JP2008547224A5 - - Google Patents

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Publication number
JP2008547224A5
JP2008547224A5 JP2008518247A JP2008518247A JP2008547224A5 JP 2008547224 A5 JP2008547224 A5 JP 2008547224A5 JP 2008518247 A JP2008518247 A JP 2008518247A JP 2008518247 A JP2008518247 A JP 2008518247A JP 2008547224 A5 JP2008547224 A5 JP 2008547224A5
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gap
substrate
film
gas
flow
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JP2008518247A
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JP5225081B2 (ja
JP2008547224A (ja
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Priority claimed from US11/166,357 external-priority patent/US7329586B2/en
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JP2008518247A 2005-06-24 2006-06-15 堆積・エッチングシーケンスを用いたギャップ充填 Active JP5225081B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/166,357 2005-06-24
US11/166,357 US7329586B2 (en) 2005-06-24 2005-06-24 Gapfill using deposition-etch sequence
PCT/US2006/023311 WO2007001878A2 (en) 2005-06-24 2006-06-15 Gapfill using deposition-etch sequence

Publications (3)

Publication Number Publication Date
JP2008547224A JP2008547224A (ja) 2008-12-25
JP2008547224A5 true JP2008547224A5 (enExample) 2011-08-11
JP5225081B2 JP5225081B2 (ja) 2013-07-03

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JP2008518247A Active JP5225081B2 (ja) 2005-06-24 2006-06-15 堆積・エッチングシーケンスを用いたギャップ充填

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US (1) US7329586B2 (enExample)
JP (1) JP5225081B2 (enExample)
CN (1) CN101278380B (enExample)
WO (1) WO2007001878A2 (enExample)

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