JP2008098225A5 - - Google Patents
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- Publication number
- JP2008098225A5 JP2008098225A5 JP2006274897A JP2006274897A JP2008098225A5 JP 2008098225 A5 JP2008098225 A5 JP 2008098225A5 JP 2006274897 A JP2006274897 A JP 2006274897A JP 2006274897 A JP2006274897 A JP 2006274897A JP 2008098225 A5 JP2008098225 A5 JP 2008098225A5
- Authority
- JP
- Japan
- Prior art keywords
- region
- slit
- vias
- semiconductor device
- slit vias
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 2
- 229910052721 tungsten Inorganic materials 0.000 claims 2
- 239000010937 tungsten Substances 0.000 claims 2
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006274897A JP2008098225A (ja) | 2006-10-06 | 2006-10-06 | 半導体装置 |
| US11/869,025 US20080083923A1 (en) | 2006-10-06 | 2007-10-09 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006274897A JP2008098225A (ja) | 2006-10-06 | 2006-10-06 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008098225A JP2008098225A (ja) | 2008-04-24 |
| JP2008098225A5 true JP2008098225A5 (https=) | 2008-07-03 |
Family
ID=39274351
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006274897A Pending JP2008098225A (ja) | 2006-10-06 | 2006-10-06 | 半導体装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20080083923A1 (https=) |
| JP (1) | JP2008098225A (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009259967A (ja) * | 2008-04-15 | 2009-11-05 | Nec Corp | 配線構造、半導体装置及び半導体装置の製造方法 |
| JP5353313B2 (ja) * | 2009-03-06 | 2013-11-27 | 富士通セミコンダクター株式会社 | 半導体装置 |
| IT1400096B1 (it) | 2010-05-12 | 2013-05-17 | St Microelectronics Srl | Processo di fabbricazione di circuiti elettronici integrati e circuiti cosi' ottenuti |
| JP2016195221A (ja) * | 2015-04-01 | 2016-11-17 | 住友電工デバイス・イノベーション株式会社 | 半導体装置及び半導体装置の測定方法 |
| JP6558969B2 (ja) * | 2015-06-10 | 2019-08-14 | 三菱電機株式会社 | 半導体チップ、半導体装置およびそれらの製造方法 |
| JP7680913B2 (ja) * | 2021-09-01 | 2025-05-21 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10000759C1 (de) * | 2000-01-11 | 2001-05-23 | Infineon Technologies Ag | Verfahren zur Erzeugung von Justiermarken |
| JP2001338955A (ja) * | 2000-05-29 | 2001-12-07 | Texas Instr Japan Ltd | 半導体装置及びその製造方法 |
| US6784556B2 (en) * | 2002-04-19 | 2004-08-31 | Kulicke & Soffa Investments, Inc. | Design of interconnection pads with separated probing and wire bonding regions |
| JP4242336B2 (ja) * | 2004-02-05 | 2009-03-25 | パナソニック株式会社 | 半導体装置 |
| JP2005251832A (ja) * | 2004-03-02 | 2005-09-15 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
| JP4780920B2 (ja) * | 2004-03-02 | 2011-09-28 | パナソニック株式会社 | 半導体素子電極パッド構造 |
| JP4803966B2 (ja) * | 2004-03-31 | 2011-10-26 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP4674522B2 (ja) * | 2004-11-11 | 2011-04-20 | 株式会社デンソー | 半導体装置 |
-
2006
- 2006-10-06 JP JP2006274897A patent/JP2008098225A/ja active Pending
-
2007
- 2007-10-09 US US11/869,025 patent/US20080083923A1/en not_active Abandoned
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