JP2008060446A5 - - Google Patents

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Publication number
JP2008060446A5
JP2008060446A5 JP2006237389A JP2006237389A JP2008060446A5 JP 2008060446 A5 JP2008060446 A5 JP 2008060446A5 JP 2006237389 A JP2006237389 A JP 2006237389A JP 2006237389 A JP2006237389 A JP 2006237389A JP 2008060446 A5 JP2008060446 A5 JP 2008060446A5
Authority
JP
Japan
Prior art keywords
thin film
film resistor
conductive member
semiconductor device
connection hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006237389A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008060446A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006237389A priority Critical patent/JP2008060446A/ja
Priority claimed from JP2006237389A external-priority patent/JP2008060446A/ja
Publication of JP2008060446A publication Critical patent/JP2008060446A/ja
Publication of JP2008060446A5 publication Critical patent/JP2008060446A5/ja
Pending legal-status Critical Current

Links

JP2006237389A 2006-09-01 2006-09-01 半導体装置の製造方法及び半導体装置 Pending JP2008060446A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006237389A JP2008060446A (ja) 2006-09-01 2006-09-01 半導体装置の製造方法及び半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006237389A JP2008060446A (ja) 2006-09-01 2006-09-01 半導体装置の製造方法及び半導体装置

Publications (2)

Publication Number Publication Date
JP2008060446A JP2008060446A (ja) 2008-03-13
JP2008060446A5 true JP2008060446A5 (enExample) 2009-09-24

Family

ID=39242809

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006237389A Pending JP2008060446A (ja) 2006-09-01 2006-09-01 半導体装置の製造方法及び半導体装置

Country Status (1)

Country Link
JP (1) JP2008060446A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5616822B2 (ja) * 2011-03-03 2014-10-29 セイコーインスツル株式会社 半導体装置の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0555520A (ja) * 1991-08-26 1993-03-05 Sharp Corp 半導体装置の製造方法
JPH06232351A (ja) * 1993-01-30 1994-08-19 Sony Corp ＢｉＣＭＯＳ型半導体装置及びその製造方法
JP4446771B2 (ja) * 2004-03-23 2010-04-07 株式会社リコー 半導体装置
JP2007149965A (ja) * 2005-11-28 2007-06-14 Seiko Npc Corp 薄膜抵抗素子

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