JP2008166457A - 電子部品のリード端子の構造 - Google Patents
電子部品のリード端子の構造 Download PDFInfo
- Publication number
- JP2008166457A JP2008166457A JP2006353605A JP2006353605A JP2008166457A JP 2008166457 A JP2008166457 A JP 2008166457A JP 2006353605 A JP2006353605 A JP 2006353605A JP 2006353605 A JP2006353605 A JP 2006353605A JP 2008166457 A JP2008166457 A JP 2008166457A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- lead wire
- metallicon
- lead
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims abstract description 111
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical class [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 102
- 239000000843 powder Substances 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 239000003985 ceramic capacitor Substances 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000012360 testing method Methods 0.000 abstract description 13
- 238000000034 method Methods 0.000 abstract description 9
- 239000002184 metal Substances 0.000 abstract description 8
- 229910052751 metal Inorganic materials 0.000 abstract description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 5
- 238000005507 spraying Methods 0.000 abstract description 5
- 238000001816 cooling Methods 0.000 abstract description 2
- 238000009751 slip forming Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 65
- 238000003466 welding Methods 0.000 description 17
- 229920005989 resin Polymers 0.000 description 15
- 239000011347 resin Substances 0.000 description 15
- 239000000463 material Substances 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 239000004020 conductor Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000013256 coordination polymer Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011104 metalized film Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000000275 quality assurance Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/242—Terminals the capacitive element surrounding the terminal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/32—Wound capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
- Details Of Resistors (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006353605A JP2008166457A (ja) | 2006-12-28 | 2006-12-28 | 電子部品のリード端子の構造 |
TW096128355A TW200828365A (en) | 2006-12-28 | 2007-08-02 | Construction of lead terminal of an electronic part |
CNA2007101477357A CN101211694A (zh) | 2006-12-28 | 2007-08-27 | 电子部件的引线端子的结构 |
KR1020070088324A KR20080063040A (ko) | 2006-12-28 | 2007-08-31 | 전자부품의 리드단자의 구조 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006353605A JP2008166457A (ja) | 2006-12-28 | 2006-12-28 | 電子部品のリード端子の構造 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2008166457A true JP2008166457A (ja) | 2008-07-17 |
Family
ID=39611636
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006353605A Pending JP2008166457A (ja) | 2006-12-28 | 2006-12-28 | 電子部品のリード端子の構造 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2008166457A (ko) |
KR (1) | KR20080063040A (ko) |
CN (1) | CN101211694A (ko) |
TW (1) | TW200828365A (ko) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014157961A (ja) * | 2013-02-18 | 2014-08-28 | Panasonic Corp | 金属化フィルムコンデンサ |
JP2015035505A (ja) * | 2013-08-09 | 2015-02-19 | 日立エーアイシー株式会社 | 金属化フィルムコンデンサ |
JP2016082128A (ja) * | 2014-10-20 | 2016-05-16 | ニチコン株式会社 | 金属化フィルムコンデンサにおけるバスバー溶接構造 |
US20220084750A1 (en) * | 2020-09-17 | 2022-03-17 | Murata Manufacturing Co., Ltd. | Multilayer ceramic electronic component and mounting structure of the multilayer ceramic electronic component |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102800500A (zh) * | 2012-08-17 | 2012-11-28 | 扬州日精电子有限公司 | 一种电容器加工方法 |
CN103954857A (zh) * | 2014-04-01 | 2014-07-30 | 扬州日精电子有限公司 | 一种薄膜电容热冲击试验的tanδ控制方法 |
KR20160130910A (ko) | 2015-05-04 | 2016-11-15 | (주)누리트론 | 전자부품의 리드단자 |
KR102222611B1 (ko) * | 2015-07-10 | 2021-03-05 | 삼성전기주식회사 | 수동소자 외부전극 형성방법 및 외부전극을 갖는 수동소자 |
CN105118670A (zh) * | 2015-08-31 | 2015-12-02 | 苏州斯尔特微电子有限公司 | 一种陶瓷电容器 |
CN108878150A (zh) * | 2017-05-09 | 2018-11-23 | 常州华威电子有限公司 | 耐高温大纹波电流电解电容器及其制备方法 |
KR20220123958A (ko) | 2021-03-02 | 2022-09-13 | 주식회사 아모텍 | 적층 세라믹 콘덴서 및 이를 구비한 수온 센서 모듈 |
KR20220151316A (ko) | 2021-05-06 | 2022-11-15 | 주식회사 아모텍 | 적층 세라믹 콘덴서 및 이를 구비한 전자 부품 패키지 |
CN116237658A (zh) * | 2023-02-10 | 2023-06-09 | 六和电子(江西)有限公司 | 一种薄膜电容器芯子与引出电极的复合焊接方法 |
-
2006
- 2006-12-28 JP JP2006353605A patent/JP2008166457A/ja active Pending
-
2007
- 2007-08-02 TW TW096128355A patent/TW200828365A/zh unknown
- 2007-08-27 CN CNA2007101477357A patent/CN101211694A/zh active Pending
- 2007-08-31 KR KR1020070088324A patent/KR20080063040A/ko not_active Application Discontinuation
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014157961A (ja) * | 2013-02-18 | 2014-08-28 | Panasonic Corp | 金属化フィルムコンデンサ |
JP2015035505A (ja) * | 2013-08-09 | 2015-02-19 | 日立エーアイシー株式会社 | 金属化フィルムコンデンサ |
JP2016082128A (ja) * | 2014-10-20 | 2016-05-16 | ニチコン株式会社 | 金属化フィルムコンデンサにおけるバスバー溶接構造 |
US20220084750A1 (en) * | 2020-09-17 | 2022-03-17 | Murata Manufacturing Co., Ltd. | Multilayer ceramic electronic component and mounting structure of the multilayer ceramic electronic component |
US11887787B2 (en) * | 2020-09-17 | 2024-01-30 | Murata Manufacturing Co., Ltd. | Multilayer ceramic electronic component including metal terminals with recess portions and mounting structure of the multilayer ceramic electronic component |
Also Published As
Publication number | Publication date |
---|---|
TW200828365A (en) | 2008-07-01 |
KR20080063040A (ko) | 2008-07-03 |
CN101211694A (zh) | 2008-07-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080930 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20081113 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090303 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090318 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20091222 |