JP4018575B2 - 半導体内蔵ミリ波帯モジュール - Google Patents

半導体内蔵ミリ波帯モジュール Download PDF

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Publication number
JP4018575B2
JP4018575B2 JP2003086254A JP2003086254A JP4018575B2 JP 4018575 B2 JP4018575 B2 JP 4018575B2 JP 2003086254 A JP2003086254 A JP 2003086254A JP 2003086254 A JP2003086254 A JP 2003086254A JP 4018575 B2 JP4018575 B2 JP 4018575B2
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JP
Japan
Prior art keywords
substrate
semiconductor
millimeter
wave band
electrically insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003086254A
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English (en)
Japanese (ja)
Other versions
JP2004006757A5 (https=
JP2004006757A (ja
Inventor
秀樹 岩城
豊 田口
哲義 小掠
康博 菅谷
俊行 朝日
東作 西山
義信 井戸川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2003086254A priority Critical patent/JP4018575B2/ja
Publication of JP2004006757A publication Critical patent/JP2004006757A/ja
Publication of JP2004006757A5 publication Critical patent/JP2004006757A5/ja
Application granted granted Critical
Publication of JP4018575B2 publication Critical patent/JP4018575B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2003086254A 2002-04-03 2003-03-26 半導体内蔵ミリ波帯モジュール Expired - Fee Related JP4018575B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003086254A JP4018575B2 (ja) 2002-04-03 2003-03-26 半導体内蔵ミリ波帯モジュール

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002100959 2002-04-03
JP2003086254A JP4018575B2 (ja) 2002-04-03 2003-03-26 半導体内蔵ミリ波帯モジュール

Publications (3)

Publication Number Publication Date
JP2004006757A JP2004006757A (ja) 2004-01-08
JP2004006757A5 JP2004006757A5 (https=) 2005-05-19
JP4018575B2 true JP4018575B2 (ja) 2007-12-05

Family

ID=30446588

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003086254A Expired - Fee Related JP4018575B2 (ja) 2002-04-03 2003-03-26 半導体内蔵ミリ波帯モジュール

Country Status (1)

Country Link
JP (1) JP4018575B2 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4919689B2 (ja) * 2005-04-19 2012-04-18 パナソニック株式会社 モジュール基板
JP2012525065A (ja) * 2009-04-21 2012-10-18 モレックス インコーポレイテド ３次元アンテナ
US9741635B2 (en) 2014-01-21 2017-08-22 Infineon Technologies Austria Ag Electronic component
CN112689927B (zh) * 2018-09-18 2023-01-10 京瓷Avx元器件公司 滤波器组件
WO2023209926A1 (ja) * 2022-04-28 2023-11-02 三菱電機株式会社 半導体装置
JP7638458B1 (ja) * 2023-05-16 2025-03-03 三菱電機株式会社 半導体装置およびその製造方法
WO2025084247A1 (ja) * 2023-10-19 2025-04-24 株式会社デンソー 半導体装置

Also Published As

Publication number Publication date
JP2004006757A (ja) 2004-01-08

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