JP2008532805A - 位置合わせされた両面パターン化ウェブの作製装置および方法 - Google Patents
位置合わせされた両面パターン化ウェブの作製装置および方法 Download PDFInfo
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Abstract
Description
本開示の状況において、「位置合わせ」は、同じウェブの反対側の他の構造に対して規定関係にあるウェブの一面上の構造の位置決めを意味する。
図1は、互いに反対側の面上に位置合わせされた微細複製構造を含む両面ウェブ12を作製する例示的成形装置10を図示する。ある例では、成形装置10は第1および第2の塗布手段16、20と、ニップロール14と、第1および第2のパターン化ロール18、24とを含む。ある例では、第1の塗布手段16は第1の押出ダイ16であり得る一方で、第2の塗布手段は第2の押出ダイ20であり得る。図示の実施形態において、第1および第2の硬化性液体が、それぞれ第1および第2のパターン化ロールを通過する前にウェブ表面上に配置される。他の実施形態において、第1の硬化性液体が第1のパターン化ロール上に配置されるとともに、第2の硬化性液体が第2のパターン化ロール上に配置され、その後パターン化ロールからウェブに転写される。
ある例では、微細複製パターンを不透明な、特に硬化エネルギーに対して不透明な可撓性ウェブまたは基板の両側に提供することが有用であり得る。他の例において、微細複製パターンを透明な、特に硬化エネルギーに対して透明な可撓性ウェブまたは基板の両側に設けることが有用であり得る。ウェブまたは基板がウェブに塗布された液体状の材料を硬化させるために必要な硬化エネルギーに対して不透明である場合、硬化エネルギーをウェブまたは基板を通過させて液体樹脂と接触することによって、材料を単純に硬化させることはできない。これらの場合、特定の硬化エネルギーに対して透明であるまたは硬化エネルギーに対して透明な部分を含むパターン化ロールを用いることが有用であり得る。ある場合には、1つのパターン化ロールのみが透明である。
ここで図22〜23を参照すると、ロールツーロール(roll−to−roll)成形装置120を含むシステム110の例示的実施形態が図示されている。図示の成形装置120において、ウェブ122が主巻出スプール(図示せず)から成形装置120に提供される。ウェブ122の本質は作製される製品によって大きく異なり得る。しかし、成形装置120は可撓性ならびに透明および/または不透明であるウェブ122を取り扱うことが可能である。ウェブ122は様々なローラ126を回って成形装置120内に向けられる。
図28を参照すると、制御部品に取り付けられているように図27のモータ装置の概略が図示されている。図1〜3に示された例示的装置において、同様な構成は各モータ装置210および220を制御する。したがって、モータ装置900は主エンコーダ930と駆動シャフト920とを含むモータ910を含む。駆動シャフト920は結合器930を介してパターン化ロール960の駆動シャフト940に結合されている。副または負荷エンコーダ950は駆動シャフト940に結合されている。
ウェブ材料はその上に微細複製パターン化構造を作製することができる、任意の適当な材料であればよい。微細複製パターン化構造の最終的な使用目的に応じて多数の異なる材料を用い得る。例えば、微細複製パターン化構造が可撓性回路基板を形成する場合には、ウェブ材料は金属化カプトン(KAPTON)などの金属化ポリマーフィルムであり得る。
微細複製構造が作製される液体は、UV光により硬化可能なアクリレートなどの光硬化性材料であり得る。当業者は、他のコーティング材料、例えば重合可能材料を用いることができるとともに、材料の選択が微細複製構造に望ましい特定の特性に依存することは理解できよう。例えば、可撓性回路基板が作製されている場合には、コーティング材料は導電性または絶縁性ポリマーを含み得る。ある実施形態において、コーティング材料は電気めっきマスキング材料および/または非導電性または絶縁性ポリマーを含む。
図30は、本明細書に記載の方法によりおよび装置を用いて形成された意図する塗布微細複製物品1200を概略的に図示する。物品1200は可撓性不透明ウェブ1202と、不透明ウェブ1202の両側に配置された多数の概略要素とを含む。要素1204は要素1206の反対側に配置されている。同様に、要素1208、要素1212および要素1216は、それぞれ要素1210、要素1214および要素1218の反対側に配置されている。なお、これらの要素を多数の異なる潜在的要素を包括的に表わすと考えることができる。これらの要素は例えば回路であり得る。ある実施形態において、微細複製パターンはさらなる回路めっきステップを通過することができる電気めっきマスクを含む。
Claims (33)
- 硬化エネルギーを提供するように構成されたエネルギー源と、
前記硬化エネルギーに対して透明な第1の基板上に配置された、前記硬化エネルギーに対して不透明な第1の複数の領域を備え、前記硬化エネルギーに対して不透明な前記第1の複数の領域が第1のパターンを画定する、第1のパターン化ロールと、
第2のパターンを画定する第2の複数の領域を備える第2のパターン化ロールと、
前記第1および第2のパターンが100マイクロメートル以内に連続位置合わせされた状態で維持されるように、前記第1および第2のパターン化ロールを回転させる手段と、を備えるアセンブリ。 - 前記第2のパターン化ロールが、前記硬化エネルギーに対して透明な第2の基板上に配置された、前記硬化エネルギーに対して不透明な第2の複数の領域を備え、前記硬化エネルギーに対して不透明な前記第2の複数の領域が第2のパターンを画定する、請求項1に記載のアセンブリ。
- 前記第1および第2のパターンが10マイクロメートル以内に連続位置合わせされた状態で維持される、請求項1または2に記載のアセンブリ。
- 前記第1の複数の領域が、前記第1の複数の領域に入射する前記硬化エネルギーの少なくとも98パーセントを遮断する、請求項1〜3のいずれか一項に記載のアセンブリ。
- 前記第1の基板が、前記第1の基板に入射する前記硬化エネルギーの少なくとも25パーセントを前記第1の基板を通過させる、請求項1〜4のいずれか一項に記載のアセンブリ。
- 前記第1の基板が第1の基板外面を画定するとともに、前記第1の複数の領域が前記第1の基板外面から半径方向外側に延在している、請求項1〜5のいずれか一項に記載のアセンブリ。
- 前記第2の基板が第2の基板外面を画定するとともに、前記第2の複数の領域が前記第2の基板外面から半径方向外側に延在している、請求項2に記載のアセンブリ。
- 前記第1の基板が外周を画定し、前記第1の複数の領域が前記外周付近に位置するとともに、前記第1の複数の領域により被覆されていない前記第1の基板の部分が前記外周から内側に延在している、請求項1〜7のいずれか一項に記載のアセンブリ。
- 前記第2の基板が外周を画定し、前記第2の複数の領域が前記外周付近に位置するとともに、前記第2の複数の領域により被覆されていない前記第2の基板の部分が前記外周から内側に延在している、請求項2に記載のアセンブリ。
- 硬化エネルギーを提供するように構成されたエネルギー源と、
前記硬化エネルギーに対して透明な第1の基板上に配置された、前記硬化エネルギーに対して不透明な第1の複数の領域を備え、前記第1の複数の領域が第1の隆起パターンを画定する、第1のパターン化ロールと、
前記硬化エネルギーに対して透明な第2の基板上に配置された、前記硬化エネルギーに対して不透明な第2の複数の領域を備え、前記第2の複数の領域が第2の隆起パターンを画定する、第2のパターン化ロールと、
第1および第2の側を有するウェブを用意するとともに、前記ウェブを供給して前記第1および第2のパターン化ロールと接触させるように構成された1つまたは複数の供給ロールと、
前記ウェブが前記第1のパターン化ロールと接触する前に、前記ウェブの前記第1の側上にまたは前記第1のパターン化ロール上に硬化性材料を配置するように構成された第1のディスペンサと、
前記ウェブが前記第2のパターン化ロールと接触する前に、前記ウェブの前記第2の側上にまたは前記第2のパターン化ロール上に硬化性材料を配置するように構成された第2のディスペンサと、
前記ウェブが連続移動されつつ前記第1および第2の隆起パターンが前記ウェブの前記第1および第2の側で前記硬化性材料内に押し込まれるとともに、前記第1および第2の隆起パターンが前記ウェブの前記第1および第2の側で100マイクロメートル以内に連続位置合わせされた状態で維持されるように、前記第1および第2のパターン化ロールを回転させる手段と、を備える装置。 - 前記第1および第2のパターンが前記ウェブの前記第1および第2の側で10マイクロメートル以内に連続位置合わせされている、請求項10に記載の装置。
- 前記第1の複数の領域が、前記第1の複数の領域に入射する前記硬化エネルギーの少なくとも98パーセントを遮断する、請求項10または11に記載の装置。
- 前記第2の複数の領域が、前記第2の複数の領域に入射する前記硬化エネルギーの少なくとも98パーセントを遮断する、請求項10〜12のいずれか一項に記載の装置。
- 前記第1の基板が、前記第1の基板に入射する前記硬化エネルギーの少なくとも25パーセントを前記第1の基板を通過させる、請求項10〜13のいずれか一項に記載の装置。
- 前記第2の基板が、前記第2の基板に入射する前記硬化エネルギーの少なくとも25パーセントを前記第2の基板を通過させる、請求項10〜14のいずれか一項に記載の装置。
- 前記ウェブが、前記ウェブに入射する硬化エネルギーの2パーセント未満を前記ウェブを通過させる、請求項10〜15のいずれか一項に記載の装置。
- 前記エネルギー源が紫外線硬化エネルギーを提供するように構成される、請求項10〜16のいずれか一項に記載の装置。
- 前記第1の基板がガラス円筒を備える、請求項10〜17のいずれか一項に記載の装置。
- 前記第1の基板がポリマー円筒を備える、請求項10〜18のいずれか一項に記載の装置。
- 前記第2の基板がガラス円筒を備える、請求項10〜19のいずれか一項に記載の装置。
- 前記第2の基板が石英円筒を備える、請求項10〜20のいずれか一項に記載の装置。
- 前記第2の基板がポリマー円筒を備える、請求項10〜21のいずれか一項に記載の装置。
- 前記第1の複数の領域がクロム、銅、アルミニウムおよびエポキシからなる群から選択された材料を備える、請求項10〜22のいずれか一項に記載の装置。
- 前記第2の複数の領域がクロム、銅、アルミニウムおよびエポキシからなる群から選択された材料を備える、請求項10〜23のいずれか一項に記載の装置。
- 前記硬化エネルギーを提供するように構成されたエネルギー源が、前記第1のパターン化ロール内に配置された第1の硬化エネルギー源と前記第2のパターン化ロール内に配置された第2の硬化エネルギー源とを備える、請求項10〜24のいずれか一項に記載の装置。
- 第1の側と第2の側とを有するウェブ上への硬化性材料を、第1のパターン化ロールと第2のパターン化ロールとでパターニングするステップと、
紫外線を少なくとも部分的に前記第1のパターン化ロールと第2のパターン化ロールとを介して向けることにより、前記ウェブの前記第1の側の前記硬化性材料を硬化させて第1のパターンを形成するとともに、前記ウェブの前記第2の側の前記硬化性材料を硬化させて第2のパターンを形成するステップとを含み、
前記第1のパターン化ロールが透明基板上に配置された第1の複数の隆起不透明領域を備えるとともに、前記第2のパターン化ロールが透明基板上に配置された第2の複数の隆起不透明領域を備え、
前記第1および第2のパターンが100マイクロメートル以内に連続位置合わせされた状態で維持されるように、前記ウェブが連続移動されつつ前記ウェブの前記第1および第2の側がパターン化される、第1の側と第2の側とを有する不透明ウェブをパターニングする方法。 - 前記第1および第2のパターンが、10マイクロメートル以内に位置合わせされた状態で前記ウェブの第1および第2の側に転写される、請求項26に記載の方法。
- 硬化性材料を前記ウェブ上に配置するステップが、
前記ウェブの前記第1の側が前記第1のパターン化ロールと接触する前に、硬化性材料を前記第1のパターン化ロール上に配置するステップと、
前記ウェブの前記第2の側が前記第2のパターン化ロールと接触する前に、硬化性材料を前記第2のパターン化ロール上に配置するステップとを含む、請求項26または27に記載の方法。 - 外面を有する硬化エネルギー透明円筒と、
前記硬化エネルギー透明円筒の前記外面上に配置された結合層と、
前記結合層上に配置されてパターンを形成する複数の硬化エネルギー不透明構造とを備え、
前記硬化エネルギー透明円筒が、前記円筒に入射する硬化光の少なくとも10パーセントを前記円筒を通過させ、
前記硬化エネルギー不透明構造が、前記硬化エネルギー不透明構造に入射する硬化光の少なくとも95パーセントを遮断するパターン化ロール。 - 前記硬化エネルギー透明円筒が石英円筒を備える、請求項29に記載のパターン化ロール。
- 前記結合層がチタン結合層を備える、請求項29または30に記載のパターン化ロール。
- 前記複数の硬化エネルギー不透明構造が複数のクロム特徴を備える、請求項29〜31のいずれか一項に記載のパターン化ロール。
- 少なくとも選択された硬化エネルギー不透明構造が硬化エネルギー透明基板表面により囲まれる、請求項29〜32のいずれか一項に記載のパターン化ロール。
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- 2006-03-06 EP EP09001026A patent/EP2058108B1/en not_active Not-in-force
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2013254866A (ja) * | 2012-06-07 | 2013-12-19 | Asahi Kasei E-Materials Corp | 微細凹凸構造を表面に有する基材の製造方法 |
JP2017030159A (ja) * | 2015-07-29 | 2017-02-09 | 東芝機械株式会社 | フィルムのパターン転写装置およびフィルムのパターン転写方法 |
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US20060210714A1 (en) | 2006-09-21 |
US20100285231A1 (en) | 2010-11-11 |
US20140239555A1 (en) | 2014-08-28 |
EP2058108B1 (en) | 2012-06-06 |
WO2006098935A1 (en) | 2006-09-21 |
EP2058108A3 (en) | 2009-12-09 |
EP2058108A2 (en) | 2009-05-13 |
CN101137481A (zh) | 2008-03-05 |
KR101300866B1 (ko) | 2013-08-27 |
EP1871584B1 (en) | 2009-11-18 |
US8968629B2 (en) | 2015-03-03 |
ATE448927T1 (de) | 2009-12-15 |
EP1871584A1 (en) | 2008-01-02 |
KR20070116599A (ko) | 2007-12-10 |
MX2007010858A (es) | 2007-11-12 |
US7767273B2 (en) | 2010-08-03 |
BRPI0608406A2 (pt) | 2009-12-29 |
US8740599B2 (en) | 2014-06-03 |
DE602006010529D1 (de) | 2009-12-31 |
JP4861400B2 (ja) | 2012-01-25 |
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