JP2008253893A - Substrate processing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus capable of cleaning substrates using cleaning liquid containing microbubbles in a sheet-fed manner while keeping the uniformity of the processed quality without causing uneven cleaning. <P>SOLUTION: An air discharging pipe 40 for discharging gas remaining inside a discharge nozzle together with the cleaning liquid of a little flow rate, is communicatedly connected to an end of the discharge nozzle 10 discharging the cleaning liquid containing microbubbles from a plurality of discharge ports 12 toward a main face of the substrate W supported and conveyed on conveying rollers 14. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

  The present invention is a substrate processing for performing cleaning processing on various substrates such as glass substrates for liquid crystal display devices, glass substrates for plasma display (PDP), semiconductor wafers, magnetic disk substrates, optical disk substrates, and photomask glass substrates. Relates to the device.

  For example, in a semiconductor device manufacturing process, microbubbles are generated in a processing liquid by a microbubble generator installed in a processing liquid supply source, and a processing liquid containing microbubbles is supplied onto the substrate from the processing liquid supply source. A substrate processing apparatus that highly cleans a substrate has been proposed (see, for example, Patent Document 1). In addition, a microbubble generator is provided in the middle of the processing liquid supply path for supplying the processing liquid from the processing liquid supply source to the batch type or single substrate processing section, and microbubbles are generated in the processing liquid by the microbubble generating section. Thus, there has been proposed a substrate processing apparatus that efficiently removes particles present on the surface of a substrate by adsorbing them to microbubbles in the processing liquid (see, for example, Patent Document 2). Furthermore, attempts have been made to use nanobubbles having a diameter smaller than that of microbubbles and a diameter on the order of nanometers for processing such as cleaning (see, for example, Patent Document 3).

Here, as a method for generating microbubbles in the liquid, for example, when an aspirator is provided in the middle of the liquid flow path and the pressurized liquid flows through the liquid flow path, the pressurized liquid passes through the aspirator. A cavitation system that generates microbubbles by creating a swirl flow, in which gas is sucked by negative pressure during the swirl flow, and air is pulverized in the swirl flow, and a three-way branch pipe in the middle of the liquid flow path The gas supply pipe is connected to one port of the three-way branch pipe via the injection part, and the pressurized liquid is allowed to flow through the three-way branch pipe into the liquid flow path, and is added to the three-way branch pipe through the injection part. An injection method in which gas is mixed with the liquid flow to form a gas-liquid mixed flow containing microbubbles by injecting the pressurized gas. A gas-liquid agitation system that generates microbubbles by refining bubbles present in the liquid by arranging agitation members such as a squeeze and rotating the agitation member at high speed while supplying gas into the liquid, porous film, etc. In a state where the porous body is immersed in a liquid, a gas is introduced into the porous body, so that the gas is discharged as ultrafine bubbles from the surface of the porous body through the micropores. There are various methods such as a gas dispersion method for generating bubbles.
Japanese Patent Laying-Open No. 2005-93873 (page 5-7, FIG. 1) JP 2006-179664 A (page 5-12, FIG. 1, FIG. 7, FIG. 11 and FIG. 14) JP 2004-121962 A (page 4, page 8, FIG. 1)

  The above-mentioned microbubbles are ultrafine bubbles having a diameter of 70 μm to 50 μm or less, staying in the liquid for a relatively long time, gradually contracting and breaking, and accompanying the contraction, the internal pressure increases and energy is consumed when disappearing. To be released. In contrast, bubbles larger than 70 μm in diameter gradually expand in the liquid, burst in a short time, and disappear near the liquid surface. By the way, even if microbubbles are generated by any of the above-described methods, the state where only microbubbles are present in the liquid does not occur. That is, as shown in FIG. 6, the diameter and the number of fine bubbles generated in the liquid have a relationship indicating a substantially normal distribution state centered on a certain diameter. Therefore, the liquid includes bubbles with a diameter larger than 70 μm together with the microbubbles. For this reason, for example, a cleaning liquid containing microbubbles is supplied to a discharge nozzle having a tubular or cylindrical shape and a plurality of discharge ports formed in parallel along the longitudinal direction. When the substrate is cleaned by discharging a cleaning liquid containing microbubbles onto the surface of the substrate, bubbles with a diameter larger than 70 μm in the hatched area in the graph of FIG. Collect and collect as a lump of gas at the end in the discharge nozzle. The lump of gas collected at the end of the discharge nozzle is discharged at random from the discharge port located near the end of the discharge nozzle. As a result, there is a problem in that the cleaning liquid is not normally ejected on a part of the surface of the substrate, resulting in unevenness in cleaning and the uniformity of the processing quality.

  The present invention has been made in view of the above circumstances, and in the case where a substrate is subjected to a single wafer cleaning process using a cleaning liquid containing microbubbles or nanobubbles, the processing quality can be improved without causing cleaning unevenness. It is an object of the present invention to provide a substrate processing apparatus that can maintain uniformity.

  According to the first aspect of the present invention, there is provided a substrate supporting means for supporting a substrate and a substrate having a tubular or cylindrical shape and a plurality of discharge ports formed in parallel along the longitudinal direction and supported by the substrate supporting means. A substrate processing apparatus comprising: a discharge nozzle that discharges cleaning liquid from the plurality of discharge ports to a main surface of the substrate; and a cleaning liquid supply unit that supplies the cleaning liquid to the discharge nozzle. The substrate is supplied to the discharge nozzle by the cleaning liquid supply unit. Provided with bubble generating means for generating micro bubbles or nano bubbles (hereinafter, simply referred to as “micro bubbles”) in the cleaning liquid by mixing gas in the cleaning liquid to be discharged from a plurality of discharge ports of the discharge nozzle A cleaning liquid containing microbubbles is discharged to the main surface of the substrate, and the gas accumulated in the discharge nozzle is reduced to a small flow rate at the end of the discharge nozzle. Characterized in that the gas vent pipe for discharging the connected communicating with solution purification.

  According to a second aspect of the present invention, in the substrate processing apparatus of the first aspect, the substrate support means is a plurality of transport rollers that support and transport the substrate in the horizontal direction, and the discharge nozzles are in the substrate transport direction. It is arranged to cross each other.

  According to a third aspect of the present invention, in the substrate processing apparatus of the second aspect, the supply nozzle that supplies the cleaning liquid to the main surface of the substrate transported by the transport roller to the front side of the discharge nozzle in the substrate transport direction. Before discharging the cleaning liquid containing microbubbles from the plurality of discharge ports of the discharge nozzle to the main surface of the substrate. The cleaning liquid which is discharged from the gas and supplied to the supply nozzle through the gas vent pipe is supplied to the main surface of the substrate.

  According to a fourth aspect of the present invention, there is provided a substrate support means for supporting a substrate, a discharge nozzle for discharging a cleaning liquid from a discharge port to the main surface of the substrate supported by the substrate support means, and the discharge nozzle through a cleaning liquid supply pipe. A substrate processing apparatus comprising a cleaning liquid supply means for supplying a cleaning liquid, comprising: bubble generating means for generating a microbubble in the cleaning liquid by mixing a gas into the cleaning liquid supplied to the discharge nozzle by the cleaning liquid supply means. The cleaning liquid containing microbubbles is discharged from the discharge port of the discharge nozzle to the main surface of the substrate, and the gas accumulated in the cleaning liquid supply pipe is close to the communication part of the cleaning liquid supply pipe with the discharge nozzle. A gas vent pipe for discharging together with a small amount of cleaning liquid is connected in communication.

  According to a fifth aspect of the present invention, in the substrate processing apparatus according to the fourth aspect, the cleaning liquid supply pipe meanders in the vertical direction in the vertical plane in the vicinity of the communication portion with the discharge nozzle, and the upper side of the meandering pipe portion. The gas vent pipe is connected to the bent portion in communication.

In the substrate processing apparatus according to the first aspect of the present invention, the cleaning liquid containing microbubbles is supplied to the discharge nozzle, and bubbles larger than the microbubble gradually increase in the cleaning liquid and gather to collect gas at the end in the discharge nozzle. However, the accumulated gas is discharged together with a small flow rate of the cleaning liquid flowing out from the end in the discharge nozzle through the gas vent pipe. For this reason, a mass of gas is not released at once from the discharge port near the end of the discharge nozzle.
Therefore, when the substrate processing apparatus of the invention according to claim 1 is used, processing quality uniformity is maintained without causing cleaning unevenness when the substrate is cleaned in a single wafer process using a cleaning liquid containing microbubbles. can do.

  In the substrate processing apparatus according to the second aspect of the present invention, while the substrate is transported in the horizontal direction by the transport roller, the cleaning liquid containing the microbubbles is ejected from the plurality of ejection ports of the ejection nozzle to the main surface of the substrate, When performing the cleaning process, the uniformity of the processing quality can be maintained without causing uneven cleaning.

  In the substrate processing apparatus of the invention according to claim 3, the cleaning liquid discharged together with the gas from the end in the discharge nozzle is fed to the supply nozzle through the gas vent pipe, and the cleaning liquid is supplied from the supply nozzle to the main surface of the substrate. After that, the cleaning liquid containing microbubbles is discharged from the discharge nozzle onto the main surface of the substrate. In this case, since the microbubbles are contained in the cleaning liquid discharged from the end portion in the discharge nozzle, the cleaning effect of the substrate is further enhanced, and the utilization efficiency of the cleaning liquid and the microbubbles can be increased.

In the substrate processing apparatus according to the fourth aspect of the present invention, the cleaning liquid containing microbubbles is supplied to the discharge nozzle through the cleaning liquid supply pipe, and in the process, bubbles larger than the microbubble gradually become larger in the cleaning liquid and gather to collect the cleaning liquid supply pipe. Even if gas accumulates inside, the accumulated gas is discharged together with a small flow of cleaning liquid flowing out from the inside of the purified liquid supply pipe through the gas vent pipe in the vicinity of the communication portion between the cleaning liquid supply pipe and the discharge nozzle. For this reason, a gas lump is not discharged from the discharge port of the discharge nozzle.
Therefore, when the substrate processing apparatus of the invention according to claim 4 is used, when the substrate is cleaned in a single-wafer type using a cleaning liquid containing microbubbles, processing quality uniformity is maintained without causing cleaning unevenness. can do.

  In the substrate processing apparatus of the invention according to claim 5, the gas larger than the micro bubbles in the cleaning liquid supply pipe gradually gathers in the cleaning liquid, and the collected gas accumulates in the upper bent portion of the serpentine pipe portion of the cleaning liquid supply pipe. It is reliably discharged together with a small flow rate of cleaning liquid flowing out from the upper bent portion of the meandering pipe portion through the gas vent pipe.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the best embodiment of the present invention will be described with reference to the drawings.
FIG. 1 shows an example of an embodiment of the present invention, and is a view showing a schematic configuration of a main part of a substrate processing apparatus together with a cleaning liquid supply system.

  The substrate processing apparatus includes a discharge nozzle 10 that discharges a cleaning liquid onto the main surface of the substrate W, and a cleaning liquid supply system that supplies a cleaning liquid containing microbubbles to the discharge nozzle 10. The discharge nozzle 10 has a tubular shape or a cylindrical shape, and is disposed horizontally so as to be orthogonal to the transport direction of the substrate W (direction perpendicular to the paper surface) as shown in FIG. . A plurality of discharge ports 12 are formed in parallel in the discharge nozzle 10 along the longitudinal direction. The substrate W is supported by a plurality of transport rollers 14 arranged in parallel at intervals in the transport direction, and is transported in the horizontal direction by the transport rollers 14. The discharge nozzle 10 may be disposed obliquely in a plan view with respect to a direction orthogonal to the substrate transport direction, or may be disposed inclined with respect to a horizontal plane. Further, the transport roller 14 may be disposed so as to be inclined with respect to the horizontal plane so that the substrate W is transported in the horizontal direction while being tilted.

  The discharge nozzle 10 is connected to a cleaning liquid supply pipe 16 that is connected to a supply source of a chemical liquid such as a cleaning liquid such as pure water or ammonia water, SC1 liquid, neutral detergent liquid, and alkaline detergent liquid. A high pressure pump 18, a filter 20, and a flow control valve 22 are inserted in the cleaning liquid supply pipe 16 in order from the upstream side, and a three-way branch pipe 24 is inserted downstream of the flow control valve 22. The flow rate control valve 22 adjusts the supply flow rate of the cleaning liquid by adjusting the valve opening degree. An inlet port and an outlet port of the three-way branch pipe 24 are communicated with the cleaning liquid supply pipe 16, and an air supply pipe 28 is connected to the remaining one port via an injection unit 26. Although details are not shown, the tip of the injection part 26 in which the injection hole is formed is inserted into the three-way branch pipe 24. The air supply pipe 28 is connected to the air supply source through a flow path. A pressure increasing valve 30, a pressure increasing air tank 32, a flow control valve 34, and a flow meter 36 are inserted in the air supply pipe 28 in this order from the upstream side. The pressure increasing valve 30 pressurizes air supplied from an air supply source, and the pressurized air is filled in the pressure increasing air tank 32. The flow control valve 34 adjusts the air supply flow rate to the injection part 26 of the three-way branch pipe 24 by adjusting the valve opening degree. The high pressure pump 18, the pressure increasing valve 30, the flow control valves 22 and 34, and the flow meter 36 are electrically connected to the control unit 38. Then, the high pressure pump 18 and the pressure increasing valve 30 are respectively controlled by the control signal output from the control unit 38, and the supply pressure of the cleaning liquid and the supply pressure of air are adjusted. Further, a detection signal from the flow meter 36 is input to the control unit 38, and the flow rate control valves 22 and 34 are respectively controlled by a control signal output from the control unit 38 based on the detection signal to supply the cleaning liquid. The flow rate and the air supply flow rate are each adjusted as desired.

As noted above, pressure, for example, with ^8kg / cm ^{2 ~9kg} / cm 2 of pressure in a pressurized cleaning liquid is flowed through the three-way branch pipe 24 the cleaning liquid supply pipe 16, the three-way branch pipe 24 air pressurized through injecting unit 26, for example by air pressurized to a pressure of the cleaning liquid delivery pressure slightly higher than 9kg ^/ cm ² ~10kg / cm 2 is injected, in the cleaning liquid in the liquid flow Are mixed to generate microbubbles in the cleaning liquid. Then, the cleaning liquid containing the microbubbles is supplied to the discharge nozzle 10 through the cleaning liquid supply pipe 16.

  An air vent pipe 40 is connected to the discharge nozzle 10 at its end. A flow rate adjusting valve 42 is inserted into the air vent pipe 40, and by adjusting the opening degree of the flow rate adjusting valve 42, it is possible to always discharge a small flow rate of cleaning liquid from the end in the discharge nozzle 10. It is configured.

  In the substrate processing apparatus having the above-described configuration, microbubbles are generated in the cleaning liquid while the cleaning liquid is supplied from the cleaning liquid supply source through the cleaning liquid supply pipe 16 through the three-way branch pipe 24 to the discharge nozzle 10. A cleaning liquid containing microbubbles is supplied to the discharge nozzle 10, and the cleaning liquid containing microbubbles is discharged from the plurality of discharge ports 12 of the discharge nozzle 10 onto the main surface of the substrate W that is transported in the horizontal direction by the transport rollers. Is done. At this time, the particles released from the substrate surface are peeled off by the energy released when the microbubbles in the cleaning liquid are destroyed and disappeared (collapsed) on the main surface of the substrate W, and the particles are discharged from the substrate W by the discharge pressure of the cleaning liquid. It is removed and flows out together with the cleaning liquid. As described above, the microbubbles are contained in the cleaning liquid discharged to the main surface of the substrate W, whereby the substrate W is highly cleaned.

  On the other hand, when microbubbles are generated in the cleaning liquid, the cleaning liquid includes bubbles larger than the microbubbles together with the microbubbles. Bubbles larger than the micro bubbles gradually expand in the cleaning liquid and gather near each other after the cleaning liquid flows into the discharge nozzle 10 or while being supplied to the discharge nozzle 10 through the cleaning liquid supply pipe 16. There is a concern that gas accumulates at the end of the. Thus, even if gas accumulates at the end in the discharge nozzle 10, the accumulated gas is discharged together with a small flow of cleaning liquid that always flows out from the end in the discharge nozzle 10 through the air vent pipe 40. It becomes. For this reason, since a mass of gas is not released all at once from the discharge port 12 near the end of the discharge nozzle 10, it is possible to maintain the uniformity of the processing quality without causing uneven cleaning.

  FIG. 2 is a schematic plan view of a substrate processing apparatus showing a modification of the embodiment of the present invention. In this processing apparatus, the cleaning liquid is applied to the main surface of the substrate W transported by a transport roller (not shown in FIG. 2) on the front side of the discharge nozzle 10 in the transport direction of the substrate W (the direction indicated by the white arrow). A supply nozzle 44 to be supplied is provided, and an air vent pipe 46 that is connected to the end of the discharge nozzle 10 and is inserted with a flow rate adjusting valve 48 is connected to the supply nozzle 44 in a flow path. In the processing apparatus having such a configuration, a small flow rate of the cleaning liquid discharged from the discharge nozzle 10 is supplied to the supply nozzle 44 through the air vent pipe 46. The cleaning liquid is supplied from the supply nozzle 44 to the main surface of the substrate W before the cleaning liquid containing microbubbles is discharged from the discharge nozzle 10 to the main surface of the substrate W. At this time, since the microbubbles are contained in the small flow rate of the cleaning liquid discharged from the end portion in the discharge nozzle 10, it is possible to increase the utilization efficiency of the cleaning liquid and the microbubbles. Further, after the cleaning liquid containing microbubbles is supplied from the supply nozzle 44 to the main surface of the substrate W, the microbubbles are discharged from the discharge nozzle 10 to the main surface of the substrate W which has been transported to the position where the discharge nozzle 10 is disposed. Since the cleaning liquid containing is discharged, the cleaning effect of the substrate W can be further enhanced.

  Next, FIG. 3 and FIG. 4 show another embodiment of the present invention, FIG. 3 is a front view showing a schematic configuration of the main part of the substrate processing apparatus, and FIG. It is a top view of a nozzle. This processing apparatus is a processing apparatus that cleans a substrate by discharging a cleaning liquid onto the substrate while rotating the substrate about a vertical axis.

  This processing apparatus includes a rotation base member 50 that fixes the substrate W by a plurality of chuck pins 52 and holds the substrate W in a horizontal posture, a rotation support shaft 54 fixed to the center of the lower surface of the rotation base member 50, and a rotation support shaft 54. Is rotated around a vertical axis to rotate the rotation base member 50 and the substrate W in a horizontal plane. A discharge nozzle 58 that discharges the cleaning liquid to the main surface of the substrate W is disposed immediately above the substrate W held by the rotation base member 50. The discharge nozzle 58 has a tubular or cylindrical shape, and a plurality of discharge ports 60 are formed along the longitudinal direction thereof. Although not shown, the cleaning liquid supply system similar to that of the processing apparatus shown in FIG. 1 is provided, and the cleaning liquid supply pipe 62 is connected to the discharge nozzle 58 so that it passes through the cleaning liquid supply pipe 62. A cleaning liquid containing bubbles is supplied to the discharge nozzle 58. Further, an air vent pipe 64 is connected to the end of the discharge nozzle 58, and a flow rate adjusting valve 66 is inserted into the air vent pipe 64. Then, by adjusting the opening degree of the flow rate adjusting valve 66, a small flow rate of the cleaning liquid can be always discharged from the end portion in the discharge nozzle 58 through the air vent pipe 64. The discharge nozzle 58 and the air vent pipe 64 are integrally supported so as to be rotatable in a horizontal plane, and the cleaning liquid can be discharged onto the entire surface of the substrate W held by the rotary base member 50. .

  In the substrate processing apparatus shown in FIG. 3 and FIG. 4, while rotating the substrate W at a low speed and reciprocatingly rotating the discharge nozzle 58 and the air vent pipe 64, the microbubbles pass through the cleaning liquid supply pipe 62 to the discharge nozzle 58. The substrate W can be highly cleaned by supplying the cleaning liquid containing, and discharging the cleaning liquid containing microbubbles from the plurality of discharge ports 60 of the discharge nozzle 58 to the substrate W. On the other hand, even if bubbles larger than the microbubbles contained in the cleaning liquid together with the microbubbles gradually expand in the cleaning liquid and gather near each other, gas may accumulate at the end in the discharge nozzle 58. Then, the liquid is discharged together with a small flow rate of the cleaning liquid that always flows out from the end in the discharge nozzle 58 through the air vent pipe 64. For this reason, since a mass of gas is not released all at once from the discharge port 60 in the vicinity of the end of the discharge nozzle 58, the uniformity of the processing quality can be maintained without causing uneven cleaning.

  Next, FIG. 5 is a front view showing a schematic configuration of a main part of the substrate processing apparatus, showing an embodiment of the invention according to a configuration different from the above.

  In this processing apparatus, the spin chuck 68 that holds the substrate W in a horizontal posture, the rotation support shaft 70 fixed to the spin chuck 68, and the rotation support shaft 70 are rotated around the vertical axis and are held by the spin chuck 68. A motor (not shown) for rotating the substrate W in a horizontal plane is provided. Immediately above the substrate W held by the spin chuck 68, a discharge nozzle 72 that discharges the cleaning liquid from the discharge port at the lower end to the main surface of the substrate W is disposed. Although not shown, the cleaning liquid supply system similar to the processing apparatus shown in FIG. 1 is provided, and the cleaning liquid supply pipe 74 is connected to the discharge nozzle 72 and passes through the cleaning liquid supply pipe 74. A cleaning liquid containing bubbles is supplied to the discharge nozzle 72. The cleaning liquid supply pipe 74 is formed so as to meander in the vertical direction in the vertical plane in the vicinity of the communicating portion with the discharge nozzle 72, and an air vent pipe 78 is connected to the upper bent portion 76 of the meandering pipe portion. A flow rate adjusting valve 80 is inserted in the air vent pipe 78. Then, by adjusting the opening degree of the flow rate adjusting valve 80, a small flow rate of the cleaning liquid can be always discharged from the upper bent portion 76 of the cleaning liquid supply pipe 74 through the air vent pipe 78.

  In the substrate processing apparatus shown in FIG. 5, while rotating the substrate W, the cleaning liquid containing microbubbles is supplied to the discharge nozzle 72 through the cleaning liquid supply pipe 74, and the microbubbles are included from the discharge port of the discharge nozzle 72. By discharging the cleaning liquid onto the substrate W, the substrate W can be highly cleaned. On the other hand, even when bubbles larger than the microbubble gradually gather and gather in the cleaning liquid in the process in which the cleaning liquid containing microbubbles is supplied to the discharge nozzle 72 through the cleaning liquid supply pipe 74, the gas remains in the cleaning liquid supply pipe 74. It accumulates in the upper bent portion 76 of the meandering pipe portion, and is discharged together with a small flow of cleaning liquid that always flows out from the upper bent portion 76 through the air vent pipe 78. For this reason, since a gas lump is not discharged from the discharge port of the discharge nozzle 72, the uniformity of the processing quality can be maintained without causing uneven cleaning.

  Although not shown, in order to enhance the cleaning effect of the substrate W, a megasonic that imparts ultrasonic vibration to the cleaning liquid containing the microbubbles discharged from the discharge nozzle 72 onto the substrate W is also provided. A two-fluid nozzle that ejects a gas-liquid mixed fluid to the substrate W after discharging the cleaning liquid containing microbubbles onto the substrate W from the nozzle 72 may be provided.

  In each of the above-described embodiments, air is mixed in the cleaning liquid supplied to the discharge nozzle to generate microbubbles in the cleaning liquid, but an inert gas such as nitrogen gas is used as the cleaning liquid instead of air. Microbubbles may be generated by mixing them inside. In addition, the present invention is not limited to the substrate processing apparatus having the configuration shown in each embodiment, but widely used in apparatuses for discharging a cleaning liquid containing microbubbles from the discharge nozzle to the main surface of the substrate in a single sheet. Applicable. Furthermore, the method of generating microbubbles is not limited to that shown in the above embodiment, and various types can be adopted, and the configuration of the discharge nozzle is not particularly limited.

It is a figure which shows one example of embodiment of this invention and shows schematic structure of the principal part of a substrate processing apparatus with a washing | cleaning-liquid supply system. It is a schematic plan view of the substrate processing apparatus which shows the modification of embodiment of this invention. It is a front view which shows another embodiment of this invention and shows schematic structure of the principal part of a substrate processing apparatus. It is a top view of the discharge nozzle which is a component of the substrate processing apparatus shown in FIG. FIG. 5 is a front view showing a schematic configuration of a main part of the substrate processing apparatus according to an embodiment of the invention related to a configuration different from that shown in FIGS. 1 to 4. It is a figure for demonstrating the relationship between the diameter and the number of the microbubbles which generate | occur | produce in a liquid when generating a microbubble in a liquid.

Explanation of symbols

10, 58, 72 Discharge nozzle 12, 60 Discharge nozzle discharge port 14 Transport roller 16, 62, 74 Cleaning liquid supply pipe 18 High-pressure pump 22, 34 Flow control valve 24 Three-way branch pipe 26 Inject part 28 Air supply pipe 30 Pressure booster valve 32 Pressure increase air tank 36 Flow meter 38 Control unit 40, 46, 64, 78 Air vent piping 42, 48, 66, 80 Flow rate adjusting valve 44 Supply nozzle 50 Rotating base member 52 Chuck pin 54, 70 Rotating support shaft 56 Motor 68 Spin chuck 76 Upper bent portion of serpentine pipe portion of cleaning liquid supply pipe W substrate

Claims (5)

Substrate support means for supporting the substrate;
A discharge that discharges the cleaning liquid from the plurality of discharge ports to the main surface of the substrate that is formed in a tube shape or a tube shape and has a plurality of discharge ports arranged in parallel along the longitudinal direction. A nozzle,
Cleaning liquid supply means for supplying a cleaning liquid to the discharge nozzle;
In a substrate processing apparatus comprising:
A bubble generating means for generating microbubbles or nanobubbles in the cleaning liquid by mixing gas in the cleaning liquid supplied to the discharge nozzle by the cleaning liquid supply means, and microbubbles from a plurality of discharge ports of the discharge nozzle or The cleaning liquid containing nanobubbles is discharged to the main surface of the substrate,
A substrate processing apparatus, wherein a gas vent pipe for exhausting the gas accumulated in the discharge nozzle together with a small flow rate of cleaning liquid is connected to the end of the discharge nozzle. The substrate processing apparatus according to claim 1,
The substrate support means is a plurality of transport rollers that support the substrate and transport it horizontally.
A substrate processing apparatus, wherein the discharge nozzle is disposed so as to intersect a substrate transport direction. The substrate processing apparatus according to claim 2,
A supply nozzle for supplying a cleaning liquid to the main surface of the substrate transported by the transport roller is disposed on the front side in the substrate transport direction of the discharge nozzle, and the gas vent pipe is connected to the supply nozzle by a flow path. Before the cleaning liquid containing microbubbles or nanobubbles is discharged from the plurality of discharge ports of the discharge nozzle onto the main surface of the substrate, the liquid is discharged from the discharge nozzle and supplied to the supply nozzle through the gas vent pipe. A substrate processing apparatus characterized in that a cleaning liquid is supplied to the main surface of the substrate. Substrate support means for supporting the substrate;
A discharge nozzle for discharging the cleaning liquid from the discharge port to the main surface of the substrate supported by the substrate support means;
Cleaning liquid supply means for supplying a cleaning liquid to the discharge nozzle through a cleaning liquid supply pipe;
In a substrate processing apparatus comprising:
A bubble generating means for generating microbubbles or nanobubbles in the cleaning liquid by mixing a gas into the cleaning liquid supplied to the discharge nozzle by the cleaning liquid supply means, including microbubbles or nanobubbles from the discharge port of the discharge nozzle; So that the cleaning liquid is discharged to the main surface of the substrate,
A substrate processing apparatus, wherein a gas venting pipe for discharging a gas accumulated in the cleaning liquid supply pipe together with a small flow rate of the cleaning liquid is connected in communication with the cleaning liquid supply pipe near the discharge nozzle. The substrate processing apparatus according to claim 4,
The substrate processing apparatus, wherein the cleaning liquid supply pipe is meandered in the vertical direction in the vertical plane in the vicinity of the communication portion with the discharge nozzle, and the gas vent pipe is connected to the upper bent portion of the meander pipe portion. .

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