JP2008547227A - マンガンドープトチタン酸バリウム薄膜組成物、キャパシタ、およびその製造方法 - Google Patents
マンガンドープトチタン酸バリウム薄膜組成物、キャパシタ、およびその製造方法 Download PDFInfo
- Publication number
- JP2008547227A JP2008547227A JP2008518322A JP2008518322A JP2008547227A JP 2008547227 A JP2008547227 A JP 2008547227A JP 2008518322 A JP2008518322 A JP 2008518322A JP 2008518322 A JP2008518322 A JP 2008518322A JP 2008547227 A JP2008547227 A JP 2008547227A
- Authority
- JP
- Japan
- Prior art keywords
- dielectric
- thin film
- capacitor
- film composition
- barium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6938—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides
- H10P14/69398—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides the material having a perovskite structure, e.g. BaTiO3
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G23/00—Compounds of titanium
- C01G23/003—Titanates
- C01G23/006—Alkaline earth titanates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/10—Metal-oxide dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
- H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
- H10P14/6516—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials
- H10P14/6529—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by exposure to a gas or vapour
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/80—Particles consisting of a mixture of two or more inorganic phases
- C01P2004/82—Particles consisting of a mixture of two or more inorganic phases two phases having the same anion, e.g. both oxidic phases
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/40—Electric properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0179—Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
- Y10T29/435—Solid dielectric type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Organic Chemistry (AREA)
- Environmental & Geological Engineering (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Formation Of Insulating Films (AREA)
- Inorganic Insulating Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/157,621 US20060287188A1 (en) | 2005-06-21 | 2005-06-21 | Manganese doped barium titanate thin film compositions, capacitors, and methods of making thereof |
| PCT/US2006/024008 WO2007002107A1 (en) | 2005-06-21 | 2006-06-21 | Manganese doped barium titanate thin film compositions, capacitors, and methods of making thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008547227A true JP2008547227A (ja) | 2008-12-25 |
| JP2008547227A5 JP2008547227A5 (https=) | 2009-08-06 |
Family
ID=37110237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008518322A Withdrawn JP2008547227A (ja) | 2005-06-21 | 2006-06-21 | マンガンドープトチタン酸バリウム薄膜組成物、キャパシタ、およびその製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (3) | US20060287188A1 (https=) |
| EP (1) | EP1897103A1 (https=) |
| JP (1) | JP2008547227A (https=) |
| KR (1) | KR100949254B1 (https=) |
| CN (1) | CN101199033A (https=) |
| TW (1) | TW200715324A (https=) |
| WO (1) | WO2007002107A1 (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013129588A (ja) * | 2011-12-20 | 2013-07-04 | Mitsubishi Materials Corp | 誘電体薄膜形成用組成物、誘電体薄膜の形成方法及び該方法により形成された誘電体薄膜 |
| JP2016060690A (ja) * | 2014-09-12 | 2016-04-25 | Tdk株式会社 | 誘電体膜および誘電体素子 |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7795663B2 (en) * | 2005-06-21 | 2010-09-14 | E. I. Du Pont De Nemours And Company | Acceptor doped barium titanate based thin film capacitors on metal foils and methods of making thereof |
| JP4908244B2 (ja) * | 2007-01-26 | 2012-04-04 | 昭和電工株式会社 | 複合酸化物膜形成用塗布剤 |
| US7635634B2 (en) * | 2007-04-16 | 2009-12-22 | Infineon Technologies Ag | Dielectric apparatus and associated methods |
| US8211496B2 (en) * | 2007-06-29 | 2012-07-03 | Johnson Ip Holding, Llc | Amorphous lithium lanthanum titanate thin films manufacturing method |
| US9034525B2 (en) * | 2008-06-27 | 2015-05-19 | Johnson Ip Holding, Llc | Ionically-conductive amorphous lithium lanthanum zirconium oxide |
| US20120196189A1 (en) | 2007-06-29 | 2012-08-02 | Johnson Ip Holding, Llc | Amorphous ionically conductive metal oxides and sol gel method of preparation |
| US20090092903A1 (en) * | 2007-08-29 | 2009-04-09 | Johnson Lonnie G | Low Cost Solid State Rechargeable Battery and Method of Manufacturing Same |
| US8446706B1 (en) * | 2007-10-10 | 2013-05-21 | Kovio, Inc. | High precision capacitors |
| US20090238954A1 (en) * | 2008-03-20 | 2009-09-24 | Seigi Suh | Large area thin film capacitors on metal foils and methods of manufacturing same |
| US20090238955A1 (en) * | 2008-03-20 | 2009-09-24 | E. I. Du Pont De Nemours And Company | Processes for the manufacture of barium titanate capacitors on nickel foils |
| US20100202099A1 (en) * | 2009-02-12 | 2010-08-12 | Lite-On Capital Inc. | Thin film capacitor |
| US7987566B2 (en) * | 2009-07-15 | 2011-08-02 | Sturzebecher Richard J | Capacitor forming method |
| EP2426684A1 (en) | 2010-09-02 | 2012-03-07 | Mitsubishi Materials Corporation | Dielectric-thin-film forming composition, method of forming dielectric thin film, and dielectric thin film formed by the method |
| TWI465485B (zh) | 2011-09-13 | 2014-12-21 | Ind Tech Res Inst | 含氧化石墨之樹脂配方、組成物及其複合材料與無機粉體的分散方法 |
| US10333123B2 (en) | 2012-03-01 | 2019-06-25 | Johnson Ip Holding, Llc | High capacity solid state composite cathode, solid state composite separator, solid-state rechargeable lithium battery and methods of making same |
| US10084168B2 (en) | 2012-10-09 | 2018-09-25 | Johnson Battery Technologies, Inc. | Solid-state battery separators and methods of fabrication |
| JP6763965B2 (ja) | 2015-12-21 | 2020-09-30 | ジョンソン・アイピー・ホールディング・エルエルシー | 固体電池、セパレータ、電極および製造方法 |
| US10218044B2 (en) | 2016-01-22 | 2019-02-26 | Johnson Ip Holding, Llc | Johnson lithium oxygen electrochemical engine |
| KR20230147659A (ko) * | 2021-02-17 | 2023-10-23 | 어플라이드 머티어리얼스, 인코포레이티드 | 더 짧은 커패시터 높이 및 양자 메모리 dram을 위한 커패시터 유전체 |
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| US3920781A (en) * | 1971-04-02 | 1975-11-18 | Sprague Electric Co | Method of forming a ceramic dielectric body |
| DE3260379D1 (en) | 1981-01-27 | 1984-08-23 | Marcel Ramond | Universal, transformable and adaptable work-bench allowing specific, multiple and functional applications |
| JPS57187905A (en) | 1981-05-13 | 1982-11-18 | Matsushita Electric Industrial Co Ltd | Method of producing positive temperature coefficient thermistor |
| US4988468A (en) * | 1987-01-08 | 1991-01-29 | Murata Manufacturing Co., Ltd. | Method for producing non-reducible dielectric ceramic composition |
| US4855266A (en) * | 1987-01-13 | 1989-08-08 | E. I. Du Pont De Nemours And Company | High K dielectric composition for use in multilayer ceramic capacitors having copper internal electrodes |
| JPS6469514A (en) | 1987-09-11 | 1989-03-15 | Ube Industries | Preparation of starting powder for condenser material |
| US5198269A (en) * | 1989-04-24 | 1993-03-30 | Battelle Memorial Institute | Process for making sol-gel deposited ferroelectric thin films insensitive to their substrates |
| US5155072A (en) * | 1990-06-29 | 1992-10-13 | E. I. Du Pont De Nemours And Company | High K dielectric compositions with fine grain size |
| US5130281A (en) * | 1990-07-10 | 1992-07-14 | Murata Manufacturing Co., Ltd. | Dielectric ceramic compositions and manufacturing method of dielectric ceramics |
| WO1992019564A1 (en) * | 1991-05-01 | 1992-11-12 | The Regents Of The University Of California | Amorphous ferroelectric materials |
| US5296646A (en) * | 1992-04-03 | 1994-03-22 | The Whitaker Corporation | Protector module for telephone line junction box |
| US5271955A (en) * | 1992-04-06 | 1993-12-21 | Motorola, Inc. | Method for making a semiconductor device having an anhydrous ferroelectric thin film |
| EP0581251A3 (en) * | 1992-07-31 | 1995-02-08 | Taiyo Yuden Kk | Ceramic materials with a high dielectric constant and capacitors made from them. |
| US6025619A (en) * | 1992-10-23 | 2000-02-15 | Azuma; Masamichi | Thin films of ABO3 with excess A-site and B-site modifiers and method of fabricating integrated circuits with same |
| US5384294A (en) * | 1993-11-30 | 1995-01-24 | The United States Of America As Represented By The Secretary Of The Air Force | Sol-gel derived lead oxide containing ceramics |
| US5456908A (en) * | 1994-03-01 | 1995-10-10 | The University Of Kentucky Research Foundation | Polyamine-polyamine and polyamine-protein transport inhibitor conjugates and their use as pharmaceuticals and in research relating to polyamine transport |
| US5453908A (en) * | 1994-09-30 | 1995-09-26 | Texas Instruments Incorporated | Barium strontium titanate (BST) thin films by holmium donor doping |
| US5563762A (en) * | 1994-11-28 | 1996-10-08 | Northern Telecom Limited | Capacitor for an integrated circuit and method of formation thereof, and a method of adding on-chip capacitors to an integrated circuit |
| US6066581A (en) * | 1995-07-27 | 2000-05-23 | Nortel Networks Corporation | Sol-gel precursor and method for formation of ferroelectric materials for integrated circuits |
| US5853500A (en) * | 1997-07-18 | 1998-12-29 | Symetrix Corporation | Method for fabricating thin films of barium strontium titanate without exposure to oxygen at high temperatures |
| JP2001506425A (ja) * | 1997-10-08 | 2001-05-15 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | セラミック多層キャパシタ |
| US5962654A (en) * | 1998-01-30 | 1999-10-05 | International Business Machines Operation | Alkoxyalkoxides and use to form films |
| US6631551B1 (en) * | 1998-06-26 | 2003-10-14 | Delphi Technologies, Inc. | Method of forming integral passive electrical components on organic circuit board substrates |
| US6207522B1 (en) * | 1998-11-23 | 2001-03-27 | Microcoating Technologies | Formation of thin film capacitors |
| US6623865B1 (en) | 2000-03-04 | 2003-09-23 | Energenius, Inc. | Lead zirconate titanate dielectric thin film composites on metallic foils |
| US6649930B2 (en) * | 2000-06-27 | 2003-11-18 | Energenius, Inc. | Thin film composite containing a nickel-coated copper substrate and energy storage device containing the same |
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| WO2002054420A1 (en) * | 2000-12-28 | 2002-07-11 | Tdk Corporation | Laminated circuit board and production method for electronic part, and laminated electronic part |
| US6477034B1 (en) * | 2001-10-03 | 2002-11-05 | Intel Corporation | Interposer substrate with low inductance capacitive paths |
| US6693793B2 (en) * | 2001-10-15 | 2004-02-17 | Mitsui Mining & Smelting Co., Ltd. | Double-sided copper clad laminate for capacitor layer formation and its manufacturing method |
| US6936301B2 (en) * | 2002-05-06 | 2005-08-30 | North Carolina State University | Methods of controlling oxygen partial pressure during annealing of a perovskite dielectric layer |
| US7029971B2 (en) * | 2003-07-17 | 2006-04-18 | E. I. Du Pont De Nemours And Company | Thin film dielectrics for capacitors and methods of making thereof |
| US7290315B2 (en) * | 2004-10-21 | 2007-11-06 | Intel Corporation | Method for making a passive device structure |
| KR100631894B1 (ko) * | 2004-12-07 | 2006-10-09 | 삼성전기주식회사 | 유전체 세라믹용 졸 조성물, 이를 이용한 유전체 세라믹과적층세라믹 커패시터 |
| US7795663B2 (en) * | 2005-06-21 | 2010-09-14 | E. I. Du Pont De Nemours And Company | Acceptor doped barium titanate based thin film capacitors on metal foils and methods of making thereof |
-
2005
- 2005-06-21 US US11/157,621 patent/US20060287188A1/en not_active Abandoned
-
2006
- 2006-06-21 WO PCT/US2006/024008 patent/WO2007002107A1/en not_active Ceased
- 2006-06-21 KR KR1020087001432A patent/KR100949254B1/ko active Active
- 2006-06-21 TW TW095122297A patent/TW200715324A/zh unknown
- 2006-06-21 EP EP20060785199 patent/EP1897103A1/en not_active Withdrawn
- 2006-06-21 JP JP2008518322A patent/JP2008547227A/ja not_active Withdrawn
- 2006-06-21 CN CNA200680021826XA patent/CN101199033A/zh active Pending
-
2007
- 2007-10-24 US US11/923,594 patent/US7572518B2/en not_active Expired - Lifetime
- 2007-10-25 US US11/923,974 patent/US7601181B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013129588A (ja) * | 2011-12-20 | 2013-07-04 | Mitsubishi Materials Corp | 誘電体薄膜形成用組成物、誘電体薄膜の形成方法及び該方法により形成された誘電体薄膜 |
| JP2016060690A (ja) * | 2014-09-12 | 2016-04-25 | Tdk株式会社 | 誘電体膜および誘電体素子 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2007002107A1 (en) | 2007-01-04 |
| TW200715324A (en) | 2007-04-16 |
| US20060287188A1 (en) | 2006-12-21 |
| CN101199033A (zh) | 2008-06-11 |
| US7601181B2 (en) | 2009-10-13 |
| KR100949254B1 (ko) | 2010-03-25 |
| US7572518B2 (en) | 2009-08-11 |
| EP1897103A1 (en) | 2008-03-12 |
| KR20080018272A (ko) | 2008-02-27 |
| US20080047117A1 (en) | 2008-02-28 |
| US20080044672A1 (en) | 2008-02-21 |
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