JP2008251922A - ダイオード - Google Patents
ダイオード Download PDFInfo
- Publication number
- JP2008251922A JP2008251922A JP2007092664A JP2007092664A JP2008251922A JP 2008251922 A JP2008251922 A JP 2008251922A JP 2007092664 A JP2007092664 A JP 2007092664A JP 2007092664 A JP2007092664 A JP 2007092664A JP 2008251922 A JP2008251922 A JP 2008251922A
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- JP
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- type semiconductor
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- Prior art date
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- 239000004065 semiconductor Substances 0.000 claims abstract description 150
- 229910052751 metal Inorganic materials 0.000 claims abstract description 35
- 239000002184 metal Substances 0.000 claims abstract description 35
- 239000000758 substrate Substances 0.000 claims description 28
- 239000000969 carrier Substances 0.000 abstract description 18
- 230000004888 barrier function Effects 0.000 abstract description 7
- 239000012535 impurity Substances 0.000 description 34
- 238000011084 recovery Methods 0.000 description 14
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 11
- 229920005591 polysilicon Polymers 0.000 description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
- 238000005215 recombination Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/872—Schottky diodes
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
【解決手段】 n−型半導体層に互いに分離した島状のp型半導体領域を複数設ける。n−型半導体層上を被覆する絶縁膜に第1開口部および第2開口部を設けて金属層を設ける。動作領域の最外周のp型半導体領域と隣接するn−型半導体層は第1開口部を介して、また内側のp型半導体領域は第2開口部を介して、金属層とコンタクトする。全てのp型半導体領域は金属層とオーミック接合を形成し、最外周のn−型半導体層のみ金属層とショットキー接合を形成する。ショットキー接合面積が小さくなるのでリーク電流を低減でき、また分離したp型半導体領域と、動作領域端部のショットキー接合領域によって、逆回復時間trrを向上させることができる。
【選択図】 図1
Description
本発明の実施の形態を図1から図4を用いて詳細に説明する。
2 n−型半導体層
3、3b p型半導体領域
3a 最外p型半導体領域
4 ガードリング
5 酸化膜
7 金属層(アノード電極)
8 蒸着金属層(カソード電極)
10 トレンチ
50 空乏層
100 ダイオード
111 n+型シリコン半導体基板
112 n−型半導体層
115 絶縁膜
117 ガードリング
118 アノード電極
119 カソード電極
113 p+型不純物領域
110 pn接合ダイオード
120 ショットキーバリアダイオード(JBS)
121 n+型シリコン半導体基板
122 n−型半導体層
123 p+型不純物領域
125 絶縁膜
126 金属層
127 ガードリング
128 アノード電極
129 カソード電極
SB、SB’ 半導体基板
OR 動作領域
OP1 第1開口部
OP2 第2開口部
OP’ 開口部
Claims (5)
- 一導電型半導体基板と、
該半導体基板上に設けられた一導電型半導体層と、
該一導電型半導体層に互いに離間して設けられた複数の逆導電型半導体領域と、
該一導電型半導体層の一主面に設けられた絶縁膜と、
該絶縁膜に設けられ一の前記逆導電型半導体領域および該一の逆導電型半導体領域に接する前記一導電型半導体層が露出する第1開口部と、
前記絶縁膜に設けられ他の前記逆導電型半導体領域が露出する第2開口部と、
前記絶縁膜上に設けられ、前記第1開口部および第2開口部を介して前記逆導電型半導体領域とコンタクトする金属層と、
を具備することを特徴とするダイオード。 - 前記第1開口部は、前記第2開口部の周囲に設けられることを特徴とする請求項1に記載のダイオード。
- 前記金属層は、前記逆導電型半導体領域とオーミック接合することを特徴とする請求項1に記載のダイオード。
- 前記金属層は、前記第1開口部から露出した前記一導電型半導体層とショットキー接合することを特徴とする請求項1に記載のダイオード。
- 隣り合う前記逆導電型半導体領域間の前記半導体層の表面は前記絶縁膜により被覆されることを特徴とする請求項1に記載のダイオード。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007092664A JP5090043B2 (ja) | 2007-03-30 | 2007-03-30 | ダイオード |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007092664A JP5090043B2 (ja) | 2007-03-30 | 2007-03-30 | ダイオード |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008251922A true JP2008251922A (ja) | 2008-10-16 |
JP5090043B2 JP5090043B2 (ja) | 2012-12-05 |
Family
ID=39976502
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007092664A Active JP5090043B2 (ja) | 2007-03-30 | 2007-03-30 | ダイオード |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5090043B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012128934A1 (en) | 2011-03-18 | 2012-09-27 | Cree, Inc. | Semiconductor devices including schottky diodes having overlapping doped regions and methods of fabricating same |
CN113871467A (zh) * | 2021-09-28 | 2021-12-31 | 吉林华微电子股份有限公司 | 一种肖特基二极管及其制造方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59110164A (ja) * | 1982-12-03 | 1984-06-26 | エヌ・ベ−・フイリップス・フル−イランペンファブリケン | 半導体装置 |
JPH02113577A (ja) * | 1988-10-21 | 1990-04-25 | Mitsubishi Electric Corp | 半導体装置 |
JPH0786621A (ja) * | 1993-09-09 | 1995-03-31 | Sansha Electric Mfg Co Ltd | 複合ダイオード |
JPH07147418A (ja) * | 1993-11-25 | 1995-06-06 | Fuji Electric Co Ltd | ダイオード |
JP2002237605A (ja) * | 2001-02-08 | 2002-08-23 | Sanken Electric Co Ltd | 半導体素子 |
JP2002319685A (ja) * | 2001-04-20 | 2002-10-31 | Fuji Electric Co Ltd | 半導体装置およびその製造方法 |
JP2003069045A (ja) * | 2001-08-22 | 2003-03-07 | Mitsubishi Electric Corp | 半導体装置 |
-
2007
- 2007-03-30 JP JP2007092664A patent/JP5090043B2/ja active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59110164A (ja) * | 1982-12-03 | 1984-06-26 | エヌ・ベ−・フイリップス・フル−イランペンファブリケン | 半導体装置 |
JPH02113577A (ja) * | 1988-10-21 | 1990-04-25 | Mitsubishi Electric Corp | 半導体装置 |
JPH0786621A (ja) * | 1993-09-09 | 1995-03-31 | Sansha Electric Mfg Co Ltd | 複合ダイオード |
JPH07147418A (ja) * | 1993-11-25 | 1995-06-06 | Fuji Electric Co Ltd | ダイオード |
JP2002237605A (ja) * | 2001-02-08 | 2002-08-23 | Sanken Electric Co Ltd | 半導体素子 |
JP2002319685A (ja) * | 2001-04-20 | 2002-10-31 | Fuji Electric Co Ltd | 半導体装置およびその製造方法 |
JP2003069045A (ja) * | 2001-08-22 | 2003-03-07 | Mitsubishi Electric Corp | 半導体装置 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012128934A1 (en) | 2011-03-18 | 2012-09-27 | Cree, Inc. | Semiconductor devices including schottky diodes having overlapping doped regions and methods of fabricating same |
EP2686876A1 (en) * | 2011-03-18 | 2014-01-22 | Cree, Inc. | Semiconductor devices including schottky diodes having overlapping doped regions and methods of fabricating same |
KR20140015412A (ko) * | 2011-03-18 | 2014-02-06 | 크리, 인코포레이티드 | 오버랩 도핑 영역을 갖는 쇼트키 다이오드를 포함하는 반도체 디바이스 및 그 제조 방법 |
EP2686876A4 (en) * | 2011-03-18 | 2014-09-17 | Cree Inc | SEMICONDUCTOR DEVICES COMPRISING SCHOTTKY DIODES WITH SUPERPOSED DOPED REGIONS, AND METHODS OF MAKING SAME |
KR101675626B1 (ko) | 2011-03-18 | 2016-11-11 | 크리, 인코포레이티드 | 오버랩 도핑 영역을 갖는 쇼트키 다이오드를 포함하는 반도체 디바이스 및 그 제조 방법 |
CN113871467A (zh) * | 2021-09-28 | 2021-12-31 | 吉林华微电子股份有限公司 | 一种肖特基二极管及其制造方法 |
CN113871467B (zh) * | 2021-09-28 | 2023-08-04 | 吉林华微电子股份有限公司 | 一种肖特基二极管及其制造方法 |
Also Published As
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JP5090043B2 (ja) | 2012-12-05 |
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