JP2005074483A - Solder feeding device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a solder feeding device, which feeds a ribbon solder without causing trouble and makes the dimensional accuracy of the ribbon solder to be fed excellent. <P>SOLUTION: The solder feeding device is composed as follows. In a cutting means 300, an upper blade (fixed blade) 301 and a lower blade (driven blade)303 are arranged in this order as seen from the side of a feeding means 200. In the vicinity of the upper blade 301 in the side of the feeding means 200, there are provided a nozzle (the first pressing means) 231 for jetting a fluid, in a manner that the ribbon solder 103 is pushed in a direction of the upper blade (fixed blade) 301, when the lower blade (driven blade) 303 returns to an original position after cutting. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention has a feeding means for feeding a certain amount of ribbon solder, a fixed blade and a driving blade, a cutting means for cutting the ribbon solder sent by the feeding means, and a solder for conveying a cut piece obtained by cutting the ribbon solder. The present invention relates to a solder supply apparatus having a feeding means, and more particularly, to a solder supply apparatus that accurately cuts and supplies solder used in an electronic component assembly and mounting apparatus.

  As an example of the solder supply device, there is a configuration shown in FIGS. In FIG. 10, a gold ribbon (ribbon solder) 1 is sandwiched between a feed roller 10 and a moving roller 13 as feed means, the feed roller 10 is rotated by a certain amount by a servo motor 11, and the gold ribbon 1 is guided by a guide 15 to be a cutter unit. 14, the gold ribbon 1 is cut into a predetermined size. As shown in FIG. 11, the cutter unit 14 is fed by the feed roller 10, and the gold ribbon 1 guided by the guide 15 is fed by a width guide 17 that is provided on the upper surface of the fixed blade 16 and is matched to the maximum ribbon width tolerance. Feed out to the position to cut in a restricted state. The suction collet 19 of the gold foil sticking head part is lowered to the fixed blade (lower blade) 16 to sandwich the gold ribbon 1, and the gold ribbon 1 is cut by the drive blade 20 (upper blade) to form a gold foil cut piece. At the same time, the gold foil cut piece from which the suction collet 19 has been cut is sucked and transferred to a cavity such as a ceramic PGA (see Patent Document 1).

  However, since the solder supply device described above is provided in the order of the driving blade 20 and the fixed blade 16 as viewed from the feeding means, when the gold ribbon 1 is cut with the driving blade 20, it is cut as shown in FIG. The tip of the gold ribbon 1 is bent in the direction of the fixed blade 16 by the driving blade 20. The gold ribbon 1 bent in the direction of the fixed blade 16 is caught by the fixed blade 16 in the next feeding, and there is a problem that it is difficult to supply the gold ribbon.

  In order to solve this problem, there is a configuration shown in FIG. In the figure, reference numeral 81 denotes a brake means that includes a pulley 58 with which the ribbon solder 51 is engaged and a pressing member 62 that presses the ribbon solder 51 against the pulley 58 by a spring 74 and applies a braking force to the movement of the ribbon solder 51. . A feeding means 83 for feeding a certain amount of ribbon solder 51 includes a clamp 52 for holding the ribbon solder 51, a feeding direction of the clamp 52 for a certain amount of ribbon solder 51 (arrow I direction in the figure), and a direction opposite to the feeding direction (arrow in the figure). The cylinder 55 is moved in the direction II). The cutting means 85 includes a fixed blade 53 and a drive blade 54, and is provided in the order of the fixed blade 53 and the drive blade 54 when viewed from the feed means 83 (see, for example, Patent Document 2).

  With such a configuration, when the clamp 52 grips the ribbon solder 51 and the cylinder 55 is driven in the direction of arrow I, the ribbon solder 51 is sent out in a certain amount in the direction of arrow I. At this time, the ribbon solder 51 is sent out by the brake mechanism 81 without slack. When the ribbon solder 51 is fed out by a certain amount, the driving blade 54 is driven downward, and the ribbon solder 51 is cut. In such a configuration, since the fixed blade 53 is on the feeding means 83 side, the tip of the ribbon solder 51 can be prevented from being bent toward the fixed blade 53 by the drive blade 54. However, after the cutting of the ribbon solder 51, when the driving blade 54 returns (ascends), the driving blade 54 rubs the cut surface of the ribbon solder 51, so that the tip of the ribbon solder 51 returns to the return direction of the driving blade 54. This causes a problem of bending (see FIG. 14).

To eliminate this. A configuration shown in FIG. 14 has been proposed. In the figure, between the brake means 81 and the feed means 83, there is provided a pull back means 86 for pulling back the ribbon solder 51 in the direction opposite to the feed direction. The pull-back means 86 is a lever 59 that is rotatably provided using a pin 73, a pulley 57 that is provided on one rotating end side of the lever 59, and on which the ribbon solder 51 after the pulley 58 is locked, and a pulley 57 and subsequent pulleys 56 that change the feeding direction of the ribbon solder 51 and a spring 76 that urges the other rotating end of the lever 59 to pull the ribbon solder 51. Further, the adjustment range of the lever 59 is adjusted by an adjustment screw 71 that can be brought into contact with the base 68 and can be brought into contact with one rotation end of the lever 59 and an adjustment screw 72 that can be brought into contact with the other rotation end of the lever 59. It is regulated. According to such a configuration, when the ribbon solder 51 is cut by the drive blade 54, the pull-back means 86 pulls the ribbon solder 51 back in the feeding direction, so that the ribbon solder is returned when the drive blade 54 returns (when it rises). The driving blade 54 rubs the cut surface of 51, and this prevents the tip of the ribbon solder 51 from bending in the return direction of the driving blade 54 (see, for example, Patent Document 2).
Japanese Patent Laid-Open No. 5-291313 (see FIGS. 2 and 4) JP-A-8-39239 (see FIGS. 1 and 4)

  However, as in the ribbon solder supply mechanism shown in FIG. 14, the method of pulling back the ribbon solder 51 by the pull-back means 86 after cutting the ribbon solder 51 has a long distance from the cutting means 85 to the pull-back means 86. The return amount is not stable due to bending. Therefore, when the ribbon solder 51 is fed by the feeding means 86, there is a problem in that the amount of feeding is large and the dimensional accuracy of the cut piece of ribbon solder is poor.

  The present invention has been made to solve the above-described problems, and the problem is to provide a solder supply apparatus that can supply ribbon solder without any trouble and that has a good dimensional accuracy of a cut piece of ribbon solder that has been cut. is there.

  The invention according to claim 1, which solves the above-mentioned problem, has a feeding means for feeding a certain amount of ribbon solder, a cutting means having a fixed blade and a driving blade, and cutting the ribbon solder sent by the feeding means. A solder feeding device that transports the ribbon solder, and the cutting means is provided in the order of a fixed blade and a driving blade as viewed from the feeding means side, in the vicinity of the feeding means side of the fixed blade, The solder supply device is characterized in that a first pressing means is provided for pressing the ribbon solder in the direction of the fixed blade when the drive blade returns to the original position after cutting.

  A certain amount of ribbon solder is fed by the feeding means, and when the drive blade is driven, the ribbon solder is cut. When the driving blade returns to the original position after cutting, the ribbon solder is pressed in the direction of the fixed blade by the first pressing means.

  The invention according to claim 2 is provided with a placement portion on which the ribbon solder is placed on the driving blade of the cutting means, and when the cutting means cuts the ribbon solder on the solder feeding means, 2. The solder supply device according to claim 1, further comprising a second pressing unit that presses the ribbon solder onto the mounting portion of the driving blade.

  When cutting the ribbon solder, the second pressing means presses the ribbon solder against the mounting portion of the driving blade.

  The invention according to claim 3 is the solder supply apparatus according to claim 1, wherein the first pressing means is a nozzle that ejects fluid toward the ribbon solder.

  When the driving blade returns to the original position after cutting, fluid is ejected from the nozzle as the first pressing means toward the ribbon solder, and the ribbon solder is pushed in the direction of the fixed blade.

  The fluid may be either gas or liquid.

  The invention according to claim 4 is the solder supply apparatus according to claim 1, wherein the first pressing means is a pressing member that directly presses the ribbon solder.

  When the driving blade returns to the original position after cutting, the pressing member as the first pressing means directly presses the ribbon solder, and the ribbon solder is pressed toward the fixed blade.

  The invention according to claim 5 has a spool around which the ribbon solder is wound, and the ribbon solder supplied to the feeding means is ribbon solder fed out from the spool and does not contact the fixed blade. 2. The solder supply apparatus according to claim 1, wherein the ribbon solder is wound around the spool so that the winding iron is applied to the ribbon solder.

  The ribbon solder fed out from the spool has a curl and is cut with the curl applied.

  According to the first to fourth aspects of the present invention, the cutting means is provided in the order of the fixed blade and the driving blade as viewed from the feeding means side, so that the tip of the ribbon solder after cutting is provided by the driving blade. It is possible to prevent bending in the direction of the fixed blade. When the driving blade returns to the original position after cutting, the first pressing means for pressing the ribbon solder in the direction of the fixed blade is provided, so that the driving blade rubs the cutting surface of the ribbon solder and thereby the tip of the ribbon solder. The portion is prevented from bending in the return direction of the drive blade. Therefore, ribbon solder can be supplied without any trouble.

  Further, the first pressing means is provided in the vicinity of the feeding means side of the fixed blade and only pushes the ribbon solder in the direction of the fixed blade. Therefore, variation in the amount of ribbon solder fed by the feeding means is small, and the cut ribbon The dimensional accuracy of the solder cut piece is improved.

  According to the second aspect of the present invention, the mounting portion on which the ribbon solder is placed is provided on the driving blade of the cutting unit, and the cutting unit is configured to cut the ribbon solder on the solder feeding unit. Further, by providing the second pressing means for pressing the ribbon solder on the mounting portion of the driving blade, the ribbon solder is not displaced, and a ribbon solder cut piece with high dimensional accuracy can be obtained.

  Further, by providing the second pressing means in the solder feeding means, the cut piece obtained by cutting the ribbon solder can be immediately sent to another place.

  According to a third aspect of the present invention, the first pressing means is a nozzle that ejects fluid toward the ribbon solder, so that the nozzle and the pipe that supplies the fluid to the nozzle need only be provided, and the mounting location can be freely set. The degree is great. Moreover, it is easy to change the pressing location and the pressing force.

  According to the fourth aspect of the present invention, the first pressing means is a pressing member that directly presses the ribbon solder, so that the operation is reliable. Moreover, a large pressing area can be taken.

  According to the fifth aspect of the invention, the ribbon solder is wound on the fixed blade by winding the ribbon solder around the spool so that a curl that does not contact the fixed blade is applied to the ribbon solder. There is no contact. Therefore, ribbon solder can be supplied without any trouble.

Hereinafter, the best mode for carrying out the present invention will be described with reference to the drawings.
(First embodiment)
First, the overall configuration and schematic operation of the apparatus provided with this embodiment will be described with reference to FIGS. 2 is an overall configuration diagram, FIG. 3 is an enlarged view of the solder supply apparatus of FIG. 2, and FIG. 4 is an explanatory view of the stem of FIG. As shown in FIGS. 2 and 3, the solder supply apparatus 100 includes a feeding unit 200 that feeds a certain amount of ribbon solder 103 wound around a spool 101, a fixed blade, and a driving blade, and is fed by the feeding unit 200. A cutting means 300 for cutting the ribbon solder 103, and a solder feeding means 400 for picking up a cut piece obtained by cutting the ribbon solder 103 and transporting it in the direction of arrow A. In this embodiment, the ribbon solder 103 is wound around the spool 101 so that a curl that does not contact the fixed blade is applied to the ribbon solder 103 (details will be described later).

  The solder feeding means 400 is provided on a guide 401 provided in the direction of arrow A, a slide base 403 movably engaged with the guide 401 and moved along the guide 401 by a drive source (not shown), and the slide base 403. And a pickup section 405 for picking up a cut piece obtained by cutting the ribbon solder 103.

  Reference numeral 500 denotes a chamber in which a chamber opening 503 is formed on the upper surface, and a stem (base) 505 and a heater (not shown) for heating the stem 505 are provided therein. It can move in the direction of arrow B intersecting the transport direction (arrow A direction).

  The cut piece picked up by the solder feeding means 400 is placed at a predetermined position of the stem 505 through the chamber opening 503 of the chamber 500. The stem 505 is heated by a heater. Therefore, the placed cut piece is melted. Then, as shown in FIG. 4, a chip 507 transported by a chip transporter (not shown) is mounted on and joined to the melted solder.

Next, a detailed description of the solder supply apparatus will be given with reference to FIG. The spool 101 is rotatably provided on a shaft 107 provided on the base 105 and can be attached to and detached from the shaft 107. A feeding means 200 is provided adjacent to the spool 101.
(Feeding means 200)
A pair of guide rollers 201 and guide rollers 203 that sandwich the ribbon solder 103 from the spool 101 are provided adjacent to the spool 101. The lower guide roller 201 is rotatably provided with respect to the base 105, and the upper guide roller 203 is provided on the base 105 via a swing lever (not shown). Then, the guide roller 201 is pressed through the ribbon solder 103 by the weight of the swing lever and the guide roller 203 to guide the feeding position of the ribbon solder 103. When the ribbon solder 103 is attached, the ribbon solder 103 can be easily attached by lifting the guide roller 203.

  A solder guide 205 having a groove slightly wider than the width of the ribbon solder 103 is provided adjacent to the guide roller 201 and the guide roller 203. When the ribbon solder 103 is engaged with the groove of the solder guide 205, the movement of the ribbon solder 103 in the width direction is restricted.

  Adjacent to the solder guide 205, a pair of feed rollers 207 and a pressing roller 209 that sandwich and convey the ribbon solder 103 are provided. The lower feed roller 207 is rotationally driven by a motor 211 provided on the base 105. On the other hand, the upper pressing roller 209 is provided on the rotating end portion side of the lever 215 provided on the base 105 so as to be rotatable using a pin 213. The lever 215 is urged in the direction in which the pressing roller 209 presses the feed roller 207 by a spring 217 whose one end is locked to the base 105 and the other end is locked to the lever 215. When the pressing roller 209 presses the feed roller 207 via the ribbon solder 103, the ribbon solder 103 is accurately conveyed without slipping. Further, in this embodiment, a servo motor or a stepping motor is used as the motor 211 so that the feeding amount of the ribbon solder 103 can be arbitrarily changed. Further, when the ribbon solder 103 is attached, the ribbon solder 103 can be easily attached by lifting the presser roller 209 (lever 215).

  A solder guide 219 is provided adjacent to the pair of feed rollers 207 and the pressing roller 209. When the ribbon solder 103 is engaged with the groove of the solder guide 219, the movement of the ribbon solder 103 in the width direction is restricted.

A cutting means 300 is provided adjacent to the feeding means 200.
(Cutting means 300)
The cutting means 300 composed of a fixed blade and a driving blade is provided in the order of the fixed blade and the driving blade as viewed from the feeding means side. In this embodiment, an upper blade 301 as a fixed blade fixed to the base 105 and a lower blade 303 as a drive blade are provided. The base 105 is provided with a guide 305 extending in the vertical direction, and a lower blade holder 307 is engaged with the guide 305 so as to be movable. The lower blade holder 307 is moved up and down by a cylinder 309 provided on the base 105 and driven by gas pressure or liquid pressure. The lower blade 303 is held by the lower blade holder 307 and is pressed against the upper blade 301 by a spring (not shown). Since the lower blade 303 and the upper blade 301 are always in contact with each other by this spring, cutting errors are eliminated. Further, when the upper blade 301 and the lower blade 303 are replaced, it is not necessary to adjust the engagement of the blades.

  Furthermore, a placement portion 311 on which the ribbon solder 103 is placed is formed on the upper surface of the lower blade 303 that is a drive blade.

Further, when the lower blade 303 as the driving blade returns to the original position after cutting in the vicinity of the feeding means 200 side of the upper blade 301 as the fixed blade, the first presses the ribbon solder 103 toward the upper blade 301 as the fixed blade. A holding means is provided. In this embodiment, the first pressing means is provided adjacent to the solder guide 219 and is a nozzle 231 that ejects compressed air toward the lower surface of the ribbon solder 103.
(Pickup unit 405 of solder feeding means 400)
The pickup unit 405 is provided on the slide base 403, the sub-base 409 on which the linear guide 407 in the vertical direction is formed, the nozzle holder 411 movably engaged with the linear guide 407, the nozzle holder 411, and the ribbon holder 411. The suction nozzle 413 sucks a cut piece obtained by cutting the solder 103. The suction nozzle 413 is connected to a vacuum source (not shown), and the suction nozzle 413 is operated by operating an electromagnetic valve provided between the suction nozzle 413 and the vacuum source.

  A rod 416 of a cylinder 415 driven by gas pressure or liquid pressure provided in the sub-base 409 passes through a hole 411a formed in the nozzle holder 411, and the rod 416 inserted through the hole 411a has a hole 411a. A stopper (not shown) larger than the diameter is provided. The rod 416 is wound, and the spring 417 that presses against the cylinder 415 and the nozzle holder 411 is integrated with the holder 411 that is displaced from the rod 416. ) Moves up and down along the linear guide 407. The suction nozzle 413 presses the ribbon solder 103 placed on the placement portion 311 of the lower blade 303 serving as a driving blade, thereby pressing the ribbon solder 103 against the placement portion 311 of the lower blade 303. It is designed to function as a means.

  Next, the operation of the above configuration will be described with reference to FIGS. As shown in FIG. 5, with the upper blade 301 and the lower blade 303 of the cutting means 300 opened, the ribbon solder 103 fed by the feeding means 200 is stopped to be fed to the mounting portion 311 of the lower blade 303 for a predetermined length. Next, as shown in FIG. 6, the suction nozzle 413 of the solder feeding means 400 presses the ribbon solder 103 on the mounting portion 311 of the lower blade 303 (operation of the second pressing means), and further, the suction nozzle 413 The ribbon solder 103 is sucked and fixed. Then, the lower blade 303 as the driving blade is raised, the ribbon solder 103 is cut, and the cut piece 104 remains on the mounting portion 311 of the lower blade 303. At this time, the suction nozzle 413 is pushed upward by the lower blade 303, but the suction nozzle 413 rises together with the lower blade 303 as the spring 417 is bent.

  Then, as shown in FIG. 7, when the lower blade 303 reaches the upper end, the suction nozzle 413 of the solder feeding means 400 moves up. At this time, the cut piece 104 sucked by the suction nozzle 413 is also raised (pickup operation). When the suction nozzle 413 reaches the upper end, the lower blade 303 descends toward the original position. At this time, compressed air is ejected from the nozzle 231 toward the lower surface of the ribbon solder 103. Then, the solder feeding means 400 places the adhering cut piece 104 at a predetermined position of the stem 505 through the chamber opening 503 of the chamber 500.

According to the above configuration, the following effects can be obtained.
(1) By providing the fixed blade (upper blade 301) and the driving blade (lower blade 303) in this order when viewed from the feeding means 200 side, the tip of the ribbon solder 103 after cutting is prevented from bending in the direction of the fixed blade. it can. In the vicinity of the feeding means 200 side of the upper blade 301 that is a fixed blade, when the upper blade 301 returns to the original position after cutting, the nozzle 231 is used as a first pressing means that pushes the ribbon solder 103 toward the upper blade 301 that is the fixed blade. By providing, the driving blade rubs the cut surface of the ribbon solder 103, thereby preventing the tip of the ribbon solder 103 from bending in the return direction of the driving blade 103. Therefore, ribbon solder can be supplied without any trouble.
(2) The nozzle 231 as the first pressing means is provided in the vicinity of the feeding means 200 side of the fixed blade (upper blade 301), and only pushes the ribbon solder 103 in the direction of the upper blade 301 that is the fixed blade. The variation in the feeding amount of the ribbon solder 103 is small, and the dimensional accuracy of the cut piece of the ribbon solder is good.
(3) When the cutting means 300 cuts the ribbon solder 103, the suction nozzle 413 that is the second pressing means that presses the ribbon solder 103 against the mounting portion 311 of the lower blade 303 that is the driving blade is provided, thereby providing a ribbon. The positional deviation of the solder 103 is eliminated, and the cut piece 104 of the ribbon solder 103 with good dimensional accuracy is obtained.
(4) By providing the suction nozzle 413 serving as the second pressing means in the solder feeding means 400, the cut piece 104 obtained by cutting the ribbon solder 103 can be immediately sent to the chamber 500.
(5) Since the first pressing means is the nozzle 231 that ejects the fluid toward the ribbon solder 103, only the pipe that supplies the fluid to the nozzle 231 and the nozzle 231 may be used, and the degree of freedom of attachment is large. Moreover, it is easy to change the pressing location and the pressing force.
(6) In the present embodiment, the ribbon solder 103 is wound around the spool 101 so that a curl that does not contact the lower blade 303 that is a fixed blade is applied to the ribbon solder 103. That is, as illustrated in FIG. 5, the ribbon solder 103 fed out from the spool 101 is wound around the spool 101, so that a curl is applied, and the tip of the ribbon solder 103 is a curl like a two-dot chain line in the drawing. That is, the curl in the direction away from the lower blade 303 which is a fixed blade is given.

  Accordingly, the ribbon solder 103 does not come into contact with the lower blade 303 which is a fixed blade, and the ribbon solder can be supplied without any trouble.

The present invention is not limited to the above embodiment. In the above embodiment, the nozzle 231 is provided between the solder guide 219 and the lower blade 303 as shown in FIGS. 5 to 7, but the solder guide 219 is extended to the lower blade 303 as shown in FIG. A nozzle 231 may be provided in the solder guide 219. With such a configuration, the feeding unit 200 can convey the ribbon solder 103 more accurately.
(Second embodiment)
This will be described with reference to FIG. In addition, the same code | symbol is attached | subjected to FIG. 1-7 which shows a 1st example, and the overlapping description is abbreviate | omitted.

  The difference between this embodiment and the first embodiment is the first pressing means that presses the ribbon solder 103 toward the upper blade 301 that is a fixed blade. In this embodiment, an escape (pressing member) 251 that directly presses the ribbon solder 103 is used. The escape 251 is moved up and down by a driving means (not shown). After the ribbon solder 103 is cut, the lower blade 303 is lowered and raised to push the lower surface of the ribbon solder 103.

  Use of such an escape 251 ensures the operation. Moreover, a large pressing area can be taken.

It is a perspective view of the solder supply apparatus of the 1st form example. It is a whole block diagram of the apparatus provided with the solder supply apparatus of the 1st example. FIG. 3 is a partially enlarged view of FIG. 2. It is explanatory drawing of the stem of FIG. It is a figure explaining the action | operation of the solder supply apparatus of FIG. It is a figure explaining the action | operation of the solder supply apparatus of FIG. It is a figure explaining the action | operation of the solder supply apparatus of FIG. It is a figure explaining the other form example of a 1st form example. It is a block diagram of a 2nd form example. It is a block diagram of the cutting means of the solder supply apparatus of the 1st prior art example. It is a perspective view of FIG. It is a figure explaining the problem of the 1st prior art example. It is a block diagram of the solder supply apparatus of the 2nd prior art example. It is a block diagram of the solder supply apparatus of the 3rd prior art example.

Explanation of symbols

200 Feeding means 231 Nozzle (first pressing means)
300 Cutting means 301 Upper blade (fixed blade)
303 Lower blade (drive blade)

Claims (5)

Feeding means for feeding a certain amount of ribbon solder;
A cutting means having a fixed blade and a driving blade, and cutting the ribbon solder sent by the feeding means;
A solder feeding means for conveying a cut piece obtained by cutting the ribbon solder;
In a solder supply apparatus having
The cutting means is provided in the order of a fixed blade and a driving blade as viewed from the feeding means side,
A solder supply device, comprising: a first pressing means for pressing the ribbon solder in the direction of the fixed blade when the driving blade returns to the original position after cutting near the feed means side of the fixed blade. While providing a mounting portion on which the ribbon solder is mounted on the drive blade of the cutting means,
2. The solder according to claim 1, wherein the solder feeding means is provided with second pressing means for pressing the ribbon solder against the mounting portion of the driving blade when the cutting means cuts the ribbon solder. Feeding device.   The solder supply apparatus according to claim 1, wherein the first pressing unit is a nozzle that ejects a fluid toward the ribbon solder.   The solder supply device according to claim 1, wherein the first pressing means is a pressing member that directly presses the ribbon solder. A spool around which the ribbon solder is wound;
The ribbon solder supplied to the feeding means is ribbon solder fed out from the spool,
2. The solder supply apparatus according to claim 1, wherein the ribbon solder is wound around the spool so that a curl that does not contact the fixed blade is applied to the ribbon solder.

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