JP2008288334A - Solder supplying apparatus, and surface mounting machine - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a solder supplying apparatus which can supply a solder piece to a surface mounting machine full-automatically and which is compact, and to provide the surface mounting machine equipped with the same. <P>SOLUTION: The solder supplying apparatus 100 supplies a solder piece U to a supply position O on a substrate 11. The solder supplying apparatus 100 includes a reel 130 wound with a solder tape in the shape of a sheet which is long in one direction, a reel holder 120 for removably holding the reel 130, a feeder 170 which picks up a solder tape Tp supplied through the reel 130 and, at the same time, sends forth the solder tape Tp horizontally toward the supply position O set up in a front part of the top face of a casing 110, and a cutter 200 which, while keeping the solder tape Tp sent to the supply position O in a horizontal posture, pushes up the solder tape Tp from below at the supply position O and cuts it into the solder piece U, all of which are stored in the casing 110 having an installation portion 115 with respect to the substrate 11. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a solder supply device and a surface mounter.

  2. Description of the Related Art Conventionally, in the process of manufacturing a circuit board, a method for electrically connecting components using solder pieces (plate-like solder pieces) has been widely adopted.

Such solder pieces are generally hand-packed on a pallet and supplied to a surface mounter after a solder tape as a base material is cut into a predetermined width by a dedicated device. However, since such hand-packing work has poor work efficiency, attempts have been made in recent years to automate it (Patent Document 1 below).
Japanese Patent No. 2552606

In the above-mentioned patent document, solder pieces are automatically supplied to a pallet (jig), which is improved to the extent that there is workability. However, the above-mentioned document has a large apparatus, and there is room for further improvement.
The present invention has been completed based on the above circumstances, and an object thereof is to provide a compact solder supply device and a surface mounter equipped with the solder supply device.

  The present invention is for solving the above-mentioned problem, and a solder supply device according to the present invention is a solder supply device for supplying a solder piece to a predetermined supply position, and is a long sheet in one direction in a casing. A reel around which a solder tape having a shape is wound, a reel holder for detachably holding the reel, and the supply position set at the front upper portion of the casing while taking up the solder tape supplied through the reel. A feeding device that feeds horizontally toward the supply position; and a cutting device that pushes up and cuts the solder tape sent to the supply position from below at the supply position to form the solder pieces. However, it has characteristics.

As an embodiment of the present invention, the following configuration is preferable.
The cutting device includes a die that presses the upper surface of the solder tape at the end of the tape conveyance path where the solder tape goes to the supply position, and a solder tape that passes through the die and protrudes from the die tip to the supply position. Is formed from a punch that is pushed up from below and cut at the supply position. If it does in this way, a cutting device can be constituted simply.

A diamond-like carbon coating is applied to at least one of the punch and the die. By doing so, it becomes difficult for solder to adhere to the punch or die during cutting, and the solder tape can be cut accurately.

A suction hole that opens on the upper surface of the punch and is connected to the negative pressure source is provided in the punch, and a suction force is applied to the upper surface of the punch. If it does in this way, it can cut in the state where the solder tape of the cut object was stuck to the punch upper surface (suction holding). Therefore, the solder tape does not escape from the punch and cause a cutting failure or the like.

-During the cutting operation in which the solder tape is pushed up and cut by the punch, negative pressure is supplied from the negative pressure source and the solder tape to be cut is sucked and held on the upper surface of the punch, while the cutting operation is completed, Under a predetermined condition, a positive pressure is supplied instead of the negative pressure through the suction hole, so that the solder pieces on the cut upper surface of the punch are discarded. In this way, even if there is a defect such as a cutting failure, the defective solder piece can be forcibly discarded from the upper surface of the punch, that is, the supply position.

A closing member that closes the upper part of the solder tape that passes through the die and protrudes to the supply position, a lift device that moves the closing member up and down in synchronization with the push-up operation of the punch, and solder by the push-up operation of the punch And a slide device that retracts the closing member from the supply position by horizontally moving the closing member in a planar direction after the tape is cut. In this way, if the configuration is such that the solder tape is cut while the upper surface is closed by the closing member, it is possible to almost completely avoid the solder tape escaping from the punch during cutting, and the solder tape cutting work can be performed more stably. Yes. In addition, since the closing member is retracted from the supply position after cutting, the subsequent solder piece removal operation can be performed smoothly without causing interference to the closing member.

A first plate cam that converts the rotational power transmitted from the motor into a reciprocating motion in the vertical direction and causes the punch to perform the push-up operation; and a second plate cam that constitutes the lift device; The rotary shaft of the first plate cam and the rotary shaft of the second plate cam are spanned to provide a synchronous rotating belt that rotates both plate cams synchronously. By doing so, it is possible to reliably synchronize the punch pushing-up operation (cutting operation) and the closing member raising operation with a relatively simple configuration.

-It is set as the structure which provides the through-hole which penetrates up and down the closing surface which blocks the upper part of a solder tape in the said closing member. If it does in this way, it will become difficult to adhere a solder piece to the closing surface of a closing member. Therefore, when the closing member is moved in the plane direction and retracted from the supply position, there is no problem that the solder piece is deformed by being pulled by the closing member.

A rotating device that forcibly rotates the reel in the feeding direction and feeds the solder tape from the reel; and a hanging device that includes a plurality of rollers that bridge the solder tape sent from the reel. The configuration is such that the solder tape wound in a curved shape on the roller group of the delivery device is taken out by the delivery device and delivered to the supply position, and at least one of the rollers constituting the roller group is provided. The movable tension roller is capable of moving toward or away from other rollers and exerts tension on the solder tape stretched over the roller group.

  If the configuration is such that the solder tape wound around the reel is directly picked up by the feeding device, even if the picking operation is stopped, the reel continues to rotate due to inertia and further tries to send the solder tape. As described above, if the solder tape is unintentionally sent even though the take-off operation is stopped, it becomes an obstacle to stably feeding the solder tape to the supply position.

  In this regard, if the configuration is such that the solder tape taken up by the delivery device is covered in the delivery device (specifically, the movable tension roller is moved closer to the other roller), the inertia of the reel works. There is no room, and the solder tape can be sent stably to the supply position.

-It is set as the structure which controls the movement of the said movable tension roller to an up-down direction. In this way, since the moving direction (up and down) of the movable tension roller and the tape feeding direction (horizontal) are orthogonal to each other, the inertia of the reel becomes even more difficult to act.

A detection device that detects a change in the position of the movable tension roller in the vertical direction that accompanies the take-up of the tape by the delivery device, and the amount of solder tape that is delivered from the reel is rotated based on the detection result of the detection device; And a control device that controls the device via the device, and constructs a control system that controls the movable tension roller so that the position in the vertical direction is substantially constant. With such a configuration, regardless of the operation of the delivery device, a fixed length of the solder tape can be held in the transfer device, and the tension acting on it can be controlled almost constant.

A tip position detection sensor for detecting the tip position of the solder tape is provided on the tape conveyance path where the solder tape goes to the supply position. With such a configuration, it is possible to specify the position of the tip of the solder tape after recovery even when the apparatus is stopped at an unplanned position due to an emergency stop or the like.

  The present invention is for solving the above-mentioned problems, and the surface mounter according to the present invention is provided with a mounting head on the base, which can be moved horizontally and takes out components and solder pieces by lifting and lowering operations. A surface mounting machine, wherein the solder supply device according to any one of claims 1 to 12 is disposed on the base so that the supply position is within a moving region of the mounting head. It has the characteristics.

As an embodiment of the present invention, the following configuration is preferable.
By supplying a negative pressure through the suction hole, a suction force is generated on the upper surface of the punch, and the solder tape is cut by the punch while the solder tape is in close contact with the upper surface of the punch. The negative pressure supply is stopped in accordance with the timing at which the mounting head takes out the solder pieces. With such a configuration, the solder piece can be smoothly taken out from the supply position.

  According to the present invention, the solder tape is cut at the supply position to form solder pieces. With such a configuration, if the mounting head is moved up and down at the supply position, the cut solder pieces can be directly taken out by the mounting head (fully automatic supply). Moreover, the solder supply apparatus has each apparatus accommodated in a casing, and is compactly packed.

1. 1 is a plan view of a surface mounter, and FIG. 2 is a partially enlarged view showing a support structure of a head unit. As shown in FIGS. 1 and 2, the surface mounter 10 has various devices arranged on a base 11 having a flat upper surface. In the following description, the longitudinal direction of the base 11 (left and right direction in FIGS. 1 and 2) is referred to as the X direction, and the Y direction and the Z direction are respectively defined in the directions of FIGS. .

  In the center of the base 11, a conveyance conveyor (hereinafter also simply referred to as a conveyor) 20 for conveying a printed wiring board is disposed. The conveyor 20 includes a pair of conveyor belts 21 that circulate and drive in the X direction. When the substrate P is set so that both the belts 21 are installed, the substrate P on the upper surface of the belt moves in the belt driving direction due to friction with the belt. It is supposed to be sent.

  In the present embodiment, the right side shown in FIG. 1 is the entrance, and the substrate P is carried into the machine through the conveyor 20 from the right side shown in FIG. The board | substrate P carried in is conveyed by the conveyor 20 to the mounting position G of the base center, and is stopped there.

  At the same mounting position G, the component W is mounted on the board P by the component mounting apparatus 30. After that, the board P after the mounting process is carried leftward in FIG. 1 through the conveyor 20 and carried out of the machine. It is the composition which becomes.

  The component mounting apparatus 30 generally includes an X-axis servo mechanism, a Y-axis servo mechanism, a Z-axis servo mechanism, and a suction head 63 that is driven by these servo mechanisms in the X-axis, Y-axis, and Z-axis directions.

  Specifically, as shown in FIG. 2, a pair of support legs 41 are installed on the base 11. Both support legs 41 are located on both sides of the mounting position G, and both extend straight in the Y direction (vertical direction in FIG. 1).

  Both support legs 41 are provided with guide rails 42 extending in the Y direction on the upper surfaces of the support legs, and head supports 51 are attached to the left and right guide rails 42 while fitting both ends in the longitudinal direction.

  A Y-axis ball screw 45 extending in the Y direction is attached to the right support leg 41, and a ball nut (not shown) is screwed to the Y-axis ball screw 45. A Y-axis motor 47 is attached to the Y-axis ball screw 45.

  When the motor 47 is energized, the ball nut advances and retreats along the Y-axis ball screw 45. As a result, the head support 51 fixed to the ball nut, and the head unit 60 described below, along the guide rail 42 in the Y direction. (Y-axis servo mechanism).

  As shown in FIG. 2, a guide member 53 extending in the X direction is installed on the head support 51, and a head unit 60 is attached to the guide member 53 movably along the axis of the guide member 53. ing. An X-axis ball screw 55 extending in the X direction is attached to the head support 51, and a ball nut is screwed onto the X-axis ball screw 55.

  An X-axis motor 57 is attached to the X-axis ball screw 55. When the motor 57 is energized, the ball nut advances and retreats along the X-axis ball screw 55. As a result, the head unit fixed to the ball nut. 60 moves in the X direction along the guide member 53 (X-axis servo mechanism).

  Accordingly, the head unit 60 can be moved and operated in the horizontal direction (XY direction) on the base 11 by controlling the X-axis servo mechanism and the Y-axis servo mechanism in combination.

  A plurality of suction heads 63 that perform a mounting operation are mounted in a row on the head unit 60. The suction head 63 protrudes downward from the lower surface of the head unit 60, and a suction nozzle 64 is provided at the tip.

  Each suction head 63 can rotate around the axis by driving an R-axis motor, and can move up and down with respect to the frame 61 of the head unit 60 by driving a Z-axis motor (Z-axis servo). mechanism). Each suction nozzle 64 is configured to be supplied with a negative pressure from a negative pressure means (not shown) so as to generate a suction force at the tip of the head.

  With this configuration, it is possible to take out components and solder pieces from the supply unit 15 by moving the suction head 63 up and down while moving the head unit 60 on the component supply 15 described below. .

  Then, after taking out the component and the solder piece, the suction head 63 is moved above the substrate P, and when the predetermined component mounting position is reached, the suction head 63 is moved up and down to move the component and the solder piece onto the substrate P. Can be implemented.

  As shown in FIG. 1, four supply parts 15 are provided on the base 11 and around the mounting position G, and supply is performed to two of them (the upper two positions 15 </ b> A and 15 </ b> B in FIG. 1). The tray 100 is installed, and four solder supply devices are installed side by side in the remaining two locations (the lower two locations 15C and 15D in FIG. 1).

2. Configuration of Supply Tray A tray supply device 80 is provided on the back side in the Y direction of the supply units 15A and 15B. In the tray supply device 80, a supply tray 90 in which component placement portions on which the component W is placed is formed in a matrix is packed and accommodated.

  The tray supply device 80 has a function of automatically supplying the supply tray 90 to the supply positions 15A and 15B while directing the front end of the tray toward the center of the base.

3. Configuration of Solder Supply Device 100 The solder supply device 100 is configured by disposing each device described below in a casing 110 having a mounting portion 115 for the base 11. The casing 110 has a box shape which is long in one direction, and a part of the upper surface (more specifically, a casing front portion where a supply position O described later is set) is opened.

  FIG. 3 is a central sectional view of the solder supply apparatus 100. As shown in the figure, a reel holder 120 is provided at the rear of the casing 110. The reel holder 120 includes a rotary plate 121 having a circular shape and a swing arm 125 that pivotally supports the rotary plate 121. The turntable 121 functions as a holding member that detachably holds the reel 130 shown in FIG. 4, and a support shaft 123 is provided at the center.

  The reel 130 is obtained by winding and holding a long sheet-like solder tape Tp in one direction around a cylindrical body 131 having a shaft hole 133, and the shaft hole of the body 131 on the support shaft 123 of the turntable 121. When 133 is fitted, the rotating disk 121 is fixed.

  A rotating device 140 is provided below the turntable 121. The rotating device 140 includes a motor 141 as a driving source and a driving roller 145 that rotates by the power of the motor 141. The driving roller 145 is disposed so that the outer periphery thereof is in contact with the outer periphery of the rotating disk 121, and forcibly rotates the rotating disk 121 in the feeding direction (the arrow F direction in FIG. 3) by friction.

  Thereby, as a result of the reel 130 rotating integrally with the turntable 121, the solder tape Tp is supplied from the reel 130.

  In the present embodiment, the rear part of the casing is a cover 117 that can be opened. After the cover 117 is opened, the swing arm 125 shown in FIG. 3 is rotated counterclockwise around the hinge C1. When it is moved, the turntable 121 can be retracted out of the casing, and the reel 130 can be replaced.

  Now, in the solder supply device 100, a transfer device 150, a delivery device 170, a guide unit 190, and a cutting device 200 are arranged in this order from the left hand to the right hand shown in FIG. Hereinafter, the transfer device 150 and the delivery device 170 will be described first, and then the guide unit 190 and the cutting device 200 will be described.

(A) Delivery device 150 and delivery device 170
The transfer device 150 includes a pair of holding rollers 151 and 153 and a movable roller 155 positioned between the holding rollers 151 and 153. The solder tape Tp supplied through the reel 130 is supplied with the rollers 151 to 155. It is configured to be stretched between them (more specifically, it is stretched in a curved shape).

  The pair of holding rollers 151 and 153 are fixed and fixed at substantially the same height at a position near the upper portion of the casing 110, while the movable roller 155 is movable in the vertical direction, with respect to the holding rollers 151 and 153. Thus, the approach / separation operation can be performed.

  More specifically, the movable roller 155 is attached to a block 161 that can move up and down along a guide groove 119 provided on the wall surface of the casing 110, and is configured to move up and down together with the block 161. .

  With such a configuration, the movable roller 155 moves closer to both the holding rollers 151 and 153 (for example, ascends from the position of FIG. 5), so that the solder tape Tp is attached to the feeding device 170 described below. The movable roller 155 moves away from the holding rollers 151 and 153 (for example, moves downward from the position shown in FIG. 5) to hold the solder tape Tp supplied from the reel 130. Is possible.

  The movable roller 155 applies the weight of the block 161 to the solder tape Tp stretched between the rollers, and also functions as a tension roller that applies tension to the solder tape Tp.

  The delivery device 170 includes a horizontal base 171, a delivery roller 175, a driven roller 176, and the like. The horizontal base 171 constitutes a delivery surface for delivering the solder tape Tp horizontally. The horizontal base 171 has an opening formed at substantially the center in the longitudinal direction. A delivery roller 175 is installed below the horizontal base 171 so that the zenith faces the opening of the horizontal base 171.

  The delivery roller 175 is rotated by obtaining the power of a motor 181 installed on the right side of the rotating disk 121, and a driven roller 176 is disposed so as to be in contact with the delivery roller 175 so as to contact the outer surface of the roller. .

  As a result, when the delivery roller 175 is rotated, the solder tape Tp on the side of the transfer device 150 is pulled by the friction between the rollers 175 and 176 and is fed horizontally along the horizontal base 171 to the front of the device. Become.

  In this embodiment, as described above, the transfer device 150 is provided with the movable roller 155, and the amount of the solder tape Tp sent is passed between the rollers 151, 153, and 155. Covered by shortening the overall length of the solder tape Tp.

  For this reason, even if the feeding device 170 pulls the solder tape Tp, it does not act on the reel 130 located upstream from the transfer device 150. The reason for this configuration is that the following points are taken into consideration.

  Here, assuming that the solder tape Tp wound around the reel 130 is directly taken up by the delivery device 170, even if the take-off operation is stopped, the reel 130 continues to rotate due to inertia and further tries to send the solder tape Tp. .

  As described above, if the solder tape Tp is unintentionally sent even though the take-off operation is stopped, it is an obstacle to stably sending the solder tape Tp to a supply position O on the punch upper surface 211 described later. It becomes. In this respect, if the configuration in which the solder tape Tp in the transfer device 150 that has already been pulled out from the reel 130 is taken out by the sending device 170, there is no room for the inertia of the reel 130 to be delivered stably.

  Further, as shown in FIG. 6, the present embodiment includes a light sensor 185, a control device 188 that controls the driving of the motor 141 that constitutes the rotating device 140, and the like, constructs a control system, and is sent from the reel 130. The amount of solder tape Tp delivered is automatically controlled.

  More specifically, a detection piece 162 is provided on the block 161 that holds the movable roller 155. On the other hand, the casing 110 is provided with an optical sensor 185. The optical sensor 185 includes a light projecting element and a light receiving element that is paired with the light projecting element and forms a detection optical axis. In the present embodiment, a plurality of such optical sensors 185 are arranged in rows in the vertical direction corresponding to the movement range of the detection piece 162.

  When the movable roller 155 is displaced up and down, the detection piece 162 blocks the detection optical axis of the specific optical sensor 185. As a result, the detection signals output from the optical sensors 185A to 185D ("detection result" of the present invention). Therefore, the position of the movable roller 155 in the vertical direction can be detected.

  When the movable roller 155 reaches the vicinity of the raised position shown in FIG. 6A, the control device 188 accelerates the rotation of the motor 141 and rotates the reel 130 at a high speed. As a result, the delivery amount of the solder tape Tp increases. The shortage of the solder tape Tp in the delivery device 150 is compensated.

  On the other hand, when the movable roller 155 reaches the vicinity of the lowered position shown in FIG. 6B, the control device 188 decelerates the motor 141, and as a result, the reel 130 rotates at a low speed to reduce the amount of solder tape Tp delivered.

  With such a configuration, regardless of the operation of the delivery device 170, the takeable solder tape Tp is continuously held in the delivery device 150 for a certain length.

  In addition, although the position of the movable roller 155 in the vertical direction is kept almost constant, the tension acting on the solder tape Tp is kept almost constant. With such a configuration, since the delivery device 170 can stably take out the solder tape Tp with a constant force, the solder tape Tp can inevitably be stably supplied to the supply position O.

(B) Guide part 190 and cutting device 200
The guide unit 190 includes a cutter base 191 and a guide plate 193. The cutter base 191 has an upper surface flush with the horizontal base 171 constituting the delivery device 170, and constitutes a tape conveyance path L for sending the delivered solder tape Tp horizontally toward the front side of the device.

  The guide plate 193 is installed above the cutter base 191 and has a passage space through which the solder tape Tp is inserted between the guide plate 193 and the upper surface of the cutter base. The guide plate 193 has a function of guiding the solder tape Tp fed on the upper surface of the cutter base and maintaining the tape in a horizontal posture.

  Further, a die 195 is provided at the front portion (right side in FIG. 3) of the guide plate 193. Similar to the guide plate 193, the die 195 has a passage space through which the solder tape Tp is inserted between the die 195 and the upper surface of the cutter base.

  Further, the front wall corresponding to the front side of the die 195 is cut off obliquely as shown in FIG. 7 to form a cutting blade 197. As shown in FIG. 7, the cutter base 191 is formed with a punch communication hole 192 that is located in front of the cutting blade 197 and allows a punch 210 described below to enter and exit. The punch 210, together with the die 195, constitutes the cutting device 200, and has a function of cutting the solder tape Tp protruding through the die 195 and projecting on the punch upper surface 211 from below.

  Returning to FIG. 3, the configuration of each unit that causes the punch 210 to perform a cutting operation will be described in order. As shown in FIG. 3, the punch 210 has a long prismatic shape. A guide shaft 230 is attached to the lower portion of the punch 210 with a flat spring receiving member 220 interposed therebetween.

  On the other hand, below the cutter base 191, a first support plate 240 and a second support plate 250 are fixed with their plate surfaces oriented horizontally. The first support plate 240 is fixed to the lower surface of the cutter base 191 so as to penetrate the punch 210 vertically. The support plate 240 is provided with spring support holes on both sides of the punch (left and right sides in FIG. 3). A coil spring 245 for return movement is attached to the spring support hole so as to abut the end of the spring receiving member 220 fixed to the lower part of the punch.

  The second support plate 250 is installed at a position slightly closer to the center in the height direction in the casing 110. The second support plate 250 is provided with a guide tube 255 at a position corresponding to the central axis of the punch 210. The guide cylinder 255 has its axis oriented vertically, and a guide shaft 230 under the punch is passed through the guide cylinder 255.

  A cam follower 265 having a circular cross section is attached to the lower end portion of the guide shaft 230 penetrating the guide tube 255 via a bracket 260.

  The entire punch including the guide shaft 230 configured as described above is biased downward by a coil spring 245 for return movement. As a result, a cam follower 265 at the lower end of the guide shaft is a first plate cam 270 described below. Of the helicopter 271 (that is, the outer peripheral portion).

  The first plate cam 270 is arranged below the second support plate 250 side by side with the drive motor 280. A motor gear (not shown) provided on the motor 280 and a cam gear (not shown) provided on the first plate cam 270 are connected by an endless timing belt.

  Therefore, when the motor 280 is driven, the first plate cam 270 rotates. When the first plate cam 270 rotates, the contact between the plate cam helicopter 271 and the cam follower 265 changes the position in the vertical direction. As a result, the rotational motion of the plate cam 270 is converted into linear reciprocating motion, and the guide shaft 230. As a result, the punch 210 is moved up and down. Accordingly, the punch 210 pushes up the solder tape Tp that has passed through the die 195 and protruded from the punch upper surface 211 from below, and is cut by the cutting blade 197 of the die 195.

  In this embodiment, both the die 195 and the punch 210 are DLC coated (diamond-like carbon coating). With such a configuration, the surfaces of the die 195 and the punch 210 can easily slide, and the solder tape Tp can be cut in the same manner as a metal piece such as iron. That is, the solder is softer than iron and unsuitable for shearing, but by making the surfaces of the die 195 and the punch 210 slip easily, the solder becomes difficult to adhere to the surfaces of the die 195 and the punch 210. It can be cut in the same way as a metal piece.

  In addition, as shown in FIG. 3, air passages 217 and 237 are formed in the shaft core portion of the punch 210 and the guide shaft 230. The air passages 217 and 237 are connected to a negative pressure source through a joint 291 provided at a lower portion of the second support plate 250.

  Further, a suction hole 213 that opens to the upper surface 211 of the punch is formed at a position near the upper end of the punch 210. A plurality of such suction holes 213 are formed in a line in the front-rear direction at the punch center, and the tape center of the solder tape Tp sent to the punch upper surface 211 after passing through the die 195 becomes the suction hole 213. It is set to exactly overlap.

  A hollow portion 215 is formed in the punch 210 at a position near the upper portion, and both the air passage 217 and the suction hole 213 communicate with the hollow portion 215.

  With the above configuration, when the negative pressure source is operated, air in the cavity 215 is extracted through the air passages 237 and 217, and as a result, a suction force acts on the punch upper surface 211 through the suction hole 213.

  As a result, the solder tape Tp can be sucked and held on the punch upper surface 211, the positional deviation of the solder tape Tp at the time of cutting can be regulated, and the cut solder piece can be held on the punch upper surface 211. Become.

  In the present embodiment, the positive pressure source is connected in parallel with the negative pressure source, and the control valves S1 and S2 are switched and controlled so that high-pressure air can be discharged from the punch upper surface 211 through the suction hole 213. ing. With such a configuration, even if there is a cutting failure or a suction error by the suction head 63, the solder piece U can be automatically discarded from the punch upper surface 211 by high-pressure air.

  Further, in the present invention, “after the cutting operation is completed, the solder piece on the upper surface of the punch is discarded under a predetermined condition” is used when the above-described cutting failure or a suction error by the suction head 63 occurs. The solder piece U is embodied by automatically discarding it from the punch upper surface 211 with high-pressure air.

  Next, the stripper 300 that assists the cutting work of the solder tape Tp by the punch 210 will be described. As shown in FIG. 7, the stripper 300 is installed on the upper surface of the cutter base 191 and has a rectangular shape having a width that can cover the upper surface 211 of the punch. The stripper 300 is held by lift arms 310 at both ends in the longitudinal direction.

  The stripper 300 corresponds to the “closing member” of the present invention, and the lower surface of the stripper 300 corresponds to the “closing surface” of the present invention.

  The lift arm 310 is formed by forming a holding portion 316 for holding the end portion of the stripper 300 at the front portion of a base portion 315 extending horizontally in the front-rear direction of the apparatus, and has an L shape as a whole. The inner wall surface of the base 315 is provided with a large roller 321 on the front side and a small roller 325 on the rear side.

  On the other hand, below the first support plate 240, a plate-shaped movable base 340 is suspended via a guide shaft 350 so as to be movable up and down (see FIG. 10). As shown in FIG. 7, guide rails 345 extending in the front-rear direction are provided on both end surfaces of the movable base 340, and rail receivers 318 provided on the inner wall surface of the lift arm 310 slide on the guide rails 345. The concave and convex are freely fitted.

  As described above, the lift arm 310 is concavo-convexly fitted to the guide rail 345 of the movable base 340 and is integrated in the vertical direction. Therefore, the lift arm 310 is guided along the guide shaft 350 that suspends the movable base 340 while Move up and down.

  Next, the lift device 400 that lifts the large roller 321 of the lift arm 310 from below and raises the stripper 300 will be described. As shown in FIG. 10, the lift device 400 includes a second plate cam 410, a bell link 420, a roller receiving member 430, and the like.

  The roller receiving member 430 supports the receiving plate 437 by erecting support columns 435 at both front and rear portions of a support block 433 that supports a roller 431 at the center. The roller receiving member 430 is attached at a position near the front portion of the second support plate 250 so as to be movable up and down while penetrating the support plate 250 through the support plate 250, and on the upper side with the second support plate 250 interposed therebetween. The receiving plate 437 is positioned, and the support block 433 is positioned on the lower side.

  The large roller 321 of the lift arm 310 is in contact with the upper surface of the receiving plate 437 positioned above the second support plate 250.

  The second plate cam 410 is fixed at a position closer to the lower rear side of the second support plate 250. The second plate cam 410 is connected to the first plate cam 270 via a synchronous rotating belt 415. More specifically, the rotation shaft 273 of the first plate cam 270 and the rotation shaft 413 of the second plate cam 410 are connected by the synchronous rotation belt 415, and when the first plate cam 270 rotates, Following this, it rotates synchronously.

  The bell link 420 is swingably attached via a hinge C2 between the second plate cam 410 and the roller receiving member 430, and one arm 421 is in contact with the lower surface of the roller 431 of the roller receiving member 430. Yes. The other arm 425 is provided with a roller 427, and the roller 427 is in contact with the helicopter (that is, the outer periphery) 411 of the second plate cam 410.

  In the present embodiment, the reference position of both plate cams 270 and 410 (that is, the position corresponding to the origin in the rotation direction) is set as shown in FIG. 10, and the stripper 300 is above the punch 210 at the reference position. Some clearance is maintained between the punch upper surface 211 (hereinafter referred to as a closed position).

  As a result, the solder tape Tp that has passed through the die 195 is configured to fit between the punch 210 and the stripper 300.

  When the motor 280 is driven to cut the solder tape Tp, the first plate cam 270 rotates and pushes up the punch 211. Then, in synchronization with the rotation of the first plate cam 270, the second plate cam 410 also rotates.

  Then, as a result of the helicopter 411 of the rotated second plate cam 410 pushing in the roller 427, the bell link 420 rotates in the direction indicated by the arrow G shown in FIG. 10 and lifts the lift arm 310 via the roller receiving member 430.

  From the above, the stripper 300 is lifted in synchronism with the pushing-up operation of the punch 210, and the solder tape Tp is cut in a state where it is sandwiched between the punch 210 and the stripper 300.

  The stripper 300 in the closed position above the punch is cut by soldering and then slid (horizontal movement) to the front side of the device in response to the operation of the slide device 500 described below, and the solder cut while opening the punch upper surface. It is comprised so that the piece U may be exposed.

  The slide device 500 includes a guide rail 510 provided on a top surface of the second support plate 250 at a position closer to the rear from the center, and a slider 520. The guide rail 510 extends in the front-rear direction (the left-right direction in FIG. 10), and the slider 520 moves back and forth on the guide rail 510.

  A holder plate 530 having a U-shaped fitting hole is fixed vertically on the slider 520, and a small roller 325 of the lift arm 310 is fitted into the fitting hole.

  Accordingly, when an air cylinder (not shown) is operated, a cylinder shaft provided in the air cylinder extends and displaces in the horizontal direction and pushes the slider 520 to the front side of the apparatus. As a result, the slider 520 moves forward along the guide rail 510 from the position in FIG.

  Then, as a result of the lift arm 310 being pushed via the slider 520, the stripper 300 moves from the closed position above the punch 210 to the front side of the apparatus. Thereby, the upper part of the punch 210 is opened, and the cut solder piece U is exposed.

  In the present embodiment, through-holes 301 penetrating vertically in the stripper 300 are formed in a line along the front-rear direction (the feeding direction of the solder tape) (see FIG. 7).

  By doing so, the solder pieces U are less likely to adhere to the lower surface of the stripper 300. Therefore, when the stripper 300 is moved to the front side of the apparatus and retracted from the punch upper surface 211, the solder pieces U are pulled by the stripper 300. Does not cause problems such as deformation.

  As shown in FIG. 1, the solder supply apparatus 100 configured as described above is attached with the front side of the apparatus provided with the punch 210 for cutting the solder tape Tp facing the center of the base on which the conveyor 20 is provided. Yes. More specifically, the punch upper surface 211 corresponding to the supply position O for supplying the solder piece U is fixed by bolts via the attachment portion 115 at the lower part of the casing. The setting is located in the area K.

  Hereinafter, the cut cycle of the solder tape Tp by the solder supply apparatus 100 will be briefly described with reference to FIGS. In the initial state before the operation starts, the first plate cam 270 and the second plate cam 410 are both at the reference position shown in FIG. That is, the punch 210 is in a lowered state that is flush with the cutter base 191, and the stripper 300 is in a closed position above the punch 210.

  When power is supplied to the solder supply device 100 and the operation is started, the delivery device 170 is first activated. As a result, the solder tape Tp is fed along the tape conveyance path L to the right side of FIG. 9 corresponding to the front side of the apparatus (pitch feed).

  As a result, the solder tape Tp passes through the die 195 and reaches the punch upper surface 211 as shown in FIG. At this time, the stripper 300 is positioned above the tape, and the upper part of the solder tape Tp is closed.

  When the solder tape Tp is sent, a negative pressure is then supplied to the suction hole 213 of the punch 210 through a negative pressure source, and a suction force is generated on the punch upper surface 211. As a result, the solder tape Tp is attracted to the punch upper surface 211 and brought into a close contact state.

  Then, before and after the supply of the negative pressure, the motor 280 is energized, and the power of the motor 280 is transmitted to the first plate cam 270 and the second plate cam 410. Thereby, both the plate cams 270 and 410 start to rotate synchronously from the reference position shown in FIG.

  Then, by the rotation of the first plate cam 270, the punch 210 starts to rise from the lowered position shown in FIG. Further, the lift device 400 is actuated by the rotation of the second plate cam 410 to raise the stripper 300 in the closed position (see FIG. 11).

  As a result, as shown in FIG. 9B, the solder tape Tp on the punch upper surface 211 is pushed up from below by the punch 210 and is cut by the cutting blade 197 of the die 195.

  During this cutting operation, a negative pressure is generated on the punch upper surface 211, and the solder tape Tp to be cut is sucked and held. Moreover, the stripper 300 is located above the solder tape Tp and closes the upper portion of the solder tape Tp. Therefore, as shown in FIG. 14, the solder tape Tp does not escape from the upper surface of the punch 210 to cause cutting failure or the like.

  Then, due to the action of the two plate cams 270 and 410 that rotate synchronously, the punch 210 then remains at the position (b) shown in FIG. 9 where the solder tape Tp is cut, whereas the stripper 300 is shown in FIG. 9 ( It further rises from the position b) and is completely separated from the solder piece U on the punch upper surface 211 cut as shown in FIG. 9C.

  Thus, when the stripper 300 is completely separated from the solder piece U, the slide device 500 is then operated by driving the cylinder. That is, the slider 520 starts to move in the right direction corresponding to the front side of the apparatus from the position shown in FIG. Thereby, the stripper 300 in the closed position moves from above the punch 210 to the front side of the apparatus.

  Then, when the stripper 300 reaches the position of the front portion of the casing shown in FIG. 12, the driving of the cylinder is stopped.

  Thereafter, the stripper 300 stays at the position shown in FIG. 12 due to the action of the two plate cams 270 and 410, while the punch 210 maintains the state in which the cut solder piece U is sucked and held, from the position shown in FIG. It rises.

  As shown in FIG. 13, the punch 210 stops rising when the upper surface 211 of the punch is substantially flush with the upper surface of the die 195. As a result, the solder piece U can be delivered to the head unit 60 on the surface mounter 10 side.

  The delivery operation will be described. First, each servo mechanism of the surface mounter 10 is driven, and the head unit 60 is moved horizontally above the solder supply device 100. The head unit 60 is temporarily stopped when the suction head 63 is positioned above the punch 210 corresponding to the supply position O as shown in FIG.

  After that, if the suction head 63 located above the supply position O is lowered and the lowering timing is estimated and the negative pressure on the punch 210 side is cut off, the holding of the solder piece U is released, and the solder piece U is removed. It can be taken out.

  Therefore, the solder piece U, which has been unheld, is sucked by the suction head 63 and the suction head 63 is lifted from this state, so that the solder piece U can be taken out from the supply position O. And the taken-out solder piece U is conveyed on the board | substrate P by the adsorption | suction head 63, and is mounted in a predetermined position.

  On the other hand, when the solder piece U is taken out from the supply position O, the punch 210 in the ascending position starts to descend due to the action of the cam 270 and the return coil spring 245 on the solder supply apparatus 100 side, and finally, FIG. Return to the lowered position shown.

  Thereafter, the cylinder device is operated, and the stripper 300 on the front side of the device is returned to the closed position above the punch while sliding backward. Then, following the return of the stripper 300, the two plate cams 270 and 410 that have been rotated synchronously return to their original positions, that is, the reference position in FIG. Thus, the state before the operation is completely restored.

  Accordingly, if the above-described series of cut cycles (cycles (a) to (d) shown in FIG. 9) are performed while the solder tape Tp is being fed by the delivery device 170, the next solder piece U is supplied to the supply position O. Automatically supplied.

  As described above, with the apparatus according to the present embodiment, it is possible to supply the solder piece U to the surface mounter 10 completely automatically without human intervention. Also, the solder supply device 100 itself has a compact form in which all devices are accommodated in the casing 110. Moreover, it can be easily removed from the base 11 (it is only necessary to unfasten the bolts), and is easy to use and excellent in merchantability.

  Further, the solder supply apparatus 100 of the present embodiment is equipped with a tip position detection sensor 600 described below, and consideration is given so that the tip position of the solder tape Tp can be detected. The tip position detection sensor 600 is a fiber sensor that includes an optical fiber 610 on the light projecting side and an optical fiber 620 on the light receiving side, and is provided at a position near the end of the tape transport path L through which the solder tape Tp is transported. Yes.

  Specifically, the optical fiber 610 on the light-projecting side and the optical fiber 620 on the light-receiving side are arranged so as to face each other with the tape transport path L in between, and the detection optical axis R is formed. When the detection optical axis R is crossed, the detection optical axis R is switched from the transmission state to the light shielding state. Therefore, the tip of the solder tape Tp can be detected.

  With such a configuration, even when the apparatus is stopped urgently, for example, when the solder tape Tp is stopped at an unscheduled position, after the recovery, the solder tape Tp is attached to the solder tape Tp in FIGS. As shown in (), once the wafer is pulled back until it passes through the detection optical axis R, and then the solder tape Tp is sent again, the tip position of the solder tape Tp can be accurately specified.

  Accordingly, it is possible to accurately feed the solder tape Tp in a predetermined amount, and the solder tape Tp can be accurately cut with a certain width.

  Note that reference numeral 700 shown in FIG. 15 is a backup device. Such a backup device supports and backs up the lower surface of the substrate P during a mounting operation in which components and solder pieces U are mounted on the substrate P by the suction head.

<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.

  (1) In the above embodiment, the transfer device 150 is provided between the reel 130 and the delivery device 170. However, the delivery device 150 is abolished and the solder tape Tp wound around the reel 130 is directly applied by the delivery device 170. It is good also as a structure to take over.

  (2) In the above embodiment, an example in which the solder supply device 100 is installed on the base 11 of the surface mounter 10 and the supplied solder piece U is directly taken out by the suction head 63 of the surface mounter 10 is shown. Such an example is an example of a usage example of the solder supply apparatus 100. For example, the solder piece U is replaced with a mounting head of the surface mounter 10 and is taken out by another type of robot (for example, an articulated robot) to perform some work. It is also possible.

The top view of the surface mounter applied to one embodiment of the present invention Partial enlarged view showing the support structure of the head unit Central cross-sectional view of solder supply device The perspective view which shows the structure of a reel A diagram schematically showing the configuration of the delivery device Diagram showing the configuration of the control system Perspective view showing the peripheral structure of the punch The figure which looked at FIG. 7 from the arrow C direction Schematic representation of the cutting cycle by the solder supply device The figure which shows the relationship of each device in the initial state The figure which shows the relation of each device at the time of cutting The figure which shows the relation of each device when the stripper slides The figure which shows the relation of each device at the time of delivery of the solder piece Diagram showing how solder tape escapes from the top of the punch during cutting DD sectional view in FIG. The figure which shows detection operation of a tip position detection sensor

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Surface mounter 11 ... Base 20 ... Conveyor 60 ... Head unit 63 ... Adsorption head (equivalent to "mounting head" of this invention)
DESCRIPTION OF SYMBOLS 100 ... Solder supply apparatus 120 ... Reel holder 130 ... Reel 150 ... Passing apparatus 151 ... Holding roller (The "roller group" of the present invention is constituted)
153: Holding roller (constitutes “roller group” of the present invention)
155 ... Movable roller (corresponding to the "movable tension roller" of the present invention and constituting a "roller group")
170 ... sending device 185 ... optical sensor (corresponding to "detecting device" of the present invention)
188 ... Control device 195 ... Die 200 ... Cutting device 210 ... Punch 270 ... First plate cam 300 ... Stripper (corresponding to "closing member" of the present invention)
400 ... Lift device 410 ... Second plate cam 415 ... Synchronous rotating belt 500 ... Slide device

Claims (14)

A solder supply device for supplying a solder piece to a predetermined supply position,
In the casing,
A reel wound with solder tape that forms a long sheet in one direction;
A reel holder for detachably holding the reel;
A feeding device that horizontally feeds the solder tape supplied through the reel toward the supply position set at the front upper surface of the casing;
A solder supply device, comprising: a cutting device that holds the solder tape sent to the supply position in a horizontal position, and pushes up and cuts the solder tape from below at the supply position to form the solder pieces. The cutting device,
A die for pressing the upper surface of the solder tape at the end of the tape conveying path toward the supply position of the solder tape;
The solder supply device according to claim 1, further comprising: a punch that passes through the die and protrudes from the tip of the die to the supply position, and pushes and cuts the solder tape from below at the supply position. . The solder supply apparatus according to claim 1 or 2, wherein a diamond-like carbon coating is applied to at least one of the punch and the die. 4. The solder supply device according to claim 2, wherein a suction hole that opens on a top surface of the punch and is connected to a negative pressure source is provided in the punch, and a suction force is applied to the top surface of the punch. 5. . During the cutting operation in which the solder tape is pushed up and cut by the punch, a negative pressure is supplied from the negative pressure source and the solder tape to be cut is sucked and held on the upper surface of the punch.
After the cutting operation is completed, the solder piece on the upper surface of the cut punch is discarded by supplying a positive pressure instead of the negative pressure through the suction hole under a predetermined condition. The solder supply device according to claim 4. A closing member that closes the upper part of the solder tape protruding through the die to the supply position;
A lift device that displaces the closing member in synchronization with the push-up operation of the punch;
3. A slide device that retracts the closing member from the supply position by horizontally moving the closing member in a planar direction after the solder tape is cut by the push-up operation of the punch. The solder supply device according to claim 5. A first plate cam that converts the rotational power transmitted from the motor into a reciprocating motion in the vertical direction and causes the punch to perform the push-up operation;
A second plate cam constituting the lift device;
The solder supply device according to claim 6, further comprising a synchronous rotating belt that spans between a rotating shaft of the first plate cam and a rotating shaft of the second plate cam and synchronously rotates both plate cams. . The solder supply apparatus according to claim 6 or 7, wherein the closing member is provided with a through-hole that vertically passes through a closing surface that closes above the solder tape. A rotating device for forcibly rotating the reel in the feeding direction and feeding the solder tape from the reel;
A delivery device comprising a plurality of roller groups for delivering the solder tape delivered from the reel, and the delivery device takes over the solder tape that is passed around the roller group of the delivery device, While being configured to be sent to the supply position,
At least one of the rollers constituting the roller group can be moved toward or away from the other roller, and a movable tension roller that applies tension to the solder tape spanned over the roller group. The solder supply apparatus according to claim 1, wherein the solder supply apparatus is a solder supply apparatus. The solder supply device according to claim 9, wherein movement of the movable tension roller is restricted in a vertical direction. A detection device for detecting a change in position of the movable tension roller in the vertical direction associated with tape take-up by the delivery device;
And a control device for controlling the amount of solder tape delivered from the reel via the rotating device based on the detection result of the detection device, and the position of the movable tension roller in the vertical direction is substantially constant. The solder supply apparatus according to claim 10, wherein a control system for controlling is constructed. 12. The tip position detection sensor for detecting a tip position of the solder tape is provided on a tape transport path where the solder tape is directed to the supply position. 12. Solder supply device. A surface mounter that is horizontally movable and has a mounting head on a base for taking out components and solder pieces by lifting and lowering operations,
A surface mounter, wherein the solder supply device according to any one of claims 1 to 12 is arranged on the base so that the supply position is within a moving region of the mounting head. . By supplying a negative pressure through the suction hole, a suction force is generated on the upper surface of the punch, and the solder tape is cut by the punch while the solder tape is in close contact with the upper surface of the punch. The surface mounting machine according to claim 13, wherein the supply of the negative pressure is stopped in accordance with a timing at which the mounting head takes out the solder piece.

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