TWI295946B - Transparent microporous materials for cmp - Google Patents
Transparent microporous materials for cmp Download PDFInfo
- Publication number
- TWI295946B TWI295946B TW095120654A TW95120654A TWI295946B TW I295946 B TWI295946 B TW I295946B TW 095120654 A TW095120654 A TW 095120654A TW 95120654 A TW95120654 A TW 95120654A TW I295946 B TWI295946 B TW I295946B
- Authority
- TW
- Taiwan
- Prior art keywords
- polishing pad
- pad substrate
- range
- gas
- substrate
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
- B24D13/02—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery
- B24D13/12—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery comprising assemblies of felted or spongy material, e.g. felt, steel wool, foamed latex
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
- B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
-
- H10P52/00—
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/158,694 US7267607B2 (en) | 2002-10-28 | 2005-06-22 | Transparent microporous materials for CMP |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200702102A TW200702102A (en) | 2007-01-16 |
| TWI295946B true TWI295946B (en) | 2008-04-21 |
Family
ID=37101929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095120654A TWI295946B (en) | 2005-06-22 | 2006-06-09 | Transparent microporous materials for cmp |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7267607B2 (enExample) |
| EP (1) | EP1915233B1 (enExample) |
| JP (1) | JP2008546550A (enExample) |
| KR (1) | KR101265370B1 (enExample) |
| CN (1) | CN101208180A (enExample) |
| IL (1) | IL187705A (enExample) |
| TW (1) | TWI295946B (enExample) |
| WO (1) | WO2007001699A1 (enExample) |
Families Citing this family (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050276967A1 (en) * | 2002-05-23 | 2005-12-15 | Cabot Microelectronics Corporation | Surface textured microporous polishing pads |
| JP3754436B2 (ja) * | 2004-02-23 | 2006-03-15 | 東洋ゴム工業株式会社 | 研磨パッドおよびそれを使用する半導体デバイスの製造方法 |
| US7438636B2 (en) * | 2006-12-21 | 2008-10-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
| TW200904591A (en) * | 2007-07-18 | 2009-02-01 | Kinik Co | Polishing tool having brazing filler layer made from spraying molding and processing method utilizing the same |
| EP2389275A1 (en) | 2009-01-05 | 2011-11-30 | innoPad, Inc. | Multi-layered chemical-mechanical planarization pad |
| WO2010143899A2 (ko) * | 2009-06-10 | 2010-12-16 | 주식회사 엘지화학 | 다공성 시트의 제조방법 및 이에 의해 제조된 다공성 시트 |
| KR101217265B1 (ko) | 2009-06-24 | 2012-12-31 | 주식회사 엘지화학 | 다공성 시트의 제조방법 및 이에 의해 제조된 다공성 시트 |
| US8162728B2 (en) | 2009-09-28 | 2012-04-24 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Dual-pore structure polishing pad |
| US9017140B2 (en) | 2010-01-13 | 2015-04-28 | Nexplanar Corporation | CMP pad with local area transparency |
| WO2011112352A1 (en) | 2010-03-10 | 2011-09-15 | Dow Global Technologies Llc | Nanoporous polymeric foam having high cell density without nanofiller |
| US9156124B2 (en) | 2010-07-08 | 2015-10-13 | Nexplanar Corporation | Soft polishing pad for polishing a semiconductor substrate |
| DE102010026722A1 (de) | 2010-07-09 | 2012-01-12 | Ahlbrandt System Gmbh | Vorrichtung zum Modifizieren der Oberfläche von Bahn-, Platten- oder Bogenware |
| US9186772B2 (en) | 2013-03-07 | 2015-11-17 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with broad spectrum, endpoint detection window and method of polishing therewith |
| JP6595473B2 (ja) * | 2013-08-22 | 2019-10-23 | キャボット マイクロエレクトロニクス コーポレイション | 多孔質界面および中実コアを備えた研磨パッドならびにその装置および方法 |
| US20150056895A1 (en) * | 2013-08-22 | 2015-02-26 | Cabot Microelectronics Corporation | Ultra high void volume polishing pad with closed pore structure |
| US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
| US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
| US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
| US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
| US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
| CN107078048B (zh) | 2014-10-17 | 2021-08-13 | 应用材料公司 | 使用加成制造工艺的具复合材料特性的cmp衬垫建构 |
| US20160121578A1 (en) * | 2014-10-29 | 2016-05-05 | Nonwoven Networks Llc | High performance moldable composite |
| CN113103145B (zh) | 2015-10-30 | 2023-04-11 | 应用材料公司 | 形成具有期望ζ电位的抛光制品的设备与方法 |
| US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
| US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
| CN108698206B (zh) | 2016-01-19 | 2021-04-02 | 应用材料公司 | 多孔化学机械抛光垫 |
| CN106146875A (zh) * | 2016-07-11 | 2016-11-23 | 浙江新恒泰新材料有限公司 | 一种高倍率热塑性聚氨酯微孔发泡板材及其生产方法 |
| US10259099B2 (en) * | 2016-08-04 | 2019-04-16 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Tapering method for poromeric polishing pad |
| US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
| WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
| WO2020050932A1 (en) | 2018-09-04 | 2020-03-12 | Applied Materials, Inc. | Formulations for advanced polishing pads |
| US11813712B2 (en) | 2019-12-20 | 2023-11-14 | Applied Materials, Inc. | Polishing pads having selectively arranged porosity |
| US11806829B2 (en) | 2020-06-19 | 2023-11-07 | Applied Materials, Inc. | Advanced polishing pads and related polishing pad manufacturing methods |
| KR102794221B1 (ko) * | 2020-11-19 | 2025-04-15 | 주식회사 케이씨텍 | 기판 연마 장치 |
| US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
| CN114536212B (zh) * | 2022-01-29 | 2024-02-09 | 浙江环龙新材料科技有限公司 | 一种微孔热塑性聚氨酯抛光垫及其半连续制备方法 |
Family Cites Families (54)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4138228A (en) * | 1977-02-02 | 1979-02-06 | Ralf Hoehn | Abrasive of a microporous polymer matrix with inorganic particles thereon |
| US4239567A (en) * | 1978-10-16 | 1980-12-16 | Western Electric Company, Inc. | Removably holding planar articles for polishing operations |
| JPH01193166A (ja) * | 1988-01-28 | 1989-08-03 | Showa Denko Kk | 半導体ウェハ鏡面研磨用パッド |
| US5182307A (en) * | 1990-11-21 | 1993-01-26 | Board Of Regents Of The University Of Washington | Polyethylene terephthalate foams with integral crystalline skins |
| DE4321823C2 (de) * | 1993-07-01 | 1997-03-06 | Telefunken Microelectron | Beleuchtungseinheit für Leuchtschilder |
| US5441598A (en) * | 1993-12-16 | 1995-08-15 | Motorola, Inc. | Polishing pad for chemical-mechanical polishing of a semiconductor substrate |
| US5489233A (en) * | 1994-04-08 | 1996-02-06 | Rodel, Inc. | Polishing pads and methods for their use |
| US5684055A (en) * | 1994-12-13 | 1997-11-04 | University Of Washington | Semi-continuous production of solid state polymeric foams |
| US5893796A (en) * | 1995-03-28 | 1999-04-13 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
| US5964643A (en) * | 1995-03-28 | 1999-10-12 | Applied Materials, Inc. | Apparatus and method for in-situ monitoring of chemical mechanical polishing operations |
| US5605760A (en) | 1995-08-21 | 1997-02-25 | Rodel, Inc. | Polishing pads |
| GB2316414B (en) * | 1996-07-31 | 2000-10-11 | Tosoh Corp | Abrasive shaped article, abrasive disc and polishing method |
| WO1998008667A2 (en) * | 1996-08-27 | 1998-03-05 | Trexel, Inc. | Method and apparatus for microcellular polymer extrusion |
| WO1998028108A1 (en) | 1996-12-20 | 1998-07-02 | Unique Technology International Private Limited | Manufacture of porous polishing pad |
| US6022268A (en) * | 1998-04-03 | 2000-02-08 | Rodel Holdings Inc. | Polishing pads and methods relating thereto |
| DE69809265T2 (de) * | 1997-04-18 | 2003-03-27 | Cabot Microelectronics Corp., Aurora | Polierkissen fur einen halbleitersubstrat |
| US6235380B1 (en) * | 1997-07-24 | 2001-05-22 | Trexel, Inc. | Lamination of microcellular articles |
| EP1040158B2 (en) * | 1997-12-19 | 2012-04-18 | Trexel, Inc. | Microcellular foam extrusion/blow molding process and article made thereby |
| US6231942B1 (en) * | 1998-01-21 | 2001-05-15 | Trexel, Inc. | Method and apparatus for microcellular polypropylene extrusion, and polypropylene articles produced thereby |
| GB2334205B (en) * | 1998-02-12 | 2001-11-28 | Shinetsu Handotai Kk | Polishing method for semiconductor wafer and polishing pad used therein |
| US6248000B1 (en) * | 1998-03-24 | 2001-06-19 | Nikon Research Corporation Of America | Polishing pad thinning to optically access a semiconductor wafer surface |
| JP2918883B1 (ja) * | 1998-07-15 | 1999-07-12 | 日本ピラー工業株式会社 | 研磨パッド |
| JP3685064B2 (ja) | 1998-08-28 | 2005-08-17 | 東レ株式会社 | 研磨パッド |
| US6322347B1 (en) | 1999-04-02 | 2001-11-27 | Trexel, Inc. | Methods for manufacturing foam material including systems with pressure restriction element |
| EP1043378B1 (en) * | 1999-04-09 | 2006-02-15 | Tosoh Corporation | Molded abrasive product and polishing wheel using it |
| US6656018B1 (en) | 1999-04-13 | 2003-12-02 | Freudenberg Nonwovens Limited Partnership | Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles |
| US6146242A (en) * | 1999-06-11 | 2000-11-14 | Strasbaugh, Inc. | Optical view port for chemical mechanical planarization endpoint detection |
| US6171181B1 (en) * | 1999-08-17 | 2001-01-09 | Rodel Holdings, Inc. | Molded polishing pad having integral window |
| JP2001062703A (ja) * | 1999-08-27 | 2001-03-13 | Asahi Chem Ind Co Ltd | 多孔性樹脂窓付き研磨パッド |
| US6602064B1 (en) | 1999-08-31 | 2003-08-05 | Trexel, Inc. | Polymer processing system and apparatus |
| US20020090819A1 (en) | 1999-08-31 | 2002-07-11 | Cangshan Xu | Windowless belt and method for improved in-situ wafer monitoring |
| EP1224060B1 (en) * | 1999-09-29 | 2004-06-23 | Rodel Holdings, Inc. | Polishing pad |
| AU2750201A (en) | 1999-11-05 | 2001-05-30 | Trexel, Inc. | Thermoformed polyolefin foams and methods of their production |
| US6368200B1 (en) * | 2000-03-02 | 2002-04-09 | Agere Systems Guardian Corporation | Polishing pads from closed-cell elastomer foam |
| EP1263548A1 (en) | 2000-03-15 | 2002-12-11 | Rodel Holdings, Inc. | Window portion with an adjusted rate of wear |
| US6454634B1 (en) * | 2000-05-27 | 2002-09-24 | Rodel Holdings Inc. | Polishing pads for chemical mechanical planarization |
| JP3925041B2 (ja) * | 2000-05-31 | 2007-06-06 | Jsr株式会社 | 研磨パッド用組成物及びこれを用いた研磨パッド |
| JP2001348271A (ja) * | 2000-06-01 | 2001-12-18 | Tosoh Corp | 研磨用成形体及びこれを用いた研磨用定盤 |
| US6685537B1 (en) | 2000-06-05 | 2004-02-03 | Speedfam-Ipec Corporation | Polishing pad window for a chemical mechanical polishing tool |
| US6623337B2 (en) | 2000-06-30 | 2003-09-23 | Rodel Holdings, Inc. | Base-pad for a polishing pad |
| US6458013B1 (en) | 2000-07-31 | 2002-10-01 | Asml Us, Inc. | Method of chemical mechanical polishing |
| US6477926B1 (en) * | 2000-09-15 | 2002-11-12 | Ppg Industries Ohio, Inc. | Polishing pad |
| US6641471B1 (en) * | 2000-09-19 | 2003-11-04 | Rodel Holdings, Inc | Polishing pad having an advantageous micro-texture and methods relating thereto |
| US20020072296A1 (en) * | 2000-11-29 | 2002-06-13 | Muilenburg Michael J. | Abrasive article having a window system for polishing wafers, and methods |
| EP1211024A3 (en) | 2000-11-30 | 2004-01-02 | JSR Corporation | Polishing method |
| US20020098790A1 (en) * | 2001-01-19 | 2002-07-25 | Burke Peter A. | Open structure polishing pad and methods for limiting pore depth |
| US20020098789A1 (en) * | 2001-01-19 | 2002-07-25 | Peter A. Burke | Polishing pad and methods for improved pad surface and pad interior characteristics |
| WO2002070200A1 (en) * | 2001-03-01 | 2002-09-12 | Cabot Microelectronics Corporation | Method for manufacturing a polishing pad having a compressed translucent region |
| JP3455208B2 (ja) * | 2001-11-13 | 2003-10-14 | 東洋紡績株式会社 | 半導体ウエハ研磨パッド、半導体ウエハの研磨方法、研磨パッド用研磨シート、及び研磨シート用発泡体ブロック |
| KR100877385B1 (ko) | 2001-11-13 | 2009-01-07 | 도요 고무 고교 가부시키가이샤 | 연마 패드 및 그 제조 방법 |
| JP3494640B1 (ja) * | 2001-12-07 | 2004-02-09 | 東洋ゴム工業株式会社 | 研磨パッド |
| US6913517B2 (en) | 2002-05-23 | 2005-07-05 | Cabot Microelectronics Corporation | Microporous polishing pads |
| US7435165B2 (en) * | 2002-10-28 | 2008-10-14 | Cabot Microelectronics Corporation | Transparent microporous materials for CMP |
| US6998166B2 (en) | 2003-06-17 | 2006-02-14 | Cabot Microelectronics Corporation | Polishing pad with oriented pore structure |
-
2005
- 2005-06-22 US US11/158,694 patent/US7267607B2/en not_active Expired - Lifetime
-
2006
- 2006-05-24 WO PCT/US2006/020193 patent/WO2007001699A1/en not_active Ceased
- 2006-05-24 JP JP2008518178A patent/JP2008546550A/ja active Pending
- 2006-05-24 EP EP06760366.2A patent/EP1915233B1/en active Active
- 2006-05-24 CN CNA2006800227305A patent/CN101208180A/zh active Pending
- 2006-05-24 KR KR1020077029836A patent/KR101265370B1/ko active Active
- 2006-06-09 TW TW095120654A patent/TWI295946B/zh active
-
2007
- 2007-11-27 IL IL187705A patent/IL187705A/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| IL187705A (en) | 2013-03-24 |
| JP2008546550A (ja) | 2008-12-25 |
| WO2007001699A1 (en) | 2007-01-04 |
| TW200702102A (en) | 2007-01-16 |
| EP1915233B1 (en) | 2019-01-30 |
| EP1915233A1 (en) | 2008-04-30 |
| KR20080016663A (ko) | 2008-02-21 |
| CN101208180A (zh) | 2008-06-25 |
| US7267607B2 (en) | 2007-09-11 |
| KR101265370B1 (ko) | 2013-05-22 |
| US20050277371A1 (en) | 2005-12-15 |
| IL187705A0 (en) | 2008-08-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI295946B (en) | Transparent microporous materials for cmp | |
| CN100589934C (zh) | 供化学机械抛光用的透明微孔材料 | |
| CN101316683B (zh) | 制造具有经控制的孔径的微孔化学机械抛光材料的方法 | |
| TWI279289B (en) | Polishing pad with microporous regions | |
| CN101219531B (zh) | 微孔抛光垫 | |
| KR101109211B1 (ko) | 배향된 포아 구조를 갖는 연마 패드 | |
| KR20080037719A (ko) | 표면-텍스쳐화 미공질 연마 패드 |