JP2008144083A - 接着剤組成物、接着フィルムおよび剥離方法 - Google Patents

接着剤組成物、接着フィルムおよび剥離方法 Download PDF

Info

Publication number
JP2008144083A
JP2008144083A JP2006335081A JP2006335081A JP2008144083A JP 2008144083 A JP2008144083 A JP 2008144083A JP 2006335081 A JP2006335081 A JP 2006335081A JP 2006335081 A JP2006335081 A JP 2006335081A JP 2008144083 A JP2008144083 A JP 2008144083A
Authority
JP
Japan
Prior art keywords
adhesive
adhesive composition
film
semiconductor wafer
peeling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006335081A
Other languages
English (en)
Japanese (ja)
Inventor
Takahiro Asai
隆宏 浅井
Koichi Misumi
浩一 三隅
Atsushi Miyanari
淳 宮成
Yoshihiro Inao
吉浩 稲尾
Akihiko Nakamura
彰彦 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Priority to JP2006335081A priority Critical patent/JP2008144083A/ja
Priority to PCT/JP2007/071801 priority patent/WO2008072437A1/ja
Priority to TW96143055A priority patent/TW200844198A/zh
Publication of JP2008144083A publication Critical patent/JP2008144083A/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
JP2006335081A 2006-12-12 2006-12-12 接着剤組成物、接着フィルムおよび剥離方法 Pending JP2008144083A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006335081A JP2008144083A (ja) 2006-12-12 2006-12-12 接着剤組成物、接着フィルムおよび剥離方法
PCT/JP2007/071801 WO2008072437A1 (ja) 2006-12-12 2007-11-09 接着剤組成物、接着フィルムおよび剥離方法
TW96143055A TW200844198A (en) 2006-12-12 2007-11-14 Adhesive composition, adhesive film, and removal method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006335081A JP2008144083A (ja) 2006-12-12 2006-12-12 接着剤組成物、接着フィルムおよび剥離方法

Publications (1)

Publication Number Publication Date
JP2008144083A true JP2008144083A (ja) 2008-06-26

Family

ID=39511462

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006335081A Pending JP2008144083A (ja) 2006-12-12 2006-12-12 接着剤組成物、接着フィルムおよび剥離方法

Country Status (3)

Country Link
JP (1) JP2008144083A (zh)
TW (1) TW200844198A (zh)
WO (1) WO2008072437A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013131652A (ja) * 2011-12-21 2013-07-04 Fujitsu Semiconductor Ltd 半導体装置の製造方法、半導体ウェハの加工方法、半導体ウェハ

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011006595A (ja) * 2009-06-26 2011-01-13 Tokyo Ohka Kogyo Co Ltd 接着剤組成物、および接着フィルム

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3053484B2 (ja) * 1991-12-17 2000-06-19 日本化薬株式会社 動物咬害防止用接着剤
US5919407A (en) * 1992-12-28 1999-07-06 Moore Business Forms, Inc. Method for producing microencapsulated adhesive
JPH0782535A (ja) * 1993-09-09 1995-03-28 Yokohama Rubber Co Ltd:The 薄板補強用接着シート
JP3838637B2 (ja) * 2002-06-10 2006-10-25 日東電工株式会社 ガラス基板ダイシング用粘着シートおよびガラス基板ダイシング方法
JP2004115653A (ja) * 2002-09-26 2004-04-15 Toppan Forms Co Ltd 光重合開始剤マイクロカプセル含有紫外線硬化型接着剤およびこれを用いた接着シート
JP2005320456A (ja) * 2004-05-10 2005-11-17 Daicel Chem Ind Ltd 転写シート及びそれを用いた記録画像の形成方法
JP2005290146A (ja) * 2004-03-31 2005-10-20 Jsr Corp 被着体の剥離方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013131652A (ja) * 2011-12-21 2013-07-04 Fujitsu Semiconductor Ltd 半導体装置の製造方法、半導体ウェハの加工方法、半導体ウェハ

Also Published As

Publication number Publication date
WO2008072437A1 (ja) 2008-06-19
TW200844198A (en) 2008-11-16

Similar Documents

Publication Publication Date Title
TWI291984B (en) Energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the same
JP5020496B2 (ja) 接着剤組成物および接着フィルム
TWI338030B (en) Die bonding adhesive tape
JP4976829B2 (ja) 接着剤組成物、及び接着フィルム
TW200842174A (en) Composition for pressure sensitive adhesive film, pressure sensitive adhesive film, and dicing die bonding film including the same
TWI765849B (zh) 雙面黏著帶及其製造方法
JP2010202833A (ja) 電子部品加工用粘着テープ
TW201319207A (zh) 電子零件切斷用加熱剝離型黏著片及電子零件切斷方法
CN105658422B (zh) 树脂膜形成用片材
JP5016296B2 (ja) 接着剤組成物、及び接着フィルム
JP2008144083A (ja) 接着剤組成物、接着フィルムおよび剥離方法
JP2014526143A (ja) 半導体組み立てにおける加工領域を保護するためのリペレント材料の使用
JP2004300333A (ja) 易剥離性粘着シート、その製造法及び使用方法
JP2008063464A (ja) 接着剤組成物、接着フィルム及び当該接着剤組成物の製造方法
KR20150092101A (ko) 칩용 수지막 형성용 시트 및 반도체 장치의 제조 방법
JP5048980B2 (ja) 接着剤組成物、接着フィルムおよび剥離方法
WO2012134034A2 (ko) 접착필름용 수지 조성물 및 이를 이용한 접착필름
JP2007250735A (ja) 粘着テープの剥離方法
JP2008063462A (ja) 接着剤組成物、接着フィルム及び当該接着剤組成物の製造方法
JP2010222493A (ja) 電子部品加工用粘着テープ
JP2008063463A (ja) 接着剤組成物、接着フィルム及び当該接着剤組成物の製造方法
JP2009203450A (ja) 接着剤組成物、および接着フィルム
JP5276314B2 (ja) 接着剤組成物および接着フィルム
JPH04345015A (ja) レジストの除去方法とこれに用いる硬化型感圧性接着剤および接着シ―ト類
JPH07183195A (ja) レジスト剥離用シート類、及びそれを用いたレジストの剥離除去方法