JP2008526106A5 - - Google Patents

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Publication number
JP2008526106A5
JP2008526106A5 JP2007548222A JP2007548222A JP2008526106A5 JP 2008526106 A5 JP2008526106 A5 JP 2008526106A5 JP 2007548222 A JP2007548222 A JP 2007548222A JP 2007548222 A JP2007548222 A JP 2007548222A JP 2008526106 A5 JP2008526106 A5 JP 2008526106A5
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JP
Japan
Prior art keywords
signal path
semiconductor substrate
coupling portion
electronic device
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007548222A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008526106A (ja
Filing date
Publication date
Priority claimed from US11/021,843 external-priority patent/US7305223B2/en
Application filed filed Critical
Publication of JP2008526106A publication Critical patent/JP2008526106A/ja
Publication of JP2008526106A5 publication Critical patent/JP2008526106A5/ja
Pending legal-status Critical Current

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JP2007548222A 2004-12-23 2005-11-10 集積オンチップ無線周波数信号結合器を備えた無線周波数回路 Pending JP2008526106A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/021,843 US7305223B2 (en) 2004-12-23 2004-12-23 Radio frequency circuit with integrated on-chip radio frequency signal coupler
PCT/US2005/041048 WO2006071371A2 (en) 2004-12-23 2005-11-10 Radio frequency circuit with integrated on-chip radio frequency signal coupler

Publications (2)

Publication Number Publication Date
JP2008526106A JP2008526106A (ja) 2008-07-17
JP2008526106A5 true JP2008526106A5 (https=) 2008-10-16

Family

ID=36612408

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007548222A Pending JP2008526106A (ja) 2004-12-23 2005-11-10 集積オンチップ無線周波数信号結合器を備えた無線周波数回路

Country Status (4)

Country Link
US (1) US7305223B2 (https=)
JP (1) JP2008526106A (https=)
TW (1) TWI377634B (https=)
WO (1) WO2006071371A2 (https=)

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