JP2008174687A5 - - Google Patents

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Publication number
JP2008174687A5
JP2008174687A5 JP2007011592A JP2007011592A JP2008174687A5 JP 2008174687 A5 JP2008174687 A5 JP 2008174687A5 JP 2007011592 A JP2007011592 A JP 2007011592A JP 2007011592 A JP2007011592 A JP 2007011592A JP 2008174687 A5 JP2008174687 A5 JP 2008174687A5
Authority
JP
Japan
Prior art keywords
kinds
polymerization initiator
minute
anisotropic conductive
conductive film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007011592A
Other languages
English (en)
Japanese (ja)
Other versions
JP5013067B2 (ja
JP2008174687A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2007011592A external-priority patent/JP5013067B2/ja
Priority to JP2007011592A priority Critical patent/JP5013067B2/ja
Priority to US12/227,164 priority patent/US8067514B2/en
Priority to HK10102236.8A priority patent/HK1135803B/xx
Priority to KR1020097001050A priority patent/KR101098205B1/ko
Priority to PCT/JP2008/050483 priority patent/WO2008090791A1/ja
Priority to CN2008800028476A priority patent/CN101589514B/zh
Priority to TW097102311A priority patent/TW200837858A/zh
Publication of JP2008174687A publication Critical patent/JP2008174687A/ja
Publication of JP2008174687A5 publication Critical patent/JP2008174687A5/ja
Publication of JP5013067B2 publication Critical patent/JP5013067B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2007011592A 2007-01-22 2007-01-22 異方性導電フィルム Active JP5013067B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2007011592A JP5013067B2 (ja) 2007-01-22 2007-01-22 異方性導電フィルム
PCT/JP2008/050483 WO2008090791A1 (ja) 2007-01-22 2008-01-17 異方性導電フィルム
HK10102236.8A HK1135803B (en) 2007-01-22 2008-01-17 Anisotropic electroconductive film
KR1020097001050A KR101098205B1 (ko) 2007-01-22 2008-01-17 이방성 도전 필름
US12/227,164 US8067514B2 (en) 2007-01-22 2008-01-17 Anisotropic conductive film
CN2008800028476A CN101589514B (zh) 2007-01-22 2008-01-17 各向异性导电膜
TW097102311A TW200837858A (en) 2007-01-22 2008-01-22 Anisotropic electroconductive film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007011592A JP5013067B2 (ja) 2007-01-22 2007-01-22 異方性導電フィルム

Publications (3)

Publication Number Publication Date
JP2008174687A JP2008174687A (ja) 2008-07-31
JP2008174687A5 true JP2008174687A5 (OSRAM) 2011-05-26
JP5013067B2 JP5013067B2 (ja) 2012-08-29

Family

ID=39644367

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007011592A Active JP5013067B2 (ja) 2007-01-22 2007-01-22 異方性導電フィルム

Country Status (6)

Country Link
US (1) US8067514B2 (OSRAM)
JP (1) JP5013067B2 (OSRAM)
KR (1) KR101098205B1 (OSRAM)
CN (1) CN101589514B (OSRAM)
TW (1) TW200837858A (OSRAM)
WO (1) WO2008090791A1 (OSRAM)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BRPI0517885A (pt) * 2004-11-29 2008-10-21 Nauer Fritz Ag método de fabricação de espuma de poliuretano, espuma de poliuretano de alto suporte de carga produzida a partir de poliol, poliisocianato e componentes de ligação dupla, e uso da mesma
KR100920611B1 (ko) 2007-12-06 2009-10-08 제일모직주식회사 2-스텝 열경화형 이방 도전성 접착 조성물 및 이방 도전성접착 필름
JP5549103B2 (ja) * 2008-07-11 2014-07-16 デクセリアルズ株式会社 異方性導電フィルム
CN104059547B (zh) * 2008-09-30 2016-08-24 迪睿合电子材料有限公司 各向异性导电粘结剂及使用该粘结剂的连接结构体的制备方法
JP4590473B2 (ja) * 2008-12-10 2010-12-01 大日本塗料株式会社 型内被覆組成物及び型内被覆成形体
JP2011040297A (ja) * 2009-08-12 2011-02-24 Iinuma Gauge Seisakusho:Kk 基板と基板を接続する方法および装置
JP5398455B2 (ja) * 2009-09-30 2014-01-29 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法
KR20130073200A (ko) * 2011-12-23 2013-07-03 삼성전기주식회사 스핀들 모터
JP6029922B2 (ja) * 2012-10-05 2016-11-24 デクセリアルズ株式会社 回路接続材料及びその製造方法、並びにそれを用いた実装体の製造方法
KR101535600B1 (ko) * 2012-11-06 2015-07-09 제일모직주식회사 이방성 도전 필름 및 반도체 장치
JP6437323B2 (ja) * 2014-02-14 2018-12-12 デクセリアルズ株式会社 接続構造体の製造方法、及び回路接続材料
WO2019226641A1 (en) * 2018-05-21 2019-11-28 Kaneka Americas Holding, Inc. Varnish of polyimide having high heat resistance and excellent mechanical strength
CN117878092A (zh) * 2022-10-11 2024-04-12 联华电子股份有限公司 半导体封装及其制作方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10168412A (ja) * 1996-12-10 1998-06-23 Sumitomo Bakelite Co Ltd 異方導電性接着剤
JPH10338860A (ja) * 1997-06-06 1998-12-22 Bridgestone Corp 異方性導電フィルム
JP2001031916A (ja) 1999-07-22 2001-02-06 Bridgestone Corp 異方性導電フィルム
JP4351348B2 (ja) * 2000-01-27 2009-10-28 リンテック株式会社 保護層を有するｉｃカードの製造方法
JP2002184487A (ja) * 2000-12-15 2002-06-28 Sony Chem Corp 異方性導電接着剤
JP4158434B2 (ja) * 2001-07-05 2008-10-01 株式会社ブリヂストン 異方性導電フィルム
DE10259451A1 (de) * 2002-12-19 2004-07-08 Tesa Ag Haftklebeartikel mit wenigstens einer Schicht aus einer thermisch leitfähigen Haftklebemasse und Verfahren zu seiner Herstellung
JP4444632B2 (ja) 2003-11-11 2010-03-31 リンテック株式会社 光学用フィルム
CN101831247B (zh) * 2004-06-09 2012-06-06 日立化成工业株式会社 粘结剂组合物、电路连接材料、电路部材的连接结构以及半导体装置
JP4780647B2 (ja) * 2004-12-02 2011-09-28 日東電工株式会社 光学フィルム用粘着剤、光学フィルム用粘着剤層およびその製造方法、粘着型光学フィルム、ならびに画像表示装置
JP2006199825A (ja) * 2005-01-20 2006-08-03 Soken Chem & Eng Co Ltd 異方導電性接着テープおよび配線基板異方導電接着体
JP5524531B2 (ja) * 2009-07-31 2014-06-18 北海製罐株式会社 溶接缶体

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