JP2008227550A - 発光ダイオード、その製造方法および白色照明装置 - Google Patents

発光ダイオード、その製造方法および白色照明装置 Download PDF

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Publication number
JP2008227550A
JP2008227550A JP2008162339A JP2008162339A JP2008227550A JP 2008227550 A JP2008227550 A JP 2008227550A JP 2008162339 A JP2008162339 A JP 2008162339A JP 2008162339 A JP2008162339 A JP 2008162339A JP 2008227550 A JP2008227550 A JP 2008227550A
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JP
Japan
Prior art keywords
emitting diode
light
light emitting
led chip
phosphor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008162339A
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English (en)
Japanese (ja)
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JP2008227550A5 (https=
Inventor
Takenori Yasuda
剛規 安田
Mineo Okuyama
峰夫 奥山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Priority to JP2008162339A priority Critical patent/JP2008227550A/ja
Publication of JP2008227550A publication Critical patent/JP2008227550A/ja
Publication of JP2008227550A5 publication Critical patent/JP2008227550A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/726—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2008162339A 2008-06-20 2008-06-20 発光ダイオード、その製造方法および白色照明装置 Pending JP2008227550A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008162339A JP2008227550A (ja) 2008-06-20 2008-06-20 発光ダイオード、その製造方法および白色照明装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008162339A JP2008227550A (ja) 2008-06-20 2008-06-20 発光ダイオード、その製造方法および白色照明装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2002263477A Division JP2004103814A (ja) 2002-09-10 2002-09-10 発光ダイオード、その製造方法および白色照明装置

Publications (2)

Publication Number Publication Date
JP2008227550A true JP2008227550A (ja) 2008-09-25
JP2008227550A5 JP2008227550A5 (https=) 2008-11-27

Family

ID=39845693

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008162339A Pending JP2008227550A (ja) 2008-06-20 2008-06-20 発光ダイオード、その製造方法および白色照明装置

Country Status (1)

Country Link
JP (1) JP2008227550A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103274598A (zh) * 2013-06-06 2013-09-04 昆明理工大学 一种高效白光发射含银纳米颗粒的玻璃及其制备方法
US8889437B2 (en) 2010-12-15 2014-11-18 Samsung Electronics Co., Ltd. Light-emitting device, light-emitting device package, method of manufacturing light-emitting device, and method of packaging light-emitting device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0367460A (ja) * 1989-08-05 1991-03-22 Furukawa Battery Co Ltd:The 鉛蓄電池極板耳群列溶接用足し鉛並にその極板耳群列の溶接法
JP2000150969A (ja) * 1998-11-16 2000-05-30 Matsushita Electronics Industry Corp 半導体発光装置
JP2002033521A (ja) * 2000-07-14 2002-01-31 Showa Denko Kk 白色発光素子およびその製造方法
JP2002076434A (ja) * 2000-08-28 2002-03-15 Toyoda Gosei Co Ltd 発光装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0367460A (ja) * 1989-08-05 1991-03-22 Furukawa Battery Co Ltd:The 鉛蓄電池極板耳群列溶接用足し鉛並にその極板耳群列の溶接法
JP2000150969A (ja) * 1998-11-16 2000-05-30 Matsushita Electronics Industry Corp 半導体発光装置
JP2002033521A (ja) * 2000-07-14 2002-01-31 Showa Denko Kk 白色発光素子およびその製造方法
JP2002076434A (ja) * 2000-08-28 2002-03-15 Toyoda Gosei Co Ltd 発光装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8889437B2 (en) 2010-12-15 2014-11-18 Samsung Electronics Co., Ltd. Light-emitting device, light-emitting device package, method of manufacturing light-emitting device, and method of packaging light-emitting device
US9893247B2 (en) 2010-12-15 2018-02-13 Samsung Electronics Co., Ltd. Light-emitting device including phosphorus layer covering side surfaces of substrate and light-emitting device package including the same
CN103274598A (zh) * 2013-06-06 2013-09-04 昆明理工大学 一种高效白光发射含银纳米颗粒的玻璃及其制备方法

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