JP2008235842A - ヒートシンクの構造及び製造方法 - Google Patents
ヒートシンクの構造及び製造方法 Download PDFInfo
- Publication number
- JP2008235842A JP2008235842A JP2007107585A JP2007107585A JP2008235842A JP 2008235842 A JP2008235842 A JP 2008235842A JP 2007107585 A JP2007107585 A JP 2007107585A JP 2007107585 A JP2007107585 A JP 2007107585A JP 2008235842 A JP2008235842 A JP 2008235842A
- Authority
- JP
- Japan
- Prior art keywords
- base
- heat sink
- fin
- fins
- caulking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000004065 semiconductor Substances 0.000 claims description 4
- 230000005855 radiation Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 13
- 239000000463 material Substances 0.000 description 7
- 238000001816 cooling Methods 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000002788 crimping Methods 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007107585A JP2008235842A (ja) | 2007-03-19 | 2007-03-19 | ヒートシンクの構造及び製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007107585A JP2008235842A (ja) | 2007-03-19 | 2007-03-19 | ヒートシンクの構造及び製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008235842A true JP2008235842A (ja) | 2008-10-02 |
| JP2008235842A5 JP2008235842A5 (cg-RX-API-DMAC7.html) | 2009-01-15 |
Family
ID=39908237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007107585A Pending JP2008235842A (ja) | 2007-03-19 | 2007-03-19 | ヒートシンクの構造及び製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2008235842A (cg-RX-API-DMAC7.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011222606A (ja) * | 2010-04-06 | 2011-11-04 | Mitsubishi Electric Corp | ヒートシンク及びヒートシンク一体型パワーモジュール |
| CN102803888A (zh) * | 2012-01-05 | 2012-11-28 | 萨帕有限公司 | 散热器及其制造方法 |
-
2007
- 2007-03-19 JP JP2007107585A patent/JP2008235842A/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011222606A (ja) * | 2010-04-06 | 2011-11-04 | Mitsubishi Electric Corp | ヒートシンク及びヒートシンク一体型パワーモジュール |
| CN102803888A (zh) * | 2012-01-05 | 2012-11-28 | 萨帕有限公司 | 散热器及其制造方法 |
| WO2013102301A1 (en) * | 2012-01-05 | 2013-07-11 | Sapa Ab | Heat sink and method for manufacturing |
| US9233438B2 (en) | 2012-01-05 | 2016-01-12 | Sapa Ab | Heat sink and method for manufacturing |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6176304B1 (en) | Heat sink | |
| CN103107149B (zh) | 液冷式冷却装置及其制造方法 | |
| CN101513150B (zh) | 马达控制器 | |
| EP1172852B1 (en) | Corrugated matrix heat sink for cooling electronic components | |
| US6742581B2 (en) | Heat sink and fin module | |
| CN101405561B (zh) | 热交换器及其制造方法 | |
| US20110168374A1 (en) | Corrugated-fin type radiator | |
| JP6645915B2 (ja) | ヒートシンク | |
| US20050000682A1 (en) | Heat dissipating fins of heat sink and manufacturing method thereof | |
| JP3149894U (ja) | 放熱器 | |
| JP2008235842A (ja) | ヒートシンクの構造及び製造方法 | |
| JP2008235842A5 (cg-RX-API-DMAC7.html) | ||
| CN210725805U (zh) | 一种镶嵌式散热结构 | |
| JP2001308231A (ja) | 電子部品の放熱器およびその製造方法 | |
| JP4063025B2 (ja) | ヒートシンク | |
| JP2005303063A (ja) | ヒートシンク | |
| JP2004158682A (ja) | ヒートシンク | |
| JP3148182U (ja) | ヒートシンク | |
| JP2002026200A (ja) | 電子部品の放熱器 | |
| TW202420929A (zh) | 組合式散熱器結構 | |
| JP7214535B2 (ja) | ヒートシンクの製造方法 | |
| JP2003142863A (ja) | ヒートシンクおよびフィンモジュール | |
| JP3192622B2 (ja) | ヒートパイプ式ヒートシンク | |
| JP7213388B2 (ja) | ヒートシンクの製造方法 | |
| JPH0621282A (ja) | ヒートシンク及びその製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Effective date: 20080702 Free format text: JAPANESE INTERMEDIATE CODE: A523 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080905 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080905 |