JP2008124008A5 - - Google Patents
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- Publication number
- JP2008124008A5 JP2008124008A5 JP2007267304A JP2007267304A JP2008124008A5 JP 2008124008 A5 JP2008124008 A5 JP 2008124008A5 JP 2007267304 A JP2007267304 A JP 2007267304A JP 2007267304 A JP2007267304 A JP 2007267304A JP 2008124008 A5 JP2008124008 A5 JP 2008124008A5
- Authority
- JP
- Japan
- Prior art keywords
- mold
- led
- led unit
- metal plate
- translucent member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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- 229910052751 metal Inorganic materials 0.000 claims description 113
- 239000002184 metal Substances 0.000 claims description 113
- 238000004519 manufacturing process Methods 0.000 claims description 18
- 230000007246 mechanism Effects 0.000 claims description 18
- 230000002093 peripheral effect Effects 0.000 claims description 18
- 239000011265 semifinished product Substances 0.000 claims description 15
- 238000000465 moulding Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 9
- 229920003002 synthetic resin Polymers 0.000 claims description 7
- 239000000057 synthetic resin Substances 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 4
- 239000000047 product Substances 0.000 claims description 4
- 238000005452 bending Methods 0.000 claims description 3
- 230000003014 reinforcing effect Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 description 12
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 9
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 238000009826 distribution Methods 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000004907 flux Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000001579 optical reflectometry Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007267304A JP2008124008A (ja) | 2006-10-18 | 2007-10-15 | Ｌｅｄユニット、ｌｅｄユニットの製造方法、及びｌｅｄユニットを用いた天井用照明器具 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006310763 | 2006-10-18 | ||
| JP2007267304A JP2008124008A (ja) | 2006-10-18 | 2007-10-15 | Ｌｅｄユニット、ｌｅｄユニットの製造方法、及びｌｅｄユニットを用いた天井用照明器具 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009201174A Division JP4430737B2 (ja) | 2006-10-18 | 2009-09-01 | Ｌｅｄユニットの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008124008A JP2008124008A (ja) | 2008-05-29 |
| JP2008124008A5 true JP2008124008A5 (https=) | 2009-08-13 |
Family
ID=39508500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007267304A Withdrawn JP2008124008A (ja) | 2006-10-18 | 2007-10-15 | Ｌｅｄユニット、ｌｅｄユニットの製造方法、及びｌｅｄユニットを用いた天井用照明器具 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2008124008A (https=) |
Families Citing this family (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5682742B2 (ja) * | 2009-05-08 | 2015-03-11 | 東芝ライテック株式会社 | 電源装置及び照明装置 |
| JP2011014316A (ja) * | 2009-06-30 | 2011-01-20 | Sharp Corp | 照明装置 |
| JP5431818B2 (ja) * | 2009-07-21 | 2014-03-05 | シチズン電子株式会社 | 発光ダイオード光源装置 |
| JP5507313B2 (ja) * | 2010-04-05 | 2014-05-28 | スタンレー電気株式会社 | 発光装置の製造方法 |
| JP4676563B1 (ja) * | 2010-04-11 | 2011-04-27 | 幸春 濱口 | 照明器具一体のｌｅｄ照明装置。 |
| JP2011247031A (ja) * | 2010-05-28 | 2011-12-08 | Shingo Denzai Co Ltd | 内照式標識の交換用ｌｅｄ照明装置及び内照式標識 |
| JP5842440B2 (ja) * | 2011-01-11 | 2016-01-13 | 東芝ライテック株式会社 | 照明器具 |
| JP5919505B2 (ja) * | 2011-08-24 | 2016-05-18 | パナソニックＩｐマネジメント株式会社 | 照明器具 |
| JP5785041B2 (ja) * | 2011-09-06 | 2015-09-24 | パナソニックＩｐマネジメント株式会社 | 照明器具 |
| KR101412011B1 (ko) * | 2011-12-06 | 2014-06-27 | 엘이디라이텍(주) | 발광소자 어레이 및 이를 포함하는 조명장치 |
| JP2013211128A (ja) * | 2012-03-30 | 2013-10-10 | Cho Yu Ryo | 全方向性出射ランプ及びそのシステム |
| KR101329889B1 (ko) * | 2012-07-13 | 2013-11-15 | 주식회사 필립인텍스 | 엘이디가 장착된 써크라인 조명등 장치 |
| JP6066468B2 (ja) * | 2012-07-13 | 2017-01-25 | アイリスオーヤマ株式会社 | Ｌｅｄ照明器具 |
| JP5999391B2 (ja) | 2012-12-13 | 2016-09-28 | パナソニックＩｐマネジメント株式会社 | 発光装置、照明用光源及び照明装置 |
| JP2013165079A (ja) * | 2013-05-29 | 2013-08-22 | Toshiba Lighting & Technology Corp | 照明器具 |
| JP2015050205A (ja) * | 2013-08-29 | 2015-03-16 | 東芝ライテック株式会社 | 発光モジュールおよび照明装置 |
| CN103629572A (zh) * | 2013-10-24 | 2014-03-12 | 湖北诺亚光电科技有限公司 | 一种大功率led灯散热方法及散热装置 |
| CN103542298B (zh) * | 2013-10-28 | 2016-03-23 | 汇高（广州）电子有限公司 | 一种生产效率高的led日光管封装结构 |
| JP5737599B2 (ja) * | 2014-06-11 | 2015-06-17 | 東芝ライテック株式会社 | 照明器具 |
| JP2014194957A (ja) * | 2014-07-04 | 2014-10-09 | Toshiba Lighting & Technology Corp | 発光装置及び照明器具 |
| JP5888624B2 (ja) * | 2014-07-04 | 2016-03-22 | 東芝ライテック株式会社 | 照明器具 |
| JP5888623B2 (ja) * | 2014-07-04 | 2016-03-22 | 東芝ライテック株式会社 | 照明器具 |
| JP5888625B2 (ja) * | 2014-07-04 | 2016-03-22 | 東芝ライテック株式会社 | 照明器具 |
| CN104406070B (zh) * | 2014-11-19 | 2017-01-11 | 广州荣基能亮节能科技有限公司 | 一种三维发光的led球泡灯及其制备方法 |
| JP6164437B2 (ja) * | 2016-02-22 | 2017-07-19 | 東芝ライテック株式会社 | 発光装置及び照明器具 |
| JP6264714B2 (ja) * | 2016-04-26 | 2018-01-24 | 東芝ライテック株式会社 | 照明器具 |
| JP6191894B2 (ja) * | 2016-04-26 | 2017-09-06 | 東芝ライテック株式会社 | 照明器具 |
| CN106287442B (zh) * | 2016-10-11 | 2019-06-11 | 欧普照明股份有限公司 | 安装底座、连接基座、光源模组及照明设备 |
| CN106287443B (zh) * | 2016-10-11 | 2019-06-11 | 欧普照明股份有限公司 | 安装底座、连接基座、光源模组及照明设备 |
| JP6369606B2 (ja) * | 2017-06-22 | 2018-08-08 | 東芝ライテック株式会社 | 照明器具 |
| JP6886395B2 (ja) * | 2017-12-20 | 2021-06-16 | 東芝ライテック株式会社 | 照明器具 |
| JP6646881B2 (ja) * | 2018-07-10 | 2020-02-14 | 東芝ライテック株式会社 | 照明器具 |
| JP6960098B2 (ja) * | 2018-07-10 | 2021-11-05 | 東芝ライテック株式会社 | 照明器具 |
| JP7231596B2 (ja) * | 2020-10-26 | 2023-03-01 | 東芝ライテック株式会社 | 照明器具 |
| JP2021044258A (ja) * | 2020-12-09 | 2021-03-18 | 東芝ライテック株式会社 | 照明器具 |
-
2007
- 2007-10-15 JP JP2007267304A patent/JP2008124008A/ja not_active Withdrawn
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