JP2008526106A - 集積オンチップ無線周波数信号結合器を備えた無線周波数回路 - Google Patents

集積オンチップ無線周波数信号結合器を備えた無線周波数回路 Download PDF

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Publication number
JP2008526106A
JP2008526106A JP2007548222A JP2007548222A JP2008526106A JP 2008526106 A JP2008526106 A JP 2008526106A JP 2007548222 A JP2007548222 A JP 2007548222A JP 2007548222 A JP2007548222 A JP 2007548222A JP 2008526106 A JP2008526106 A JP 2008526106A
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signal path
coupling
coupling portion
electronic device
coupler
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Pending
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JP2007548222A
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Japanese (ja)
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JP2008526106A5 (https=
Inventor
リウ、リアンジュン
ケイ. アブロクワー、ジョナサン
アール. レイ、マーカス
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NXP USA Inc
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NXP USA Inc
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Publication of JP2008526106A publication Critical patent/JP2008526106A/ja
Publication of JP2008526106A5 publication Critical patent/JP2008526106A5/ja
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00Interconnections in chips, wafers or substrates
    • H10W20/40Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/497Inductive arrangements or effects of, or between, wiring layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00Coupling devices of the waveguide type
    • H01P5/12Coupling devices having more than two ports
    • H01P5/16Conjugate devices, i.e. devices having at least one port decoupled from one other port
    • H01P5/18Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
    • H01P5/184Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers the guides being strip lines or microstrips
    • H01P5/185Edge coupled lines
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/80Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors
    • H10D86/85Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple passive components, e.g. resistors, capacitors or inductors characterised by only passive components
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00Electrical arrangements for controlling or matching impedance
    • H10W44/20Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]

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  • Semiconductor Integrated Circuits (AREA)
  • Transceivers (AREA)
  • Filters And Equalizers (AREA)
JP2007548222A 2004-12-23 2005-11-10 集積オンチップ無線周波数信号結合器を備えた無線周波数回路 Pending JP2008526106A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/021,843 US7305223B2 (en) 2004-12-23 2004-12-23 Radio frequency circuit with integrated on-chip radio frequency signal coupler
PCT/US2005/041048 WO2006071371A2 (en) 2004-12-23 2005-11-10 Radio frequency circuit with integrated on-chip radio frequency signal coupler

Publications (2)

Publication Number Publication Date
JP2008526106A true JP2008526106A (ja) 2008-07-17
JP2008526106A5 JP2008526106A5 (https=) 2008-10-16

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JP2007548222A Pending JP2008526106A (ja) 2004-12-23 2005-11-10 集積オンチップ無線周波数信号結合器を備えた無線周波数回路

Country Status (4)

Country Link
US (1) US7305223B2 (https=)
JP (1) JP2008526106A (https=)
TW (1) TWI377634B (https=)
WO (1) WO2006071371A2 (https=)

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CN103985613A (zh) * 2014-05-30 2014-08-13 佳一电气有限公司 用于断路器操作机构的离合装置和手动/电动切换装置
US12476592B2 (en) 2019-12-10 2025-11-18 Murata Manufacturing Co., Ltd. Power amplifier

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JP2008134816A (ja) * 2006-11-28 2008-06-12 Philtech Inc Rfパウダー粒子、rfパウダー、およびrfパウダーの励起方法
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CN102148610B (zh) * 2010-02-04 2016-01-27 赫梯特微波公司 宽带模拟低通滤波器
CN102148609B (zh) * 2010-02-04 2014-12-17 赫梯特微波公司 宽带模拟带通滤波器
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US9755670B2 (en) 2014-05-29 2017-09-05 Skyworks Solutions, Inc. Adaptive load for coupler in broadband multimode multiband front end module
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TWI573316B (zh) * 2014-07-22 2017-03-01 絡達科技股份有限公司 寬頻定向耦合器
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CN109314298B (zh) 2016-04-29 2023-05-02 天工方案公司 补偿电磁耦合器
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KR20180135080A (ko) 2016-05-09 2018-12-19 스카이워크스 솔루션즈, 인코포레이티드 자동 주파수 검출을 하는 셀프 조정 전자기 결합기
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103985613A (zh) * 2014-05-30 2014-08-13 佳一电气有限公司 用于断路器操作机构的离合装置和手动/电动切换装置
US12476592B2 (en) 2019-12-10 2025-11-18 Murata Manufacturing Co., Ltd. Power amplifier

Also Published As

Publication number Publication date
US20060141979A1 (en) 2006-06-29
US7305223B2 (en) 2007-12-04
TWI377634B (en) 2012-11-21
TW200636895A (en) 2006-10-16
WO2006071371A2 (en) 2006-07-06
WO2006071371A3 (en) 2007-02-15

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