titanate based thin film capacitors on metal foils and methods of making thereof
JP4908244B2 (ja) * 2007-01-26 2012-04-04 昭和電工株式会社 複合酸化物膜形成用塗布剤
US7635634B2 (en) * 2007-04-16 2009-12-22 Infineon Technologies Ag Dielectric apparatus and associated methods
US8211496B2 (en) * 2007-06-29 2012-07-03 Johnson Ip Holding, Llc Amorphous lithium lanthanum titanate thin films manufacturing method
US9034525B2 (en) * 2008-06-27 2015-05-19 Johnson Ip Holding, Llc Ionically-conductive amorphous lithium lanthanum zirconium oxide
US20120196189A1 (en) 2007-06-29 2012-08-02 Johnson Ip Holding, Llc Amorphous ionically conductive metal oxides and sol gel method of preparation
US20090092903A1 (en) * 2007-08-29 2009-04-09 Johnson Lonnie G Low Cost Solid State Rechargeable Battery and Method of Manufacturing Same
US8446706B1 (en) * 2007-10-10 2013-05-21 Kovio, Inc. High precision capacitors
US20090238954A1 (en) * 2008-03-20 2009-09-24 Seigi Suh Large area thin film capacitors on metal foils and methods of manufacturing same
US20090238955A1 (en) * 2008-03-20 2009-09-24 E. I. Du Pont De Nemours And Company Processes for the manufacture of barium titanate capacitors on nickel foils
US20100202099A1 (en) * 2009-02-12 2010-08-12 Lite-On Capital Inc. Thin film capacitor
US7987566B2 (en) * 2009-07-15 2011-08-02 Sturzebecher Richard J Capacitor forming method
EP2426684A1 (en) 2010-09-02 2012-03-07 Mitsubishi Materials Corporation Dielectric-thin-film forming composition, method of forming dielectric thin film, and dielectric thin film formed by the method
TWI465485B (zh) 2011-09-13 2014-12-21 Ind Tech Res Inst 含氧化石墨之樹脂配方、組成物及其複合材料與無機粉體的分散方法
US10333123B2 (en) 2012-03-01 2019-06-25 Johnson Ip Holding, Llc High capacity solid state composite cathode, solid state composite separator, solid-state rechargeable lithium battery and methods of making same
US10084168B2 (en) 2012-10-09 2018-09-25 Johnson Battery Technologies, Inc. Solid-state battery separators and methods of fabrication
JP6763965B2 (ja) 2015-12-21 2020-09-30 ジョンソン・アイピー・ホールディング・エルエルシー 固体電池、セパレータ、電極および製造方法
US10218044B2 (en) 2016-01-22 2019-02-26 Johnson Ip Holding, Llc Johnson lithium oxygen electrochemical engine
KR20230147659A (ko) * 2021-02-17 2023-10-23 어플라이드 머티어리얼스, 인코포레이티드 더 짧은 커패시터 높이 및 양자 메모리 dram을 위한 커패시터 유전체

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3920781A (en) * 1971-04-02 1975-11-18 Sprague Electric Co Method of forming a ceramic dielectric body
DE3260379D1 (en) 1981-01-27 1984-08-23 Marcel Ramond Universal, transformable and adaptable work-bench allowing specific, multiple and functional applications
JPS57187905A (en) 1981-05-13 1982-11-18 Matsushita Electric Industrial Co Ltd Method of producing positive temperature coefficient thermistor
US4988468A (en) * 1987-01-08 1991-01-29 Murata Manufacturing Co., Ltd. Method for producing non-reducible dielectric ceramic composition
US4855266A (en) * 1987-01-13 1989-08-08 E. I. Du Pont De Nemours And Company High K dielectric composition for use in multilayer ceramic capacitors having copper internal electrodes
JPS6469514A (en) 1987-09-11 1989-03-15 Ube Industries Preparation of starting powder for condenser material
US5198269A (en) * 1989-04-24 1993-03-30 Battelle Memorial Institute Process for making sol-gel deposited ferroelectric thin films insensitive to their substrates
US5155072A (en) * 1990-06-29 1992-10-13 E. I. Du Pont De Nemours And Company High K dielectric compositions with fine grain size
US5130281A (en) * 1990-07-10 1992-07-14 Murata Manufacturing Co., Ltd. Dielectric ceramic compositions and manufacturing method of dielectric ceramics
WO1992019564A1 (en) * 1991-05-01 1992-11-12 The Regents Of The University Of California Amorphous ferroelectric materials
US5296646A (en) * 1992-04-03 1994-03-22 The Whitaker Corporation Protector module for telephone line junction box
US5271955A (en) * 1992-04-06 1993-12-21 Motorola, Inc. Method for making a semiconductor device having an anhydrous ferroelectric thin film
EP0581251A3 (en) * 1992-07-31 1995-02-08 Taiyo Yuden Kk Ceramic materials with a high dielectric constant and capacitors made from them.
US6025619A (en) * 1992-10-23 2000-02-15 Azuma; Masamichi Thin films of ABO3 with excess A-site and B-site modifiers and method of fabricating integrated circuits with same
US5384294A (en) * 1993-11-30 1995-01-24 The United States Of America As Represented By The Secretary Of The Air Force Sol-gel derived lead oxide containing ceramics
US5456908A (en) * 1994-03-01 1995-10-10 The University Of Kentucky Research Foundation Polyamine-polyamine and polyamine-protein transport inhibitor conjugates and their use as pharmaceuticals and in research relating to polyamine transport
US5453908A (en) * 1994-09-30 1995-09-26 Texas Instruments Incorporated Barium strontium titanate (BST) thin films by holmium donor doping
US5563762A (en) * 1994-11-28 1996-10-08 Northern Telecom Limited Capacitor for an integrated circuit and method of formation thereof, and a method of adding on-chip capacitors to an integrated circuit
US6066581A (en) * 1995-07-27 2000-05-23 Nortel Networks Corporation Sol-gel precursor and method for formation of ferroelectric materials for integrated circuits
US5853500A (en) * 1997-07-18 1998-12-29 Symetrix Corporation Method for fabricating thin films of barium strontium titanate without exposure to oxygen at high temperatures
JP2001506425A (ja) * 1997-10-08 2001-05-15 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ セラミック多層キャパシタ
US5962654A (en) * 1998-01-30 1999-10-05 International Business Machines Operation Alkoxyalkoxides and use to form films
US6631551B1 (en) * 1998-06-26 2003-10-14 Delphi Technologies, Inc. Method of forming integral passive electrical components on organic circuit board substrates
US6207522B1 (en) * 1998-11-23 2001-03-27 Microcoating Technologies Formation of thin film capacitors
US6623865B1 (en) 2000-03-04 2003-09-23 Energenius, Inc. Lead zirconate titanate dielectric thin film composites on metallic foils
US6649930B2 (en) * 2000-06-27 2003-11-18 Energenius, Inc. Thin film composite containing a nickel-coated copper substrate and energy storage device containing the same
US6541137B1 (en) * 2000-07-31 2003-04-01 Motorola, Inc. Multi-layer conductor-dielectric oxide structure
WO2002054420A1 (en) * 2000-12-28 2002-07-11 Tdk Corporation Laminated circuit board and production method for electronic part, and laminated electronic part
US6477034B1 (en) * 2001-10-03 2002-11-05 Intel Corporation Interposer substrate with low inductance capacitive paths
US6693793B2 (en) * 2001-10-15 2004-02-17 Mitsui Mining & Smelting Co., Ltd. Double-sided copper clad laminate for capacitor layer formation and its manufacturing method
US6936301B2 (en) * 2002-05-06 2005-08-30 North Carolina State University Methods of controlling oxygen partial pressure during annealing of a perovskite dielectric layer
US7029971B2 (en) * 2003-07-17 2006-04-18 E. I. Du Pont De Nemours And Company Thin film dielectrics for capacitors and methods of making thereof
US7290315B2 (en) * 2004-10-21 2007-11-06 Intel Corporation Method for making a passive device structure
KR100631894B1 (ko) * 2004-12-07 2006-10-09 삼성전기주식회사 유전체 세라믹용 졸 조성물, 이를 이용한 유전체 세라믹과적층세라믹 커패시터
US7795663B2 (en) * 2005-06-21 2010-09-14 E. I. Du Pont De Nemours And Company Acceptor doped barium titanate based thin film capacitors on metal foils and methods of making thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013129588A (ja) * 2011-12-20 2013-07-04 Mitsubishi Materials Corp 誘電体薄膜形成用組成物、誘電体薄膜の形成方法及び該方法により形成された誘電体薄膜
JP2016060690A (ja) * 2014-09-12 2016-04-25 Tdk株式会社 誘電体膜および誘電体素子

Also Published As

Publication number Publication date
WO2007002107A1 (en) 2007-01-04
TW200715324A (en) 2007-04-16
US20060287188A1 (en) 2006-12-21
CN101199033A (zh) 2008-06-11
US7601181B2 (en) 2009-10-13
KR100949254B1 (ko) 2010-03-25
US7572518B2 (en) 2009-08-11
EP1897103A1 (en) 2008-03-12
KR20080018272A (ko) 2008-02-27
US20080047117A1 (en) 2008-02-28
US20080044672A1 (en) 2008-02-21

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