JP2008078684A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2008078684A5 JP2008078684A5 JP2007318155A JP2007318155A JP2008078684A5 JP 2008078684 A5 JP2008078684 A5 JP 2008078684A5 JP 2007318155 A JP2007318155 A JP 2007318155A JP 2007318155 A JP2007318155 A JP 2007318155A JP 2008078684 A5 JP2008078684 A5 JP 2008078684A5
- Authority
- JP
- Japan
- Prior art keywords
- gan
- layer
- forming
- crystal defects
- gan layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000013078 crystal Substances 0.000 claims 10
- 230000007547 defect Effects 0.000 claims 10
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims 7
- 238000004519 manufacturing process Methods 0.000 claims 7
- 238000000034 method Methods 0.000 claims 6
- 238000005253 cladding Methods 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 claims 3
- 229910052710 silicon Inorganic materials 0.000 claims 3
- 239000010703 silicon Substances 0.000 claims 3
- 229910052594 sapphire Inorganic materials 0.000 claims 2
- 239000010980 sapphire Substances 0.000 claims 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007318155A JP4760821B2 (ja) | 2007-12-10 | 2007-12-10 | 半導体素子の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007318155A JP4760821B2 (ja) | 2007-12-10 | 2007-12-10 | 半導体素子の製造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002331901A Division JP2004165550A (ja) | 2002-11-15 | 2002-11-15 | 窒化物半導体素子 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008078684A JP2008078684A (ja) | 2008-04-03 |
| JP2008078684A5 true JP2008078684A5 (https=) | 2009-07-30 |
| JP4760821B2 JP4760821B2 (ja) | 2011-08-31 |
Family
ID=39350350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007318155A Expired - Fee Related JP4760821B2 (ja) | 2007-12-10 | 2007-12-10 | 半導体素子の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4760821B2 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2743981A1 (en) * | 2009-10-30 | 2014-06-18 | Imec | Method of manufacturing an integrated semiconductor substrate structure |
| JP2015018840A (ja) | 2013-07-08 | 2015-01-29 | 株式会社東芝 | 半導体発光素子 |
| US20250112439A1 (en) * | 2022-01-27 | 2025-04-03 | Kyocera Corporation | Manufacturing method and manufacturing apparatus for laser element, laser element, and electronic device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2828002B2 (ja) * | 1995-01-19 | 1998-11-25 | 松下電器産業株式会社 | 半導体発光素子およびその製造方法 |
| JP3651260B2 (ja) * | 1997-10-01 | 2005-05-25 | 日亜化学工業株式会社 | 窒化物半導体素子 |
-
2007
- 2007-12-10 JP JP2007318155A patent/JP4760821B2/ja not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5571503B2 (ja) | 基板構造体及びその製造方法 | |
| JP4471726B2 (ja) | 単結晶サファイア基板の製造方法 | |
| US9355840B2 (en) | High quality devices growth on pixelated patterned templates | |
| JP2009123717A5 (https=) | ||
| JP2009283807A (ja) | 窒化物半導体層を含む構造体、窒化物半導体層を含む複合基板、及びこれらの製造方法 | |
| TW201225171A (en) | Method of manufacturing a semiconductor device | |
| KR20120004159A (ko) | 기판구조체 및 그 제조방법 | |
| JP5148729B2 (ja) | 窒化物半導体素子の製造方法 | |
| TW201339086A (zh) | 外延結構體 | |
| TW201339085A (zh) | 外延襯底 | |
| TW201340395A (zh) | 外延襯底的製備方法 | |
| JP2009038377A (ja) | Iii族窒化物半導体発光素子 | |
| JP2008078684A5 (https=) | ||
| WO2006041134A1 (ja) | 窒化化合物半導体素子およびその製造方法 | |
| JP5906108B2 (ja) | フォトニック結晶の製造方法及び面発光レーザの製造方法 | |
| KR101357271B1 (ko) | 반도체 재료를 에피택셜 성장시키기 위한 패터닝된 기판 및 기판을 패터닝하기 위한 방법 | |
| JP4283840B2 (ja) | Iii族窒化物半導体の製造方法 | |
| KR101392366B1 (ko) | 질화물 발광 다이오드 제조방법 | |
| JP2009184860A (ja) | 基板およびエピタキシャルウェハ | |
| TWI386981B (zh) | 氮化物半導體結構及其製造方法 | |
| JP2019036662A (ja) | 発光素子の製造方法 | |
| JP5450682B2 (ja) | 窒化物半導体素子の製造方法 | |
| TWI508325B (zh) | 基材表面圖案化方法及其半導體發光元件 | |
| KR101323778B1 (ko) | 반도체 발광소자용 기판 및 이의 제조 방법 | |
| JP5450683B2 (ja) | 窒化物半導体素子の製造方法 |