JP2000332032A - Method of sticking tape to member for assembling electronic component - Google Patents
Method of sticking tape to member for assembling electronic componentInfo
- Publication number
- JP2000332032A JP2000332032A JP11137040A JP13704099A JP2000332032A JP 2000332032 A JP2000332032 A JP 2000332032A JP 11137040 A JP11137040 A JP 11137040A JP 13704099 A JP13704099 A JP 13704099A JP 2000332032 A JP2000332032 A JP 2000332032A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- adhesive tape
- lead frame
- electronic component
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83194—Lateral distribution of the layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Die Bonding (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】半導体装置や電子部品組み立
て用部材に使用される貼付テープの切り取り方法に関
し、特にＬＯＣタイプリードフレーム作製時の貼り付け
テープの切り出し方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for cutting an adhesive tape used for a member for assembling a semiconductor device or an electronic component, and more particularly to a method for cutting an adhesive tape when a LOC type lead frame is manufactured.
【０００２】[0002]
【従来の技術】半導体装置や電子部品組み立て用部材の
一つにＬＯＣタイプのリードフレームがある。このリー
ドフレームはインナーリード部に貼付テープが設けられ
ており、この貼付テープ上に半導体素子を接着し、半導
体素子の電極とリードとをボンディングワイヤーで電気
的に接続することにより半導体装置の組み立てに供され
る。2. Description of the Related Art One of members for assembling semiconductor devices and electronic parts is a LOC type lead frame. In this lead frame, an adhesive tape is provided on the inner lead portion, a semiconductor element is adhered on the adhesive tape, and the electrodes of the semiconductor element and the leads are electrically connected by bonding wires to assemble the semiconductor device. Provided.
【０００３】ところで、このＬＯＣタイプのリードフレ
ームは、所望形状のリードフレームパターンをエッチン
グ法、あるいは打ち抜き金型を用いたプレス法により作
成し、リードフレームパターンのインナーリード部に、
主として金型パンチにより打ち抜かれたテープ貼付るこ
とにより作製されている。より具体的には、帯状のテー
プを所定位置に搬送し、金型パンチで所望形状に貼付用
テープを打ち抜き、抜き終わった残りのテープは巻き取
る。By the way, this LOC type lead frame is prepared by forming a lead frame pattern having a desired shape by an etching method or a pressing method using a punching die, and forming a lead frame pattern on an inner lead portion of the lead frame pattern.
It is mainly produced by sticking a tape punched by a mold punch. More specifically, the belt-shaped tape is conveyed to a predetermined position, the adhesive tape is punched into a desired shape by a mold punch, and the remaining tape that has been removed is wound up.
【０００４】巻き取られるテープの状態を示したのが図
１である。１，２，３，４が一つのリードフレームに貼
り付けられるために切り取られた部分の跡である。図１
より解るとおり搬送するためのテープ部、いわゆる残り
しろが多く、テープ有効利用率が小さい。その結果、コ
スト低減に寄与していない。とはいえ、テープを安定し
て抜き加工するためには残りしろは必要不可欠でもあ
る。FIG. 1 shows a state of a tape to be wound. 1, 2, 3, and 4 are traces of portions cut out to be attached to one lead frame. FIG.
As can be seen, the tape portion for transport, that is, so-called residual margin, is large, and the tape effective utilization rate is small. As a result, it does not contribute to cost reduction. However, the remaining margin is also indispensable for stable punching of the tape.
【０００５】[0005]
【発明が解決しようとする課題】本発明は上記状況に鑑
みてなされたものであり、その目的とするところは、よ
り良好なテープ有効利用率を実現しうる電子部品組み立
て用部材へのテープの貼付方法の提供である。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method of assembling a tape to an electronic component assembling member capable of realizing a better tape effective utilization rate. It is to provide a sticking method.
【０００６】[0006]
【課題を解決するための手段】上記課題を解決する本発
明は、リードフレーム等の電子部品組み立て用部材に貼
付テープを切り出し、貼付るに際して、まず、所望の貼
付部の外形と同じ形状に、かつその外形の一辺が、直前
に貼付用テープが切り取られた後のテープ端部と一致す
るするように位置調整した後、切り出し、これを貼付用
テープとして上記組み立て用部材に貼付、その後、貼付
たテープの不要部を抜き加工にて除去することを特徴と
するものである。SUMMARY OF THE INVENTION The present invention for solving the above-mentioned problems is to cut and attach an adhesive tape to an electronic component assembling member such as a lead frame, and to attach the tape to a member having the same outer shape as a desired attaching portion. And after adjusting the position so that one side of the outer shape coincides with the end of the tape immediately after the pasting tape was cut out, cut out and paste this as the pasting tape on the above-mentioned assembling member, and then paste An unnecessary portion of the tape is removed by punching.
【０００７】そして、好ましくはテープの切り出しに打
ち抜き金型を用い、該打ち抜き金型として、金型の下部
に電子部品組み立て用部材が通過するガイドが設けら
れ、打ち抜かれた貼付テープが該部材に貼付られるよう
に構成された打ち抜き金型を用いてテープを貼付、次い
でテープの不要部を抜き加工により除去するものであ
る。Preferably, a punching die is used for cutting out the tape, and a guide through which an electronic component assembling member passes is provided below the die as the punching die. The tape is attached using a punching die configured to be attached, and then unnecessary portions of the tape are removed by punching.
【０００８】[0008]
【発明の実施の形態】本発明はまず、外形に合わせた形
でスクラップレス法によりテープを打ち抜き、これをリ
ードフレーム等に貼付、次いで貼付たテープの不要部を
打ち抜き加工により除去するものである。BEST MODE FOR CARRYING OUT THE INVENTION The present invention firstly punches out a tape according to the outer shape by a scrapless method, affixes it to a lead frame or the like, and then removes unnecessary portions of the affixed tape by punching. .
【０００９】本発明に用いる貼付テープは、半導体装置
及び電子部品に使用される各種のテープであり、例え
ば、ポリイミドフィルムの両面に熱可塑型樹脂接着剤
層、熱硬化型樹脂接着剤層、常温硬化型樹脂接着剤層等
を設けたものである。The adhesive tape used in the present invention is various tapes used for semiconductor devices and electronic components. For example, a thermoplastic resin adhesive layer, a thermosetting resin adhesive layer, a normal temperature It is provided with a curable resin adhesive layer and the like.
【００１０】また、不要部分のカットに関しては要求用
途に合わせてテープのみの切断、または、例えばテープ
を貼り付けられたリードフレームインナーリード部の不
要先端部と合わせて切断加工ができる。カット形状とし
ては、所望のテープ貼付状態が達成できるように任意に
設定する。The cutting of the unnecessary portion can be performed by cutting only the tape or, for example, by cutting the unnecessary portion of the inner lead portion of the lead frame to which the tape is attached, according to the required application. The cut shape is arbitrarily set so that a desired tape-attached state can be achieved.
【００１１】以下、図を用いて本発明の方法を説明す
る。図２は本発明の工程を示したものであり、ａの様に
貼り付け部外周に合わせた貼付テープ１が切り出され、
任意のフレーム、例えばリードフレームインナーリード
部（図示せず）に貼り付けられる。その後、ｂに示した
ように十字型の切り取り金型５により中央不要部が切り
取られる。そして、ｃに示した所望の貼付テープパター
ンが完成される。The method of the present invention will be described below with reference to the drawings. FIG. 2 shows a process of the present invention, in which an adhesive tape 1 is cut out to fit the outer periphery of the adhesive portion as shown in a.
It is attached to an arbitrary frame, for example, a lead frame inner lead portion (not shown). Then, as shown in b, the central unnecessary portion is cut out by the cross-shaped cutting die 5. Then, the desired adhesive tape pattern shown in c is completed.
【００１２】[0012]
【実施例】次に実施例を用いて本発明をさらに説明す
る。 （実施例１）任意のフレームとしてリードフレーム（以
下「ＬＦ」と示す。）を用いて貼付テープを貼付た。Next, the present invention will be further described with reference to examples. (Example 1) An adhesive tape was attached using a lead frame (hereinafter referred to as "LF") as an arbitrary frame.
【００１３】用いた貼付テープ貼付金型はダイ下部にリ
ードフレームが通過するガイドが設けられており、ダイ
上部の貼付テープとリードフレームとは直交するように
送られるものであり、パンチが上方より下降し、貼付テ
ープを押し切り、押し切られた貼付テープがダイ下部の
リードフレームの所定位置に貼り付けられるようになっ
ている。また、貼り付けられたテープの不要部を抜く金
型は、貼付テープが貼り付けられたリードフレームの上
方よりパンチが降下し、不要部を切断すると共に吸引除
去する構造となっている。以下具体的に説明する。[0013] The adhesive tape attaching die used is provided with a guide through which the lead frame passes below the die, and the adhesive tape on the upper part of the die and the lead frame are fed orthogonally, and the punch is moved from above. It descends, pushes off the adhesive tape, and the pushed-off adhesive tape is attached to a predetermined position of the lead frame below the die. Further, the die for removing an unnecessary portion of the attached tape has a structure in which the punch descends from above the lead frame to which the attaching tape is attached, cuts the unnecessary portion, and sucks and removes the unnecessary portion. This will be specifically described below.
【００１４】３．２０ｍｍ幅にスリットされたポリイミ
ドの両面に熱硬化型接着剤層を設けた熱硬化型テープを
縦方向に金型内に送り込み（送り込み量9.30mm）カット
し、そのまま金型下側に配置されたＬＦの所定部に貼り
付けた。次にテープ間の不要部を金型で十字に貼り付け
テープ面方向から打ち抜き、不要部を排除した。図３に
貼り付けられた貼付テープ部の形状等を示した。3. A thermosetting tape having a thermosetting adhesive layer provided on both sides of a polyimide slit to a width of 20 mm is fed vertically into the mold (feeding amount: 9.30 mm), cut, and then directly cut under the mold. Affixed to a predetermined portion of the LF arranged on the side. Next, unnecessary portions between the tapes were pasted crosswise with a mold and punched out from the tape surface direction to remove unnecessary portions. FIG. 3 shows the shape and the like of the attached tape portion.
【００１５】本例での１リードフレーム当たりの使用テ
ープ量は テープ縦 ９．３mm／ピース 幅 ３．２mm／ピース 使用総面積 ３９．７６mm2／ピース となった。この結果、下記従来例と比較して解るよう
に、２２．８％の節約が可能となった。In this example, the amount of tape used per lead frame was 9.3 mm / piece in length, 3.2 mm / piece in width, and 39.76 mm2 / piece in total use area. As a result, as can be understood from the following conventional example, a saving of 22.8% was made possible.
【００１６】（従来例１）貼付テープの切断法を図１に
示した従来法とし、実施例１のリードフレームと同じ貼
付テープつきリードフレームを得た。(Conventional Example 1) A lead frame with an adhesive tape identical to the lead frame of Example 1 was obtained by using the conventional method shown in FIG.
【００１７】本例での１リードフレーム当たりの使用テ
ープ量は テープ縦 １０．３mm／ピース 幅 ５．０mm／ピース 使用総面積 ５１．５mm2／ピース となった。The amount of tape used per lead frame in this example was 10.3 mm in tape length / piece, 5.0 mm in width, and 5.0 mm / piece in total use area, and 51.5 mm 2 / piece.
【００１８】従来加工では、抜き加工を行うためには形
成されるべき形状の外周には常に不要部分が必要にな
る。そのため、従来では縦方向のパターンを形成するた
めにテープ外形長よりも長いテープを送り込んでいた。
また、幅方向のパターンを形成するため、テープ外形幅
よりも広いテープ幅が必要であった。しかし、実施例で
はテープ長さ、テープ幅方向の無駄が無くなるため、使
用テープ総面積が従来例と比較し減少した。In conventional processing, an unnecessary portion is always required on the outer periphery of a shape to be formed in order to perform punching. Therefore, conventionally, a tape longer than the tape outer length has been fed in order to form a vertical pattern.
Further, in order to form a pattern in the width direction, a tape width larger than the tape outer width was required. However, in the embodiment, since there is no waste in the tape length and tape width directions, the total area of the tape used is reduced as compared with the conventional example.
【００１９】（実施例２）１３．５ｍｍ幅にスリットさ
れた熱可塑型テープを横方向から送り込み（送り込み量
４．９０ｍｍ）、カットは先端部が鋭利に加工されてい
るスリッターにてカットを行った。カット後のテープを
吸着により保持したまま、テープ貼付工程へ搬送し、そ
こに配置されているＬＦへ貼り付けた。その後、貼付テ
ープの不要部をリード側から打ち抜き、不要部を排除し
て形成は完了した。図４に貼り付けられた貼付テープ部
の形状等を示した。(Example 2) A thermoplastic tape slit to a width of 13.5 mm is fed in from the lateral direction (feeding amount: 4.90 mm), and cut by a slitter whose tip is sharpened. Was. While holding the cut tape by suction, the tape was conveyed to a tape sticking step, where the tape was stuck to the LF disposed there. Thereafter, an unnecessary portion of the adhesive tape was punched out from the lead side, and the unnecessary portion was removed to complete the formation. FIG. 4 shows the shape and the like of the attached tape portion.
【００２０】本例での１リードフレーム当たりの使用テ
ープ量は テープ縦 ９．３mm／ピース 幅 ３．２mm／ピース 使用総面積 ３９．７６mm2／ピース となった。その結果、下記従来例との対比で解るとお
り、４２．５％の節約が可能となった。The amount of tape used per lead frame in this example was 9.3 mm / piece in length, 3.2 mm / piece in width, and 39.76 mm2 / piece in total use area. As a result, 42.5% savings have been made possible, as can be seen in comparison with the following conventional example.
【００２１】（従来例２）貼付テープの切り出し方法を
図１に示した従来例と同様とし、実施例２と同じリード
フレームの必要箇所に貼り付けた。(Conventional Example 2) The method of cutting out the adhesive tape was the same as that of the conventional example shown in FIG.
【００２２】本例での１リードフレーム当たりの使用テ
ープ量は テープ縦 １４．５mm／ピース 幅 ７．０mm／ピース 使用総面積 １０１．５mm2／ピース となった。The amount of tape used per lead frame in the present example was 14.5 mm tape / piece, width 7.0 mm / piece, total used area 101.5 mm 2 / piece.
【００２３】（実施例３）７．６０ｍｍ幅にスリットさ
れた熱可塑型テープを横方向から送り込み（送り込み量
３．３０ｍｍ）、カットは先端部が鋭利に加工されてい
るスリッターにてカットを行った。カット後の貼付テー
プは吸着により保持したまま、テープ貼付工程へ搬送
し、そこに配置されているＬＦへ貼り付けた。その後、
貼付テープの不要部（長方形）をリード側から打ち抜
き、不要部を排除して形成は完了した。図５に貼り付け
られた貼付テープ部の形状等を示した。Example 3 A thermoplastic tape slit to a width of 7.60 mm was fed in from the lateral direction (feeding amount: 3.30 mm), and cut by a slitter whose tip was sharpened. Was. The cut tape was conveyed to the tape sticking step while being held by suction, and was stuck to the LF arranged there. afterwards,
An unnecessary portion (rectangle) of the adhesive tape was punched out from the lead side, and the unnecessary portion was removed to complete the formation. FIG. 5 shows the shape and the like of the attached tape portion.
【００２４】本例での１リードフレーム当たりの使用テ
ープ量は テープ縦 ７．６mm／ピース 幅 ３．３mm／ピース 使用総面積 ２５．１mm2／ピース となった。その結果、下記従来例との対比で解るとお
り、３１．８％の節約が可能となった。The amount of tape used per lead frame in this example was 7.6 mm in length, 3.3 mm / piece in width, and 25.1 mm 2 / piece in total area of use. As a result, as can be understood from comparison with the following conventional example, a saving of 31.8% was made possible.
【００２５】（従来例３）貼付テープの切り出し方法を
図１に示した従来例と同様とし、実施例３と同じリード
フレームの必要箇所に貼り付けた。(Conventional Example 3) The method of cutting out the adhesive tape was the same as that of the conventional example shown in FIG.
【００２６】本例での１リードフレーム当たりの使用テ
ープ量は テープ縦 ９．０mm／ピース 幅 ４．５mm／ピース 使用総面積 ４０．５mm2／ピース となった。In this example, the amount of tape used per lead frame was 9.0 mm / piece, 4.5 mm / piece, width 4.5 mm / piece, and the total area used was 40.5 mm 2 / piece.
【００２７】（実施例４）実施例１と同様の金型を用い
て貼付テープを貼り付けた。Example 4 An adhesive tape was applied using the same mold as in Example 1.
【００２８】２０．０ｍｍ幅にスリットされた常温接着
型テープを縦方向に金型内に送り込み（送り込み量２
０．０ｍｍ）カットし、そのまま金型下側に配置された
スティフナーに貼り付けた。次に貼付テープの不要部
（正方形スリット）を金型においてテープ面方向から打
ち抜き、不要部を排除して形成を完了した。図６に貼り
付けられた貼付テープ部の形状等を示した。A room-temperature adhesive tape slit to a width of 20.0 mm is fed vertically into the mold (feeding amount 2
0.0 mm), and cut as it was and pasted on a stiffener arranged below the mold. Next, an unnecessary portion (square slit) of the adhesive tape was punched out from the tape surface direction in a mold, and the unnecessary portion was eliminated to complete the formation. FIG. 6 shows the shape and the like of the attached tape portion.
【００２９】本例での１リードフレーム当たりの使用テ
ープ量は テープ縦 ２０．０mm／ピース 幅 ２０．０mm／ピース 使用総面積 ４００．０mm2／ピース となった。その結果、下記従来例との対比で解るとお
り、３０．６％の節約が可能となった。The amount of tape used per lead frame in this example was 20.0 mm in tape length / piece, 20.0 mm in width, and 400.0 mm 2 / piece in total use area. As a result, as can be understood from comparison with the following conventional example, a saving of 30.6% was made possible.
【００３０】（従来例４）貼付テープの切り出し方法を
図１に示した従来例と同様とし、実施例４と同じスティ
フナーの必要箇所に貼り付けた。(Conventional Example 4) The method of cutting out the adhesive tape was the same as that of the conventional example shown in FIG. 1, and the same stiffener as in Example 4 was attached to the necessary portion.
【００３１】本例での１リードフレーム当たりの使用テ
ープ量は テープ縦 ２４．０mm／ピース 幅 ２４．０mm／ピース 使用総面積 ５７６．０mm2／ピース となった。In this example, the amount of tape used per lead frame was 24.0 mm / piece in length, 24.0 mm / piece in width, and 576.0 mm 2 / piece in total use area.
【００３２】[0032]
【発明の効果】本発明によれば、従来加工では不可欠と
されていた、抜き加工を行うためには形成されるべき形
状の外周の不要部分が不必要になる。このため、消費さ
れるテープ面積が低減され、テープコストの大幅削減が
可能である。また、貼付テープ形状が複雑化しても容易
に対応可能である。According to the present invention, unnecessary portions of the outer periphery of the shape to be formed, which have been indispensable in the conventional processing, are not required for performing the punching. For this reason, the tape area consumed is reduced, and the tape cost can be significantly reduced. Further, even if the shape of the attaching tape becomes complicated, it can be easily handled.
【図１】金型パンチで所望形状に貼付用テープが打ち抜
かれた後のテープの状態を示した図である。FIG. 1 is a view showing a state of a tape after a sticking tape is punched into a desired shape by a mold punch.
【図２】本発明の工程を示したものであり、ａは貼り付
け部外周に合わせた切り出された貼付テープであり、ｂ
は十字型の切り取り金型により中央不要部が切り取られ
る状態を示した図であり、ｃは完成された貼付テープパ
ターンである。FIG. 2 is a view showing a process of the present invention, wherein a is an adhesive tape cut out along the outer periphery of the adhesive portion, and b
Is a view showing a state where an unnecessary central portion is cut off by a cross-shaped cutting die, and c is a completed adhesive tape pattern.
【図３】実施例１で貼り付けられた貼付テープ部の形状
等を示した図である。FIG. 3 is a diagram showing a shape and the like of an attaching tape portion attached in Example 1.
【図４】実施例２で貼り付けられた貼付テープ部の形状
等を示した図である。FIG. 4 is a diagram showing a shape and the like of an attaching tape portion attached in Example 2.
【図５】実施例３で貼り付けられた貼付テープ部の形状
等を示した図である。FIG. 5 is a diagram showing a shape and the like of an attaching tape portion attached in Example 3.
【図６】実施例４で貼り付けられた貼付テープ部の形状
等を示した図である。FIG. 6 is a diagram showing a shape and the like of an attaching tape portion attached in Example 4.
１―――テープ ２―――切り取られた部分 ３―――張り付けられた部分 ４―――切り取り金型 1 ---- Tape 2 ---- Cut-off part 3 ---- Attached part 4--Cut-off die
Claims (2)
用部材に貼付テープを切り出し、貼付るに際して、ま
ず、所望の貼付部の外形と同じ形状に、かつその外形の
一辺が、直前に貼付用テープが切り取られた後のテープ
端部と一致するするように位置調整した後、切り出し、
これを貼付用テープとして上記組み立て用部材に貼付、
その後、貼付たテープの不要部を抜き加工にて除去する
ことを特徴とする電子部品組み立て用部材へのテープの
貼付方法。1. When cutting out and attaching an adhesive tape to an electronic component assembling member such as a lead frame, the adhesive tape has the same shape as that of a desired attaching portion, and one side of the outer shape has an adhesive tape immediately before. After adjusting the position to match the end of the tape after cutting, cut out,
This is attached to the assembly member as an attaching tape,
Thereafter, an unnecessary portion of the attached tape is removed by punching, and the tape is attached to an electronic component assembling member.
い、該打ち抜き金型として、金型の下部に電子部品組み
立て用部材が通過するガイドが設けられ、打ち抜かれた
貼付テープが該部材に貼付られるように構成された打ち
抜き金型を用いてテープを貼付、次いでテープの不要部
を抜き加工により除去することを特徴とするテープの貼
付方法。2. A punching die is used for cutting out a tape, and a guide through which an electronic component assembling member passes is provided below the die as the punching die, and a punched-out adhesive tape is attached to the member. A tape bonding method comprising: attaching a tape using a punching die configured as described above; and removing unnecessary portions of the tape by punching.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11137040A JP2000332032A (en) | 1999-05-18 | 1999-05-18 | Method of sticking tape to member for assembling electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11137040A JP2000332032A (en) | 1999-05-18 | 1999-05-18 | Method of sticking tape to member for assembling electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000332032A true JP2000332032A (en) | 2000-11-30 |
Family
ID=15189466
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11137040A Pending JP2000332032A (en) | 1999-05-18 | 1999-05-18 | Method of sticking tape to member for assembling electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000332032A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104985636A (en) * | 2015-07-27 | 2015-10-21 | 合肥京东方显示光源有限公司 | Mouth-shaped rubber preparation system |
-
1999
- 1999-05-18 JP JP11137040A patent/JP2000332032A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104985636A (en) * | 2015-07-27 | 2015-10-21 | 合肥京东方显示光源有限公司 | Mouth-shaped rubber preparation system |
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