JPH0536740A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPH0536740A JPH0536740A JP21633291A JP21633291A JPH0536740A JP H0536740 A JPH0536740 A JP H0536740A JP 21633291 A JP21633291 A JP 21633291A JP 21633291 A JP21633291 A JP 21633291A JP H0536740 A JPH0536740 A JP H0536740A
- Authority
- JP
- Japan
- Prior art keywords
- brazing material
- island
- brazing
- lead frame
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、半導体装置、特にリ
ードフレームにチップをろう付けするための構成に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly to a structure for brazing a chip to a lead frame.
【０００２】[0002]
【従来の技術】図５は従来のこの種半導体装置、特に箔
状のろう材を供給されたリードフレーム部を示す平面
図、図６は箔状のろう材を供給する装置を示す正面図で
ある。図中１はリードフレームの巾Ｘ、長さＹのアイラ
ンド部、２はアイランド部１に供給された巾Ｗ、長さＬ
のろう材、３はろう材供給装置、４はろう材供給装置３
に取付けられたろう材リール、５はろう材リール４に巻
きつけられたろう材、６は供給装置３に取付けられたろ
う材５を搬送するガイド、７はろう材５を一定量供給す
るローラ、８はろう材５をカットするための上刃、９は
ローラ７により一定量（図１の長さＬ）供給されたろう
材２を上刃８と協働してカットする下刃、１０はろう材
をリードフレームのアイランド１上に搬送して圧接する
ピックアップコレットである。2. Description of the Related Art FIG. 5 is a plan view showing a conventional semiconductor device of this kind, particularly a lead frame portion supplied with a foil-shaped brazing material, and FIG. 6 is a front view showing an apparatus for supplying a foil-shaped brazing material. is there. In the figure, 1 is an island portion having a lead frame width X and length Y, 2 is a width W and a length L supplied to the island portion 1.
Brazing material, 3 is a brazing material supply device, 4 is a brazing material supply device 3
To the brazing material reel 4, 5 is a brazing material wound around the brazing material reel 4, 6 is a guide for conveying the brazing material 5 mounted to the supply device 3, 7 is a roller for supplying a certain amount of the brazing material 5, and 8 is a roller. An upper blade for cutting the brazing material 5, a lower blade 9 for cutting the brazing material 2 supplied by the roller 7 by a predetermined amount (length L in FIG. 1) in cooperation with the upper blade 8, and a brazing material 10 for cutting the brazing material. It is a pickup collet that is carried onto the island 1 of the lead frame and pressed against it.
【０００３】この従来のものでは、リードフレームのア
イランド部１に圧接されたろう材２によって図示しない
チップが固着され、ワイヤボンド封止工程を経て半導体
装置として組立られる。ここでろう材２の巾Ｗ、長さＬ
は溶融後のろう材厚み、アイランド１の寸法Ｘ，Ｙによ
り決定される。例えば、溶融後のろう材厚みが10μｍ、
ろう材２の厚みが0.1ｍｍの場合、Ｗ：Ｘ＝Ｙ：10Ｌと
なり、ＷはＸに対してかなり巾が狭くなる。従ってろう
材はアイランド部の中央に位置し、特にチップサイズが
大きくなった場合、角部までろう材が拡がりにくくな
る。その対策としては、ろう材をできるだけ薄くするこ
とが考えられるが、現在の技術では困難である。またア
イランド１上にろう材を多点付けする方法も考えられる
が、タクトの問題もあり、現在の装置では困難である。In this conventional device, a chip (not shown) is fixed by the brazing material 2 pressed against the island portion 1 of the lead frame, and a semiconductor device is assembled through a wire bond sealing step. Here, the width W and the length L of the brazing material 2
Is determined by the thickness of the brazing material after melting and the dimensions X and Y of the island 1. For example, the thickness of the brazing material after melting is 10 μm,
When the thickness of the brazing filler metal 2 is 0.1 mm, W: X = Y: 10L, and the width of W is considerably narrow with respect to X. Therefore, the brazing material is located at the center of the island portion, and especially when the chip size becomes large, it becomes difficult for the brazing material to spread to the corners. As a countermeasure, it is conceivable to make the brazing filler metal as thin as possible, but it is difficult with the current technology. A method of attaching multiple brazing materials on the island 1 is also conceivable, but it is difficult with the current device because of the problem of tact.
【０００４】[0004]
【発明が解決しようとする課題】従来の半導体装置は以
上のように構成されているので、アイランドの中央部に
箔状のろう材が供給され、チップの角部までろう材が拡
がりにくいという問題点があった。Since the conventional semiconductor device is configured as described above, the problem is that the foil-shaped brazing filler metal is supplied to the center of the island and the brazing filler metal does not easily spread to the corners of the chip. There was a point.
【０００５】この発明はこのような問題点を解消するた
めになされたもので、簡単にアイランド上の広範囲にわ
たって箔状のろう材が供給でき、ろう材の拡がりが良好
な半導体装置を得ることを目的とする。The present invention has been made in order to solve such problems, and it is possible to easily supply a foil-shaped brazing filler metal over a wide area on an island and obtain a semiconductor device in which the brazing filler metal spreads well. To aim.
【０００６】[0006]
【課題を解決するための手段】この発明に係る半導体装
置は、リードフレームのアイランド部のほぼ全域に分布
するように所定形状に打抜かれた箔状のろう材を配置す
ると共に、このろう材によって半導体チップをアイラン
ド部に取付けたものである。In a semiconductor device according to the present invention, a foil-shaped brazing material punched into a predetermined shape is arranged so as to be distributed over almost the entire island portion of the lead frame. A semiconductor chip is attached to the island.
【０００７】[0007]
【作用】この発明におけるろう材は、半導体チップの角
部まで所定の厚さで均一に拡がり、良好な接着状態が得
られる。The brazing filler metal according to the present invention uniformly spreads to a corner portion of the semiconductor chip with a predetermined thickness, and a good adhesive state can be obtained.
【０００８】[0008]
【実施例】以下この発明の一実施例を図１〜図４にもと
づいて説明する。２は巾Ｗ1、長さＬ1のろう材で３Ｗ1
＝Ｗ、３Ｌ1＝Ｌとなるよう構成されている。７１，７
２はフィードローラ、１１はピックアップコレット１０
の先端部に形成されバキューム用小孔１１１を有するダ
イ部、１２はろう材のガイド６の主面上に形成されダイ
部１１が嵌合するポンチ部、１３はろう材の巻き取りリ
ール、１４は打抜かれた後巻き取られたろう材である。
なおその他の構成は図５および図６に示す従来のものと
同様であるので説明を省略する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 2 is a brazing filler metal having a width W 1 and a length L 1 3 W 1
= W, 3L 1 = L. 71,7
2 is a feed roller, 11 is a pickup collet 10
A die portion having a vacuum small hole 111 formed at the tip end of the brazing material, 12 a punch portion formed on the main surface of the brazing material guide 6 and fitted with the die portion 11, 13 a brazing material winding reel, 14 Is a brazing material that has been punched and then wound up.
The other structure is the same as that of the conventional structure shown in FIGS. 5 and 6, and the description thereof is omitted.
【０００９】このように構成されたものでは、ろう材５
は、フィールドローラ７１によりガイド６上を搬送さ
れ、ポンチ部１２へ供給される。ろう材５はそこでダイ
部１１、ポンチ部１２によって、図１に示すろう材１２
のような形状に打抜かれる。打ち抜かれたろう材２は、
ポンチ部１１のバキューム用小孔１１１によって同時に
吸着され、リードフレームのアイランド部１上へ搬送さ
れて圧着される。その後打ち抜かれた残りのろう材１４
はフィードローラ７２によってガイド６上を搬送され、
巻き取りリール１３によって巻き取られる。このように
図５に示すろう材と同じ厚みで巾の広いものを用いて図
１に示すように複数個のろう材を形成したので、リード
フレームのアイランド部１上の広範囲にろう材を供給す
ることができると共に、現状の技術でも製造可能であ
り、タクトも損わない。In the case of such a structure, the brazing material 5
Is conveyed on the guide 6 by the field roller 71 and supplied to the punch section 12. The brazing material 5 is then applied to the brazing material 12 shown in FIG. 1 by the die portion 11 and the punch portion 12.
It is punched into a shape like. The brazed material 2 that has been punched out is
At the same time, it is adsorbed by the vacuum small holes 111 of the punch portion 11, and is conveyed onto the island portion 1 of the lead frame and pressure-bonded. Remaining brazing material 14 punched out thereafter
Is conveyed on the guide 6 by the feed roller 72,
It is taken up by the take-up reel 13. In this way, since a plurality of brazing filler metals are formed as shown in FIG. 1 by using the brazing filler metal having the same thickness and wide as the brazing filler metal shown in FIG. 5, the brazing filler metal is supplied to a wide area on the island portion 1 of the lead frame. In addition to being able to do so, it is possible to manufacture with the current technology, and the tact is not impaired.
【００１０】なお実施例においては、複数個の長方形の
ろう材をアイランド部に圧接するようにしたが、打抜い
た後の残りのろう材１４をアイランド部の寸法に合わせ
て切断してアイランド部に配置するようにしてもよい。In the embodiment, a plurality of rectangular brazing filler metals are pressed against the island portion. However, the remaining brazing filler metal 14 after punching is cut in accordance with the dimensions of the island portion to form the island portion. You may arrange | position to it.
【００１１】[0011]
【発明の効果】上記のようにこの発明による半導体装置
は、リードフレームのアイランド部のほぼ全域に分布す
るように配置されると共に、所定形状に打抜かれたろう
材によって半導体チップをアイランド部に取付けたの
で、ろう材が半導体チップの角部まで所定の厚さで均一
に拡がり、良好な接着状態が得られる。As described above, the semiconductor device according to the present invention is arranged so as to be distributed over almost the entire island portion of the lead frame, and the semiconductor chip is attached to the island portion by the brazing material punched into a predetermined shape. Therefore, the brazing material spreads evenly to the corners of the semiconductor chip with a predetermined thickness, and a good adhesion state can be obtained.
【図１】この発明の一実施例の要部を示す平面図であ
る。FIG. 1 is a plan view showing a main part of an embodiment of the present invention.
【図２】この発明の一実施例の製造方法を示す正面図で
ある。FIG. 2 is a front view showing a manufacturing method according to an embodiment of the present invention.
【図３】（ａ）（ｂ）（ｃ）は図２の要部拡大三面図で
ある。3 (a), (b), and (c) are enlarged trihedral views of the main part of FIG.
【図４】図２の要部拡大斜視図である。FIG. 4 is an enlarged perspective view of a main part of FIG.
【図５】従来のこの種半導体装置の要部を示す平面図で
ある。FIG. 5 is a plan view showing a main part of a conventional semiconductor device of this type.
【図６】従来の半導体装置の製造方法を示す正面図であ
る。FIG. 6 is a front view showing a conventional method for manufacturing a semiconductor device.
１ リードフレームのアイランド部 ２ ろう材 ３ ろう材供給装置 ４ ろう材リール ５ ろう材 ６ ガイド ７,71,72 フィードローラ ８ 上刃 ９ 下刃 10 ろう材ピックアップコレット 11 ダイ部 12 ポンチ部 13 巻き取りリール 1 Island part of lead frame 2 Brazing material 3 Brazing material supply device 4 Brazing material reel 5 Brazing material 6 Guide 7,71,72 Feed roller 8 Upper blade 9 Lower blade 10 Brazing material pickup collet 11 Die portion 12 Punch portion 13 Winding up reel
Claims (1)
域に分布するように配置されると共に、所定形状に打抜
かれた箔状のろう材、このろう材によってアイランド部
に取付けられた半導体チップを備えた半導体装置。Claim: What is claimed is: 1. A foil-shaped brazing material which is arranged so as to be distributed over substantially the entire area of the island portion of the lead frame and is punched into a predetermined shape, and is attached to the island portion by this brazing material. Device equipped with a semiconductor chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21633291A JPH0536740A (en) | 1991-08-01 | 1991-08-01 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21633291A JPH0536740A (en) | 1991-08-01 | 1991-08-01 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0536740A true JPH0536740A (en) | 1993-02-12 |
Family
ID=16686883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21633291A Pending JPH0536740A (en) | 1991-08-01 | 1991-08-01 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0536740A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008288334A (en) * | 2007-05-16 | 2008-11-27 | Yamaha Motor Co Ltd | Solder supplying apparatus, and surface mounting machine |
| JP2008288415A (en) * | 2007-05-18 | 2008-11-27 | Fuji Electric Device Technology Co Ltd | Semiconductor device and its manufacturing method |
-
1991
- 1991-08-01 JP JP21633291A patent/JPH0536740A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008288334A (en) * | 2007-05-16 | 2008-11-27 | Yamaha Motor Co Ltd | Solder supplying apparatus, and surface mounting machine |
| JP2008288415A (en) * | 2007-05-18 | 2008-11-27 | Fuji Electric Device Technology Co Ltd | Semiconductor device and its manufacturing method |
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