JP2008141026A5 - - Google Patents

Download PDF

Info

Publication number
JP2008141026A5
JP2008141026A5 JP2006326488A JP2006326488A JP2008141026A5 JP 2008141026 A5 JP2008141026 A5 JP 2008141026A5 JP 2006326488 A JP2006326488 A JP 2006326488A JP 2006326488 A JP2006326488 A JP 2006326488A JP 2008141026 A5 JP2008141026 A5 JP 2008141026A5
Authority
JP
Japan
Prior art keywords
film
substrate
wiring
connection portion
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006326488A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008141026A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006326488A priority Critical patent/JP2008141026A/ja
Priority claimed from JP2006326488A external-priority patent/JP2008141026A/ja
Priority to TW096139328A priority patent/TW200837819A/zh
Priority to US11/877,492 priority patent/US7763901B2/en
Priority to KR1020070108944A priority patent/KR101382354B1/ko
Priority to CN2007101875674A priority patent/CN101197355B/zh
Publication of JP2008141026A publication Critical patent/JP2008141026A/ja
Publication of JP2008141026A5 publication Critical patent/JP2008141026A5/ja
Pending legal-status Critical Current

Links

JP2006326488A 2006-12-04 2006-12-04 電子機器及びその製造方法、並びに、発光ダイオード表示装置及びその製造方法 Pending JP2008141026A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2006326488A JP2008141026A (ja) 2006-12-04 2006-12-04 電子機器及びその製造方法、並びに、発光ダイオード表示装置及びその製造方法
TW096139328A TW200837819A (en) 2006-12-04 2007-10-19 Electronic device, method of producing the same, light-emitting diode display unit, and method of producing the same
US11/877,492 US7763901B2 (en) 2006-12-04 2007-10-23 Electronic device, method of producing the same, light-emitting diode display unit, and method of producing the same
KR1020070108944A KR101382354B1 (ko) 2006-12-04 2007-10-29 전자기기 및 그 제조 방법과, 발광 다이오드 표시 장치 및그 제조 방법
CN2007101875674A CN101197355B (zh) 2006-12-04 2007-12-03 电子器件及其制造方法、发光二极管显示单元及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006326488A JP2008141026A (ja) 2006-12-04 2006-12-04 電子機器及びその製造方法、並びに、発光ダイオード表示装置及びその製造方法

Publications (2)

Publication Number Publication Date
JP2008141026A JP2008141026A (ja) 2008-06-19
JP2008141026A5 true JP2008141026A5 (enExample) 2009-12-24

Family

ID=39547629

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006326488A Pending JP2008141026A (ja) 2006-12-04 2006-12-04 電子機器及びその製造方法、並びに、発光ダイオード表示装置及びその製造方法

Country Status (5)

Country Link
US (1) US7763901B2 (enExample)
JP (1) JP2008141026A (enExample)
KR (1) KR101382354B1 (enExample)
CN (1) CN101197355B (enExample)
TW (1) TW200837819A (enExample)

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070125961A1 (en) * 2005-11-17 2007-06-07 Michel Despont Micromechanical system
US9534772B2 (en) 2007-05-31 2017-01-03 Nthdegree Technologies Worldwide Inc Apparatus with light emitting diodes
US9343593B2 (en) 2007-05-31 2016-05-17 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US8852467B2 (en) 2007-05-31 2014-10-07 Nthdegree Technologies Worldwide Inc Method of manufacturing a printable composition of a liquid or gel suspension of diodes
US8877101B2 (en) 2007-05-31 2014-11-04 Nthdegree Technologies Worldwide Inc Method of manufacturing a light emitting, power generating or other electronic apparatus
US9018833B2 (en) 2007-05-31 2015-04-28 Nthdegree Technologies Worldwide Inc Apparatus with light emitting or absorbing diodes
US9419179B2 (en) 2007-05-31 2016-08-16 Nthdegree Technologies Worldwide Inc Diode for a printable composition
CN101599442A (zh) * 2008-06-04 2009-12-09 富准精密工业(深圳)有限公司 发光二极管的制造方法
JP2010107935A (ja) * 2008-10-28 2010-05-13 Samsung Mobile Display Co Ltd 平板表示装置及びその製造方法
JP2011129646A (ja) * 2009-12-16 2011-06-30 Panasonic Corp Ｌｅｄモジュール用配線基板、ｌｅｄモジュール及びｌｅｄモジュール用配線基板の製造方法
JP5670051B2 (ja) * 2009-12-25 2015-02-18 日亜化学工業株式会社 半導体発光装置及びその製造方法
JP5481305B2 (ja) 2010-07-30 2014-04-23 株式会社東芝 出力配分制御装置
KR102156532B1 (ko) * 2010-09-01 2020-09-16 엔티에이치 디그리 테크놀로지스 월드와이드 인코포레이티드 발광, 발전 또는 기타 전자 장치 및 이의 제조 방법
US9899329B2 (en) 2010-11-23 2018-02-20 X-Celeprint Limited Interconnection structures and methods for transfer-printed integrated circuit elements with improved interconnection alignment tolerance
US8889485B2 (en) 2011-06-08 2014-11-18 Semprius, Inc. Methods for surface attachment of flipped active componenets
CN102903804B (zh) * 2011-07-25 2015-12-16 财团法人工业技术研究院 发光元件的转移方法以及发光元件阵列
US9306117B2 (en) 2011-07-25 2016-04-05 Industrial Technology Research Institute Transfer-bonding method for light emitting devices
US20120175667A1 (en) * 2011-10-03 2012-07-12 Golle Aaron J Led light disposed on a flexible substrate and connected with a printed 3d conductor
TWI450476B (zh) * 2011-11-18 2014-08-21 Hongkong Dongshan Prec Union Opoelectronic Co Ltd Padding method
WO2014157455A1 (ja) 2013-03-28 2014-10-02 東芝ホクト電子株式会社 発光装置、その製造方法、および発光装置使用装置
CN107768362B (zh) * 2013-03-28 2020-09-08 东芝北斗电子株式会社 发光装置及其制造方法
JP5961148B2 (ja) * 2013-08-02 2016-08-02 富士フイルム株式会社 発光装置の製造方法
JP6010003B2 (ja) * 2013-08-02 2016-10-19 富士フイルム株式会社 発光装置およびその製造方法
WO2015068344A1 (ja) * 2013-11-07 2015-05-14 東芝ホクト電子株式会社 発光装置
CN106716003B (zh) * 2014-09-02 2020-03-10 飞利浦照明控股有限公司 将照明布置应用于表面的方法和照明表面
US20160093600A1 (en) * 2014-09-25 2016-03-31 X-Celeprint Limited Compound micro-assembly strategies and devices
US9799719B2 (en) 2014-09-25 2017-10-24 X-Celeprint Limited Active-matrix touchscreen
US10381332B2 (en) 2014-10-31 2019-08-13 eLux Inc. Fabrication method for emissive display with light management system
US10535640B2 (en) 2014-10-31 2020-01-14 eLux Inc. System and method for the fluidic assembly of micro-LEDs utilizing negative pressure
US10242977B2 (en) 2014-10-31 2019-03-26 eLux, Inc. Fluid-suspended microcomponent harvest, distribution, and reclamation
US10520769B2 (en) 2014-10-31 2019-12-31 eLux, Inc. Emissive display with printed light modification structures
US10381335B2 (en) 2014-10-31 2019-08-13 ehux, Inc. Hybrid display using inorganic micro light emitting diodes (uLEDs) and organic LEDs (OLEDs)
US9825202B2 (en) 2014-10-31 2017-11-21 eLux, Inc. Display with surface mount emissive elements
US10446728B2 (en) 2014-10-31 2019-10-15 eLux, Inc. Pick-and remove system and method for emissive display repair
US10319878B2 (en) 2014-10-31 2019-06-11 eLux, Inc. Stratified quantum dot phosphor structure
US10543486B2 (en) 2014-10-31 2020-01-28 eLux Inc. Microperturbation assembly system and method
US10418527B2 (en) 2014-10-31 2019-09-17 eLux, Inc. System and method for the fluidic assembly of emissive displays
US10236279B2 (en) 2014-10-31 2019-03-19 eLux, Inc. Emissive display with light management system
JP6591254B2 (ja) * 2015-10-16 2019-10-16 スタンレー電気株式会社 半導体発光装置、及び、半導体発光装置の製造方法
JP6602197B2 (ja) * 2015-12-21 2019-11-06 スタンレー電気株式会社 半導体発光装置、及び、半導体発光装置の製造方法
TWI681508B (zh) 2016-02-25 2020-01-01 愛爾蘭商艾克斯瑟樂普林特有限公司 有效率地微轉印微型裝置於大尺寸基板上
EP3223306B1 (en) * 2016-03-24 2020-08-19 Technische Hochschule Ingolstadt Semiconductor package
US10600671B2 (en) 2016-11-15 2020-03-24 X-Celeprint Limited Micro-transfer-printable flip-chip structures and methods
US10395966B2 (en) 2016-11-15 2019-08-27 X-Celeprint Limited Micro-transfer-printable flip-chip structures and methods
TWI739949B (zh) 2016-11-15 2021-09-21 愛爾蘭商艾克斯展示公司技術有限公司 微轉印可印刷覆晶結構及方法
US11024608B2 (en) 2017-03-28 2021-06-01 X Display Company Technology Limited Structures and methods for electrical connection of micro-devices and substrates
JP6739390B2 (ja) * 2017-03-30 2020-08-12 富士フイルム株式会社 有機ｅｌ画像表示装置の製造方法
EP3462489B1 (en) * 2017-09-29 2021-05-26 Facebook Technologies, LLC Mesa shaped micro light emitting diode with bottom n-contact
JP2021506108A (ja) * 2017-12-04 2021-02-18 トンシュー グループ カンパニー リミテッドＴｕｎｇｈｓｕ Ｇｒｏｕｐ Ｃｏ．， Ｌｔｄ． マイクロｌｅｄデバイス用上部基板、マイクロｌｅｄデバイス及びマイクロｌｅｄ表示装置
US10418510B1 (en) 2017-12-22 2019-09-17 Facebook Technologies, Llc Mesa shaped micro light emitting diode with electroless plated N-contact
US12002910B2 (en) 2018-10-09 2024-06-04 Sony Corporation Display device
KR102877921B1 (ko) * 2020-02-20 2025-10-30 삼성디스플레이 주식회사 표시 장치
KR102437208B1 (ko) * 2021-03-03 2022-08-30 웨이브로드 주식회사 반도체 발광소자를 지지 기판으로 이전하는 방법
WO2025222495A1 (zh) * 2024-04-26 2025-10-30 汕头超声显示器技术有限公司 Led阵列装置及其制造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0818105A (ja) * 1994-06-28 1996-01-19 Mitsubishi Chem Corp 発光装置
JPH11126037A (ja) * 1997-10-23 1999-05-11 Futaba Corp 半導体表示装置及びその製造方法
JP3610787B2 (ja) * 1998-03-24 2005-01-19 セイコーエプソン株式会社 半導体チップの実装構造体、液晶装置及び電子機器
US6280559B1 (en) * 1998-06-24 2001-08-28 Sharp Kabushiki Kaisha Method of manufacturing color electroluminescent display apparatus and method of bonding light-transmitting substrates
JP3613098B2 (ja) * 1998-12-21 2005-01-26 セイコーエプソン株式会社 回路基板ならびにそれを用いた表示装置および電子機器
US6932516B2 (en) * 2000-07-19 2005-08-23 Canon Kabushiki Kaisha Surface optical device apparatus, method of fabricating the same, and apparatus using the same
AU2003275662A1 (en) * 2002-10-25 2004-05-13 Moriyama Sangyo Kabushiki Kaisha Light-emitting module
JP4082242B2 (ja) 2003-03-06 2008-04-30 ソニー株式会社 素子転写方法
JP4100203B2 (ja) 2003-03-14 2008-06-11 ソニー株式会社 素子転写方法
AU2005232074A1 (en) * 2004-03-29 2005-10-20 LumaChip, Inc. Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
JP4281678B2 (ja) * 2004-11-29 2009-06-17 セイコーエプソン株式会社 電気光学装置の製造方法及び画像形成装置

Similar Documents

Publication Publication Date Title
JP2008141026A5 (enExample)
KR102089246B1 (ko) 플렉서블 디스플레이 장치 및 플렉서블 디스플레이 장치의 제조방법
US7781794B2 (en) Resin sheet for encapsulating optical semiconductor element and optical semiconductor device
TWI457875B (zh) 顯示裝置及其製造方法
WO2018219129A1 (zh) 胶膜及其制备方法、柔性显示模组
JP2019071471A (ja) 発光装置の製造方法
WO2009037797A1 (ja) 表示装置の製造方法及び積層構造体
JP5078644B2 (ja) 光半導体素子封止用樹脂シートおよび光半導体装置
CN106449699A (zh) 柔性显示装置
CN105874617A (zh) 具有磷光体转换器的无胶发光器件
WO2015014036A1 (zh) 柔性有机发光二极管显示器及其制备方法
CN103180945B (zh) 用于制造发光器件的层压支撑膜及其制造方法
WO2018054118A1 (zh) 柔性显示面板及其制造方法以及柔性显示装置
CN101997023A (zh) 电光学装置、电子设备、电光学装置的制造方法
JP2016538689A5 (enExample)
CN110391165B (zh) 转移载板与晶粒载板
CN106935720A (zh) 显示基板、显示面板、显示设备和制造其的方法
JP6722595B2 (ja) フレキシブル表示パネル、その製造方法、及び該フレキシブル表示パネルを形成するための装置
CN112599538A (zh) 柔性显示屏、其制备方法、及柔性显示装置
CN111583807B (zh) 显示面板和显示装置
CN114167636B (zh) 一种显示模组、显示装置、可穿戴装置及制作方法
JP6688374B2 (ja) 導電性フィルム、光電半導体装置及びその製造方法
US20170231100A1 (en) Circuit board structure and method for manufacturing the same
TWI778885B (zh) 光學膠膜片結構、拼接式顯示模組以及顯示模組的製造方法
JP2009065015A5 (enExample)