JP2008298300A - Heat treatment device - Google Patents

Heat treatment device Download PDF

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Publication number
JP2008298300A
JP2008298300A JP2007141427A JP2007141427A JP2008298300A JP 2008298300 A JP2008298300 A JP 2008298300A JP 2007141427 A JP2007141427 A JP 2007141427A JP 2007141427 A JP2007141427 A JP 2007141427A JP 2008298300 A JP2008298300 A JP 2008298300A
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Prior art keywords
heat treatment
gas
duct
heater
introduction
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JP2007141427A
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JP4589941B2 (en
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Nagamitsu Tezeni
永充 手錢
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Espec Corp
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Espec Corp
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Priority to JP2007141427A priority Critical patent/JP4589941B2/en
Priority to KR1020080048563A priority patent/KR101450902B1/en
Priority to CN2008101001260A priority patent/CN101314516B/en
Priority to TW097119342A priority patent/TWI476356B/en
Publication of JP2008298300A publication Critical patent/JP2008298300A/en
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27FURNACES; KILNS; OVENS; RETORTS
    • F27BFURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B17/00Furnaces of a kind not covered by any preceding group
    • F27B17/0016Chamber type furnaces
    • F27B17/0025Especially adapted for treating semiconductor wafers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27FURNACES; KILNS; OVENS; RETORTS
    • F27BFURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B17/00Furnaces of a kind not covered by any preceding group
    • F27B17/0016Chamber type furnaces
    • F27B17/0083Chamber type furnaces with means for circulating the atmosphere
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27FURNACES; KILNS; OVENS; RETORTS
    • F27DDETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D7/00Forming, maintaining, or circulating atmospheres in heating chambers
    • F27D7/02Supplying steam, vapour, gases, or liquids
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27FURNACES; KILNS; OVENS; RETORTS
    • F27DDETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D7/00Forming, maintaining, or circulating atmospheres in heating chambers
    • F27D7/04Circulating atmospheres by mechanical means
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27FURNACES; KILNS; OVENS; RETORTS
    • F27DDETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D7/00Forming, maintaining, or circulating atmospheres in heating chambers
    • F27D7/02Supplying steam, vapour, gases, or liquids
    • F27D2007/023Conduits
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27FURNACES; KILNS; OVENS; RETORTS
    • F27DDETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D7/00Forming, maintaining, or circulating atmospheres in heating chambers
    • F27D7/04Circulating atmospheres by mechanical means
    • F27D2007/045Fans

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
  • Furnace Details (AREA)
  • Gas-Filled Discharge Tubes (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat treatment device capable of cleaning the inside of a heat treatment chamber of a heat treatment portion in a state of preventing the failure of a blower and a heater. <P>SOLUTION: This heat treatment device comprises a heat treatment portion 10 receiving a heat treatment object W in a heat treatment chamber 11 in a state of being taken in and out, and having a gas lead-in portion 12 and a gas lead-out portion 13, and a gas passage 21A constituted to lead a gas for heat treatment to the gas lead-in portion 12 of the heat treatment portion 10 and to lead a heat-treated gas out from the gas lead-out portion 13. The gas passage 21A is provided with a catalyst 30 for decomposing a sublimate generated from the heat treatment object W in performing the heat treatment on the heat treatment object W, a gas treatment portion 20A provided with the heater 31 for heating at least the catalyst 30, and the air blower 32, and connectors (connection flanges 14, 15, 25, 26 and bolt/nut) for detachably connecting the gas passage 21A to the gas lead-in portion 12 and the gas lead-out portion 13 of the heat treatment portion 10. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、被熱処理物を熱処理する熱処理装置に関するものである。   The present invention relates to a heat treatment apparatus for heat treating an object to be heat treated.

従来、熱処理装置としては、熱処理部の熱処理室に被熱処理物が収容された状態で、前記熱処理室内の空気を循環させながら加熱することにより前記被熱処理物を熱処理するものが知られている。   2. Description of the Related Art Conventionally, as a heat treatment apparatus, a heat treatment apparatus is known in which heat treatment is performed by heating the object to be heat treated while circulating the air in the heat treatment chamber in a state where the object to be heat treated is accommodated in a heat treatment chamber of a heat treatment unit.

このような熱処理装置は、例えばFPD(フラットパネルディスプレイ)の製造工程におけるフォトレジストや有機物薄膜のプリベーク、ポストベーク工程に用いられることがある。これらの工程では、ガラス基板等からなる被熱処理物が熱処理される際に、フォトレジスト等に含まれる揮発性成分が気化して多量の昇華物が発生し、この昇華物が再結晶化して熱処理装置周辺に飛散したり周辺に付着したりする等の問題があった。   Such a heat treatment apparatus may be used, for example, in a pre-bake or post-bake process of a photoresist or an organic thin film in an FPD (flat panel display) manufacturing process. In these processes, when a heat-treated object made of a glass substrate or the like is heat-treated, a volatile component contained in the photoresist or the like is vaporized to generate a large amount of sublimated material, and the sublimated material is recrystallized and heat-treated. There were problems such as scattering around the device and adhering to the periphery.

この問題の対策として、例えば特許文献1には、外気を加熱して前記熱処理室内に送り込みつつ前記熱処理室内の空気を導出ダクト内に流出させることにより前記熱処理室内を換気することが記載されている。このように換気することにより、昇華物の再結晶化および周辺への付着を抑制することができる。
特開平10−141868号公報
As a countermeasure for this problem, for example, Patent Document 1 describes that the outside of the heat treatment chamber is ventilated by heating the outside air and feeding the air into the heat treatment chamber while allowing the air in the heat treatment chamber to flow into the outlet duct. . By ventilating in this way, recrystallization of the sublimate and adhesion to the surroundings can be suppressed.
JP-A-10-141868

しかしながら、上記特許文献1の熱処理装置においては、熱処理部の外壁と熱処理室との間に、熱処理室の内外へ空気を循環させるための送風機や加熱器を有する気体処理部が設けられているため、熱処理室の内壁などに付着した前記昇華物を洗浄により除去しようとすると、前記気体処理部の送風機や加熱器などの電気機器が、洗浄に用いる洗浄液により故障する虞があった。   However, in the heat treatment apparatus of Patent Document 1, a gas treatment unit having a blower and a heater for circulating air into and out of the heat treatment chamber is provided between the outer wall of the heat treatment portion and the heat treatment chamber. When trying to remove the sublimated material adhering to the inner wall of the heat treatment chamber by cleaning, there is a risk that an electric device such as a blower or a heater of the gas processing unit may be damaged by the cleaning liquid used for cleaning.

本発明は、このような事情に鑑みてなされたもので、送風機や加熱器の故障を防止する状態で熱処理部の熱処理室内を洗浄することができる熱処理装置を提供することを目的とする。   This invention is made | formed in view of such a situation, and it aims at providing the heat processing apparatus which can wash | clean the heat processing chamber of a heat processing part in the state which prevents failure of a fan or a heater.

請求項1に係る発明は、熱処理室に被熱処理物が出し入れ可能に収容され、かつ熱処理室に共に連通する気体導入部および気体導出部を有する熱処理部と、前記気体導入部へ熱処理用気体を導入しかつ前記気体導出部から熱処理済みの気体を導出するための気体通路を有し、その気体通路に、前記被熱処理物を熱処理する際に当該被熱処理物から発生する昇華物を分解するための触媒と、少なくとも該触媒を加熱する加熱器と、前記熱処理用気体および前記熱処理済みの気体を所定方向に導く1または2以上の送風機とが設けられた気体処理部とを具備することを特徴とする。   According to the first aspect of the present invention, there is provided a heat treatment part having a gas introduction part and a gas lead part communicating with the heat treatment room, in which a material to be heat treated can be taken in and out of the heat treatment room, and a gas for heat treatment to the gas introduction part. Introducing a gas passage for introducing and heat-treating the gas from the gas lead-out section, in order to decompose the sublimate generated from the heat-treated material when the heat-treated material is heat-treated in the gas passage And a gas processing section provided with at least a heater for heating the catalyst, and one or more blowers for guiding the heat treatment gas and the heat treated gas in a predetermined direction. And

請求項2に係る発明は、請求項1に記載の熱処理装置において、前記気体通路は、前記気体導入部に連結手段を介して着脱可能に出側端が連結される導入ダクトと、前記気体導出部に連結手段を介して着脱可能に入側端が連結される導出ダクトとを有することを特徴とする。   According to a second aspect of the present invention, in the heat treatment apparatus according to the first aspect, the gas passage includes an introduction duct in which an outlet side end is detachably connected to the gas introduction part via a coupling means, and the gas lead-out And a lead-out duct having an inlet side end detachably connected to the part via a connecting means.

請求項3に係る発明は、請求項2に記載の熱処理装置において、前記導入ダクトの入側端と前記導出ダクトの出側端とが気体処理ダクトを介して連結されていて、前記気体処理ダクトに、前記触媒と前記加熱器とが設けられていることを特徴とする。   The invention according to claim 3 is the heat treatment apparatus according to claim 2, wherein an inlet side end of the introduction duct and an outlet side end of the lead-out duct are connected via a gas processing duct, and the gas processing duct Further, the catalyst and the heater are provided.

請求項4に係る発明は、請求項2に記載の熱処理装置において、前記導入ダクトの入側端が開放され、かつ前記導出ダクトの出側端に気体処理ダクトが連結されていて、前記気体処理ダクトに前記触媒と前記加熱器とが設けられ、前記導入ダクトに気体加熱用加熱器が設けられており、前記導出ダクト、前記気体処理ダクトおよび前記導入ダクトのうちの少なくとも一つに前記送風機が設けられていることを特徴とする。   The invention according to claim 4 is the heat treatment apparatus according to claim 2, wherein an inlet side end of the introduction duct is opened, and a gas processing duct is connected to an outlet side end of the outlet duct. The catalyst and the heater are provided in a duct, the heater for gas heating is provided in the introduction duct, and the blower is provided in at least one of the outlet duct, the gas processing duct, and the introduction duct. It is provided.

請求項5に係る発明は、請求項2に記載の熱処理装置において、前記導入ダクトの入側端が開放され、かつ前記導出ダクトの出側端に気体処理ダクトが連結されていて、前記気体処理ダクトに前記触媒と前記加熱器とが設けられるとともに、気体処理ダクトの前記触媒と前記加熱器とが設けられた箇所よりも下流位置と前記導入ダクトの途中が連結ダクトを介して連通連結されていて、導入ダクトの連結ダクトとの合流点よりも下流側に気体加熱用加熱器と前記送風機とが設けられていることを特徴とする。   The invention according to claim 5 is the heat treatment apparatus according to claim 2, wherein an inlet side end of the introduction duct is opened, and a gas processing duct is connected to an outlet side end of the outlet duct. The catalyst and the heater are provided in the duct, and the downstream position of the gas processing duct where the catalyst and the heater are provided and the middle of the introduction duct are connected to each other via a connecting duct. And the heater for gas heating and the said air blower are provided downstream from the confluence | merging point with the connection duct of an introduction duct, It is characterized by the above-mentioned.

請求項6に係る発明は、請求項5に記載の熱処理装置において、前記導入ダクトの連結ダクトとの合流点よりも下流側であって前記気体加熱用加熱器および前記送風機よりも上流側の位置と、前記導出ダクトの途中とが第2連結ダクトを介して連通連結されていることを特徴とする。   The invention according to claim 6 is the heat treatment apparatus according to claim 5, wherein the position is downstream of the junction point of the introduction duct with the connection duct and upstream of the gas heating heater and the blower. And the middle of the lead-out duct are connected in communication via a second connection duct.

請求項7に係る発明は、請求項1乃至6のいずれか1つに記載の熱処理装置において、前記熱処理部の前記熱処理室にも別の触媒が設けられていることを特徴とする。   The invention according to claim 7 is the heat treatment apparatus according to any one of claims 1 to 6, characterized in that another catalyst is also provided in the heat treatment chamber of the heat treatment section.

請求項1に係る発明によれば、熱処理部から離れた熱処理部の外側の気体通路に送風機および加熱器が配設されるので、送風機や加熱器の故障を防止する状態で熱処理部の熱処理室内を洗浄することができる。   According to the first aspect of the present invention, since the blower and the heater are disposed in the gas passage outside the heat treatment part away from the heat treatment part, the heat treatment chamber of the heat treatment part is in a state of preventing failure of the fan and the heater. Can be washed.

請求項2に係る発明によれば、気体処理部の導入ダクトと導出ダクトを連結手段により熱処理部から切り離すことが可能となる。この切り離し状態では、送風機や加熱器の故障を確実に防止する状態で熱処理部の熱処理室内を洗浄することができる。また、熱処理部と気体処理部とを切り離すことで、熱処理部だけを交換することや、或いは気体処理部だけを交換することが可能になる。   According to the invention which concerns on Claim 2, it becomes possible to isolate | separate the introduction duct and derivation | leading-out duct of a gas processing part from a heat processing part by a connection means. In this disconnected state, the heat treatment chamber of the heat treatment section can be washed in a state that reliably prevents the blower and the heater from failing. Further, by separating the heat treatment part and the gas processing part, it is possible to exchange only the heat treatment part or to exchange only the gas treatment part.

請求項3に係る発明によれば、熱処理室から導出された気体が、導出ダクト、気体処理ダクトおよび導入ダクトをこの順に経て再び熱処理室に戻る循環経路が構成され、1つの送風機で気体を循環させることができるとともに、加熱器により触媒と気体とを加熱することができる。   According to the invention of claim 3, a circulation path is formed in which the gas led out from the heat treatment chamber returns to the heat treatment chamber again in this order through the lead-out duct, the gas treatment duct, and the introduction duct, and the gas is circulated by one blower. And the catalyst and the gas can be heated by the heater.

請求項4に係る発明によれば、導入ダクトの開放された入側端から吸入された気体が気体加熱用加熱器にて加熱されて熱処理室に導入され、導出ダクトおよび気体処理ダクトを経て導出されるように構成されているので、導入ダクトの入側端から吸気される気体が昇華物の無いものとなる。このため、熱処理室には常時フレッシュな気体が導入されるので、触媒による昇華物の酸化分解反応を低下させ難くすることが可能になる。また、この発明では、導入ダクト、導入ダクトおよび気体処理ダクトのうちの少なくとも一つに送風機を設けることで、熱処理室への気体導入と熱処理室からの気体導出とが可能である。   According to the fourth aspect of the present invention, the gas sucked from the open inlet end of the introduction duct is heated by the gas heating heater and introduced into the heat treatment chamber, and is led out through the lead-out duct and the gas treatment duct. Therefore, the gas sucked from the inlet side end of the introduction duct has no sublimation. For this reason, since fresh gas is always introduced into the heat treatment chamber, it is possible to make it difficult to reduce the oxidative decomposition reaction of the sublimate by the catalyst. Moreover, in this invention, by providing a blower in at least one of the introduction duct, the introduction duct, and the gas treatment duct, gas introduction into the heat treatment chamber and gas discharge from the heat treatment chamber are possible.

請求項5に係る発明によれば、導入ダクトの入側端が開放されているので、フレッシュな気体の導入が可能になる。また、熱処理室から導出された気体が、触媒により浄化され、かつ加熱器により加熱されたものとなって連結ダクトを介して導入ダクトに入り、導入ダクトの開放入側端から吸入された気体と混合されて熱処理室に導入されるので、熱損失を少なくすることができる。また、熱処理室に導入される気体が、導入ダクトに設けた気体加熱用加熱器により加熱されるので、その気体加熱用加熱器は熱処理室の温度管理に、気体処理ダクトに設けた加熱器は触媒の温度管理にそれぞれ専有的に用いることが可能になる。したがって、被熱処理物の加熱温度に左右されずに、触媒を最適な活性温度に設定することができる。   According to the invention which concerns on Claim 5, since the entrance side end of the introduction duct is open | released, introduction of fresh gas is attained. Further, the gas led out from the heat treatment chamber is purified by the catalyst and heated by the heater, enters the introduction duct through the connection duct, and the gas sucked from the open entry side end of the introduction duct. Since they are mixed and introduced into the heat treatment chamber, heat loss can be reduced. In addition, since the gas introduced into the heat treatment chamber is heated by the gas heating heater provided in the introduction duct, the gas heating heater is used for temperature control of the heat treatment chamber, and the heater provided in the gas treatment duct is Each can be used exclusively for temperature control of the catalyst. Therefore, the catalyst can be set to an optimum activation temperature regardless of the heating temperature of the object to be heat treated.

請求項6に係る発明によれば、導入ダクトの入側端が開放され、かつ連結ダクトを介して気体が循環する構成となっているので、請求項5と同様な効果が得られることは勿論のこと、連結ダクトによる循環経路よりも熱処理室により近い循環経路が第2連結ダクトにより形成され、かつ循環経路に設けられた気体加熱用加熱器により加熱する構成となっているので、温度低下が少ない気体を再利用することが可能になる。   According to the invention of claim 6, since the inlet end of the introduction duct is opened and the gas is circulated through the connecting duct, it is of course possible to obtain the same effect as that of claim 5. That is, the circulation path closer to the heat treatment chamber than the circulation path by the connecting duct is formed by the second connecting duct and is heated by the gas heating heater provided in the circulation path. A small amount of gas can be reused.

請求項7に係る発明によれば、熱処理室の容積や昇華物の発生量に合わせて気体処理部の能力を選定及び選択することができる。   According to the invention which concerns on Claim 7, the capability of a gas processing part can be selected and selected according to the volume of a heat processing chamber, and the generation amount of a sublimate.

以下、本発明を実施するための最良の形態について、図面を参照しながら詳細に説明する。   Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to the drawings.

(第1実施形態)
図1は、本発明の第1実施形態に係る熱処理装置の概略構成図である。この熱処理装置1Aは、例えばFPDの製造工程に用いられるものであり、クリーンルーム内に設置されるいわゆるクリーンオーブンと呼ばれるものである。
(First embodiment)
FIG. 1 is a schematic configuration diagram of a heat treatment apparatus according to the first embodiment of the present invention. This heat treatment apparatus 1A is used in, for example, an FPD manufacturing process, and is called a so-called clean oven installed in a clean room.

熱処理装置1Aは、被熱処理物(ワークとも言う)Wが出し入れ可能に収容される熱処理室11を有する熱処理部10と、熱処理部10の熱処理室11へ熱処理用気体、例えば加熱エアを導入するとともに熱処理室11から熱処理済みの気体、例えば熱処理済みエアを導出する気体通路21Aを有する気体処理部20Aとを備える。   1 A of heat processing apparatuses introduce | transduce the gas for heat processing, for example, heating air, into the heat processing part 10 which has the heat processing chamber 11 in which the to-be-processed object (it is also called workpiece | work) W is accommodated so that insertion / removal is possible, A gas processing unit 20A having a gas passage 21A for extracting heat-treated gas, for example, heat-treated air, from the heat treatment chamber 11 is provided.

熱処理部10は、気体処理部20Aからの熱処理用気体が導入される気体導入部12と、熱処理室11から熱処理済みエアを導出する気体導出部13とを有し、熱処理室11の外側が断熱壁11aで囲繞されている。   The heat treatment part 10 has a gas introduction part 12 into which the gas for heat treatment from the gas treatment part 20A is introduced, and a gas lead-out part 13 that leads out the heat-treated air from the heat treatment room 11, and the outside of the heat treatment room 11 is insulated. It is surrounded by a wall 11a.

熱処理室11の内側には、例えば1または2以上の被熱処理物Wを所定状態で保持できる保持部材(図示せず)が二点鎖線で示す箇所に設けられている。上記気体導入部12は、熱処理室11と連通する管状のものでその入側端に連結用フランジ14を備える。また、上記気体導出部13も熱処理室11と連通する管状のものでその出側端に連結用フランジ15を備える。   Inside the heat treatment chamber 11, for example, a holding member (not shown) capable of holding one or two or more objects to be heat treated W in a predetermined state is provided at a position indicated by a two-dot chain line. The gas introduction part 12 has a tubular shape communicating with the heat treatment chamber 11 and is provided with a connecting flange 14 at the inlet end thereof. The gas lead-out portion 13 is also in a tubular shape communicating with the heat treatment chamber 11 and is provided with a connecting flange 15 at the outlet end thereof.

気体通路21Aは、気体導入部12に連結される導入ダクト22と、気体導出部13に連結される導出ダクト23と、導入ダクト22と導出ダクト23の間に設けられた気体処理ダクト24とを有する。導入ダクト22の出側端には、気体導入部12の連結用フランジ14に連結される連結用フランジ25が設けられ、導出ダクト23の入側端には、気体導出部13の連結用フランジ15に連結される連結用フランジ26が設けられている。そして、導入ダクト22の連結用フランジ25と、気体導入部12の連結用フランジ14とを締結手段、例えばボルトおよびナットにより連結し、導出ダクト23の連結用フランジ26と、気体導出部13の連結用フランジ15とを締結手段、例えばボルトおよびナットにより連結すると、熱処理部10の熱処理室11と気体処理部20Aの気体通路21Aとが連通連結されて循環通路が形成される。なお、気体通路21Aには、適所に風量調整用のダンパー(図示せず)が設けられる。   The gas passage 21 </ b> A includes an introduction duct 22 connected to the gas introduction part 12, a lead-out duct 23 connected to the gas lead-out part 13, and a gas processing duct 24 provided between the lead-in duct 22 and the lead-out duct 23. Have. A connecting flange 25 connected to the connecting flange 14 of the gas inlet 12 is provided at the outlet end of the introduction duct 22, and a connecting flange 15 of the gas outlet 13 is provided at the inlet end of the outlet duct 23. A connecting flange 26 is provided to be connected to each other. Then, the connection flange 25 of the introduction duct 22 and the connection flange 14 of the gas introduction part 12 are connected by fastening means such as bolts and nuts, and the connection flange 26 of the lead-out duct 23 and the gas lead-out part 13 are connected. When the flange 15 is connected by fastening means such as bolts and nuts, the heat treatment chamber 11 of the heat treatment section 10 and the gas passage 21A of the gas treatment section 20A are connected in communication to form a circulation passage. The gas passage 21A is provided with a damper (not shown) for adjusting the air volume at an appropriate position.

また、上記気体処理ダクト24には、触媒30と加熱器31と送風機32と前処理剤33とが設けられている。送風機32は、上記循環通路をエアが循環して流れるようにするためのものであり、加熱器31は触媒30およびエアを加熱するものである。この加熱器31により加熱されたエアは、導入ダクト22を経て熱処理室11に入り、ここで被熱処理物Wを加熱して熱処理を行う。この熱処理に際し、被熱処理物Wから昇華物が発生する。熱処理済みエアは、上記昇華物を含んだものであって、上記気体導出部13および上記導出ダクト23を経て触媒30へ与えられる。   The gas treatment duct 24 is provided with a catalyst 30, a heater 31, a blower 32, and a pretreatment agent 33. The blower 32 is for allowing air to circulate and flow through the circulation passage, and the heater 31 is for heating the catalyst 30 and the air. The air heated by the heater 31 enters the heat treatment chamber 11 through the introduction duct 22, and heats the workpiece W to be heat treated. At the time of this heat treatment, a sublimation product is generated from the workpiece W. The heat-treated air contains the sublimate and is given to the catalyst 30 via the gas outlet 13 and the outlet duct 23.

触媒30は、熱処理済みエアに含まれる昇華物の酸化分解反応を促進するためのものであり、例えば白金(Pt)やパラジウム(Pd)等の貴金属や、これらの貴金属の合金などの活性金属が採用される。このような触媒30は、約150〜350℃程度の温度雰囲気下において触媒活性を示す。よって、本実施形態においては、触媒30の前側(循環通路をエアが流れる方向の触媒30よりも上流側)に加熱器31を配置している。また、昇華物に、触媒毒といわれる物質、例えばSi、P、S等を含む有機化合物が入っていて、触媒30が被毒することがある場合には、その防止のために前処理剤33を触媒30の前側に配設させることが好ましい。   The catalyst 30 is for accelerating the oxidative decomposition reaction of the sublimate contained in the heat-treated air. For example, a noble metal such as platinum (Pt) or palladium (Pd) or an active metal such as an alloy of these noble metals is used. Adopted. Such a catalyst 30 exhibits catalytic activity in a temperature atmosphere of about 150 to 350 ° C. Therefore, in the present embodiment, the heater 31 is disposed on the front side of the catalyst 30 (upstream side of the catalyst 30 in the direction in which air flows in the circulation passage). Further, if the sublimation contains an organic compound containing a catalyst poison, for example, Si, P, S, etc., and the catalyst 30 may be poisoned, the pretreatment agent 33 is used to prevent the poisoning. Is preferably disposed on the front side of the catalyst 30.

したがって、このように構成された第1実施形態に係る熱処理装置1Aによる場合には、熱処理部10から離れた熱処理部10の外側の気体通路21Aに送風機32および加熱器31が配設されるので、送風機32や加熱器31の故障を防止する状態で熱処理室11の内部を洗浄することができる。加えて、熱処理部10の気体導入部12および気体導出部13に対し、連結用フランジ14、15、25、26およびボルト・ナットから構成される連結手段を介して気体通路21Aが着脱可能に連結されるので、その気体通路21Aに設けた送風機32および加熱器31を、気体処理部20Aを熱処理部10から切り離すことで熱処理部10から分離させ得、これにより送風機32や加熱器31の故障を確実に防止する状態で熱処理室11の内部を洗浄することができる。また、熱処理室11から導出された気体が、導出ダクト23、気体処理ダクト24および導入ダクト22をこの順に経て再び熱処理室11に戻る循環経路が構成されているので、1つの送風機32で気体を循環させることができるとともに、加熱器31により触媒30と気体とを加熱することができる。更に、熱処理部10と気体処理部20Aとを切り離すことで、熱処理部10だけを交換することや、或いは気体処理部20Aだけを交換することが可能になる。   Therefore, in the case of the heat treatment apparatus 1A according to the first embodiment configured as described above, the blower 32 and the heater 31 are disposed in the gas passage 21A outside the heat treatment unit 10 away from the heat treatment unit 10. The inside of the heat treatment chamber 11 can be cleaned while preventing the blower 32 and the heater 31 from being broken. In addition, the gas passage 21 </ b> A is detachably connected to the gas introduction part 12 and the gas lead-out part 13 of the heat treatment part 10 through connection means composed of connection flanges 14, 15, 25, 26 and bolts and nuts. Therefore, the blower 32 and the heater 31 provided in the gas passage 21A can be separated from the heat treatment part 10 by separating the gas treatment part 20A from the heat treatment part 10, thereby causing a failure of the blower 32 and the heater 31. The inside of the heat treatment chamber 11 can be cleaned in a state where it is reliably prevented. Moreover, since the gas led out from the heat treatment chamber 11 passes through the lead-out duct 23, the gas treatment duct 24, and the introduction duct 22 in this order, and returns to the heat treatment chamber 11 again, the gas is supplied by one blower 32. While being able to circulate, the heater 30 can heat the catalyst 30 and gas. Furthermore, by separating the heat treatment unit 10 and the gas processing unit 20A, it is possible to replace only the heat treatment unit 10 or to replace only the gas processing unit 20A.

(第2実施形態)
図2は、本発明の第2実施形態に係る熱処理装置の概略構成図である。なお、図1と同一部分には、同一符号を付している。
(Second Embodiment)
FIG. 2 is a schematic configuration diagram of a heat treatment apparatus according to the second embodiment of the present invention. In addition, the same code | symbol is attached | subjected to the same part as FIG.

この熱処理装置1Dは、第1実施形態の気体処理部20Aとは異なる気体処理部20Dを有する。即ち、導入ダクト22の入側に開放端22aが、気体処理ダクト24の出側に開放端24aが設けられた気体通路21Dを有し、気体処理部20Dは気体処理ダクト24に触媒30と加熱器31とが設けられ、導入ダクト22に送風機34と加熱器35とが設けられている。なお、図2では前処理剤を省略しているが、設けるようにしてもよい。   This heat treatment apparatus 1D includes a gas processing unit 20D that is different from the gas processing unit 20A of the first embodiment. That is, it has a gas passage 21D in which an open end 22a is provided on the entry side of the introduction duct 22 and an open end 24a is provided on the exit side of the gas treatment duct 24. The gas treatment unit 20D is heated by the catalyst 30 and the gas treatment duct 24. A blower 34 and a heater 35 are provided in the introduction duct 22. In FIG. 2, the pretreatment agent is omitted, but it may be provided.

このように構成された熱処理装置1Dのエア流れは以下のようになっている。即ち、開放端22aから入ったエアは、加熱器35により加熱されて導入ダクト22を経て熱処理室11に入り、ここで熱処理に寄与する。その熱処理済みエアは、昇華物を含むもので、導出ダクト23に入った後、気体処理ダクト24に導かれて触媒30による昇華物の酸化分解反応を受けた後に、開放端24aから排出される。なお、図2中の16は、エアが熱処理室11の内部で還流することなく、気体導入部12から気体導出部13へ流れるようにするための邪魔板であり、熱処理室11の気体導入部12とは反対側に通路16aが形成されるように設けられる。   The air flow of the heat treatment apparatus 1D configured as described above is as follows. That is, the air that has entered from the open end 22a is heated by the heater 35 and enters the heat treatment chamber 11 through the introduction duct 22 and contributes to the heat treatment. The heat-treated air contains a sublimation product, enters the outlet duct 23, is guided to the gas processing duct 24, undergoes an oxidative decomposition reaction of the sublimate by the catalyst 30, and is then discharged from the open end 24a. . 2 is a baffle plate for allowing air to flow from the gas introduction part 12 to the gas outlet part 13 without recirculating inside the heat treatment room 11, and the gas introduction part of the heat treatment room 11. 12 is provided so that a passage 16 a is formed on the side opposite to the side 12.

したがって、この熱処理装置1Dにあっても、熱処理部10から離れた熱処理部10の外側の気体通路21Dに送風機34および加熱器31、35が配設されるので、送風機34や加熱器31、35の故障を防止する状態で熱処理室11の内部を洗浄することができる。加えて、熱処理部10の気体導入部12および気体導出部13に対し、連結用フランジ14、15、25、26およびボルト・ナットから構成される連結手段を介して気体通路21Dが着脱可能に連結されるので、その気体通路21Dに設けた送風機34および加熱器31、35を、気体処理部20Dを熱処理部10から切り離すことで熱処理部10から分離させ得、これにより送風機34や加熱器31、35の故障を確実に防止する状態で熱処理室11の内部を洗浄することができる。また、熱処理部10と気体処理部20Dとを切り離すことで、熱処理部10だけを交換することや、或いは気体処理部20Dだけを交換することが可能になる。更に、導入ダクト22の入側開放端22aから吸入されたエアが加熱器35にて加熱されて熱処理室11に導入され、導出ダクト23および気体処理ダクト24を経て導出されるように構成されているので、導入ダクト22の開放端22aから吸気されるエアが昇華物の無いものとなる。このため、熱処理室11には常時フレッシュなエアが導入されるので、触媒30による昇華物の酸化分解反応を低下させ難くすることが可能になる。また、この熱処理装置1Dでは、導入ダクト22に送風機34を設けることで、熱処理室11への気体導入と熱処理室11からの気体導出とが可能である。   Therefore, even in the heat treatment apparatus 1D, the blower 34 and the heaters 31 and 35 are disposed in the gas passage 21D outside the heat treatment unit 10 away from the heat treatment unit 10, and thus the blower 34 and the heaters 31 and 35 are disposed. The inside of the heat treatment chamber 11 can be cleaned in a state that prevents this failure. In addition, the gas passage 21D is detachably connected to the gas introduction part 12 and the gas lead-out part 13 of the heat treatment part 10 through connection means composed of connection flanges 14, 15, 25, 26 and bolts and nuts. Therefore, the blower 34 and the heaters 31 and 35 provided in the gas passage 21D can be separated from the heat treatment unit 10 by separating the gas treatment unit 20D from the heat treatment unit 10, and thereby the blower 34 and the heater 31, The inside of the heat treatment chamber 11 can be cleaned in a state that reliably prevents 35 failures. Further, by separating the heat treatment unit 10 and the gas processing unit 20D, it is possible to replace only the heat treatment unit 10 or to replace only the gas processing unit 20D. Further, the air sucked from the inlet side open end 22 a of the introduction duct 22 is heated by the heater 35 and introduced into the heat treatment chamber 11, and is led out through the lead-out duct 23 and the gas treatment duct 24. Therefore, the air sucked from the open end 22a of the introduction duct 22 is free of sublimation. For this reason, since fresh air is always introduced into the heat treatment chamber 11, it is possible to make it difficult to lower the oxidative decomposition reaction of the sublimate by the catalyst 30. Further, in this heat treatment apparatus 1 </ b> D, by providing the blower 34 in the introduction duct 22, gas introduction into the heat treatment chamber 11 and gas discharge from the heat treatment chamber 11 are possible.

なお、この第2実施形態では、送風機34を導入ダクト22に設けているが、これに限らない。例えば、導出ダクト23や気体処理ダクト24に設けても、或いは導入ダクト22、気体処理ダクト24および導出ダクト23のうちの少なくとも1つに送風機を設けてもよい。   In addition, in this 2nd Embodiment, although the air blower 34 is provided in the introduction duct 22, it is not restricted to this. For example, it may be provided in the outlet duct 23 or the gas processing duct 24, or a blower may be provided in at least one of the introduction duct 22, the gas processing duct 24, and the outlet duct 23.

(第3実施形態)
図3は、本発明の第3実施形態に係る熱処理装置の概略構成図である。なお、図2と同一部分には、同一符号を付している。
(Third embodiment)
FIG. 3 is a schematic configuration diagram of a heat treatment apparatus according to the third embodiment of the present invention. In addition, the same code | symbol is attached | subjected to the same part as FIG.

この熱処理装置1Cは、第2実施形態の気体処理部20Dとは異なる気体処理部20Cを有する。即ち、気体処理ダクト24の触媒30、加熱器31および送風機32が設けられた箇所と出側端24aとの間と、導入ダクト22の途中とが、連結ダクト28を介して連通連結された気体通路21Cを有し、気体処理部20Cは、導入ダクト22の連結ダクト28の合流点よりも下流位置に加熱器35と送風機34が設けられた構成となっている。なお、図3では前処理剤を省略しているが、設けるようにしてもよい。また、上記送風機32は省略することができる。   This heat treatment apparatus 1C has a gas processing unit 20C different from the gas processing unit 20D of the second embodiment. That is, the gas in which the portion of the gas processing duct 24 where the catalyst 30, the heater 31 and the blower 32 are provided and the outlet end 24a and the middle of the introduction duct 22 are connected via the connection duct 28. The gas processing unit 20 </ b> C has a passage 21 </ b> C, and has a configuration in which a heater 35 and a blower 34 are provided at a downstream position from the junction of the connection duct 28 of the introduction duct 22. Although the pretreatment agent is omitted in FIG. 3, it may be provided. Further, the blower 32 can be omitted.

このように構成された熱処理装置1Cのエア流れは以下のようになっている。即ち、開放端22aから入ったエアは、加熱器35により加熱されて導入ダクト22を経て熱処理室11に入り、ここで熱処理に寄与する。その熱処理済みエアは、昇華物を含むもので、導出ダクト23に入った後、気体処理ダクト24に導かれて触媒30による昇華物の酸化分解反応を受けた後に、開放端24aから排出されるか、または連結ダクト28および導入ダクト22を介して熱処理室11に戻される。なお、図3中の16は、第2実施形態と同様の邪魔板である。   The air flow of the heat treatment apparatus 1 </ b> C configured as described above is as follows. That is, the air that has entered from the open end 22a is heated by the heater 35 and enters the heat treatment chamber 11 through the introduction duct 22 and contributes to the heat treatment. The heat-treated air contains a sublimation product, enters the outlet duct 23, is guided to the gas processing duct 24, undergoes an oxidative decomposition reaction of the sublimate by the catalyst 30, and is then discharged from the open end 24a. Alternatively, it is returned to the heat treatment chamber 11 through the connection duct 28 and the introduction duct 22. In addition, 16 in FIG. 3 is a baffle plate similar to 2nd Embodiment.

したがって、この第3実施形態に係る熱処理装置1Cにあっても、熱処理部10から離れた熱処理部10の外側の気体通路21Cに送風機32、34および加熱器31、35が配設されるので、送風機32、34や加熱器31、35の故障を防止する状態で熱処理室11の内部を洗浄することができる。加えて、熱処理部10の気体導入部12および気体導出部13に対し、連結用フランジ14、15、25、26およびボルト・ナットから構成される連結手段を介して気体通路21Cが着脱可能に連結されるので、その気体通路21Cに設けた送風機32、34および加熱器31、35を、気体処理部20Cを熱処理部10から切り離すことで熱処理部10から分離させ得、これにより送風機32、34や加熱器31、35の故障を確実に防止する状態で熱処理室11の内部を洗浄することができるとともに、熱処理部10だけを交換することや或いは気体処理部20Cだけを交換することが可能になる。   Therefore, even in the heat treatment apparatus 1C according to the third embodiment, the fans 32 and 34 and the heaters 31 and 35 are disposed in the gas passage 21C outside the heat treatment unit 10 away from the heat treatment unit 10. The inside of the heat treatment chamber 11 can be cleaned while preventing the blowers 32 and 34 and the heaters 31 and 35 from being broken. In addition, the gas passage 21 </ b> C is detachably connected to the gas introduction part 12 and the gas outlet part 13 of the heat treatment part 10 through connection means composed of connection flanges 14, 15, 25, 26 and bolts and nuts. Therefore, the blowers 32 and 34 and the heaters 31 and 35 provided in the gas passage 21C can be separated from the heat treatment unit 10 by separating the gas treatment unit 20C from the heat treatment unit 10, whereby the blowers 32 and 34 and The inside of the heat treatment chamber 11 can be cleaned in a state that reliably prevents the failure of the heaters 31 and 35, and only the heat treatment unit 10 can be replaced or only the gas treatment unit 20C can be replaced. .

また、熱処理装置1Cにおいて、導入ダクト22の入側端22aが開放されているので、フレッシュなエアの導入が可能になる。また、熱処理室11から導出されたエアが、触媒30により浄化され、かつ加熱器31により加熱されたものとなって連結ダクト28を介して導入ダクト22に入り、導入ダクト22の開放入側端22aから吸入されたエアと混合されて熱処理室11に導入されるので、熱損失を少なくすることができる。更に、熱処理室11に導入されるエアが、導入ダクト22に設けた気体加熱用加熱器35により加熱されるので、その気体加熱用加熱器35は熱処理室11の温度管理に、気体処理ダクト24に設けた加熱器31は触媒30の温度管理にそれぞれ専有的に用いることが可能になる。したがって、被熱処理物Wの加熱温度に左右されずに、触媒30を最適な活性温度に設定することができる。   Moreover, in the heat treatment apparatus 1C, the inlet side end 22a of the introduction duct 22 is opened, so that fresh air can be introduced. In addition, the air led out from the heat treatment chamber 11 is purified by the catalyst 30 and heated by the heater 31 and enters the introduction duct 22 through the connection duct 28, and opens the inlet side end of the introduction duct 22. Since it is mixed with the air sucked from 22a and introduced into the heat treatment chamber 11, heat loss can be reduced. Furthermore, since the air introduced into the heat treatment chamber 11 is heated by the gas heating heater 35 provided in the introduction duct 22, the gas heating heater 35 is used for the temperature management of the heat treatment chamber 11 for the gas treatment duct 24. Each of the heaters 31 provided in the can be used exclusively for temperature control of the catalyst 30. Therefore, the catalyst 30 can be set to an optimum activation temperature without being influenced by the heating temperature of the workpiece W.

(第4実施形態)
図4は、本発明の第4実施形態に係る熱処理装置の概略構成図である。なお、図3と同一部分には、同一符号を付している。
(Fourth embodiment)
FIG. 4 is a schematic configuration diagram of a heat treatment apparatus according to the fourth embodiment of the present invention. The same parts as those in FIG. 3 are denoted by the same reference numerals.

この熱処理装置1Bは、導入ダクト22の連結ダクト28との合流点よりも下流側であって気体加熱用加熱器35と送風機34とが設けられている位置よりも上流側の位置と、導出ダクト23の途中とが、第2連結ダクト27を介して連通連結された気体通路21Bを有する。   This heat treatment apparatus 1B has a position on the downstream side of the junction with the connecting duct 28 of the introduction duct 22 and on the upstream side of the position where the gas heating heater 35 and the blower 34 are provided, and the outlet duct. 23 has a gas passage 21 </ b> B communicated and connected via the second connection duct 27.

気体処理部20Bは、以下のように構成されている。即ち、気体処理ダクト24には、触媒30と加熱器31と送風機32とが設けられ、導入ダクト22の途中であって第2連結ダクト27の合流点よりも下流位置には、上述したように送風機34と加熱器35とが設けられている。加熱器35は、熱処理室11に導入されるエアを加熱する目的で設けられている。また、熱処理室11の内部には、前記邪魔板16が設けられている。なお、図4では前処理剤を省略しているが、設けるようにしてもよい。   The gas processing unit 20B is configured as follows. That is, the gas treatment duct 24 is provided with the catalyst 30, the heater 31, and the blower 32. As described above, in the middle of the introduction duct 22 and downstream of the joining point of the second connection duct 27. A blower 34 and a heater 35 are provided. The heater 35 is provided for the purpose of heating the air introduced into the heat treatment chamber 11. Further, the baffle plate 16 is provided inside the heat treatment chamber 11. Although the pretreatment agent is omitted in FIG. 4, it may be provided.

このように構成された熱処理装置1Bのエア流れは以下のようになっている。即ち、開放端22aから入ったエアは、加熱器35により加熱されて導入ダクト22を経て熱処理室11に入り、ここで熱処理に寄与する。その熱処理済みエアは、昇華物を含むもので、導出ダクト23に入った後、第2連結ダクト27と気体処理ダクト24とに向けて分岐し、第2連結ダクト27に導かれたエアは再度加熱器35により加熱されて導入ダクト22を経て熱処理室11に戻る。つまり、熱処理室11と第2連結ダクト27との間を循環する。一方、気体処理ダクト24に向けて導かれた昇華物を含む熱処理済みエアは、触媒30による昇華物の酸化分解反応を受けた後に、開放端24aから排出されるか、または連結ダクト28および導入ダクト22を介して熱処理室11に戻される。   The air flow of the heat treatment apparatus 1B configured as described above is as follows. That is, the air that has entered from the open end 22a is heated by the heater 35 and enters the heat treatment chamber 11 through the introduction duct 22 and contributes to the heat treatment. The heat-treated air contains a sublimate, and after entering the outlet duct 23, branches toward the second connecting duct 27 and the gas processing duct 24, and the air guided to the second connecting duct 27 is again It is heated by the heater 35 and returns to the heat treatment chamber 11 through the introduction duct 22. That is, it circulates between the heat treatment chamber 11 and the second connection duct 27. On the other hand, the heat-treated air containing the sublimate guided toward the gas processing duct 24 is exhausted from the open end 24a after being subjected to the oxidation decomposition reaction of the sublimate by the catalyst 30, or the connection duct 28 and the introduction. It returns to the heat treatment chamber 11 through the duct 22.

したがって、この熱処理装置1Bにあっても、熱処理部10から離れた熱処理部10の外側の気体通路21Bに送風機32、34および加熱器31、35が配設されるので、送風機32、34や加熱器31、35の故障を防止する状態で熱処理室11の内部を洗浄することができる。加えて、熱処理部10の気体導入部12および気体導出部13に対し、連結用フランジ14、15、25、26およびボルト・ナットから構成される連結手段を介して気体通路21Bが着脱可能に連結されるので、その気体通路21Bに設けた送風機32、34および加熱器31、35を、気体処理部20Bを熱処理部10から切り離すことで熱処理部10から分離させ得、これにより送風機32、34や加熱器31、35の故障を確実に防止する状態で熱処理室11の内部を洗浄することができるとともに、熱処理部10だけを交換することや或いは気体処理部20Bだけを交換することが可能になる。   Accordingly, even in this heat treatment apparatus 1B, the fans 32 and 34 and the heaters 31 and 35 are disposed in the gas passage 21B outside the heat treatment part 10 away from the heat treatment part 10, and therefore the fans 32 and 34 and the heating The inside of the heat treatment chamber 11 can be cleaned in a state in which failure of the vessels 31 and 35 is prevented. In addition, the gas passage 21B is detachably connected to the gas introduction part 12 and the gas lead-out part 13 of the heat treatment part 10 through connection means composed of connection flanges 14, 15, 25, 26 and bolts and nuts. Therefore, the blowers 32 and 34 and the heaters 31 and 35 provided in the gas passage 21B can be separated from the heat treatment unit 10 by separating the gas treatment unit 20B from the heat treatment unit 10, and thus the blowers 32 and 34 and It is possible to clean the inside of the heat treatment chamber 11 in a state that reliably prevents the failure of the heaters 31 and 35, and it is possible to replace only the heat treatment unit 10 or replace only the gas treatment unit 20B. .

また、この熱処理装置1Bにおいては、導入ダクト22の入側端22aが開放され、かつ連結ダクト28を介してエアが循環する構成となっているので、第3実施形態と同様な効果が得られることは勿論のこと、連結ダクト28による循環経路よりも熱処理室11により近い循環経路が第2連結ダクト27により形成され、かつ第2連結ダクト27を含む循環経路に設けられた気体加熱用加熱器35により加熱する構成となっているので、温度低下が少ないエアを再利用することが可能になる。   Moreover, in this heat treatment apparatus 1B, since the entrance end 22a of the introduction duct 22 is opened and air is circulated through the connection duct 28, the same effect as that of the third embodiment can be obtained. Needless to say, the gas heating heater provided in the circulation path including the second connection duct 27, in which a circulation path closer to the heat treatment chamber 11 than the circulation path by the connection duct 28 is formed by the second connection duct 27. Since it becomes the structure heated by 35, it becomes possible to recycle the air with few temperature drops.

なお、上述した第1〜第4実施形態では熱処理部10の気体導入部12および気体導出部13と、気体通路(21A〜21D)とを連結する手段として、連結用フランジ14、15、25、26およびボルト・ナットから構成されるものを用いているが、本発明はこれに限らない。例えば、雄ねじと雌ねじを組み合わせた連結手段や、他の機構であってもよい。   In the first to fourth embodiments described above, the connecting flanges 14, 15, 25, as means for connecting the gas introduction part 12 and the gas outlet part 13 of the heat treatment part 10 and the gas passages (21A to 21D), However, the present invention is not limited to this. For example, a coupling means that combines a male screw and a female screw, or another mechanism may be used.

また、上述した第1〜第4実施形態では熱処理部10の気体導入部12および気体導出部13と、気体通路(21A〜21D)とを連結手段(連結用フランジ14、15、25、26およびボルト・ナット)で着脱可能に連結する構成としているが、本発明はこれに限らず、気体導入部12と導入ダクト22を溶接等で連結し、気体導出部13と導出ダクト23を溶接等で連結した構成としてもよい。この構成とした場合にも、熱処理部10から離れた熱処理部10外側の気体通路(21A〜21D)に送風機32等および加熱器31等が配設されるので、送風機32等および加熱器31等へ洗浄液等が到達し難くなって、送風機および加熱器の故障を防止する状態で熱処理室11の洗浄をすることが可能となり、本発明の目的を達成することができる。   In the first to fourth embodiments described above, the gas introduction part 12 and the gas outlet part 13 of the heat treatment part 10 and the gas passages (21A to 21D) are connected to the connecting means (the connecting flanges 14, 15, 25, 26 and However, the present invention is not limited to this, and the gas inlet 12 and the inlet duct 22 are connected by welding or the like, and the gas outlet 13 and the outlet duct 23 are connected by welding or the like. It is good also as a connected structure. Even in this configuration, since the blower 32 and the heater 31 are disposed in the gas passages (21A to 21D) outside the heat treatment unit 10 away from the heat treatment unit 10, the blower 32 and the heater 31 etc. It becomes difficult for the cleaning liquid or the like to reach, so that the heat treatment chamber 11 can be cleaned in a state in which the blower and the heater are prevented from being broken, and the object of the present invention can be achieved.

更に、上述した第1〜第4実施形態では、1つの熱処理部10に対して1つの気体処理部(20A〜20D)を配設する構成としているが、本発明はこれに限らず、1つの熱処理部10に対して2以上の気体処理部を配設する構成としてもよい。例えば、1つの熱処理部10に対して2つの気体処理部を配設する場合を例に挙げて図5に基づき説明する。
図5に示すように熱処理部10に、1組の気体導入部12と気体導出部13の他に、もう1組の気体導入部12aと気体導出部13aを設けておき、気体導入部12と気体導出部13に気体処理部20Aの気体通路21Aを連通連結させ、気体導入部12aと気体導出部13aに、同様の気体処理部20Aの気体通路21Aを連通連結させる構成としてもよい。なお、この構成において、1組の気体導入部12と気体導出部13しか使用しないときは、図6に示すように気体導入部12aと気体導出部13aに対し、蓋18を取付けておけばよい。
Furthermore, in the first to fourth embodiments described above, one gas processing unit (20A to 20D) is arranged for one heat treatment unit 10, but the present invention is not limited to this, and one It is good also as a structure which arrange | positions two or more gas processing parts with respect to the heat processing part 10. FIG. For example, a case where two gas processing units are provided for one heat treatment unit 10 will be described with reference to FIG.
As shown in FIG. 5, in addition to the one set of gas introduction part 12 and the gas derivation part 13, another set of gas introduction part 12 a and gas derivation part 13 a is provided in the heat treatment part 10. The gas passage 21A of the gas processing unit 20A may be connected to the gas outlet 13 and the gas passage 21A of the same gas processing unit 20A may be connected to the gas inlet 12a and the gas outlet 13a. In this configuration, when only one set of the gas introduction part 12 and the gas lead-out part 13 is used, a lid 18 may be attached to the gas lead-in part 12a and the gas lead-out part 13a as shown in FIG. .

更にまた、上述した実施形態では触媒30を気体処理ダクト24にのみ配設する構成としているが、本発明はこれに限らない。例えば図7に示すように、熱処理室11の内部にも別の触媒17を配設する構成としてもよい。このとき、熱処理室11の内部には、邪魔板16を設けていても設けてなくても構わない。このような構成とすることで、2つの触媒30、17により昇華物の酸化分解反応を高効率で行わせることが可能になる。   Furthermore, in the above-described embodiment, the catalyst 30 is disposed only in the gas processing duct 24, but the present invention is not limited to this. For example, as shown in FIG. 7, another catalyst 17 may be disposed inside the heat treatment chamber 11. At this time, the baffle plate 16 may or may not be provided inside the heat treatment chamber 11. With such a configuration, the two catalysts 30 and 17 can perform the oxidative decomposition reaction of the sublimate with high efficiency.

本発明の第1実施形態に係る熱処理装置の概略構成図である。It is a schematic block diagram of the heat processing apparatus which concerns on 1st Embodiment of this invention. 本発明の第2実施形態に係る熱処理装置の概略構成図である。It is a schematic block diagram of the heat processing apparatus which concerns on 2nd Embodiment of this invention. 本発明の第3実施形態に係る熱処理装置の概略構成図である。It is a schematic block diagram of the heat processing apparatus which concerns on 3rd Embodiment of this invention. 本発明の第4実施形態に係る熱処理装置の概略構成図である。It is a schematic block diagram of the heat processing apparatus which concerns on 4th Embodiment of this invention. 本発明の他の実施形態に係る熱処理装置の概略構成図である。It is a schematic block diagram of the heat processing apparatus which concerns on other embodiment of this invention. 本発明の更に他の実施形態に係る熱処理装置の概略構成図である。It is a schematic block diagram of the heat processing apparatus which concerns on other embodiment of this invention. 本発明の更に他の実施形態に係る熱処理装置の概略構成図である。It is a schematic block diagram of the heat processing apparatus which concerns on other embodiment of this invention.

符号の説明Explanation of symbols

1A〜1D 熱処理装置
10 熱処理部
11 熱処理室
12 気体導入部
13 気体導出部
14、15、25、26 連結用フランジ(連結手段)
20A〜20D 気体処理部
21A〜21D 気体通路
22 導入ダクト
23 導出ダクト
27 第2連結ダクト
28 連結ダクト
30 触媒
31、35 加熱器
32、34 送風機
DESCRIPTION OF SYMBOLS 1A-1D Heat processing apparatus 10 Heat processing part 11 Heat processing chamber 12 Gas introduction part 13 Gas derivation | leading-out part 14, 15, 25, 26 Flange for connection (connection means)
20A to 20D Gas processing unit 21A to 21D Gas passage 22 Introduction duct 23 Derivation duct 27 Second connection duct 28 Connection duct 30 Catalyst 31, 35 Heater 32, 34 Blower

Claims (7)

熱処理室に被熱処理物が出し入れ可能に収容され、かつ熱処理室に共に連通する気体導入部および気体導出部を有する熱処理部と、
前記気体導入部へ熱処理用気体を導入しかつ前記気体導出部から熱処理済みの気体を導出するための気体通路を有し、その気体通路に、前記被熱処理物を熱処理する際に当該被熱処理物から発生する昇華物を分解するための触媒と、少なくとも該触媒を加熱する加熱器と、前記熱処理用気体および前記熱処理済みの気体を所定方向に導く1または2以上の送風機とが設けられた気体処理部とを具備することを特徴とする熱処理装置。
A heat treatment part having a gas introduction part and a gas lead part communicating with the heat treatment room, wherein the object to be heat treated is detachably accommodated in the heat treatment room, and
A gas passage for introducing a heat treatment gas into the gas introduction section and for deriving a heat-treated gas from the gas lead-out section; A gas provided with a catalyst for decomposing sublimates generated from the gas, at least a heater for heating the catalyst, and one or more blowers for guiding the heat treatment gas and the heat treated gas in a predetermined direction A heat treatment apparatus comprising: a processing unit.
請求項1に記載の熱処理装置において、
前記気体通路は、前記気体導入部に連結手段を介して着脱可能に出側端が連結される導入ダクトと、前記気体導出部に連結手段を介して着脱可能に入側端が連結される導出ダクトとを有することを特徴とする熱処理装置。
The heat treatment apparatus according to claim 1,
The gas passage includes an introduction duct whose detachable end is detachably connected to the gas introduction part via a connecting means, and a lead which is detachably connected to the gas lead-out part via a connecting means. A heat treatment apparatus comprising a duct.
請求項2に記載の熱処理装置において、
前記導入ダクトの入側端と前記導出ダクトの出側端とが気体処理ダクトを介して連結されていて、前記気体処理ダクトに、前記触媒と前記加熱器とが設けられていることを特徴とする熱処理装置。
The heat treatment apparatus according to claim 2,
The inlet side end of the introduction duct and the outlet side end of the outlet duct are connected via a gas processing duct, and the catalyst and the heater are provided in the gas processing duct. Heat treatment equipment.
請求項2に記載の熱処理装置において、
前記導入ダクトの入側端が開放され、かつ前記導出ダクトの出側端に気体処理ダクトが連結されていて、前記気体処理ダクトに前記触媒と前記加熱器とが設けられ、前記導入ダクトに気体加熱用加熱器が設けられており、前記導出ダクト、前記気体処理ダクトおよび前記導入ダクトのうちの少なくとも一つに前記送風機が設けられていることを特徴とする熱処理装置。
The heat treatment apparatus according to claim 2,
The inlet end of the introduction duct is opened, and a gas processing duct is connected to the outlet end of the outlet duct. The gas processing duct is provided with the catalyst and the heater. A heat treatment apparatus, wherein a heating heater is provided, and the blower is provided in at least one of the lead-out duct, the gas processing duct, and the introduction duct.
請求項2に記載の熱処理装置において、
前記導入ダクトの入側端が開放され、かつ前記導出ダクトの出側端に気体処理ダクトが連結されていて、前記気体処理ダクトに前記触媒と前記加熱器とが設けられるとともに、気体処理ダクトの前記触媒と前記加熱器とが設けられた箇所よりも下流位置と前記導入ダクトの途中が連結ダクトを介して連通連結されていて、導入ダクトの連結ダクトとの合流点よりも下流側に気体加熱用加熱器と前記送風機とが設けられていることを特徴とする熱処理装置。
The heat treatment apparatus according to claim 2,
An inlet end of the introduction duct is opened, and a gas processing duct is connected to an outlet end of the outlet duct. The catalyst and the heater are provided in the gas processing duct. A downstream position and a midway of the introduction duct are connected to each other through a connecting duct from a location where the catalyst and the heater are provided, and gas heating is performed downstream from a junction with the connecting duct of the introduction duct. A heat treatment apparatus comprising a heater for heating and the blower.
請求項5に記載の熱処理装置において、
前記導入ダクトの連結ダクトとの合流点よりも下流側であって前記気体加熱用加熱器および前記送風機よりも上流側の位置と、前記導出ダクトの途中とが第2連結ダクトを介して連通連結されていることを特徴とする熱処理装置。
The heat treatment apparatus according to claim 5,
A position downstream of the junction with the connection duct of the introduction duct and upstream of the gas heating heater and the blower and the middle of the lead-out duct are connected through a second connection duct. The heat processing apparatus characterized by the above-mentioned.
請求項1乃至6のいずれか1つに記載の熱処理装置において、
前記熱処理部の前記熱処理室にも別の触媒が設けられていることを特徴とする熱処理装置。
The heat treatment apparatus according to any one of claims 1 to 6,
A heat treatment apparatus, wherein another catalyst is also provided in the heat treatment chamber of the heat treatment section.
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010144939A (en) * 2008-12-16 2010-07-01 Tohoku Univ Circulation type substrate burning furnace
JP2017034230A (en) * 2015-07-29 2017-02-09 東京エレクトロン株式会社 Substrate processing apparatus, substrate processing method and maintenance method of substrate processing apparatus and storage medium
JP2019509176A (en) * 2016-11-29 2019-04-04 ▲躍▼ ▲張▼ Hot air oxygen-free brazing system
KR102012158B1 (en) * 2019-05-13 2019-08-20 정영문 air conditioning apparatus
JP2022156337A (en) * 2021-03-31 2022-10-14 株式会社村田製作所 Heat treatment system

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI404955B (en) * 2009-02-23 2013-08-11 Yang Electronic Systems Co Ltd Cooling and moisture-proofing apparatus for use in electric property test of flat panel display substrate
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Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4961009A (en) * 1972-05-05 1974-06-13
JPS61127519U (en) * 1985-01-29 1986-08-11
JPH059556A (en) * 1991-07-02 1993-01-19 Daido Steel Co Ltd Gas feeding method for heat treating furnace
JP3000420U (en) * 1994-01-25 1994-08-09 日本電熱計器株式会社 Atmosphere cooling device for soldering equipment
JPH07100422A (en) * 1993-10-02 1995-04-18 Osaka Gas Co Ltd Coating and drying furnace
JPH10141868A (en) * 1996-11-12 1998-05-29 Tabai Espec Corp Heat treatment device provided with sublimate measures
JP2001201271A (en) * 2000-01-24 2001-07-27 Shinko Mex Co Ltd Exhaust gas treatment system of vertical blast furnace for copper
JP2002243368A (en) * 2001-02-20 2002-08-28 Chugai Ro Co Ltd Continuous kiln for flat sheet glass
JP2002257314A (en) * 2001-03-02 2002-09-11 Ngk Insulators Ltd Hot blast generator
JP2003158082A (en) * 2001-11-22 2003-05-30 Hitachi Ltd Substrate processor
JP2003229425A (en) * 2002-02-05 2003-08-15 Hitachi Kokusai Electric Inc Substrate processing apparatus
JP2004197182A (en) * 2002-12-19 2004-07-15 Hitachi Kokusai Electric Inc Substrate treatment apparatus
JP2004206983A (en) * 2002-12-25 2004-07-22 Pioneer Electronic Corp Manufacturing method of plasma display panel, and heat treatment device therefor
JP2004316987A (en) * 2003-04-14 2004-11-11 Koyo Thermo System Kk Continuous kiln with discharge gas treatment unit
JP2005048985A (en) * 2003-07-30 2005-02-24 Ngk Insulators Ltd Heat treatment furnace
JP2005071632A (en) * 2003-08-25 2005-03-17 Fujitsu Hitachi Plasma Display Ltd Method and device for manufacturing plasma display panel
JP2008002766A (en) * 2006-06-23 2008-01-10 Future Vision:Kk Air supply and exhaust system for substrate calcination furnace
JP2008039376A (en) * 2006-07-13 2008-02-21 Espec Corp Heat treating device
JP2008304182A (en) * 2008-07-22 2008-12-18 Future Vision:Kk Intake/exhaust method of substrate baking furnace

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03420U (en) * 1989-05-25 1991-01-07
CN100501287C (en) * 2003-01-25 2009-06-17 北京环能海臣科技有限公司 Thermal gas recycling device for retrieving condensed water from dehydrating material
JP2005037024A (en) * 2003-07-18 2005-02-10 Matsushita Electric Ind Co Ltd Baking furnace for plasma display panel
JP2007085702A (en) * 2005-09-26 2007-04-05 Espec Corp Glass substrate treating device, glass substrate treating system and glass substrate treating method

Patent Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4961009A (en) * 1972-05-05 1974-06-13
JPS61127519U (en) * 1985-01-29 1986-08-11
JPH059556A (en) * 1991-07-02 1993-01-19 Daido Steel Co Ltd Gas feeding method for heat treating furnace
JPH07100422A (en) * 1993-10-02 1995-04-18 Osaka Gas Co Ltd Coating and drying furnace
JP3000420U (en) * 1994-01-25 1994-08-09 日本電熱計器株式会社 Atmosphere cooling device for soldering equipment
JPH10141868A (en) * 1996-11-12 1998-05-29 Tabai Espec Corp Heat treatment device provided with sublimate measures
JP2001201271A (en) * 2000-01-24 2001-07-27 Shinko Mex Co Ltd Exhaust gas treatment system of vertical blast furnace for copper
JP2002243368A (en) * 2001-02-20 2002-08-28 Chugai Ro Co Ltd Continuous kiln for flat sheet glass
JP2002257314A (en) * 2001-03-02 2002-09-11 Ngk Insulators Ltd Hot blast generator
JP2003158082A (en) * 2001-11-22 2003-05-30 Hitachi Ltd Substrate processor
JP2003229425A (en) * 2002-02-05 2003-08-15 Hitachi Kokusai Electric Inc Substrate processing apparatus
JP2004197182A (en) * 2002-12-19 2004-07-15 Hitachi Kokusai Electric Inc Substrate treatment apparatus
JP2004206983A (en) * 2002-12-25 2004-07-22 Pioneer Electronic Corp Manufacturing method of plasma display panel, and heat treatment device therefor
JP2004316987A (en) * 2003-04-14 2004-11-11 Koyo Thermo System Kk Continuous kiln with discharge gas treatment unit
JP2005048985A (en) * 2003-07-30 2005-02-24 Ngk Insulators Ltd Heat treatment furnace
JP2005071632A (en) * 2003-08-25 2005-03-17 Fujitsu Hitachi Plasma Display Ltd Method and device for manufacturing plasma display panel
JP2008002766A (en) * 2006-06-23 2008-01-10 Future Vision:Kk Air supply and exhaust system for substrate calcination furnace
JP2008039376A (en) * 2006-07-13 2008-02-21 Espec Corp Heat treating device
JP2008304182A (en) * 2008-07-22 2008-12-18 Future Vision:Kk Intake/exhaust method of substrate baking furnace

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010144939A (en) * 2008-12-16 2010-07-01 Tohoku Univ Circulation type substrate burning furnace
JP2017034230A (en) * 2015-07-29 2017-02-09 東京エレクトロン株式会社 Substrate processing apparatus, substrate processing method and maintenance method of substrate processing apparatus and storage medium
CN106409670A (en) * 2015-07-29 2017-02-15 东京毅力科创株式会社 Substrate processing apparatus, substrate processing method and maintenance method of substrate processing apparatus
JP2019509176A (en) * 2016-11-29 2019-04-04 ▲躍▼ ▲張▼ Hot air oxygen-free brazing system
KR102012158B1 (en) * 2019-05-13 2019-08-20 정영문 air conditioning apparatus
JP2022156337A (en) * 2021-03-31 2022-10-14 株式会社村田製作所 Heat treatment system
JP7517226B2 (en) 2021-03-31 2024-07-17 株式会社村田製作所 Heat Treatment System

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