JP2008166565A - 回路装置及びデジタル放送受信装置 - Google Patents

回路装置及びデジタル放送受信装置 Download PDF

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Publication number
JP2008166565A
JP2008166565A JP2006355461A JP2006355461A JP2008166565A JP 2008166565 A JP2008166565 A JP 2008166565A JP 2006355461 A JP2006355461 A JP 2006355461A JP 2006355461 A JP2006355461 A JP 2006355461A JP 2008166565 A JP2008166565 A JP 2008166565A
Authority
JP
Japan
Prior art keywords
wiring board
wiring
digital broadcast
connection electrodes
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006355461A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008166565A5 (https=
Inventor
Kenichi Kobayashi
健一 小林
Atsushi Nakano
敦史 中野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
System Solutions Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Sanyo Semiconductor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd, Sanyo Semiconductor Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP2006355461A priority Critical patent/JP2008166565A/ja
Publication of JP2008166565A publication Critical patent/JP2008166565A/ja
Publication of JP2008166565A5 publication Critical patent/JP2008166565A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
JP2006355461A 2006-12-28 2006-12-28 回路装置及びデジタル放送受信装置 Pending JP2008166565A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006355461A JP2008166565A (ja) 2006-12-28 2006-12-28 回路装置及びデジタル放送受信装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006355461A JP2008166565A (ja) 2006-12-28 2006-12-28 回路装置及びデジタル放送受信装置

Publications (2)

Publication Number Publication Date
JP2008166565A true JP2008166565A (ja) 2008-07-17
JP2008166565A5 JP2008166565A5 (https=) 2010-01-21

Family

ID=39695627

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006355461A Pending JP2008166565A (ja) 2006-12-28 2006-12-28 回路装置及びデジタル放送受信装置

Country Status (1)

Country Link
JP (1) JP2008166565A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021515397A (ja) * 2018-02-26 2021-06-17 ツェットカーヴェー グループ ゲーエムベーハー 高出力構成部品用の電子プリント基板構成グループ
US12360407B2 (en) 2021-06-11 2025-07-15 Fujitsu Optical Components Limited Optical device and optical communication device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11265975A (ja) * 1998-03-17 1999-09-28 Mitsubishi Electric Corp 多層化集積回路装置
JP2001203318A (ja) * 1999-12-17 2001-07-27 Texas Instr Inc <Ti> 複数のフリップチップを備えた半導体アセンブリ
JP2004022664A (ja) * 2002-06-13 2004-01-22 Matsushita Electric Ind Co Ltd 半導体装置のパッケージおよび検査回路

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11265975A (ja) * 1998-03-17 1999-09-28 Mitsubishi Electric Corp 多層化集積回路装置
JP2001203318A (ja) * 1999-12-17 2001-07-27 Texas Instr Inc <Ti> 複数のフリップチップを備えた半導体アセンブリ
JP2004022664A (ja) * 2002-06-13 2004-01-22 Matsushita Electric Ind Co Ltd 半導体装置のパッケージおよび検査回路

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021515397A (ja) * 2018-02-26 2021-06-17 ツェットカーヴェー グループ ゲーエムベーハー 高出力構成部品用の電子プリント基板構成グループ
US12360407B2 (en) 2021-06-11 2025-07-15 Fujitsu Optical Components Limited Optical device and optical communication device

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