JP2008248311A - 真空蒸着装置 - Google Patents

真空蒸着装置 Download PDF

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Publication number
JP2008248311A
JP2008248311A JP2007090566A JP2007090566A JP2008248311A JP 2008248311 A JP2008248311 A JP 2008248311A JP 2007090566 A JP2007090566 A JP 2007090566A JP 2007090566 A JP2007090566 A JP 2007090566A JP 2008248311 A JP2008248311 A JP 2008248311A
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JP
Japan
Prior art keywords
vacuum
substrate
electrode
film
vapor deposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007090566A
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English (en)
Japanese (ja)
Other versions
JP2008248311A5 (enExample
Inventor
Yukihisa Noguchi
恭久 野口
Hiroshi Soda
浩志 左右田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Priority to JP2007090566A priority Critical patent/JP2008248311A/ja
Priority to US12/059,616 priority patent/US20080236496A1/en
Publication of JP2008248311A publication Critical patent/JP2008248311A/ja
Publication of JP2008248311A5 publication Critical patent/JP2008248311A5/ja
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks
    • C23C14/044Coating on selected surface areas, e.g. using masks using masks using masks to redistribute rather than totally prevent coating, e.g. producing thickness gradient
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50Substrate holders

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Light Receiving Elements (AREA)
JP2007090566A 2007-03-30 2007-03-30 真空蒸着装置 Pending JP2008248311A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007090566A JP2008248311A (ja) 2007-03-30 2007-03-30 真空蒸着装置
US12/059,616 US20080236496A1 (en) 2007-03-30 2008-03-31 Vacuum evaporation apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007090566A JP2008248311A (ja) 2007-03-30 2007-03-30 真空蒸着装置

Publications (2)

Publication Number Publication Date
JP2008248311A true JP2008248311A (ja) 2008-10-16
JP2008248311A5 JP2008248311A5 (enExample) 2009-11-05

Family

ID=39792119

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007090566A Pending JP2008248311A (ja) 2007-03-30 2007-03-30 真空蒸着装置

Country Status (2)

Country Link
US (1) US20080236496A1 (enExample)
JP (1) JP2008248311A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102632234A (zh) * 2012-04-27 2012-08-15 四川大学 超细w-k金属粉末的真空热蒸发混料工艺
JP2016069714A (ja) * 2014-10-01 2016-05-09 新日鐵住金株式会社 基材保持具およびそれを備える成膜装置
JP2020038321A (ja) * 2018-09-05 2020-03-12 富士ゼロックス株式会社 定着装置、画像形成装置

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8963094B2 (en) * 2008-06-11 2015-02-24 Rapiscan Systems, Inc. Composite gamma-neutron detection system
KR101097311B1 (ko) * 2009-06-24 2011-12-21 삼성모바일디스플레이주식회사 유기 발광 디스플레이 장치 및 이를 제조하기 위한 유기막 증착 장치
US9491802B2 (en) * 2012-02-17 2016-11-08 Honeywell International Inc. On-chip alkali dispenser
CN111710749B (zh) * 2020-04-23 2022-09-09 中国科学院上海技术物理研究所 基于多基板二次拼接的长线列探测器拼接结构及实现方法
CN112201709A (zh) * 2020-09-25 2021-01-08 暨南大学 一种硒化锑薄膜太阳电池及其制备方法与应用

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005310472A (ja) * 2004-04-20 2005-11-04 Canon Inc 真空蒸着用マスクおよび真空蒸着装置および真空蒸着方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60180998A (ja) * 1984-02-27 1985-09-14 Anelva Corp 分子線エピタキシヤル成長装置用の基板保持装置
SG114589A1 (en) * 2001-12-12 2005-09-28 Semiconductor Energy Lab Film formation apparatus and film formation method and cleaning method
US7256370B2 (en) * 2002-03-15 2007-08-14 Steed Technology, Inc. Vacuum thermal annealer

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005310472A (ja) * 2004-04-20 2005-11-04 Canon Inc 真空蒸着用マスクおよび真空蒸着装置および真空蒸着方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102632234A (zh) * 2012-04-27 2012-08-15 四川大学 超细w-k金属粉末的真空热蒸发混料工艺
JP2016069714A (ja) * 2014-10-01 2016-05-09 新日鐵住金株式会社 基材保持具およびそれを備える成膜装置
JP2020038321A (ja) * 2018-09-05 2020-03-12 富士ゼロックス株式会社 定着装置、画像形成装置
JP7159708B2 (ja) 2018-09-05 2022-10-25 富士フイルムビジネスイノベーション株式会社 定着装置、画像形成装置

Also Published As

Publication number Publication date
US20080236496A1 (en) 2008-10-02

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