TWI295946B - Transparent microporous materials for cmp - Google Patents

Transparent microporous materials for cmp Download PDF

Info

Publication number
TWI295946B
TWI295946B TW095120654A TW95120654A TWI295946B TW I295946 B TWI295946 B TW I295946B TW 095120654 A TW095120654 A TW 095120654A TW 95120654 A TW95120654 A TW 95120654A TW I295946 B TWI295946 B TW I295946B
Authority
TW
Taiwan
Prior art keywords
polishing pad
pad substrate
range
gas
substrate
Prior art date
Application number
TW095120654A
Other languages
English (en)
Chinese (zh)
Other versions
TW200702102A (en
Inventor
Abaneshwar Prasad
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of TW200702102A publication Critical patent/TW200702102A/zh
Application granted granted Critical
Publication of TWI295946B publication Critical patent/TWI295946B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/02—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery
    • B24D13/12—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery comprising assemblies of felted or spongy material, e.g. felt, steel wool, foamed latex
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
TW095120654A 2005-06-22 2006-06-09 Transparent microporous materials for cmp TWI295946B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/158,694 US7267607B2 (en) 2002-10-28 2005-06-22 Transparent microporous materials for CMP

Publications (2)

Publication Number Publication Date
TW200702102A TW200702102A (en) 2007-01-16
TWI295946B true TWI295946B (en) 2008-04-21

Family

ID=37101929

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095120654A TWI295946B (en) 2005-06-22 2006-06-09 Transparent microporous materials for cmp

Country Status (8)

Country Link
US (1) US7267607B2 (enExample)
EP (1) EP1915233B1 (enExample)
JP (1) JP2008546550A (enExample)
KR (1) KR101265370B1 (enExample)
CN (1) CN101208180A (enExample)
IL (1) IL187705A (enExample)
TW (1) TWI295946B (enExample)
WO (1) WO2007001699A1 (enExample)

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KR101217265B1 (ko) 2009-06-24 2012-12-31 주식회사 엘지화학 다공성 시트의 제조방법 및 이에 의해 제조된 다공성 시트
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US20150056895A1 (en) * 2013-08-22 2015-02-26 Cabot Microelectronics Corporation Ultra high void volume polishing pad with closed pore structure
WO2015026614A1 (en) * 2013-08-22 2015-02-26 Cabot Microelectronics Corporation Polishing pad with porous interface and solid core, and related apparatus and methods
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US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
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US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
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US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
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US20160121578A1 (en) * 2014-10-29 2016-05-05 Nonwoven Networks Llc High performance moldable composite
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KR20240015161A (ko) 2016-01-19 2024-02-02 어플라이드 머티어리얼스, 인코포레이티드 다공성 화학적 기계적 연마 패드들
CN106146875A (zh) * 2016-07-11 2016-11-23 浙江新恒泰新材料有限公司 一种高倍率热塑性聚氨酯微孔发泡板材及其生产方法
US10259099B2 (en) * 2016-08-04 2019-04-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Tapering method for poromeric polishing pad
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
CN112654655A (zh) 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
KR102794221B1 (ko) * 2020-11-19 2025-04-15 주식회사 케이씨텍 기판 연마 장치
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
JP7587455B2 (ja) * 2021-03-30 2024-11-20 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
CN114536212B (zh) * 2022-01-29 2024-02-09 浙江环龙新材料科技有限公司 一种微孔热塑性聚氨酯抛光垫及其半连续制备方法

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Also Published As

Publication number Publication date
EP1915233B1 (en) 2019-01-30
KR101265370B1 (ko) 2013-05-22
TW200702102A (en) 2007-01-16
CN101208180A (zh) 2008-06-25
JP2008546550A (ja) 2008-12-25
EP1915233A1 (en) 2008-04-30
US7267607B2 (en) 2007-09-11
IL187705A0 (en) 2008-08-07
KR20080016663A (ko) 2008-02-21
US20050277371A1 (en) 2005-12-15
WO2007001699A1 (en) 2007-01-04
IL187705A (en) 2013-03-24

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