DE112008000743B8 - Leistungsmodul und Wechselrichter für Fahrzeuge - Google Patents

Leistungsmodul und Wechselrichter für Fahrzeuge Download PDF

Info

Publication number
DE112008000743B8
DE112008000743B8 DE112008000743.8T DE112008000743T DE112008000743B8 DE 112008000743 B8 DE112008000743 B8 DE 112008000743B8 DE 112008000743 T DE112008000743 T DE 112008000743T DE 112008000743 B8 DE112008000743 B8 DE 112008000743B8
Authority
DE
Germany
Prior art keywords
inverter
vehicles
power module
module
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE112008000743.8T
Other languages
German (de)
English (en)
Other versions
DE112008000743T5 (de
DE112008000743B4 (de
Inventor
Takashi Atsumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Motor Corp
Original Assignee
Toyota Motor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Motor Corp filed Critical Toyota Motor Corp
Publication of DE112008000743T5 publication Critical patent/DE112008000743T5/de
Application granted granted Critical
Publication of DE112008000743B4 publication Critical patent/DE112008000743B4/de
Publication of DE112008000743B8 publication Critical patent/DE112008000743B8/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H10W40/735—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state by melting or evaporation of solids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01308—Manufacture or treatment of die-attach connectors using permanent auxiliary members, e.g. using alignment marks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07311—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
DE112008000743.8T 2007-03-22 2008-03-21 Leistungsmodul und Wechselrichter für Fahrzeuge Expired - Fee Related DE112008000743B8 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007074811A JP2008235674A (ja) 2007-03-22 2007-03-22 パワーモジュール及び車両用インバータ
JP2007-074811 2007-03-22
PCT/JP2008/055988 WO2008123386A1 (ja) 2007-03-22 2008-03-21 パワーモジュール及び車両用インバータ

Publications (3)

Publication Number Publication Date
DE112008000743T5 DE112008000743T5 (de) 2010-01-14
DE112008000743B4 DE112008000743B4 (de) 2013-12-24
DE112008000743B8 true DE112008000743B8 (de) 2014-03-13

Family

ID=39830874

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112008000743.8T Expired - Fee Related DE112008000743B8 (de) 2007-03-22 2008-03-21 Leistungsmodul und Wechselrichter für Fahrzeuge

Country Status (4)

Country Link
US (1) US20100102431A1 (https=)
JP (1) JP2008235674A (https=)
DE (1) DE112008000743B8 (https=)
WO (1) WO2008123386A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2712602C (en) * 2008-02-22 2014-08-05 Toppan Printing Co., Ltd. Transponder and booklet
JP4957649B2 (ja) * 2008-05-14 2012-06-20 株式会社デンソー はんだ接合体およびその製造方法
DE102012208767A1 (de) * 2011-06-17 2012-12-20 Robert Bosch Gmbh Elektronische Schaltungsanordnung mit Verlustwärme abgebenden Komponenten
CN103843132A (zh) 2012-02-14 2014-06-04 松下电器产业株式会社 半导体装置及其制造方法
DE112016006332B4 (de) * 2016-01-28 2021-02-04 Mitsubishi Electric Corporation Leistungsmodul
JP7203214B2 (ja) * 2018-10-19 2023-01-12 ヒタチ・エナジー・スウィツァーランド・アクチェンゲゼルシャフト 浮動性実装を有する電力半導体装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB999679A (en) * 1962-03-30 1965-07-28 Bbc Brown Boveri & Cie Semiconductor device
US4915167A (en) * 1988-08-05 1990-04-10 Westinghouse Electric Corp. Thermal coupling to enhance heat transfer
WO1992022090A1 (en) * 1991-06-03 1992-12-10 Motorola, Inc. Thermally conductive electronic assembly
US5328087A (en) * 1993-03-29 1994-07-12 Microelectronics And Computer Technology Corporation Thermally and electrically conductive adhesive material and method of bonding with same
JPH1056131A (ja) * 1996-08-12 1998-02-24 Denso Corp 半導体装置
US6144104A (en) * 1999-03-24 2000-11-07 Visteon Corporation High-operating-temperature electronic component
JP2004096029A (ja) * 2002-09-04 2004-03-25 Toshiba Corp パワー半導体装置の製造方法
JP2006073810A (ja) * 2004-09-02 2006-03-16 Toyota Motor Corp パワー半導体モジュールおよびその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0519957Y2 (https=) * 1986-10-14 1993-05-25
JPH0637438A (ja) 1992-07-16 1994-02-10 Sanyo Electric Co Ltd 混成集積回路
JP2001185664A (ja) * 1999-12-24 2001-07-06 Toshiba Corp セラミックス回路基板
JP3792521B2 (ja) * 2001-02-23 2006-07-05 アルプス電気株式会社 磁気ヘッド装置
US20050029666A1 (en) * 2001-08-31 2005-02-10 Yasutoshi Kurihara Semiconductor device structural body and electronic device
JP2007074811A (ja) 2005-09-06 2007-03-22 Oki Electric Cable Co Ltd サージ抑制ユニット組み合せ体

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB999679A (en) * 1962-03-30 1965-07-28 Bbc Brown Boveri & Cie Semiconductor device
US4915167A (en) * 1988-08-05 1990-04-10 Westinghouse Electric Corp. Thermal coupling to enhance heat transfer
WO1992022090A1 (en) * 1991-06-03 1992-12-10 Motorola, Inc. Thermally conductive electronic assembly
US5328087A (en) * 1993-03-29 1994-07-12 Microelectronics And Computer Technology Corporation Thermally and electrically conductive adhesive material and method of bonding with same
JPH1056131A (ja) * 1996-08-12 1998-02-24 Denso Corp 半導体装置
US6144104A (en) * 1999-03-24 2000-11-07 Visteon Corporation High-operating-temperature electronic component
JP2004096029A (ja) * 2002-09-04 2004-03-25 Toshiba Corp パワー半導体装置の製造方法
JP2006073810A (ja) * 2004-09-02 2006-03-16 Toyota Motor Corp パワー半導体モジュールおよびその製造方法

Also Published As

Publication number Publication date
WO2008123386A1 (ja) 2008-10-16
JP2008235674A (ja) 2008-10-02
DE112008000743T5 (de) 2010-01-14
DE112008000743B4 (de) 2013-12-24
US20100102431A1 (en) 2010-04-29

Similar Documents

Publication Publication Date Title
EP2490317A4 (en) Power source device and vehicle
DK3404807T3 (da) Motortilslutningskasse og omformermotor
EP2357104A4 (en) COOLING STRUCTURE FOR A VEHICLE CURRENT SOURCE UNIT
EP2273597A4 (en) FUEL CELL BATTERY MODULE AND FUEL CELL BATTERY DEVICE
DE112008001911B8 (de) Invertersteuervorrichtung und Fahrzeug
BRPI0807895A2 (pt) Veículo híbrido
EP2196370A4 (en) Hybrid vehicle
DE602008003375D1 (de) Stromversorgungsvorrichtung für ein elektrisches Fahrzeug
DE602008002302D1 (de) Batteriemodul
EP2232690A4 (en) PARALLEL SWITCHED INVERTER
PL2208225T3 (pl) Moduł półprzewodnikowy mocy
DE602007003755D1 (de) Stromrichter und Motorantriebssystem
EP2202824A4 (en) BATTERY MODULE AND BATTERY PACK USING THE BATTERY MODULE
ATE529316T1 (de) Triebwagen zur personenbeförderung
EP2521236A4 (en) APPARATUS FOR RECEIVING ELECTRIC WIRE, VEHICLE EQUIPPED WITH SAID APPARATUS AND DEVICE FOR SUPPLYING ENERGY
DE602007002767D1 (de) Batteriemodul
DE602007009630D1 (de) Batteriemodul
DE602007014153D1 (de) Batteriemodul
DE602006018999D1 (de) Batteriemodul
DE102008048841B8 (de) Trennschaltung für Wechselrichter
BRPI0909830A2 (pt) unidade de potência veicular
GB0711825D0 (en) Boholst vehicle power unit
EP2206160A4 (en) Power panel
DE502006008859D1 (de) Lagersystem für einen Elektromotor und Elektromotor
DE602008004199D1 (de) Batteriemodul

Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8125 Change of the main classification

Ipc: H01L 21/58 AFI20080321BHDE

R016 Response to examination communication
R018 Grant decision by examination section/examining division
R020 Patent grant now final

Effective date: 20140325

R084 Declaration of willingness to licence
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee