JP2008235674A - パワーモジュール及び車両用インバータ - Google Patents

パワーモジュール及び車両用インバータ Download PDF

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Publication number
JP2008235674A
JP2008235674A JP2007074811A JP2007074811A JP2008235674A JP 2008235674 A JP2008235674 A JP 2008235674A JP 2007074811 A JP2007074811 A JP 2007074811A JP 2007074811 A JP2007074811 A JP 2007074811A JP 2008235674 A JP2008235674 A JP 2008235674A
Authority
JP
Japan
Prior art keywords
semiconductor chip
power module
resin
substrate
resin material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007074811A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008235674A5 (https=
Inventor
Takashi Atsumi
貴司 渥美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Motor Corp
Original Assignee
Toyota Motor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Motor Corp filed Critical Toyota Motor Corp
Priority to JP2007074811A priority Critical patent/JP2008235674A/ja
Priority to PCT/JP2008/055988 priority patent/WO2008123386A1/ja
Priority to US12/532,584 priority patent/US20100102431A1/en
Priority to DE112008000743.8T priority patent/DE112008000743B8/de
Publication of JP2008235674A publication Critical patent/JP2008235674A/ja
Publication of JP2008235674A5 publication Critical patent/JP2008235674A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H10W40/735—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state by melting or evaporation of solids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01308—Manufacture or treatment of die-attach connectors using permanent auxiliary members, e.g. using alignment marks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07311—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Die Bonding (AREA)
  • Inverter Devices (AREA)
JP2007074811A 2007-03-22 2007-03-22 パワーモジュール及び車両用インバータ Pending JP2008235674A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007074811A JP2008235674A (ja) 2007-03-22 2007-03-22 パワーモジュール及び車両用インバータ
PCT/JP2008/055988 WO2008123386A1 (ja) 2007-03-22 2008-03-21 パワーモジュール及び車両用インバータ
US12/532,584 US20100102431A1 (en) 2007-03-22 2008-03-21 Power module and inverter for vehicles
DE112008000743.8T DE112008000743B8 (de) 2007-03-22 2008-03-21 Leistungsmodul und Wechselrichter für Fahrzeuge

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007074811A JP2008235674A (ja) 2007-03-22 2007-03-22 パワーモジュール及び車両用インバータ

Publications (2)

Publication Number Publication Date
JP2008235674A true JP2008235674A (ja) 2008-10-02
JP2008235674A5 JP2008235674A5 (https=) 2009-08-20

Family

ID=39830874

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007074811A Pending JP2008235674A (ja) 2007-03-22 2007-03-22 パワーモジュール及び車両用インバータ

Country Status (4)

Country Link
US (1) US20100102431A1 (https=)
JP (1) JP2008235674A (https=)
DE (1) DE112008000743B8 (https=)
WO (1) WO2008123386A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009277840A (ja) * 2008-05-14 2009-11-26 Denso Corp はんだ接合体およびその製造方法
JP2022505219A (ja) * 2018-10-19 2022-01-14 ヒタチ・エナジー・スウィツァーランド・アクチェンゲゼルシャフト 浮動性実装を有する電力半導体装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX2010008213A (es) * 2008-02-22 2010-09-30 Toppan Printing Co Ltd Transpondedor y cuaderno.
DE102012208767A1 (de) * 2011-06-17 2012-12-20 Robert Bosch Gmbh Elektronische Schaltungsanordnung mit Verlustwärme abgebenden Komponenten
EP2816594A4 (en) 2012-02-14 2015-08-12 Panasonic Ip Man Co Ltd SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD THEREFOR
US10418295B2 (en) * 2016-01-28 2019-09-17 Mitsubishi Electric Corporation Power module

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH396221A (de) * 1962-03-30 1965-07-31 Bbc Brown Boveri & Cie Halbleiteranordnung
JPH0519957Y2 (https=) * 1986-10-14 1993-05-25
US4915167A (en) * 1988-08-05 1990-04-10 Westinghouse Electric Corp. Thermal coupling to enhance heat transfer
WO1992022090A1 (en) * 1991-06-03 1992-12-10 Motorola, Inc. Thermally conductive electronic assembly
JPH0637438A (ja) 1992-07-16 1994-02-10 Sanyo Electric Co Ltd 混成集積回路
US5328087A (en) * 1993-03-29 1994-07-12 Microelectronics And Computer Technology Corporation Thermally and electrically conductive adhesive material and method of bonding with same
JP3879150B2 (ja) * 1996-08-12 2007-02-07 株式会社デンソー 半導体装置
US6144104A (en) * 1999-03-24 2000-11-07 Visteon Corporation High-operating-temperature electronic component
JP2001185664A (ja) * 1999-12-24 2001-07-06 Toshiba Corp セラミックス回路基板
JP3792521B2 (ja) * 2001-02-23 2006-07-05 アルプス電気株式会社 磁気ヘッド装置
WO2003021664A1 (en) * 2001-08-31 2003-03-13 Hitachi, Ltd. Semiconductor device, structural body and electronic device
JP4010911B2 (ja) * 2002-09-04 2007-11-21 株式会社東芝 パワー半導体装置の製造方法
JP2006073810A (ja) * 2004-09-02 2006-03-16 Toyota Motor Corp パワー半導体モジュールおよびその製造方法
JP2007074811A (ja) 2005-09-06 2007-03-22 Oki Electric Cable Co Ltd サージ抑制ユニット組み合せ体

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009277840A (ja) * 2008-05-14 2009-11-26 Denso Corp はんだ接合体およびその製造方法
JP2022505219A (ja) * 2018-10-19 2022-01-14 ヒタチ・エナジー・スウィツァーランド・アクチェンゲゼルシャフト 浮動性実装を有する電力半導体装置
JP7203214B2 (ja) 2018-10-19 2023-01-12 ヒタチ・エナジー・スウィツァーランド・アクチェンゲゼルシャフト 浮動性実装を有する電力半導体装置

Also Published As

Publication number Publication date
DE112008000743B8 (de) 2014-03-13
DE112008000743B4 (de) 2013-12-24
US20100102431A1 (en) 2010-04-29
WO2008123386A1 (ja) 2008-10-16
DE112008000743T5 (de) 2010-01-14

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