JP2008147645A5 - - Google Patents

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Publication number
JP2008147645A5
JP2008147645A5 JP2007298320A JP2007298320A JP2008147645A5 JP 2008147645 A5 JP2008147645 A5 JP 2008147645A5 JP 2007298320 A JP2007298320 A JP 2007298320A JP 2007298320 A JP2007298320 A JP 2007298320A JP 2008147645 A5 JP2008147645 A5 JP 2008147645A5
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JP
Japan
Prior art keywords
chamber
substrate
metrology
blade
measurement
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Pending
Application number
JP2007298320A
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English (en)
Japanese (ja)
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JP2008147645A (ja
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Priority claimed from US11/561,995 external-priority patent/US7601272B2/en
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Publication of JP2008147645A publication Critical patent/JP2008147645A/ja
Publication of JP2008147645A5 publication Critical patent/JP2008147645A5/ja
Pending legal-status Critical Current

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JP2007298320A 2006-11-21 2007-11-16 計測法とエッチング処理を統合する方法及び装置 Pending JP2008147645A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/561,995 US7601272B2 (en) 2005-01-08 2006-11-21 Method and apparatus for integrating metrology with etch processing

Publications (2)

Publication Number Publication Date
JP2008147645A JP2008147645A (ja) 2008-06-26
JP2008147645A5 true JP2008147645A5 (https=) 2011-01-06

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ID=39402905

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007298320A Pending JP2008147645A (ja) 2006-11-21 2007-11-16 計測法とエッチング処理を統合する方法及び装置

Country Status (8)

Country Link
US (1) US7601272B2 (https=)
EP (1) EP1939931B1 (https=)
JP (1) JP2008147645A (https=)
KR (1) KR101188385B1 (https=)
CN (2) CN103745912B (https=)
AT (1) ATE455369T1 (https=)
DE (1) DE602007004290D1 (https=)
TW (1) TWI387039B (https=)

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