JP2008023920A - 金型コア、金型コアの製造方法、パターン転写金型 - Google Patents

金型コア、金型コアの製造方法、パターン転写金型 Download PDF

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JP2008023920A
JP2008023920A JP2006201374A JP2006201374A JP2008023920A JP 2008023920 A JP2008023920 A JP 2008023920A JP 2006201374 A JP2006201374 A JP 2006201374A JP 2006201374 A JP2006201374 A JP 2006201374A JP 2008023920 A JP2008023920 A JP 2008023920A
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mold
mold core
pattern
plating layer
transfer
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JP2006201374A
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Japanese (ja)
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JP2008023920A5 (enExample
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Hisashi Kojima
久司 小嶋
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  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
JP2006201374A 2006-07-24 2006-07-24 金型コア、金型コアの製造方法、パターン転写金型 Pending JP2008023920A (ja)

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JP2008023920A true JP2008023920A (ja) 2008-02-07
JP2008023920A5 JP2008023920A5 (enExample) 2009-09-03

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010064412A (ja) * 2008-09-12 2010-03-25 Aida Eng Ltd 熱板装置及び熱転写プレス装置
JP2010115838A (ja) * 2008-11-12 2010-05-27 Toyota Motor Corp 金型、金型を用いた成形方法、及び、金型の製造方法
JP2010173280A (ja) * 2009-02-02 2010-08-12 Meiki Co Ltd 極薄成形品の成形金型および成形方法
EP3995247A4 (en) * 2019-07-04 2023-07-26 NGK Insulators, Ltd. CUPROBERYLLIUM ALLOY BONDED BODY AND METHOD FOR PRODUCTION THEREOF

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5712615A (en) * 1980-06-27 1982-01-22 Toshiba Corp Manufacture of block for record pressing mold
JPH10244560A (ja) * 1997-03-05 1998-09-14 Olympus Optical Co Ltd 射出成形用金型およびその製造方法
JPH1142650A (ja) * 1997-05-28 1999-02-16 Mitsubishi Eng Plast Kk 熱可塑性樹脂成形用の金型組立体及び成形品の製造方法
JPH1158473A (ja) * 1997-08-12 1999-03-02 Sekisui Chem Co Ltd 射出成形用金型
JP2001018229A (ja) * 1999-05-06 2001-01-23 Ono Sangyo Kk 合成樹脂成形用金型並びに金型温度調整装置及び金型温度調整方法
JP2001266416A (ja) * 2000-03-24 2001-09-28 Matsushita Electric Ind Co Ltd 光ディスク金型と光ディスク基板成形方法
JP2003014938A (ja) * 2001-04-12 2003-01-15 Mitsubishi Engineering Plastics Corp 透明樹脂製の導光板及びその成形方法、入れ子、金型組立体、並びに、面状光源装置
JP2004202731A (ja) * 2002-12-24 2004-07-22 Sumitomo Chem Co Ltd 大型導光板の製造方法
JP2005280278A (ja) * 2004-03-30 2005-10-13 Nissan Motor Co Ltd 入れ子構造を備える樹脂成形用金型および樹脂成形方法
JP2006137142A (ja) * 2004-11-15 2006-06-01 Konica Minolta Opto Inc 光学部品用金型

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5712615A (en) * 1980-06-27 1982-01-22 Toshiba Corp Manufacture of block for record pressing mold
JPH10244560A (ja) * 1997-03-05 1998-09-14 Olympus Optical Co Ltd 射出成形用金型およびその製造方法
JPH1142650A (ja) * 1997-05-28 1999-02-16 Mitsubishi Eng Plast Kk 熱可塑性樹脂成形用の金型組立体及び成形品の製造方法
JPH1158473A (ja) * 1997-08-12 1999-03-02 Sekisui Chem Co Ltd 射出成形用金型
JP2001018229A (ja) * 1999-05-06 2001-01-23 Ono Sangyo Kk 合成樹脂成形用金型並びに金型温度調整装置及び金型温度調整方法
JP2001266416A (ja) * 2000-03-24 2001-09-28 Matsushita Electric Ind Co Ltd 光ディスク金型と光ディスク基板成形方法
JP2003014938A (ja) * 2001-04-12 2003-01-15 Mitsubishi Engineering Plastics Corp 透明樹脂製の導光板及びその成形方法、入れ子、金型組立体、並びに、面状光源装置
JP2004202731A (ja) * 2002-12-24 2004-07-22 Sumitomo Chem Co Ltd 大型導光板の製造方法
JP2005280278A (ja) * 2004-03-30 2005-10-13 Nissan Motor Co Ltd 入れ子構造を備える樹脂成形用金型および樹脂成形方法
JP2006137142A (ja) * 2004-11-15 2006-06-01 Konica Minolta Opto Inc 光学部品用金型

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010064412A (ja) * 2008-09-12 2010-03-25 Aida Eng Ltd 熱板装置及び熱転写プレス装置
JP2010115838A (ja) * 2008-11-12 2010-05-27 Toyota Motor Corp 金型、金型を用いた成形方法、及び、金型の製造方法
JP2010173280A (ja) * 2009-02-02 2010-08-12 Meiki Co Ltd 極薄成形品の成形金型および成形方法
EP3995247A4 (en) * 2019-07-04 2023-07-26 NGK Insulators, Ltd. CUPROBERYLLIUM ALLOY BONDED BODY AND METHOD FOR PRODUCTION THEREOF
US11761071B2 (en) 2019-07-04 2023-09-19 Ngk Insulators, Ltd. Beryllium copper alloy bonded body and production method therefor

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