JP2008221444A - ガントリー型ｘｙステージ - Google Patents

ガントリー型ｘｙステージ Download PDF

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Publication number
JP2008221444A
JP2008221444A JP2007067092A JP2007067092A JP2008221444A JP 2008221444 A JP2008221444 A JP 2008221444A JP 2007067092 A JP2007067092 A JP 2007067092A JP 2007067092 A JP2007067092 A JP 2007067092A JP 2008221444 A JP2008221444 A JP 2008221444A
Authority
JP
Japan
Prior art keywords
gantry
stage
type
axis direction
right support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007067092A
Other languages
English (en)
Japanese (ja)
Inventor
Atsushi Ogawa
敦 小川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Danaher Motion Japan Co Ltd
Original Assignee
Danaher Motion Japan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Danaher Motion Japan Co Ltd filed Critical Danaher Motion Japan Co Ltd
Priority to JP2007067092A priority Critical patent/JP2008221444A/ja
Priority to KR1020070040369A priority patent/KR20080084516A/ko
Publication of JP2008221444A publication Critical patent/JP2008221444A/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q5/00—Driving or feeding mechanisms; Control arrangements therefor
    • B23Q5/22—Feeding members carrying tools or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
    • B23Q1/25—Movable or adjustable work or tool supports
    • B23Q1/26—Movable or adjustable work or tool supports characterised by constructional features relating to the co-operation of relatively movable members; Means for preventing relative movement of such members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Machine Tool Units (AREA)
JP2007067092A 2007-03-15 2007-03-15 ガントリー型ｘｙステージ Pending JP2008221444A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007067092A JP2008221444A (ja) 2007-03-15 2007-03-15 ガントリー型ｘｙステージ
KR1020070040369A KR20080084516A (ko) 2007-03-15 2007-04-25 갠트리형 ｘｙ 스테이지

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007067092A JP2008221444A (ja) 2007-03-15 2007-03-15 ガントリー型ｘｙステージ

Publications (1)

Publication Number Publication Date
JP2008221444A true JP2008221444A (ja) 2008-09-25

Family

ID=39840625

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007067092A Pending JP2008221444A (ja) 2007-03-15 2007-03-15 ガントリー型ｘｙステージ

Country Status (2)

Country Link
JP (1) JP2008221444A (ko)
KR (1) KR20080084516A (ko)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010253446A (ja) * 2009-04-28 2010-11-11 Hitachi Plant Technologies Ltd ペースト塗布装置及び塗布方法
WO2013012162A1 (ko) * 2011-07-19 2013-01-24 주식회사 쎄믹스 향상된 기구적 강성을 갖는 수평수직 이동기구
JP2013051289A (ja) * 2011-08-30 2013-03-14 Nikon Corp 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
JP2014018949A (ja) * 2012-07-20 2014-02-03 Hon Hai Precision Industry Co Ltd 旋盤
CN109366212A (zh) * 2018-10-29 2019-02-22 任磊 一种用于新能源汽车内部锂电池框架加工的安装调动机构

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010253446A (ja) * 2009-04-28 2010-11-11 Hitachi Plant Technologies Ltd ペースト塗布装置及び塗布方法
TWI455761B (zh) * 2009-04-28 2014-10-11 Hitachi Ltd 糊劑塗布裝置及塗布方法
WO2013012162A1 (ko) * 2011-07-19 2013-01-24 주식회사 쎄믹스 향상된 기구적 강성을 갖는 수평수직 이동기구
KR101242633B1 (ko) * 2011-07-19 2013-03-20 주식회사 쎄믹스 향상된 기구적 강성을 갖는 수평수직 이동기구
JP2013051289A (ja) * 2011-08-30 2013-03-14 Nikon Corp 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
JP2014018949A (ja) * 2012-07-20 2014-02-03 Hon Hai Precision Industry Co Ltd 旋盤
US9346143B2 (en) 2012-07-20 2016-05-24 Hon Hai Precision Industry Co., Ltd. Lathe for machining curved surfaces
CN109366212A (zh) * 2018-10-29 2019-02-22 任磊 一种用于新能源汽车内部锂电池框架加工的安装调动机构

Also Published As

Publication number Publication date
KR20080084516A (ko) 2008-09-19

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