JP2015050205A - 発光モジュールおよび照明装置 - Google Patents
発光モジュールおよび照明装置 Download PDFInfo
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- JP2015050205A JP2015050205A JP2013178631A JP2013178631A JP2015050205A JP 2015050205 A JP2015050205 A JP 2015050205A JP 2013178631 A JP2013178631 A JP 2013178631A JP 2013178631 A JP2013178631 A JP 2013178631A JP 2015050205 A JP2015050205 A JP 2015050205A
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- light emitting
- emitting elements
- leds
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- blue
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
- F21V3/062—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being plastics
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
- F21Y2105/12—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the geometrical disposition of the light-generating elements, e.g. arranging light-generating elements in differing patterns or densities
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2113/00—Combination of light sources
- F21Y2113/10—Combination of light sources of different colours
- F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
Abstract
【解決手段】発光モジュール10は、複数の青色LED121と、青色LED121とは異なる色で発光する複数の赤色LED122と、を具備する。複数の青色LED121および複数の赤色LED122は、予め定められた複数の列に並べて基板上に配置されている。複数の青色LED121のそれぞれは、複数の列のそれぞれにおいて、隣接して配置される数が、予め定められた数以下となるように並べられている。複数の列の中には、青色LED121が隣接して並べられている数が、他の列と異なる列が存在する。
【選択図】図4
Description
図1は、実施形態に係る発光モジュールを装着した照明装置の構成の一例を示す図である。図1に示すように、本実施形態に係る照明装置1は、発光モジュール10と、本体11と、口金部材12と、アイレット部13と、カバー14と、制御部15と、電気配線16aと、電気配線16bとを有する。発光モジュール10は、基板110を有する。基板110は、低熱伝導率のセラミックス、例えば、アルミナや、窒化ケイ素や、酸化ケイ素や、アルミニウムなどにより形成され、本体11の上面11aに配置される。
図2は、実施形態に係る発光モジュールの構成の一例を示す図である。図2は、図1において、矢印A方向から見た場合の発光モジュール10の構成の一例を示す上面図である。図2に示すように、基板110の配置面110aには、複数の青色LED121および複数の赤色LED122が配置されている。
図3は、実施形態に係る発光モジュールの電気配線の一例を示す図である。複数の青色LED121および複数の赤色LED122は、図3に示すように、基板110上の複数の領域18a〜18c(図3の例では3つの領域)のそれぞれに配置されている。それぞれの領域18a〜18c内において、複数の青色LED121および複数の赤色LED122は、ボンディングワイヤ172により直列に接続されている。
図4は、実施形態に係る青色LEDおよび赤色LEDの配列を説明するための概念図である。本実施形態における青色LED121および赤色LED122は、例えば図4に示すように、基板110の配置面110a上に格子状の配列で並べて配置されている。なお、青色LED121および赤色LED122の配置は、格子状以外にも、放射状、同心円状、またはこれらの組み合わせの配置であってもよい。
図5は、実施形態に係る発光モジュールが発する光の放射方向を説明するための概念図である。図5は、図2のB−B断面の一部を拡大したものである。樹脂140には、黄色蛍光体141が含まれている。青色LED121は、青色系の光を発する。黄色蛍光体141は、青色LED121の光により励起されて、黄色系の光を発する。青色LED121が発する青色系の光と、黄色蛍光体141が発する黄色系の光とで、発光モジュール10は、全体として白色光を発する。
10 発光モジュール
121 青色LED
122 赤色LED
Claims (6)
- 複数の第一の発光素子と;
前記第一の発光素子とは異なる色で発光する複数の第二の発光素子と;
を具備し、
前記複数の第一の発光素子および前記複数の第二の発光素子は、予め定められた複数の列に並べて基板上に配置されており、
前記複数の第一の発光素子のそれぞれは、前記複数の列のそれぞれにおいて、隣接して配置される数が、予め定められた数以下となるように並べられており、
前記複数の列の中には、前記第一の発光素子が隣接して並べられている数が、他の列と異なる列が存在する発光モジュール。 - 前記複数の第一の発光素子および前記複数の第二の発光素子は、
前記基板上の複数の領域のそれぞれに配置されており、
それぞれの前記領域間において、配置される前記第一の発光素子および前記第二の発光素子の数が同数であり、
それぞれの前記領域間で、前記複数の第一の発光素子および前記複数の第二の発光素子が同じ配置で並べられている請求項1に記載の発光モジュール。 - それぞれの前記領域内の前記複数の第一の発光素子および前記複数の第二の発光素子は、電気的に直列に接続されている請求項2に記載の発光モジュール。
- それぞれの前記領域内には、直列に連続して接続されている前記複数の第一の発光素子からなる発光素子群が複数存在し、
前記複数の発光素子群の中には、連続して接続されている前記複数の第一の発光素子の数が異なる発光素子群が存在する請求項3に記載の発光モジュール。 - 前記基板上に設けられ、前記複数の第一の発光素子および前記複数の第二の発光素子のそれぞれに電力を供給する配線パターンと;
前記複数の第一の発光素子および前記複数の第二の発光素子を覆うように形成された封止体と;
前記封止体を囲む堰止め部材と;
をさらに具備し、
前記堰止め部材の少なくとも一部は、
前記配線パターン上に配設されている請求項1から4のいずれか一項に記載の発光モジュール。 - 請求項1から5のいずれか一項に記載の発光モジュールと;
前記発光モジュールの電源を制御する電源制御部と;
を具備する照明装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013178631A JP2015050205A (ja) | 2013-08-29 | 2013-08-29 | 発光モジュールおよび照明装置 |
EP14160416.5A EP2843704A1 (en) | 2013-08-29 | 2014-03-18 | Light emitting module and lighting device |
US14/219,246 US20150060900A1 (en) | 2013-08-29 | 2014-03-19 | Light Emitting Module and Lighting Device |
CN201420136352.5U CN203880434U (zh) | 2013-08-29 | 2014-03-24 | 发光模块及照明装置 |
Applications Claiming Priority (1)
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JP2013178631A JP2015050205A (ja) | 2013-08-29 | 2013-08-29 | 発光モジュールおよび照明装置 |
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JP2015050205A true JP2015050205A (ja) | 2015-03-16 |
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JP2013178631A Pending JP2015050205A (ja) | 2013-08-29 | 2013-08-29 | 発光モジュールおよび照明装置 |
Country Status (4)
Country | Link |
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US (1) | US20150060900A1 (ja) |
EP (1) | EP2843704A1 (ja) |
JP (1) | JP2015050205A (ja) |
CN (1) | CN203880434U (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150260351A1 (en) * | 2014-03-14 | 2015-09-17 | Panasonic Intellectual Property Management Co., Ltd. | Light-emitting device, illumination light source, and illumination device |
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-
2013
- 2013-08-29 JP JP2013178631A patent/JP2015050205A/ja active Pending
-
2014
- 2014-03-18 EP EP14160416.5A patent/EP2843704A1/en not_active Withdrawn
- 2014-03-19 US US14/219,246 patent/US20150060900A1/en not_active Abandoned
- 2014-03-24 CN CN201420136352.5U patent/CN203880434U/zh not_active Expired - Fee Related
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JP2008124008A (ja) * | 2006-10-18 | 2008-05-29 | Nobuichi Tsubota | Ledユニット、ledユニットの製造方法、及びledユニットを用いた天井用照明器具 |
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US20150260351A1 (en) * | 2014-03-14 | 2015-09-17 | Panasonic Intellectual Property Management Co., Ltd. | Light-emitting device, illumination light source, and illumination device |
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Also Published As
Publication number | Publication date |
---|---|
CN203880434U (zh) | 2014-10-15 |
US20150060900A1 (en) | 2015-03-05 |
EP2843704A1 (en) | 2015-03-04 |
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