JP2008260677A - 化学気相堆積炭化ケイ素物品 - Google Patents
化学気相堆積炭化ケイ素物品 Download PDFInfo
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- JP2008260677A JP2008260677A JP2008055287A JP2008055287A JP2008260677A JP 2008260677 A JP2008260677 A JP 2008260677A JP 2008055287 A JP2008055287 A JP 2008055287A JP 2008055287 A JP2008055287 A JP 2008055287A JP 2008260677 A JP2008260677 A JP 2008260677A
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- silicon carbide
- joint
- chemical vapor
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/003—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts
- C04B37/006—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts consisting of metals or metal salts
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
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Abstract
【解決手段】化学気相堆積炭化ケイ素物品および化学気相堆積炭化ケイ素物品を製造する方法が開示される。化学気相堆積炭化ケイ素物品は、焼結セラミック結合部116によって結合された複数の部品112、114で構成されている。結合部が強化され、物品の結合部における公差を維持する。物品は、半導体処理で使用され得る。
【選択図】図1
Description
3種類の結合部を調製し、結合部の強度を試験するための標準的な試験法を用いてそれらの強度を試験した。2種類の結合部は、各端板の側方受口に挿入するための対応する角型CVD−SiCロッドと共に円形CVD−SiC端板を含むものであった。第3の種類の結合部は、円形の焼結炭化ケイ素端板、および各端板の側方受口に挿入するための対応する角型焼結炭化ケイ素ロッドで構成されていた。CVD−SiC端板およびロッドは、従来のCVD−SiC法で製造され、ローム・アンド・ハース・カンパニーの、米国マサチューセッツ州ウォバーン所在の同社Advanced Materials事業部から入手した。焼結炭化ケイ素端板およびロッドは、焼結炭化ケイ素に含浸させたケイ素を用いて従来の焼結法によって製造された。
それぞれの部品を結合する結合部の種類で区別される3種類のウエハーボートをCVD−SiCで調製し、それらのTPを比較した。CVD−SiC部品は、化学気相堆積炉内で、適切な形状およびサイズを有する黒鉛マンドレル上に炭化ケイ素を堆積することにより調製した。使用した反応成分およびパラメータは、以下の表2に開示するとおりである。
112 ロッド
114 端板
116 焼結セラミック接合部
118 穴
120 穴
122 面
124 歯
126 溝
200 接合部
202 角型ロッド
204 面
206 受口
208 板
210 側面
300 接合部
302 角型ロッド
304 面
306 基部
308 凹面裂溝
309 平面
310 受口
312 端板
314 側面
316 面
318 想像線
400 接合部
402 角型ロッド
404 面
406 基部
408 くさび形裂溝
410 上面
412 下面
414 共通接合部
416 面
418 受口
420 端板
422 側面
424 面
500 接合部
502 円形ロッド
504 くさび形裂溝
506 上面
508 下面
510 側面
512 基部
514 端板
516 側面
518 面
520 焼結セラミック
600 接合部
602 フラットロッド
604 受口
606 基部
608 矩形裂溝
610 背板
612 焼結セラミック
700 リフタ
702 背板
704 器具設置穴
706 器具設置穴
708 ロッド
710 ロッド
712 歯
714 ギャップ
Claims (10)
- 焼結セラミックによって結合された少なくとも2つの化学気相堆積炭化ケイ素部品を含む物品。
- 少なくとも前記焼結セラミックが化学気相堆積炭化ケイ素で被覆されている請求項1記載の物品。
- 前記化学気相堆積炭化ケイ素被覆が0.5〜3mmの厚さである請求項2記載の物品。
- 両端において焼結セラミックによりそれぞれの端板に結合された複数のロッドを含み、該複数のロッドおよび該端板が化学気相堆積炭化ケイ素から成る物品。
- 少なくとも前記焼結セラミックが化学気相堆積炭化ケイ素で被覆されている請求項4記載の物品。
- 前記端板の相互に対する真位置が2mm以下である請求項4記載の物品。
- それぞれの端部の一方において、焼結セラミック結合部により背板の基部に結合された複数のロッドを含み、該複数のロッドの両端が、焼結セラミック結合部により支持レールに結合されており、該複数のロッド、該背板および該支持レールが化学気相堆積炭化ケイ素から成る物品。
- a)1以上のセラミックを含むペースト、ゾルまたはスラリーを提供し;
b)前記1以上のセラミックを含むペースト、ゾルまたはスラリーを2つの化学気相堆積炭化ケイ素部品に適用して前記部品を結合し;
c)前記ペースト、ゾルまたはスラリーを乾燥して、前記2つの化学気相堆積炭化ケイ素部品の周りに前記1以上のセラミックを含む乾燥した組成物を形成し;および
d)前記2つの化学気相堆積炭化ケイ素部品の周りの前記1以上のセラミックを含む乾燥した組成物を焼結して、焼結セラミック結合部を形成すること;
を含む方法。 - 前記1以上のセラミックが、炭化ケイ素、金属酸化物および原料鉱物材料を含む請求項8記載の方法。
- 少なくとも前記焼結セラミック結合部上に化学気相堆積炭化ケイ素の層を堆積する工程をさらに含む請求項8記載の方法。
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015044719A (ja) * | 2013-08-29 | 2015-03-12 | 株式会社豊田中央研究所 | 耐熱黒鉛部材およびその製造方法 |
JP2016155751A (ja) * | 2012-04-05 | 2016-09-01 | ゲネラル アトミクスGeneral Atomics | セラミック物品の間の高耐久性接合部並びにその製造及び使用方法 |
JP2017005112A (ja) * | 2015-06-10 | 2017-01-05 | クアーズテック株式会社 | ウエハボート及びその製造方法 |
JP2021515409A (ja) * | 2018-03-07 | 2021-06-17 | 東京エレクトロン株式会社 | 水平基板ボート |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2785666B1 (en) | 2011-11-29 | 2019-09-18 | Corning Incorporated | Method of treating joint in ceramic assembly |
US8753985B2 (en) | 2012-01-17 | 2014-06-17 | Applied Materials, Inc. | Molecular layer deposition of silicon carbide |
FR3074171B1 (fr) | 2017-11-29 | 2021-02-26 | Commissariat Energie Atomique | Materiau ceramique composite particulaire, piece le comprenant, et procede de preparation de cette piece. |
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US20230192564A1 (en) * | 2021-12-22 | 2023-06-22 | Rolls-Royce High Temperature Composites, Inc. | Joining material with silicon carbide particles and reactive additives |
CN116854477B (zh) * | 2023-07-04 | 2024-05-24 | 北京亦盛精密半导体有限公司 | 一种各向异性电阻率的碳化硅陶瓷及其制备方法、碳化硅薄片类制件 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH035381A (ja) * | 1989-05-31 | 1991-01-11 | Ibiden Co Ltd | セラミックス素材用の接着剤 |
JPH09293685A (ja) * | 1996-02-28 | 1997-11-11 | Asahi Glass Co Ltd | 縦型ウエハボート |
JPH1087376A (ja) * | 1996-05-03 | 1998-04-07 | Cvd Inc | 炭化ケイ素部品の結合方法 |
JP2000040667A (ja) * | 1998-07-21 | 2000-02-08 | Toshiba Ceramics Co Ltd | ウエハボート |
JP2000072576A (ja) * | 1998-08-31 | 2000-03-07 | Toshiba Ceramics Co Ltd | シリコン含浸炭化珪素部材の製造方法 |
JP2002343730A (ja) * | 2001-05-11 | 2002-11-29 | Shinetsu Quartz Prod Co Ltd | 縦型ウェーハ支持治具 |
WO2006023894A2 (en) * | 2004-08-24 | 2006-03-02 | Saint-Gobain Ceramics & Plastics, Inc. | Semiconductor processing components and semiconductor processing utilizing same |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT1117334B (it) | 1977-12-23 | 1986-02-17 | Fiat Spa | Procedimento per la sinterizazzione di nitruro di silicio reaction bonded |
FR2493304A1 (fr) * | 1980-10-30 | 1982-05-07 | Europ Propulsion | Procede d'assemblage de pieces refractaires |
US4961529A (en) * | 1987-12-24 | 1990-10-09 | Kernforschungsanlage Julich Gmbh | Method and components for bonding a silicon carbide molded part to another such part or to a metallic part |
US4925608A (en) * | 1988-09-27 | 1990-05-15 | Norton Company | Joining of SiC parts by polishing and hipping |
US4921554A (en) * | 1988-09-27 | 1990-05-01 | Norton Company | Joining of porous silicon carbide bodies |
JPH04300262A (ja) * | 1991-03-28 | 1992-10-23 | Shin Etsu Chem Co Ltd | 炭化珪素質治具 |
US5204294A (en) * | 1991-10-21 | 1993-04-20 | Hercules Incorporated | Silicon carbide ceramics containing a dispersed high metal content silicide phase |
US5374412A (en) * | 1992-07-31 | 1994-12-20 | Cvd, Inc. | Highly polishable, highly thermally conductive silicon carbide |
US5354580A (en) | 1993-06-08 | 1994-10-11 | Cvd Incorporated | Triangular deposition chamber for a vapor deposition system |
US5443649A (en) * | 1994-11-22 | 1995-08-22 | Sibley; Thomas | Silicon carbide carrier for wafer processing in vertical furnaces |
EP0781739B1 (en) * | 1995-12-26 | 1999-10-27 | Asahi Glass Company Ltd. | Jig for heat treatment and process for fabricating the jig |
TW325588B (en) * | 1996-02-28 | 1998-01-21 | Asahi Glass Co Ltd | Vertical wafer boat |
JPH09268067A (ja) * | 1996-03-29 | 1997-10-14 | Asahi Glass Co Ltd | 炭化ケイ素部材の製造方法 |
EP0826646B1 (en) * | 1996-08-27 | 2003-06-18 | Asahi Glass Company Ltd. | Highly corrosion-resistant silicon carbide product |
US6165301A (en) * | 1997-02-12 | 2000-12-26 | Battelle Memorial Institute | Method of joining ceramics |
US6277493B1 (en) * | 1997-02-12 | 2001-08-21 | Battelle Memorial Institute | Joined ceramic product |
JP2891978B1 (ja) * | 1998-02-17 | 1999-05-17 | 日本ピラー工業株式会社 | 炭化珪素質構造体 |
US6319421B1 (en) * | 1998-10-14 | 2001-11-20 | Samsung Electro-Mechanics Co., Ltd. | Ceramic oxide powder, method for producing the ceramic oxide powder, ceramic paste produced using the ceramic oxide powder, and method for producing the ceramic paste |
DE19856468C1 (de) * | 1998-11-30 | 2000-06-15 | Sico Jena Gmbh Quarzschmelze | Verfahren zur Herstellung einer Haltevorrichtung für Halbleiterscheiben |
JP2001048667A (ja) * | 1999-08-13 | 2001-02-20 | Asahi Glass Co Ltd | セラミックス部品の接合方法 |
DE60008830T2 (de) * | 1999-10-05 | 2005-01-13 | Rohm And Haas Co. | Verfahren zur Herstellung von keramischen Zusammensetzungen |
US6673198B1 (en) * | 1999-12-22 | 2004-01-06 | Lam Research Corporation | Semiconductor processing equipment having improved process drift control |
US6555031B2 (en) * | 2000-06-19 | 2003-04-29 | Corning Incorporated | Process for producing silicon carbide bodies |
US6863759B2 (en) * | 2001-01-24 | 2005-03-08 | M Cubed Technologies, Inc. | Methods for making composite bonded structures |
US6811040B2 (en) * | 2001-07-16 | 2004-11-02 | Rohm And Haas Company | Wafer holding apparatus |
-
2008
- 2008-02-25 TW TW097106418A patent/TWI361469B/zh active
- 2008-03-05 JP JP2008055287A patent/JP5459969B2/ja active Active
- 2008-03-06 IL IL217795A patent/IL217795A/en active IP Right Grant
- 2008-03-06 CN CN2008100817411A patent/CN101429048B/zh active Active
- 2008-03-06 IL IL189993A patent/IL189993A/en active IP Right Grant
- 2008-03-07 US US12/074,974 patent/US20080226868A1/en not_active Abandoned
- 2008-03-07 EP EP08152485A patent/EP1970358A1/en not_active Withdrawn
- 2008-03-10 KR KR1020080022226A patent/KR101540933B1/ko active IP Right Grant
-
2011
- 2011-02-24 US US13/033,880 patent/US20110274874A1/en not_active Abandoned
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH035381A (ja) * | 1989-05-31 | 1991-01-11 | Ibiden Co Ltd | セラミックス素材用の接着剤 |
JPH09293685A (ja) * | 1996-02-28 | 1997-11-11 | Asahi Glass Co Ltd | 縦型ウエハボート |
JPH1087376A (ja) * | 1996-05-03 | 1998-04-07 | Cvd Inc | 炭化ケイ素部品の結合方法 |
JP2000040667A (ja) * | 1998-07-21 | 2000-02-08 | Toshiba Ceramics Co Ltd | ウエハボート |
JP2000072576A (ja) * | 1998-08-31 | 2000-03-07 | Toshiba Ceramics Co Ltd | シリコン含浸炭化珪素部材の製造方法 |
JP2002343730A (ja) * | 2001-05-11 | 2002-11-29 | Shinetsu Quartz Prod Co Ltd | 縦型ウェーハ支持治具 |
WO2006023894A2 (en) * | 2004-08-24 | 2006-03-02 | Saint-Gobain Ceramics & Plastics, Inc. | Semiconductor processing components and semiconductor processing utilizing same |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2016155751A (ja) * | 2012-04-05 | 2016-09-01 | ゲネラル アトミクスGeneral Atomics | セラミック物品の間の高耐久性接合部並びにその製造及び使用方法 |
JP2015044719A (ja) * | 2013-08-29 | 2015-03-12 | 株式会社豊田中央研究所 | 耐熱黒鉛部材およびその製造方法 |
JP2017005112A (ja) * | 2015-06-10 | 2017-01-05 | クアーズテック株式会社 | ウエハボート及びその製造方法 |
JP2021515409A (ja) * | 2018-03-07 | 2021-06-17 | 東京エレクトロン株式会社 | 水平基板ボート |
JP7312952B2 (ja) | 2018-03-07 | 2023-07-24 | 東京エレクトロン株式会社 | 水平基板ボート |
Also Published As
Publication number | Publication date |
---|---|
KR101540933B1 (ko) | 2015-07-31 |
US20110274874A1 (en) | 2011-11-10 |
IL217795A0 (en) | 2012-03-29 |
CN101429048B (zh) | 2013-04-24 |
IL189993A (en) | 2013-11-28 |
EP1970358A1 (en) | 2008-09-17 |
CN101429048A (zh) | 2009-05-13 |
JP5459969B2 (ja) | 2014-04-02 |
US20080226868A1 (en) | 2008-09-18 |
KR20080082944A (ko) | 2008-09-12 |
IL217795A (en) | 2013-11-28 |
TW200937555A (en) | 2009-09-01 |
TWI361469B (en) | 2012-04-01 |
IL189993A0 (en) | 2008-12-29 |
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