JP2008544086A - 平坦且つ平面的な物体を処理する装置 - Google Patents

平坦且つ平面的な物体を処理する装置 Download PDF

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Publication number
JP2008544086A
JP2008544086A JP2008517394A JP2008517394A JP2008544086A JP 2008544086 A JP2008544086 A JP 2008544086A JP 2008517394 A JP2008517394 A JP 2008517394A JP 2008517394 A JP2008517394 A JP 2008517394A JP 2008544086 A JP2008544086 A JP 2008544086A
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JP
Japan
Prior art keywords
contact
contact means
circuit board
wheel
case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008517394A
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English (en)
Japanese (ja)
Other versions
JP2008544086A5 (https=
Inventor
アンドレアス マウラー，ベルナー
Original Assignee
ゲブリューダー シュミット ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ゲブリューダー シュミット ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー filed Critical ゲブリューダー シュミット ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー
Publication of JP2008544086A publication Critical patent/JP2008544086A/ja
Publication of JP2008544086A5 publication Critical patent/JP2008544086A5/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0621—In horizontal cells
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2008517394A 2005-06-22 2006-06-20 平坦且つ平面的な物体を処理する装置 Pending JP2008544086A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005030546A DE102005030546A1 (de) 2005-06-22 2005-06-22 Einrichtung zur Behandlung von flachen und flächigen Gegenständen
PCT/EP2006/005892 WO2006136362A2 (de) 2005-06-22 2006-06-20 Einrichtung zur behandlung von flachen und flächigen gegenständen

Publications (2)

Publication Number Publication Date
JP2008544086A true JP2008544086A (ja) 2008-12-04
JP2008544086A5 JP2008544086A5 (https=) 2009-08-06

Family

ID=36809626

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008517394A Pending JP2008544086A (ja) 2005-06-22 2006-06-20 平坦且つ平面的な物体を処理する装置

Country Status (7)

Country Link
EP (1) EP1899507A2 (https=)
JP (1) JP2008544086A (https=)
KR (1) KR20080039841A (https=)
CN (1) CN101203632A (https=)
AT (1) AT10276U1 (https=)
DE (1) DE102005030546A1 (https=)
WO (1) WO2006136362A2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009023763A1 (de) 2009-05-22 2010-11-25 Hübel, Egon, Dipl.-Ing. (FH) Verfahren und Vorrichtung zum elektrolytischen Behandeln von hochohmigen Schichten
DE102009023768A1 (de) * 2009-05-22 2010-11-25 Hübel, Egon, Dipl.-Ing. (FH) Verfahren und Vorrichtung zum Steuern von elektrochemischen Oberflächenprozessen
DE102009049565A1 (de) * 2009-10-09 2011-04-14 Gebr. Schmid Gmbh & Co. Verfahren und Anlage zur Metallisierung von Siliziumwafern
DE102009057463A1 (de) 2009-12-03 2011-06-09 Hübel, Egon Verfahren und Vorrichtung zum elektrischen Kontaktieren von Gut in Durchlaufanlagen
CN102808206B (zh) * 2012-05-04 2015-04-08 上海贺鸿电子有限公司 一种适用于片状和卷状产品水平电镀线的导电及辅助传动装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0383341U (https=) * 1989-12-14 1991-08-23
EP0578699B1 (de) * 1991-04-12 1995-07-12 Siemens Aktiengesellschaft Galvanisiereinrichtung für plattenförmige werkstücke, insbesondere leiterplatten
JP2002506483A (ja) * 1997-04-25 2002-02-26 アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング 導体プレートや導体箔の電気分解的な処理のための装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3729390A (en) * 1967-11-24 1973-04-24 Du Pont Electrotinning process to prevent plating on the cathode contact roll
JPH01162798A (ja) * 1987-12-18 1989-06-27 Nkk Corp 電気めっき用コンダクターロールの付着金属除去装置
DE19628784A1 (de) * 1996-07-17 1998-01-22 Schmid Gmbh & Co Geb Einrichtung zur Behandlung von Gegenständen, insbesondere Galvanisiereinrichtung für Leiterplatten

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0383341U (https=) * 1989-12-14 1991-08-23
EP0578699B1 (de) * 1991-04-12 1995-07-12 Siemens Aktiengesellschaft Galvanisiereinrichtung für plattenförmige werkstücke, insbesondere leiterplatten
JP2002506483A (ja) * 1997-04-25 2002-02-26 アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング 導体プレートや導体箔の電気分解的な処理のための装置

Also Published As

Publication number Publication date
CN101203632A (zh) 2008-06-18
WO2006136362A3 (de) 2008-02-28
EP1899507A2 (de) 2008-03-19
KR20080039841A (ko) 2008-05-07
DE102005030546A1 (de) 2007-01-04
WO2006136362A2 (de) 2006-12-28
AT10276U1 (de) 2008-12-15

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