JP2008151792A5 - - Google Patents
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- Publication number
- JP2008151792A5 JP2008151792A5 JP2007324161A JP2007324161A JP2008151792A5 JP 2008151792 A5 JP2008151792 A5 JP 2008151792A5 JP 2007324161 A JP2007324161 A JP 2007324161A JP 2007324161 A JP2007324161 A JP 2007324161A JP 2008151792 A5 JP2008151792 A5 JP 2008151792A5
- Authority
- JP
- Japan
- Prior art keywords
- lead material
- electronic component
- pressure detection
- lead
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001514 detection method Methods 0.000 claims 14
- 239000000463 material Substances 0.000 claims 12
- 239000011347 resin Substances 0.000 claims 5
- 229920005989 resin Polymers 0.000 claims 5
- 229910000679 solder Inorganic materials 0.000 claims 4
- 238000007789 sealing Methods 0.000 claims 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 2
- 229910052710 silicon Inorganic materials 0.000 claims 2
- 239000010703 silicon Substances 0.000 claims 2
- 239000003990 capacitor Substances 0.000 claims 1
- 230000004907 flux Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007324161A JP4969430B2 (ja) | 2007-12-17 | 2007-12-17 | 圧力検出装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007324161A JP4969430B2 (ja) | 2007-12-17 | 2007-12-17 | 圧力検出装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003154273A Division JP2004356494A (ja) | 2003-05-30 | 2003-05-30 | 電子装置および圧力検出装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008151792A JP2008151792A (ja) | 2008-07-03 |
JP2008151792A5 true JP2008151792A5 (zh) | 2010-07-29 |
JP4969430B2 JP4969430B2 (ja) | 2012-07-04 |
Family
ID=39654071
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007324161A Expired - Lifetime JP4969430B2 (ja) | 2007-12-17 | 2007-12-17 | 圧力検出装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4969430B2 (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5712799B2 (ja) * | 2011-06-03 | 2015-05-07 | 株式会社デンソー | センサおよびその製造方法 |
JP2014195039A (ja) * | 2013-02-26 | 2014-10-09 | Tokai Rika Co Ltd | 電子部品の接続構造 |
EP3109897A1 (en) * | 2015-06-23 | 2016-12-28 | Nxp B.V. | A lead frame assembly |
US9681568B1 (en) * | 2015-12-02 | 2017-06-13 | Ge Energy Power Conversion Technology Ltd | Compact stacked power modules for minimizing commutating inductance and methods for making the same |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01105565A (ja) * | 1987-10-17 | 1989-04-24 | Matsushita Electric Ind Co Ltd | 混成集積回路用リードフレーム |
JPH06268120A (ja) * | 1993-03-16 | 1994-09-22 | Hitachi Ltd | パワースイッチングモジュールのヒートシンク |
JP4117807B2 (ja) * | 1997-06-24 | 2008-07-16 | 松下電工株式会社 | 電子部品のハンダ付け方法 |
JP2000165042A (ja) * | 1998-11-30 | 2000-06-16 | Nec Corp | 薄膜多層配線基板 |
JP2002124616A (ja) * | 2000-10-13 | 2002-04-26 | Aisan Ind Co Ltd | リードフレームのチップ部品実装構造 |
JP2002151612A (ja) * | 2000-11-10 | 2002-05-24 | Sumitomo Metal Electronics Devices Inc | 光通信用パッケージ及びその製造方法 |
JP3791403B2 (ja) * | 2000-12-04 | 2006-06-28 | 富士電機ホールディングス株式会社 | 鉛フリーハンダ対応無洗浄用フラックスおよびこれを含有するハンダ組成物 |
JP3752444B2 (ja) * | 2001-11-16 | 2006-03-08 | 株式会社日立製作所 | 圧力検出装置 |
-
2007
- 2007-12-17 JP JP2007324161A patent/JP4969430B2/ja not_active Expired - Lifetime
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