JP2008546550A5 - - Google Patents

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Publication number
JP2008546550A5
JP2008546550A5 JP2008518178A JP2008518178A JP2008546550A5 JP 2008546550 A5 JP2008546550 A5 JP 2008546550A5 JP 2008518178 A JP2008518178 A JP 2008518178A JP 2008518178 A JP2008518178 A JP 2008518178A JP 2008546550 A5 JP2008546550 A5 JP 2008546550A5
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JP
Japan
Prior art keywords
density
less
pores
porous material
polishing pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008518178A
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English (en)
Japanese (ja)
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JP2008546550A (ja
Filing date
Publication date
Priority claimed from US11/158,694 external-priority patent/US7267607B2/en
Application filed filed Critical
Publication of JP2008546550A publication Critical patent/JP2008546550A/ja
Publication of JP2008546550A5 publication Critical patent/JP2008546550A5/ja
Pending legal-status Critical Current

Links

JP2008518178A 2005-06-22 2006-05-24 Ｃｍｐのための透過性微細多孔質材料 Pending JP2008546550A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/158,694 US7267607B2 (en) 2002-10-28 2005-06-22 Transparent microporous materials for CMP
PCT/US2006/020193 WO2007001699A1 (en) 2005-06-22 2006-05-24 Tranparent microporous materials for cmp

Publications (2)

Publication Number Publication Date
JP2008546550A JP2008546550A (ja) 2008-12-25
JP2008546550A5 true JP2008546550A5 (enExample) 2009-07-09

Family

ID=37101929

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008518178A Pending JP2008546550A (ja) 2005-06-22 2006-05-24 Ｃｍｐのための透過性微細多孔質材料

Country Status (8)

Country Link
US (1) US7267607B2 (enExample)
EP (1) EP1915233B1 (enExample)
JP (1) JP2008546550A (enExample)
KR (1) KR101265370B1 (enExample)
CN (1) CN101208180A (enExample)
IL (1) IL187705A (enExample)
TW (1) TWI295946B (enExample)
WO (1) WO2007001699A1 (enExample)

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US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US10456886B2 (en) 2016-01-19 2019-10-29 Applied Materials, Inc. Porous chemical mechanical polishing pads
CN106146875A (zh) * 2016-07-11 2016-11-23 浙江新恒泰新材料有限公司 一种高倍率热塑性聚氨酯微孔发泡板材及其生产方法
US10259099B2 (en) * 2016-08-04 2019-04-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Tapering method for poromeric polishing pad
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
KR102794221B1 (ko) * 2020-11-19 2025-04-15 주식회사 케이씨텍 기판 연마 장치
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
CN114536212B (zh) * 2022-01-29 2024-02-09 浙江环龙新材料科技有限公司 一种微孔热塑性聚氨酯抛光垫及其半连续制备方法

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