JP2008226431A - 段状フレア構造を備えた垂直書き込みヘッド及びその製造方法 - Google Patents
段状フレア構造を備えた垂直書き込みヘッド及びその製造方法 Download PDFInfo
- Publication number
- JP2008226431A JP2008226431A JP2008050051A JP2008050051A JP2008226431A JP 2008226431 A JP2008226431 A JP 2008226431A JP 2008050051 A JP2008050051 A JP 2008050051A JP 2008050051 A JP2008050051 A JP 2008050051A JP 2008226431 A JP2008226431 A JP 2008226431A
- Authority
- JP
- Japan
- Prior art keywords
- magnetic
- write
- abs
- write head
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 48
- 230000005291 magnetic effect Effects 0.000 claims abstract description 286
- 238000000034 method Methods 0.000 claims abstract description 97
- 239000000696 magnetic material Substances 0.000 claims description 38
- 125000006850 spacer group Chemical group 0.000 claims description 22
- 229910003321 CoFe Inorganic materials 0.000 claims description 20
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 15
- 238000009713 electroplating Methods 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 239000000725 suspension Substances 0.000 claims description 10
- 238000013500 data storage Methods 0.000 claims 4
- 230000008569 process Effects 0.000 abstract description 58
- 238000010276 construction Methods 0.000 abstract description 3
- 238000011161 development Methods 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 147
- 239000000463 material Substances 0.000 description 104
- 238000007747 plating Methods 0.000 description 30
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 14
- 229920002120 photoresistant polymer Polymers 0.000 description 14
- 229910045601 alloy Inorganic materials 0.000 description 13
- 239000000956 alloy Substances 0.000 description 13
- 239000000203 mixture Substances 0.000 description 11
- 238000000992 sputter etching Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 10
- 238000005530 etching Methods 0.000 description 9
- 229910052703 rhodium Inorganic materials 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 229910052741 iridium Inorganic materials 0.000 description 8
- 238000000206 photolithography Methods 0.000 description 7
- 238000001020 plasma etching Methods 0.000 description 7
- 238000012546 transfer Methods 0.000 description 7
- 230000004907 flux Effects 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 239000011651 chromium Substances 0.000 description 5
- 238000000151 deposition Methods 0.000 description 5
- 230000005415 magnetization Effects 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 230000005294 ferromagnetic effect Effects 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000000866 electrolytic etching Methods 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 3
- 230000002829 reductive effect Effects 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- 229910052715 tantalum Inorganic materials 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 238000000231 atomic layer deposition Methods 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 239000008139 complexing agent Substances 0.000 description 2
- 239000002772 conduction electron Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000007737 ion beam deposition Methods 0.000 description 2
- 238000010884 ion-beam technique Methods 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 229910003070 TaOx Inorganic materials 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 239000010405 anode material Substances 0.000 description 1
- 239000006117 anti-reflective coating Substances 0.000 description 1
- 230000005290 antiferromagnetic effect Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000003637 basic solution Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000872 buffer Substances 0.000 description 1
- 239000013590 bulk material Substances 0.000 description 1
- 239000010406 cathode material Substances 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000007787 long-term memory Effects 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 1
- 229910000702 sendust Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000002195 soluble material Substances 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3109—Details
- G11B5/313—Disposition of layers
- G11B5/3143—Disposition of layers including additional layers for improving the electromagnetic transducing properties of the basic structure, e.g. for flux coupling, guiding or shielding
- G11B5/3146—Disposition of layers including additional layers for improving the electromagnetic transducing properties of the basic structure, e.g. for flux coupling, guiding or shielding magnetic layers
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/10—Structure or manufacture of housings or shields for heads
- G11B5/11—Shielding of head against electric or magnetic fields
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/1278—Structure or manufacture of heads, e.g. inductive specially adapted for magnetisations perpendicular to the surface of the record carrier
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/187—Structure or manufacture of the surface of the head in physical contact with, or immediately adjacent to the recording medium; Pole pieces; Gap features
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3109—Details
- G11B5/3116—Shaping of layers, poles or gaps for improving the form of the electrical signal transduced, e.g. for shielding, contour effect, equalizing, side flux fringing, cross talk reduction between heads or between heads and information tracks
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3109—Details
- G11B5/313—Disposition of layers
- G11B5/3143—Disposition of layers including additional layers for improving the electromagnetic transducing properties of the basic structure, e.g. for flux coupling, guiding or shielding
- G11B5/3146—Disposition of layers including additional layers for improving the electromagnetic transducing properties of the basic structure, e.g. for flux coupling, guiding or shielding magnetic layers
- G11B5/315—Shield layers on both sides of the main pole, e.g. in perpendicular magnetic heads
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
- G11B5/3166—Testing or indicating in relation thereto, e.g. before the fabrication is completed
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
- G11B5/3169—Working or finishing the interfacing surface of heads, e.g. lapping of heads
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
- Y10T29/49032—Fabricating head structure or component thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
- Y10T29/49032—Fabricating head structure or component thereof
- Y10T29/49036—Fabricating head structure or component thereof including measuring or testing
- Y10T29/49039—Fabricating head structure or component thereof including measuring or testing with dual gap materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
- Y10T29/49032—Fabricating head structure or component thereof
- Y10T29/49036—Fabricating head structure or component thereof including measuring or testing
- Y10T29/49043—Depositing magnetic layer or coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
- Y10T29/49032—Fabricating head structure or component thereof
- Y10T29/49036—Fabricating head structure or component thereof including measuring or testing
- Y10T29/49043—Depositing magnetic layer or coating
- Y10T29/49044—Plural magnetic deposition layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
- Y10T29/49032—Fabricating head structure or component thereof
- Y10T29/49036—Fabricating head structure or component thereof including measuring or testing
- Y10T29/49043—Depositing magnetic layer or coating
- Y10T29/49046—Depositing magnetic layer or coating with etching or machining of magnetic material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
- Y10T29/49032—Fabricating head structure or component thereof
- Y10T29/49048—Machining magnetic material [e.g., grinding, etching, polishing]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
- Y10T29/49032—Fabricating head structure or component thereof
- Y10T29/49048—Machining magnetic material [e.g., grinding, etching, polishing]
- Y10T29/49052—Machining magnetic material [e.g., grinding, etching, polishing] by etching
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Magnetic Heads (AREA)
Abstract
【解決手段】磁気書き込みヘッド302は、第2フレア・ポイントFP2を規定する段状磁性シェル部404を有する。磁性シェル部によって規定される第2フレア・ポイントは、書き込みヘッドの空気軸受面(ABS)からの距離に関して厳密に制御される。またこのフレア・ポイントは、フォトリソグラフィ的に主磁極構造上に位置する従来のフレア・ポイントよりも、より厳密に制御される。これによって、書き込みヘッドの有効なフレア・ポイントを、現在利用可能なツール及びフォトリソグラフィ技術を利用して可能な程度よりも、より密接にABSに近づけることが可能となる。
【選択図】図3
Description
ここで図6−14を参照し、上述したような磁気書き込みヘッド302の製造方法について述べる。特に図6を参照すると、基板又は下地層602が示される。基板602は、例えば、図3を参照して述べたような充填層330及び磁気形成層312であってもよい。またヘッド内の他の構造又は装置が、この下地層602の内部又はその下にあってもよい。充填層330はアルミナによって構成される。磁極材料604は基板602上に堆積する。磁性材料604は、複数の材料で構成可能であるが、好ましくは、アルミナ、二酸化ケイ素又はその他の任意の材料などの薄い非磁性層によって分離される、CoFe、NiFe又はそれらの合金などの磁性積層である。マスク構造606は磁性層604上に形成される。マスク構造には、1つ又は複数のハード・マスク層、1つ又は複数の画像転送層、及びフォトレジスト又は熱画像レジストなどのマスク材料などの種々の層が含まれる。図7を参照すると、マスク構造606が、空気軸受面(ABS)の平面をこえて延在する書き込み磁極構造を規定するように構成される構図が示される。
<犠牲充填層>
上述の書き込みヘッド製造法には、書き込み磁極上に段状構造を電気メッキすることによって第2フレア・ポイント(FP2)を有する書き込み磁極を形成する方法が含まれていた。図15及び図16を参照すると、上述の構造と類似し、且つラップアラウンド・トレーリング・シールドをも有する段状第2ノッチ構造を有する書き込みヘッドが示される。特に図15を参照すると、本発明の一実施形態に基づいた磁気読み取り/書き込みヘッド1502は、書き込み磁極310の側部を包み込むように構成され、またCoFe、NiFe又はそれらの合金などの磁性材料によって構成されるトレーリング・シールド1506を有する書き込みヘッド1504を有する。トレーリング・シールド1506は、アルミナ(A12O3)及び/又はTa/Rh、Ta/Ir、又はAuなどの非磁性ギャップ材料1508によって書き込み磁極310から分離される。トレーリング・シールドは、ABSから磁性シェル部1510の端部に隣接したその後端部までの間で測られるスロート・ハイト(TH)を有する。
<段状トレーリング・シールドを有する書き込みヘッド>
ここで図31を参照すると、段状トレーリング・シールド3104を有する磁気書き込みヘッド3102が示される。この書き込みヘッドは、図15、16A及び16Bを参照して上に述べたコア402と類似したコア部3108を有する、磁性書き込み磁極3106を含む。また磁極3106は、図15及び16Bを参照して述べた磁性シェル404と類似した磁性シェル部3110を有する。また、トレーリング・シールド3104は、図31Aに示すように、戻り磁極314としての機能をも果たす。
<自己整合電子ラッピング・ガイド(ELG)>
図37に示すように、上述の実施形態のような、磁気書き込みヘッドの形成においては、フレア・ポイント(フレア・ポイント及びABS3737間の距離)及びトレーリング・シールド・スロート・ハイト(ABS3747から計測したトレーリング・シールドの厚み)を慎重に制御することが必要とされる。書き込み磁極フレア・ポイント及びトレーリング・シールド・スロート・ハイトの両方は、ラッピング加工によって規定されるABSの位置から計測される。このラッピング加工は、ウエハがスライダの列にカットされた後に行われる。スライダの列の側部又は個々のスライダはラッピングされ、所望のABS面位置に到達するまで材料が除去される。この時点で、スライダの列は、個々のスライダにカットされる。しかし、このラッピング加工の制御は困難である。
Claims (28)
- 磁気データ記録用の磁気書き込みヘッドであって、
空気軸受面(ABS)に配置された端部を有する書き込み磁極コア部と、
前記書き込み磁極コア部の一部分を取り囲み、またABSから後退し、前記書き込み磁極コア部のフレア・ポイントを規定する端面を有する磁性シェル部と、
を有する磁気書き込みヘッド。 - 前記書き込み磁極コア部が上面を有しており、そして前記磁性シェル部が前記ABSから後退した領域で前記書き込み磁極コア部の上面を被覆することを特徴とする請求項1に記載の磁気書き込みヘッド。
- 前記書き込み磁極コア部が側部を有しており、そして前記磁性シェル部が前記ABSから後退した領域で前記書き込み磁極コア部の前記側部を被覆することを特徴とする請求項1に記載の磁気書き込みヘッド。
- 前記書き込み磁極コア部が上部及び第1及び第2側部を有しており、そして前記磁性シェル部が前記ABSから後退した領域で前記書き込み磁極コア部の前記第1及び第2側部及び上部を被覆することを特徴とする請求項1に記載の磁気書き込みヘッド。
- 前記書き込み磁極コア部が当該書込み磁極コア部の長さに沿った軸を有しており、そして前記磁性シェル部が前記軸を中心として対称であることを特徴とする請求項1に記載の磁気書き込みヘッド。
- 前記書き込み磁極コア部が、薄い非磁性層で分離された磁性材料の層を含んだ積層構造であり、そして前記磁性シェル部が、前記書き込み磁極コア部上に電気メッキされた磁性金属であることを特徴とする請求項1に記載の磁気書き込みヘッド。
- 前記磁性シェル部が段状フレア構造を形成することを特徴とする請求項1に記載の磁気書き込みヘッド。
- 前記書き込み磁極コア部が、前記ABSからの距離FP1の位置に位置する第1フレア・ポイントを有しており、そして前記磁性シェル部の前記端面が、前記FP1未満の距離FP2の位置に位置する第2フレア・ポイントを規定することを特徴とする請求項1に記載の磁気書き込みヘッド。
- 前記書き込み磁極コア部が、非磁性材料の薄層によって分離された磁性材料の層を含んだ積層構造であり、そして前記磁性シェル部が電気メッキされたCoFeを含むことを特徴とする請求項1に記載の磁気書き込みヘッド。
- 前記書き込み磁極コア部が、非磁性材料の薄層によって分離された磁性材料の層を含んだ積層構造であり、そして前記磁性シェル部が電気メッキされたNiFeを含むことを特徴とする請求項1に記載の磁気書き込みヘッド。
- 磁気データ記録用の磁気書き込みヘッドであって、
空気軸受面(ABS)で終端する端部を有し、そしてトレーリング・エッジ及び、第1及び第2の横方向に対向する側部を有するコア部と、前記コア部の一部分を被覆し、前記ABSから後退した端面を有する磁性シェル部と、を有する書き込み磁極と、
前記コア部を部分的に取り囲み、非磁性ギャップによって前記コア部の前記トレーリング・エッジから分離され、そして非磁性ギャップによって前記コア部及び磁性シェル部から分離される磁気シールドと、
を有する磁気書き込みヘッド。 - 前記磁性シェル部の前記端面が書き込み磁極のフレア・ポイントを規定することを特徴とする請求項11に記載の磁気書き込みヘッド。
- さらに、前記ABSから第1の距離分後退した端面を有する前記磁性シェル部を被覆し、そして前記第1の距離よりも大きい第2の距離分前記ABSから後退した端面を有する非磁性スペーサ層を有する請求項11に記載の磁気書き込みヘッド。
- 前記コア部が薄い非磁性層によって分離された複数の磁性層を含み、そして前記磁性シェル部が磁性金属を含むことを特徴とする請求項11に記載の磁気書き込みヘッド。
- 前記コア部が薄い非磁性層によって分離された複数の磁性層を含み、そして前記磁性シェル部が電気メッキされたCoFeを含むことを特徴とする請求項11に記載の磁気書き込みヘッド。
- 前記コア部が薄い非磁性層によって分離された複数の磁性層を含み、そして前記磁性シェル部が電気メッキされたNiFeを含むことを特徴とする請求項11に記載の磁気書き込みヘッド。
- 前記磁性シェル部の前記端面が書き込みヘッドのフレア・ポイントを規定し、そして、前記磁気シールドが、ABSに露出した前面及び前記前面と反対側の後面とを有しており、前記前面及び後面間の距離が前記磁気シールドのスロート・ハイトを画定し、またここで前記磁気シールドの前記後面が前記ABS及び前記フレア・ポイント間に配置されることを特徴とする請求項11に記載の磁気書き込みヘッド。
- 前記コア部が第1フレア・ポイントを有しており、また前記磁性シェル部の端面が、前記第1フレア・ポイント及び前記ABS間に配置される第2フレア・ポイントを規定することを特徴とする請求項11に記載の磁気書き込みヘッド。
- さらに、前記磁性シェル部の少なくとも一部分を取り囲む非磁性スペーサ層を有する請求項11に記載の磁気書き込みヘッド。
- さらに、前記磁気シールドと接しており、前記非磁性スペーサ層上に延在する磁性層を有する請求項19に記載の磁気書き込みヘッド。
- 前記磁性シェル部が横方向に左右対称であることを特徴とする請求項11に記載の磁気書き込みヘッド。
- 前記磁性シェル部及び前記非磁性スペーサ層がいずれも横方向に左右対称であることを特徴とする請求項19に記載の磁気書き込みヘッド。
- 前記非磁性スペーサ層が、前記ABSに向かって配置され、前記ABSから前記磁性シェル部と同じ距離をおいて配置される端面を有することを特徴とする請求項19に記載の磁気書き込みヘッド。
- ハウジングと、
前記ハウジング内に回転可能に取り付けられる磁気ディスクと、
サスペンションと、
前記サスペンションに接続されるスライダと、
前記スライダを前記磁気ディスクの表面に向けるために前記サスペンションに接続されるアクチュエータと、
前記スライダ上に形成される磁気書き込みヘッドとを有し、
前記磁気書き込みヘッドは、
空気軸受面(ABS)で終端する端部を有する書き込み磁極コア部と、
前記書き込み磁極コア部の一部分を取り囲み、前記ABSから第1の距離をおいて配置される端面を有する磁性シェル部と、
前記磁性シェル部の一部分を取り囲み、前記ABSから前記第1の距離よりも大きい第2の距離をおいて配置される端面を有する非磁性スペーサ層と、
前記ABSにおいて配置され、前記書き込み磁極コア部を部分的に取り囲み、そして非磁性ギャップ層によって、前記書き込み磁極コア部及び前記磁性シェル部から分離される磁気トレーリング・シールドと、
を有するデータ記憶装置。 - 前記磁気トレーリング・シールドが段状構造を有しており、第1後端部が前記ABSから第1の距離をおいて配置され、さらに第2後端部が前記ABSから第2の距離をおいて配置され、そして前記第2の距離は前記第1の距離よりも大きいことを特徴とする請求項24に記載のデータ記憶装置。
- 前記磁気トレーリング・シールドの前記第1及び第2後端部が、等厚性の非磁性ギャップ層によって、前記書き込み磁極コア部、磁性シェル部及び非磁性スペーサから分離されることを特徴とする請求項25に記載のデータ記憶装置。
- 前記磁気トレーリング・シールドの前記第1後端部が前記磁性シェル部に隣接して配置され、そして前記第2後端部が前記非磁性スペーサに隣接して配置されることを特徴とする請求項25に記載のデータ記憶装置。
- 磁気書き込みヘッドを製造する方法であって、
基板を用意するステップと、
前記基板上に書き込み磁極を形成するステップと、
前記書き込み磁極上に、フレア・ポイントを規定する後端部を有するマスク構造を形成するステップと、
磁性材料を電気メッキして、前記書き込み磁極上に、書き込み磁極フレア・ポイントを規定する端部を有する磁性シェルを形成するステップと、
を有する方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/683972 | 2007-03-08 | ||
US11/683,972 US8634162B2 (en) | 2007-03-08 | 2007-03-08 | Perpendicular write head having a stepped flare structure and method of manufacture thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008226431A true JP2008226431A (ja) | 2008-09-25 |
JP5775653B2 JP5775653B2 (ja) | 2015-09-09 |
Family
ID=39774429
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008050051A Expired - Fee Related JP5775653B2 (ja) | 2007-03-08 | 2008-02-29 | 段状フレア構造を備えた垂直書き込みヘッド及びその製造方法 |
Country Status (4)
Country | Link |
---|---|
US (4) | US8634162B2 (ja) |
JP (1) | JP5775653B2 (ja) |
KR (1) | KR20080082452A (ja) |
CN (1) | CN101261839B (ja) |
Families Citing this family (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7558020B2 (en) * | 2004-11-12 | 2009-07-07 | Headway Technologies, Inc. | Thin-film magnetic head structure having a magnetic pole tip with an even width portion method of manufacturing thereof, and thin-film magnetic head having a magnetic pole tip with an even width portion |
US7813077B2 (en) * | 2006-08-31 | 2010-10-12 | International Business Machines Corporation | Apparatus, system, and method for detecting a periodic sequence of servo signals |
US8634162B2 (en) * | 2007-03-08 | 2014-01-21 | HGST Netherlands B.V. | Perpendicular write head having a stepped flare structure and method of manufacture thereof |
JP2008243244A (ja) * | 2007-03-26 | 2008-10-09 | Tdk Corp | 垂直磁気記録ヘッド及びその製造方法 |
US8289650B2 (en) * | 2007-09-19 | 2012-10-16 | Seagate Technology Llc | HAMR recording head having a sloped wall pole |
US8049989B2 (en) * | 2007-12-26 | 2011-11-01 | Hitachi Global Storage Technologies Netherlands B.V. | Magnetic head for perpendicular recording having stepped wrap around shield with independent control of write pole track width and flare point dimensions |
US8649123B1 (en) * | 2008-11-26 | 2014-02-11 | Western Digital (Fremont), Llc | Method to eliminate reactive ion etching (RIE) loading effects for damascene perpendicular magnetic recording (PMR) fabrication |
JP2010146600A (ja) * | 2008-12-16 | 2010-07-01 | Hitachi Global Storage Technologies Netherlands Bv | 垂直磁気記録ヘッド、その製造方法及び磁気記録再生装置 |
JP2010146641A (ja) * | 2008-12-19 | 2010-07-01 | Hitachi Global Storage Technologies Netherlands Bv | 垂直記録用磁気ヘッドとその製造方法及びそれを用いた磁気ディスク装置 |
US8808524B2 (en) * | 2009-01-27 | 2014-08-19 | Seagate Technology Llc | Direct electrodeposition of magnetic recording head features |
US20110075299A1 (en) * | 2009-09-30 | 2011-03-31 | Olson Trevor W | Magnetic write heads for hard disk drives and method of forming same |
US8724258B2 (en) * | 2009-09-30 | 2014-05-13 | HGST Netherlands B.V. | Slanted bump design for magnetic shields in perpendicular write heads and method of making same |
US8449752B2 (en) * | 2009-09-30 | 2013-05-28 | HGST Netherlands B.V. | Trailing plated step |
JP2011108320A (ja) * | 2009-11-17 | 2011-06-02 | Hitachi Global Storage Technologies Netherlands Bv | 磁気ヘッド及びその製造方法 |
US8441757B2 (en) * | 2009-12-09 | 2013-05-14 | HGST Netherlands B.V. | Perpendicular magnetic write head with wrap-around shield, slanted pole and slanted pole bump fabricated by damascene process |
US8451562B2 (en) | 2010-04-23 | 2013-05-28 | HGST Netherlands B.V. | Method for manufacturing a magnetic write head having a wrap around trailing magnetic shield with a tapered side gap |
US8453317B2 (en) | 2010-10-14 | 2013-06-04 | HGST Netherlands, B.V. | Magnetic write head fabrication with integrated electrical lapping guides |
US8889018B2 (en) | 2010-11-23 | 2014-11-18 | HGST Netherlands B.V. | Method for manufacturing a magnetic write pole using a multi-layered hard mask structure |
US8801944B2 (en) * | 2012-11-28 | 2014-08-12 | HGST Netherlands B.V. | Method for manufacturing a magnetic write head using novel mask structure |
US9082426B1 (en) * | 2012-12-19 | 2015-07-14 | Western Digital (Fremont), Llc | Methods for manufacturing electronic lapping guides for writer heads that closely track pole formation of the writer heads |
US8921126B2 (en) | 2013-01-25 | 2014-12-30 | Headway Technologies, Inc. | Magnetic seed method for improving blocking temperature and shield to shield spacing in a TMR sensor |
US8947834B2 (en) * | 2013-03-12 | 2015-02-03 | Seagate Technology Llc | Method and apparatus for chemical-mechanical polishing |
US20140268417A1 (en) * | 2013-03-16 | 2014-09-18 | Seagate Technology Llc | Bottom shield stabilized magnetic seed layer |
US8817418B1 (en) * | 2013-08-15 | 2014-08-26 | Tdk Corporation | Magnetic head for perpendicular magnetic recording having a write shield |
US8837083B1 (en) * | 2013-08-23 | 2014-09-16 | Headway Technologies, Inc. | Magnetic head for perpendicular magnetic recording including a heater |
US9280990B1 (en) | 2013-12-11 | 2016-03-08 | Western Digital (Fremont), Llc | Method for fabricating a magnetic writer using multiple etches |
US9305583B1 (en) | 2014-02-18 | 2016-04-05 | Western Digital (Fremont), Llc | Method for fabricating a magnetic writer using multiple etches of damascene materials |
US8988825B1 (en) | 2014-02-28 | 2015-03-24 | Western Digital (Fremont, LLC | Method for fabricating a magnetic writer having half-side shields |
US10003014B2 (en) * | 2014-06-20 | 2018-06-19 | International Business Machines Corporation | Method of forming an on-pitch self-aligned hard mask for contact to a tunnel junction using ion beam etching |
KR102257901B1 (ko) * | 2014-09-19 | 2021-05-31 | 삼성전자주식회사 | 반도체 검사 장비 및 이를 이용한 반도체 소자의 검사 방법 |
US9972345B1 (en) | 2015-12-18 | 2018-05-15 | Seagate Technology Llc | Method for making a write head for magnetic recording |
US11031032B1 (en) * | 2017-04-03 | 2021-06-08 | Seagate Technology Llc | Cryogenic magnetic alloys with less grain refinement dopants |
US10014012B1 (en) | 2017-06-23 | 2018-07-03 | Western Digital Technologies, Inc. | Spin-orbit torque based magnetic recording |
US10181334B1 (en) | 2017-06-23 | 2019-01-15 | Western Digital Technologies, Inc. | Spin-orbit torque based magnetic recording |
US10157632B1 (en) | 2017-06-23 | 2018-12-18 | Western Digital Technologies, Inc. | Areal density capability improvement with spin-orbit torque based structures surrounding main pole tip |
US10210888B1 (en) | 2017-06-23 | 2019-02-19 | Western Digital Technologies, Inc. | Dual spin-orbit torque oscillator in magnetic recording |
US10734014B2 (en) | 2017-06-23 | 2020-08-04 | Western Digital Technologies, Inc. | Areal density capability improvement with a main pole skin |
US10141014B1 (en) | 2017-07-28 | 2018-11-27 | Seagate Technology Llc | Write head with reduced trailing shield—side shield spacing |
US10734015B1 (en) | 2018-02-20 | 2020-08-04 | Western Digital Technologies, Inc. | Magnetic recording write head having YIG-heavy metal-YIG in write gap and side gap to maximize spin-orbit-coupling efficiency |
US10891976B1 (en) | 2019-04-24 | 2021-01-12 | Western Digital Technologies, Inc. | Areal density capability improvement with a main pole skin |
KR20210020292A (ko) * | 2019-08-14 | 2021-02-24 | 현대자동차주식회사 | 차량용 스피커 그릴 제조방법 |
US11127421B1 (en) * | 2020-07-30 | 2021-09-21 | Western Digital Technologies, Inc. | Heat-assisted magnetic recording (HAMR) write head with improved corrosion resistance and method for making the head |
US11657837B2 (en) | 2021-05-19 | 2023-05-23 | Western Digital Technologies, Inc. | Magnetic recording head with trailing shield having multiple throat-heights |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11102506A (ja) * | 1997-09-29 | 1999-04-13 | Hitachi Ltd | 薄膜磁気ヘッド及びその製造方法 |
JP2002197614A (ja) * | 2000-12-26 | 2002-07-12 | Alps Electric Co Ltd | 垂直磁気記録ヘッド及びその製造方法 |
JP2002324303A (ja) * | 2001-04-26 | 2002-11-08 | Hitachi Ltd | 垂直記録用磁気ヘッドおよびそれを搭載した磁気ディスク装置 |
JP2005190518A (ja) * | 2003-12-24 | 2005-07-14 | Hitachi Global Storage Technologies Netherlands Bv | 磁気ヘッドとその製造方法および磁気記録再生装置 |
JP2006004604A (ja) * | 2004-06-18 | 2006-01-05 | Headway Technologies Inc | 薄膜磁気ヘッドおよびその製造方法並びにヘッドジンバルアセンブリおよびハードディスク装置 |
Family Cites Families (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60163221A (ja) | 1984-02-06 | 1985-08-26 | Hitachi Ltd | 垂直磁気記録再生用薄膜ヘツド |
EP0222183B1 (en) * | 1985-10-14 | 1994-01-12 | Hitachi, Ltd. | Thin film magnetic head |
US5075956A (en) * | 1988-03-16 | 1991-12-31 | Digital Equipment Corporation | Method of making recording heads with side shields |
JPH03209609A (ja) | 1990-01-10 | 1991-09-12 | Fujitsu Ltd | 垂直磁気薄膜ヘッドの製造方法 |
JP3209609B2 (ja) | 1993-03-03 | 2001-09-17 | 関西ペイント株式会社 | 水性被覆組成物 |
US6635806B1 (en) * | 1998-05-14 | 2003-10-21 | Dekalb Genetics Corporation | Methods and compositions for expression of transgenes in plants |
US6693768B1 (en) * | 2000-03-15 | 2004-02-17 | Seagate Technology Llc | Perpendicular magnetic recording head having a flux focusing main pole |
JP2002208111A (ja) * | 2000-11-10 | 2002-07-26 | Tdk Corp | 薄膜磁気ヘッドおよびその製造方法 |
US6922316B2 (en) * | 2000-11-10 | 2005-07-26 | Tdk Corporation | Thin-film magnetic head and method of manufacturing same |
US6954340B2 (en) * | 2001-05-23 | 2005-10-11 | Seagate Technology Llc | Perpendicular magnetic recording head with nonmagnetic write gap greater than twice side shield gap distance |
PE20021091A1 (es) * | 2001-05-25 | 2003-02-04 | Aventis Pharma Gmbh | Derivados de fenilurea sustituidos con carbonamida y procedimiento para su preparacion |
JP2003036503A (ja) * | 2001-07-24 | 2003-02-07 | Hitachi Ltd | 垂直記録用磁気ヘッド及びそれを搭載した磁気ディスク装置 |
US7085100B2 (en) * | 2002-03-19 | 2006-08-01 | Hitachi Global Storage Technologies Netherlands B.V. | Magnetic head having a bilayer pole tip |
JP2004086961A (ja) * | 2002-08-26 | 2004-03-18 | Hitachi Ltd | 磁気ヘッド及び磁気記録装置 |
US7061719B2 (en) * | 2002-10-01 | 2006-06-13 | Tdk Corporation | Thin film magnetic head and method of manufacturing the same |
US20040175942A1 (en) * | 2003-01-03 | 2004-09-09 | Chang Song Y. | Composition and method used for chemical mechanical planarization of metals |
US7268973B2 (en) * | 2003-07-24 | 2007-09-11 | Hitachi Global Storage Technologies Netherlands, B.V. | Perpendicular magnetic head having thermally assisted recording element |
US7024756B2 (en) * | 2003-07-30 | 2006-04-11 | Hitachi Global Storage Technologies Netherlands, B.V. | Method of making a perpendicular recording magnetic head pole tip with an etchable adhesion CMP stop layer |
US7031121B2 (en) * | 2003-07-30 | 2006-04-18 | Hitachi Global Storage Technologies Netherlands B.V. | Perpendicular recording magnetic head with a write shield magnetically coupled to a first pole piece |
JP4104511B2 (ja) * | 2003-09-12 | 2008-06-18 | Tdk株式会社 | 垂直磁気ヘッドの製造方法 |
KR100594228B1 (ko) * | 2003-09-19 | 2006-07-03 | 삼성전자주식회사 | 자기 기록 헤드 |
US7120988B2 (en) * | 2003-09-26 | 2006-10-17 | Hitachi Global Storage Technologies Netherlands B.V. | Method for forming a write head having air bearing surface (ABS) |
US7002775B2 (en) * | 2003-09-30 | 2006-02-21 | Hitachi Global Storage Technologies Netherlands B.V. | Head for perpendicular magnetic recording with a shield structure connected to the return pole piece |
US7126788B1 (en) * | 2003-11-26 | 2006-10-24 | Western Digital (Fremont), Inc. | Trailing edge recording magnetic head with reversed double bias coil and deflection pole for perpendicular recording with a non-perpendicular write field |
US7233457B2 (en) * | 2003-12-16 | 2007-06-19 | Seagate Technology Llc | Head for perpendicular recording with reduced erasure |
US7265941B2 (en) * | 2004-02-27 | 2007-09-04 | Hitachi Global Storage Technologies Netherlands B.V. | Self-aligned, notched trailing shield for perpendicular recording |
JP2005285306A (ja) * | 2004-03-05 | 2005-10-13 | Tdk Corp | 薄膜磁気ヘッド |
US7248434B2 (en) * | 2004-03-10 | 2007-07-24 | Hitachi Global Storage Technologies Netherlands B.V. | Planarized perpendicular pole tip system and method for manufacturing the same |
US7212379B2 (en) * | 2004-03-31 | 2007-05-01 | Hitachi Global Storage Technologies Netherlands B.V. | Perpendicular magnetic recording head with flare and taper configurations |
JP4118246B2 (ja) * | 2004-03-31 | 2008-07-16 | Tdk株式会社 | 垂直磁気記録ヘッド及びその製造方法 |
US7477481B2 (en) * | 2004-04-30 | 2009-01-13 | Hitachi Global Storage Technologies Netherlands B.V. | Bilayer trailing shield gap for perpendicular head |
US8177955B2 (en) * | 2004-06-03 | 2012-05-15 | Headway Technologies, Inc. | Electrodeposition of FeCoNiV films with high resistivity and high saturation magnetization for magnetic head fabrication |
US7580222B2 (en) * | 2004-06-18 | 2009-08-25 | Headway Technologies, Inc. | Thin-film magnetic head, a head gimbal assembly and hard disk drive |
US7227720B2 (en) * | 2004-06-21 | 2007-06-05 | Headway Technologies, Inc. | Magnetic head for perpendicular magnetic recording and method of manufacturing same |
US7070698B2 (en) * | 2004-06-30 | 2006-07-04 | Hitachi Global Storage Technologies Netherlands B.V. | Methods of fabricating magnetic write heads with side and trailing shield structures |
US7468864B2 (en) * | 2004-07-01 | 2008-12-23 | Headway Technologies, Inc. | Magnetic head for perpendicular magnetic recording and method of manufacturing same |
JP4763264B2 (ja) * | 2004-10-25 | 2011-08-31 | ヒタチグローバルストレージテクノロジーズネザーランドビーブイ | 垂直記録用磁気ヘッド |
US7446980B2 (en) * | 2004-10-29 | 2008-11-04 | Hitachi Global Storage Technologies Netherlands B.V. | Method for manufacturing a stitched “floating” trailing shield for a perpendicular recording head |
US7649711B2 (en) * | 2004-10-29 | 2010-01-19 | Hitachi Global Storage Technologies Netherlands B.V. | Double notched shield and pole structure for stray field reduction in a magnetic head |
JP4134119B2 (ja) * | 2004-12-17 | 2008-08-13 | Tdk株式会社 | 垂直磁気記録用の薄膜磁気ヘッドを備えた磁気ディスク装置及び該薄膜磁気ヘッドの製造方法 |
JP2006209927A (ja) * | 2005-01-31 | 2006-08-10 | Toshiba Corp | 垂直磁気ヘッドおよび垂直磁気ディスク装置 |
US8467147B2 (en) * | 2006-10-13 | 2013-06-18 | Headway Technologies, Inc. | Magnetic head for perpendicular magnetic recording and method of manufacturing same |
US8634162B2 (en) | 2007-03-08 | 2014-01-21 | HGST Netherlands B.V. | Perpendicular write head having a stepped flare structure and method of manufacture thereof |
-
2007
- 2007-03-08 US US11/683,972 patent/US8634162B2/en active Active
-
2008
- 2008-02-26 KR KR1020080017122A patent/KR20080082452A/ko not_active Application Discontinuation
- 2008-02-28 CN CN2008100806671A patent/CN101261839B/zh active Active
- 2008-02-29 JP JP2008050051A patent/JP5775653B2/ja not_active Expired - Fee Related
-
2009
- 2009-12-23 US US12/646,884 patent/US8230583B2/en active Active
- 2009-12-23 US US12/646,879 patent/US8797685B2/en active Active
- 2009-12-23 US US12/646,858 patent/US20100128392A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11102506A (ja) * | 1997-09-29 | 1999-04-13 | Hitachi Ltd | 薄膜磁気ヘッド及びその製造方法 |
JP2002197614A (ja) * | 2000-12-26 | 2002-07-12 | Alps Electric Co Ltd | 垂直磁気記録ヘッド及びその製造方法 |
JP2002324303A (ja) * | 2001-04-26 | 2002-11-08 | Hitachi Ltd | 垂直記録用磁気ヘッドおよびそれを搭載した磁気ディスク装置 |
JP2005190518A (ja) * | 2003-12-24 | 2005-07-14 | Hitachi Global Storage Technologies Netherlands Bv | 磁気ヘッドとその製造方法および磁気記録再生装置 |
JP2006004604A (ja) * | 2004-06-18 | 2006-01-05 | Headway Technologies Inc | 薄膜磁気ヘッドおよびその製造方法並びにヘッドジンバルアセンブリおよびハードディスク装置 |
Also Published As
Publication number | Publication date |
---|---|
US8634162B2 (en) | 2014-01-21 |
US8230583B2 (en) | 2012-07-31 |
CN101261839A (zh) | 2008-09-10 |
US20100128392A1 (en) | 2010-05-27 |
US20100091407A1 (en) | 2010-04-15 |
CN101261839B (zh) | 2012-06-27 |
US20100126001A1 (en) | 2010-05-27 |
US20080232001A1 (en) | 2008-09-25 |
US8797685B2 (en) | 2014-08-05 |
KR20080082452A (ko) | 2008-09-11 |
JP5775653B2 (ja) | 2015-09-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5775653B2 (ja) | 段状フレア構造を備えた垂直書き込みヘッド及びその製造方法 | |
US8000059B2 (en) | Perpendicular magnetic write head with a thin wrap around magnetic shield | |
US8066892B2 (en) | Method for manufacturing a perpendicular magnetic write head with a wrap around shield | |
US7788796B2 (en) | Method FPR manufacturing a magnetic write head | |
US8347489B2 (en) | Method for manufacturing a perpendicular magnetic write head having a leading edge tapered write pole, self aligned side shield and independent trailing shield | |
US8201320B2 (en) | Method for manufacturing a magnetic write head having a wrap around shield that is magnetically coupled with a leading magnetic shield | |
US9047894B2 (en) | Magnetic write head having spin torque oscillator that is self aligned with write pole | |
US8339734B2 (en) | Magnetic write head having a wrap around trailing shield with an asymetrical side gap | |
US20110147222A1 (en) | Method for manufacturing a perpendicular magnetic write head having a tapered write pole and a stepped wrap around side shield gap | |
US7990651B2 (en) | Method of manufacturing a perpendicular magnetic write head with stepped trailing magnetic shield with electrical lapping guide control | |
US8503131B2 (en) | Perpendicular magnetic write head having a novel shield structure | |
US7950137B2 (en) | Method for manufacturing a magnetic write head | |
US8137570B2 (en) | Additive write pole process for wrap around shield | |
US8003304B2 (en) | Method for manufacturing a perpendicular magnetic write pole using an electrical lapping guide for tight write pole flare point control | |
US7788798B2 (en) | Method for manufacturing a perpendicular magnetic write head with wrap around magnetic trailing and side shields | |
US7881010B2 (en) | Process for self-aligned flare point and shield throat definition prior to main pole patterning | |
US20100155364A1 (en) | Magnetic write head having a stepped trailing shield and write pole with a sloped trailing edge | |
US8349197B2 (en) | Method for manufacturing a perpendicular magnetic write head having a tapered write pole and non-magnetic bump structure | |
US8371019B1 (en) | Method for manufacturing a magnetic write pole having straight side walls and a well defined track-width | |
US8252190B2 (en) | Method for manufacturing a magnetic write head having a hard mask defined write pole trailing edge step | |
US20100155232A1 (en) | Method for manufacturing a magnetic write head having a write pole trailing edge taper | |
JP2011076703A (ja) | 磁気ヘッドの作製方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20110121 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20120911 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20121002 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20121206 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130702 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20131002 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20131022 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140108 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20140122 |
|
A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20140320 |
|
RD12 | Notification of acceptance of power of sub attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7432 Effective date: 20141008 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20141008 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20141119 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20141119 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20150427 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150515 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20150706 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5775653 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |