JP2004006757A5 - - Google Patents
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- Publication number
- JP2004006757A5 JP2004006757A5 JP2003086254A JP2003086254A JP2004006757A5 JP 2004006757 A5 JP2004006757 A5 JP 2004006757A5 JP 2003086254 A JP2003086254 A JP 2003086254A JP 2003086254 A JP2003086254 A JP 2003086254A JP 2004006757 A5 JP2004006757 A5 JP 2004006757A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- thermal conductivity
- high thermal
- low loss
- low
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 description 16
- 239000004065 semiconductor Substances 0.000 description 3
- 239000011800 void material Substances 0.000 description 1
Images
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003086254A JP4018575B2 (ja) | 2002-04-03 | 2003-03-26 | 半導体内蔵ミリ波帯モジュール |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002100959 | 2002-04-03 | ||
| JP2003086254A JP4018575B2 (ja) | 2002-04-03 | 2003-03-26 | 半導体内蔵ミリ波帯モジュール |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004006757A JP2004006757A (ja) | 2004-01-08 |
| JP2004006757A5 true JP2004006757A5 (https=) | 2005-05-19 |
| JP4018575B2 JP4018575B2 (ja) | 2007-12-05 |
Family
ID=30446588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003086254A Expired - Fee Related JP4018575B2 (ja) | 2002-04-03 | 2003-03-26 | 半導体内蔵ミリ波帯モジュール |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4018575B2 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4919689B2 (ja) * | 2005-04-19 | 2012-04-18 | パナソニック株式会社 | モジュール基板 |
| JP2012525065A (ja) * | 2009-04-21 | 2012-10-18 | モレックス インコーポレイテド | 3次元アンテナ |
| US9741635B2 (en) | 2014-01-21 | 2017-08-22 | Infineon Technologies Austria Ag | Electronic component |
| CN112689927B (zh) * | 2018-09-18 | 2023-01-10 | 京瓷Avx元器件公司 | 滤波器组件 |
| WO2023209926A1 (ja) * | 2022-04-28 | 2023-11-02 | 三菱電機株式会社 | 半導体装置 |
| JP7638458B1 (ja) * | 2023-05-16 | 2025-03-03 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
| WO2025084247A1 (ja) * | 2023-10-19 | 2025-04-24 | 株式会社デンソー | 半導体装置 |
-
2003
- 2003-03-26 JP JP2003086254A patent/JP4018575B2/ja not_active Expired - Fee Related
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