JP2008023616A - Capsule for feeding abrasive grain - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a capsule for feeding abrasive grains capable of preventing the environment deterioration caused by dispersion of powder dust and smoothly feeding the abrasive grains. <P>SOLUTION: This capsule 100 for feeding the abrasive grains is formed by detachably mounting a lid body 110 for closing an opening part on the opening part of a tubular capsule body 101 and is retained in the upper part of a water storage tank with the lid body 110 disposed downward. The lid body 110 is provided with a water supply plug 114 supplying water to the interior of the capsule 100 along the tubular inner wall and generating a tornado-like water flow, and a mixed water discharge part 113 formed in a position equivalent to the center of the tornado-like water flow and downward discharging the abrasive grains in its inside with the fed water. The mixed water discharge part 113 closed by the abrasive grains is opened by the generation of the tornado-like water flow and the mixed water containing the abrasive grains are smoothly discharged from the mixed water discharge part 113 without scattering of the powder dust. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a capsule for supplying abrasive grains, which is suitable for use when replenishing abrasive grains to a water jet machining apparatus for cutting a workpiece by jetting machining water mixed with abrasive grains at a high pressure.

  Devices such as semiconductor chips are singulated by forming electronic circuits such as ICs and LSIs in a large number of grid-like rectangular areas partitioned on the surface of the wafer, and cutting the dividing lines at the boundaries of the rectangular areas. Has been. In order to cut the wafer, a dicing device for cutting with a cutting blade or a laser device for irradiating a laser beam is used. The singulated device may be packaged by a packaging technology called CSP (Chip Size Package) that can be miniaturized.

  The CSP stacks and mounts devices on each lead frame of a substrate made of a copper plate or the like in which a large number of device-sized lead frames are partitioned, and seals these devices with a resin to manufacture a CSP substrate. The CSP substrate is obtained by cutting each lead frame. In the CSP substrate cutting, the dicing apparatus is generally used. However, since a burr generated by cutting may cause a short circuit of a lead terminal and deteriorate the quality, a water jet processing apparatus has been used in recent years. (Patent Document 1, etc.).

JP 2005-230994 A

  The water jet machining apparatus described in the above publication sets a workpiece directly under an injection nozzle, and at a high pressure directs processing water in which abrasive grains are mixed with water at a predetermined mixing rate from the injection nozzle toward the workpiece. While jetting, the jet nozzle is relatively moved in the horizontal direction with respect to the workpiece, and the workpiece is cut along a predetermined division line. A buffer tank (water tank) that receives high-pressure processed water, that is, a water jet, and attenuates the water force is disposed below the workpiece. By the way, although it is economically desirable to circulate and reuse the processing water containing abrasive grains, the abrasive grains that have been cut through the workpiece and pierced are used in a particle size (for example, about 50 μm). However, the mixing ratio of usable abrasive grains becomes low and becomes insufficient.

  Therefore, it is necessary to replenish abrasive grains to the circulated processing water, and the buffer tank is considered to be appropriate as a replenishment place. However, if the abrasive grains are put in the buffer tank as they are, there will be a problem that fine dust will rise and cause environmental degradation, and this problem will be avoided by all means, especially in the semiconductor chip manufacturing environment where manufacturing in a clean environment is required. Should be.

  Accordingly, an object of the present invention is to provide a capsule for supplying abrasive grains, in which environmental deterioration due to dust scattering is prevented and abrasive grains can be supplied smoothly.

  The present invention includes a holding means for holding a workpiece, and a processing water injection means for performing processing by injecting, from an injection nozzle, processing water in which abrasive grains and water are mixed into the workpiece held by the holding means. A capsule for supplying abrasive grains to be used in a water jet machining apparatus, comprising at least a buffer tank disposed immediately below the injection nozzle and receiving the machining water penetrating the workpiece to attenuate the momentum. A cylindrical capsule body that has an opening on one end side and is closed on the other end side, a lid that closes the opening, and a water supply section formed on the lid And a mixed water discharge part, wherein the water supply part is formed on the outer peripheral part of the lid body and supplies water along the cylindrical inner wall of the capsule body to generate a tornado state, and the mixing The water discharge part should coincide with the rotation center part of the tornado state It is characterized in that it is formed in the center portion of the lid member.

  According to the capsule for supplying abrasive grains of the present invention, the mixed water discharge part formed on the lid body is held in a downward direction, and water is supplied from the water supply part into the capsule for use. When water is not supplied, the abrasive grains are clogged in the mixed water discharge portion, and the abrasive grains are not easily discharged. However, when water is supplied from the water supply unit, a tornado-like water flow is generated in the capsule, and the abrasive grains also rise in a tornado shape, and the abrasive grains are separated from the mixed water discharge unit corresponding to the center of the tornado state, and the mixed water discharge unit Open. The abrasive grains will eventually fall away from the tornado-like water flow, and will be smoothly discharged from the mixed water discharge portion as mixed water with water. Since the abrasive grains contained in the capsule are discharged after being mixed with water, dust scattering at the time of discharge is suppressed and environmental degradation is prevented.

  ADVANTAGE OF THE INVENTION According to this invention, when supplying an abrasive grain to a water jet processing apparatus, there exists an effect that the environmental deterioration by the dust scattering of an abrasive grain is prevented and it can supply smoothly.

Hereinafter, an embodiment according to the present invention will be described with reference to the drawings.
[1] Configuration of Water Jet Processing Apparatus FIG. 1 shows a water jet processing apparatus according to an embodiment. In the drawing, horizontal X and Y directions orthogonal to each other and a Z direction which is a vertical direction are indicated by arrows. The water jet machining apparatus 1 holds a workpiece on a holding table (holding means) 10 that is movable in the X, Y, and Z directions, and a water jet (water jet) (from the injection nozzle 2 toward the held workpiece). High-pressure processing water in which abrasive grains are mixed with water) is sprayed and cut.

  The holding table 10 is attached to a rectangular parallelepiped fixed base 20 extending in the X direction via an X / Y / Z moving mechanism 3 including an X-axis moving base 30, a Z-axis moving base 40, and a Y-axis moving base 50. It has been. A pair of guide rails 21 extending in the longitudinal direction (X direction) are formed on one side surface of the fixed base 20, and an X-axis moving base 30 is slidably attached to the guide rails 21 in the X direction. .

  The X-axis movement base 30 is moved in the X direction along the guide rail 21 by the X-axis movement mechanism 31. The X-axis moving mechanism 31 includes a screw rod 32 that extends between the guide rails 21 and is rotatably supported by the fixed base 20 and extends in the X direction, and a pulse motor 33 that rotates the screw rod 32 forward and backward. ing. The screw rod 32 is screwed into and penetrates the X-axis moving base 30, and is rotatable but cannot be moved in the axial direction. When the pulse motor 33 of the X-axis moving mechanism 31 is actuated and the screw rod 32 rotates in one direction, the X-axis moving base 30 moves along the guide rail 21 in the X direction corresponding to the rotating direction. It has become.

  The Z-axis movement base 40 is attached to the X-axis movement base 30, and the Y-axis movement base 50 is attached to the Z-axis movement base 40. The attachment structure is such that the X-axis movement base 30 is attached to the fixed base 20. The moving mechanism is the same structure as that shown in FIG.

  The Z-axis movement base 40 is slidably attached to a pair of guide rails 34 formed in the X-axis movement base 30 and extending in the Z direction, and is moved up and down in the Z direction along the guide rails 34 by the Z-axis movement mechanism 41. It is done. The Z-axis moving mechanism 41 is rotatably supported by the X-axis moving base 30 and is screwed into the Z-axis moving base 40 to extend in the Z direction, and a pulse for rotating the screw rod 42 forward and backward. When the screw rod 42 is rotated by the pulse motor 43, the Z-axis movement base 40 moves (lifts) in the Z direction corresponding to the rotation direction.

  The Y-axis movement base 50 is slidably attached to a pair of guide rails 44 extending in the Y direction formed on the Z-axis movement base 40, and is moved in the Y direction along the guide rails 44 by the Y-axis movement mechanism 51. It is done. The Y-axis moving mechanism 51 is rotatably supported by the Z-axis moving base 40, is threaded into the Y-axis moving base 50 and extends in the Y direction, and a pulse for rotating the screw rod 52 forward and backward. When the screw rod 52 is rotated by the pulse motor 53, the Y-axis movement base 50 moves (lifts) in the Y direction corresponding to the rotation direction.

  A flat plate-like holding table 10 extending in the X direction is attached to the surface of the Y-axis movement base 50 opposite to the attachment side to the Z-axis movement base 40. A rectangular mounting port 11 that is long in the X direction is opened at the front end side of the holding table 10, and positioning pins 12 that protrude upward are provided at four corners around the mounting port 11. A workpiece is positioned on the holding table 10 using a positioning pin 12 through a jig described later. The workpiece is moved along the X direction by the X, Y, and Z moving mechanism 3 together with the holding table 10. It is moved in the Y direction and the Z direction. Above the holding table 10, the spray nozzle 2 is disposed with the water jet spray direction directed vertically downward. The injection nozzle 2 includes a water jet injection port having a diameter of about 200 μm, and is supported on the fixed base 20 via the nozzle support arm 4.

In the present embodiment, the CSP substrate 60 shown in FIG.
In the CSP substrate 60, a plurality (three in the illustrated example) of chip mounting blocks 62 are arranged in the longitudinal direction on the surface of a substrate 61 made of a rectangular copper plate or the like. A large number of CSPs (Chip Size Packages) 64 are partitioned in a grid pattern by 63. Each CSP 64 is formed by sealing a device laminated on a lead frame formed on a substrate 61 with a resin, and the CSP substrate 60 is lead along a planned division line 63 by the water jet processing apparatus 1. It is separated into pieces by cutting every frame.

  In order to cut the division line 63 of the CSP substrate 60, zigzag cutting that reciprocates in the width direction is performed, and then zigzag cutting that reciprocates in the longitudinal direction is performed. Note that this order may be reversed. The CSP substrate 60 is set on the holding table 10 with the longitudinal direction parallel to the X direction. In the case of zigzag cutting in the reciprocating width direction, the Y direction cutting jig 70Y shown in FIG. In the case of zigzag cutting in a reciprocating direction, the jig is held by the X-direction cutting jig 70X shown in FIG.

  A Y-direction cutting jig 70Y shown in FIG. 3 has a cover 72 hinged to one long edge of a rectangular holding plate 71 so as to be opened and closed. A hook 72 a is formed at the rotating end of the cover 72, and the cover 72 overlaps the holding plate 71 and closes by engaging the hook 72 a with a hook engaging recess 71 a formed on the holding plate 71. The state is maintained. In the center of the cover 72, an opening 72b that exposes a processing region of the CSP substrate 64 is formed, and the outer peripheral edge of the CSP substrate 64 is pressed against and held by the peripheral edge of the opening 72b.

  The central portion of the holding plate 71 is an area where the CSP substrate 60 is disposed, and in this area, a zigzag slit that reciprocates in the width direction of the holding plate 71 (the Y direction when set on the holding table 10). 71y is formed. The slit 71 y is a space through which the water jet passes, passes through the holding plate 71, and is formed corresponding to the planned division line 63 extending in the width direction of the CSP substrate 60. Further, pin holes 71 b into which the positioning pins 12 of the holding table 10 are fitted are formed at the four corners of the holding plate 71. The CSP substrate 60 is placed on the holding plate 71 with the division line 63 extending in the width direction aligned with the slit 71y extending in the width direction of the holding plate 71, and the Y-direction cutting jig 70Y is closed by closing the cover 72. Retained.

  The X-direction cutting jig 70X shown in FIG. 4 includes a holding plate 71 and a cover 72 similar to the Y-direction cutting jig 70Y, but is formed in the CSP substrate placement region of the holding plate 71. The only difference is that the slit 71x has a zigzag shape that reciprocates in the longitudinal direction of the holding plate 71 (X direction when set on the holding table 10). The rest of the configuration is the same as that of the Y-direction cutting jig 70Y. The CSP substrate 60 has a predetermined dividing line 63 extending in the longitudinal direction aligned with a slit 71x extending in the longitudinal direction of the holding plate 71 on the holding plate 71. The X-direction cutting jig 70X is held by closing the cover 72.

  These jigs 70X and 70Y are set on the holding table 10 of the water jet machining apparatus 1 with the pin holes 71b of the holding plate 71 fitted to the positioning pins 12. As shown in FIG. 1, a buffer tank 80 that receives a water jet ejected from the ejection nozzle 2 is disposed below the holding table 10. As shown in FIG. 5, the buffer tank 80 has a structure in which a water storage tank 82 lower than the drain tank 81 is provided in an outer drain tank 81, and a basket made of mesh is formed in the water tank 82. 83 is housed. The basket 83 is filled with an appropriate amount of a large number of hard spheres 84 that attenuate the water jet water. The hard sphere 84 is made of the same material as the abrasive used in the water jet, and the hard sphere has a particle size sufficiently larger than the abrasive particle size of about 50 μm. For example, alumina balls or zirconia balls having a particle size of about 3 to 8 mm are preferably used.

  The water jet sprayed from the spray nozzle 2 enters the water storage tank 82 and enters the water tank 82 or enters the water tank 84 or hits the hard sphere 84 to attenuate the water force. The processing water (water + abrasive grains) that has become the water jet accumulates in the water storage tank 82, passes through the outside of the basket 83, is discharged from the circulation port 85, and is reused. As described above, the abrasive grains mixed with the processing water have a particle diameter of about 50 μm, and the basket 83 has a mesh roughness through which such abrasive grains pass. By the way, some of the abrasive grains in the water jet are crushed by penetrating the workpiece or hitting the hard sphere 84, and become fine powder having a particle size of about 5 to 10 μm, for example. There is. The fine abrasive particles float on the water surface in the water storage tank 82, fall into the drainage tank 81 together with the overflowing water, and are sent from the drainage port 86 to a predetermined facility for disposal.

  Here, a processing water supply system for supplying the processing water to the injection nozzle 2 will be described with reference to FIG. A processing water circulation line (working water circulation path) 90 piped from the circulation port 85 of the water storage tank 82 is connected to the injection nozzle 2, and the injection nozzle 2 extends from the circulation port 85 in the middle of the processing water circulation line 90. A processing water refining tank 91, a processing water tank 92, and a pressure feed pump 93 are provided. The processing water tank 92 stores processing water in which abrasive grains are mixed with water at an appropriate mixing rate (for example, 50 g / L), and the processing water is pressurized by the pumping pump 93 and is supplied from the injection nozzle 2 to the water. It is designed to jet as a jet. The injection nozzle 2, the processing water tank 92, and the pressure feed pump 93 constitute the processing water injection means of the present invention. Then, the reusable processing water discharged from the circulation port 85 of the water storage tank 82 is cleaned by the processing water refining unit 91 and the abrasive grains having an inappropriate particle size are excluded, and usable abrasive grains are removed. The processed water is returned to the processed water tank 92.

  Since the abrasive grains in the processing water are crushed as described above and transferred to the drainage tank 81 and do not return to the processing water circulation line 90, the abrasive mixing ratio of the processing water gradually decreases as the water jet processing apparatus 1 is operated. Become. If the abrasive mixing ratio is not properly maintained, the cutting function by the water jet changes, so that it is necessary to replenish the abrasive grains. Therefore, in the present embodiment, the abrasive grains are replenished in the water storage tank 82 of the buffer tank 80 by the capsule 100 for supplying abrasive grains shown in FIG. 6, and the abrasive mixing ratio of the processing water is maintained in an appropriate range. .

[2] Configuration of Abrasive Grain Supply Capsule FIG. 6 shows a state where the abrasive grain supply capsule 100 is disassembled, and the capsule 100 is mainly composed of a cylindrical capsule body 101. The capsule body 101 has a bottomed cylindrical shape in which one end side in the longitudinal direction (direction orthogonal to the radial direction) is open and the other end side is closed, and a flange 102 is formed on the periphery of the opening. A disc-shaped lid 110 that closes the opening is detachably attached to the flange 102. A circular recess 111 is formed in the center of the back side of the lid 110 facing the opening of the capsule body 101, and an annular wall is thicker than the recess 111 around the recess 111. A convex portion 112 is formed. The size of the recess 111 is set such that the flange 102 of the capsule body 101 just fits. A plurality of screw holes 110a penetrating in the thickness direction are formed in the annular convex portion 112 at equally spaced locations in the circumferential direction.

  Reference numeral 120 in FIG. 6 denotes a clamping ring for fixing the lid. The sandwiching ring 120 has an outer diameter that is substantially the same as the outer diameter of the lid 110, and the inner diameter is set slightly larger than the outer diameter of the capsule body 101. The clamping ring 120 is formed with a plurality of screw holes 120a corresponding to the screw through holes 110a of the lid 110 and into which the screws 125 are screwed. Abrasive grains are accommodated in the capsule body 101 from the opening, and the lid 110 is fastened to the opening in a state where the abrasive grains are accommodated.

  The lid 110 is provided with a ring-shaped packing 129 on the outer periphery of the recess 111, the surface of the flange 102 is aligned with the packing 129, and is fitted in the recess 111, and the sandwiching ring 120 and the lid 110 that are passed through the capsule body 101. By sandwiching the flange 102 by the above, the screw 125 passed through the screw hole 110a of the lid 110 is screwed into the screw hole 120a of the clamp ring 120 and fastened, whereby the capsule 100 is mounted. Composed.

  A mixed water discharge portion 113 is formed at the center of the lid 110, and a water supply plug (water supply portion) 114 is attached to the outer peripheral portion of the recess 111 on the back surface. As shown in FIG. 8, on the front side (lower side in FIG. 8) of the lid 110, there are an abrasive discharge pipe 115 that leads to the mixed water discharge section 113 and a water introduction pipe 116 that leads to the water supply plug 114, respectively. It is connected. The water supply plug 114 has a nozzle 114a that injects water toward the tangential direction of the outer periphery of the lid 110 and slightly upward (in the direction of the capsule body 101) in FIG. A water supply line (not shown) is connected to the water introduction pipe 116, and water is supplied from the water supply line to the water supply plug 114 through the water introduction pipe 116. When water is supplied to the water supply plug 114 in a state where the lid 110 is attached to the capsule body 101, water is ejected from the nozzle 114a in a direction along the inner wall of the capsule body 101. A tornado-like water flow is generated along the inner wall of the castle.

  In the capsule 100, an amount of abrasive grains having an appropriate space such as about 1/2 of the capacity is accommodated and held above the water storage tank 82 with the mixed water discharge portion 113 facing downward. The Thus, in order to hold | maintain the capsule 100 above the water storage tank 82, an operator may carry it by hand and may mount it on a suitable stand. FIG. 7 shows a capsule-mounting stand 130 in which legs 132 are fixed to a ring base 131. The capsule 100 is placed on the ring stand 131 with the stand 130 placed on the water storage tank 82 and the abrasive discharge pipe 115 facing the water storage tank 82. In this way, the capsule 100 is held so that the abrasive discharge pipe 115 is positioned above the water storage tank 82 and the abrasive discharged from the abrasive discharge pipe 115 is directly input to the water storage tank 82.

[3] Operation of Water Jet Processing Device The above is the configuration of the water jet processing device 1 and the capsule 100 for supplying abrasive grains. Subsequently, the operation of dividing the CSP substrate 60 into individual CSPs 64 by the water jet processing device 1 will be described. To do.

  The CSP substrate 60 is held by the Y-direction cutting jig 70Y, and the pin hole is fitted to the positioning pin 12 with the held CSP substrate 60 disposed on the CSP substrate 60, and the CSP is cut via the Y-direction cutting jig 70Y. The substrate 60 is set on the holding table 10. Next, by appropriately moving the X-axis movement base 30 and the Y-axis movement base 50 of the X / Y / Z movement mechanism 3, the CSP substrate 60 is moved to a processing region below the injection nozzle 2 and further injected. One end of a zigzag-shaped division planned line 63 reciprocating in the width direction of the CSP substrate 60, that is, the Y direction is aligned with the target of the water jet ejected from the nozzle 2. Then, the Z-axis movement base 40 is raised to adjust the distance between the water jet injection port at the tip of the injection nozzle 2 and the CSP substrate 60 to an appropriate interval (for example, 50 μm).

  Next, the pumping pump 93 is operated to inject the processing water from the injection nozzle 2 at a predetermined pressure, and the water jet that is in the processing water injection state is applied to the CSP substrate 60 to penetrate the slits of the CSP substrate 60 and the holding plate 71. However, by alternately moving the Y-axis movement base 50 and the X-axis movement base 30, the planned division lines 63 extending in the Y direction of the CSP substrate 60 are cut in a zigzag shape. When this cutting is completed, the operation of the water jet is interrupted, the Z-axis moving base 40 is lowered, the injection nozzle 2 is separated from the CSP substrate 60, the CSP substrate 60 is replaced with the X-direction cutting jig 70X, and the X direction The cutting jig 70X is set on the holding table 10.

  Similarly to the above, the Y-axis moving base 50 and the X-axis moving base 30 are appropriately moved, and one end of a zigzag-shaped division planned line 63 that reciprocates in the longitudinal direction of the CSP substrate 60, that is, the X direction, to the water jet target. And the Z-axis moving base 40 is raised to adjust the interval between the water jet injection port of the injection nozzle 2 and the CSP substrate 60 to an appropriate interval.

  By again operating the pressure pump 93 to inject a water jet from the injection nozzle 2 and alternately moving the X-axis movement base 30 and the Y-axis movement base 50, this time, the planned division line extending in the X direction of the CSP substrate 60. 63 is cut into a zigzag shape. When all the planned dividing lines 63 extending in the X direction are cut, the operation of the water jet is stopped, the Z-axis movement base 40 is lowered, the spray nozzle 2 is separated from the CSP substrate 60, and the X-direction cutting jig 70X is moved. Remove from the holding table 10. The CSP substrate 60 is cut for each lead frame and separated into individual CSPs 64, and these CSPs 64 are transferred to the next mounting process or the like in the next process. The operation of the X / Y / Z moving mechanism 3 and the operation of water jet injection from the injection nozzle 2 are appropriately controlled by control means for storing necessary data in advance and performing control based thereon.

[4] Action of Abrasive Grain Supply Capsule When the operation of the water jet is continued in this way, the crushed and refined abrasive grains in the processing water move to the drain tank 81 and are disposed of from the drain pipe 86. As described above, the abrasive mixing ratio of the processing water gradually decreases. Therefore, in order to keep the abrasive mixing ratio of the processing water within an appropriate range, new abrasive grains stored in the abrasive grain supply capsule 100 are supplied to the water storage tank 82.

  For this purpose, for example, an operator holds it with his hand or uses the stand 130 to hold the mixed water discharge portion 113 of the lid 110 facing down immediately above the water storage tank 82, and the water introduction pipe 116. Water is supplied to the water supply plug 114 at a pressure of, for example, 2 to 3 atmospheres. The water is ejected from the nozzle 114a of the water supply plug 114 in the capsule 100 in the direction along the inner wall of the capsule main body 101, thereby generating a tornado-like water flow as shown in FIG. The abrasive grains accommodated in the capsule 100 ride on the tornado-shaped water stream and rise to a tornado-like shape, and the mixed water discharge part 113 which is hollowed at the center and closed with the abrasive grains opens. Although the mixed water discharge part 113 is formed at the center of the lid 110, the mixed water discharge part 113 opens because the formation position is a position corresponding to the center of the tornado-like water flow generated in the capsule 100. The abrasive grains eventually fall away from the tornado-like water flow, are discharged as mixed water with water from the open mixed water discharge portion 113, and are supplied to the water storage tank 82 through the abrasive discharge pipe 115. When all the abrasive grains in the capsule 100 are charged, the first replenishment of the abrasive grains is completed, and thereafter, the replenishment is similarly performed as necessary.

  In this way, the abrasive grains flow in a tornado shape with water in the capsule 100, and are thereby smoothly discharged from the mixed water discharge portion 113 opened. When the tornado-shaped water flow is not generated, the mixed water discharge portion 113 is clogged with abrasive grains, and although there is a slight drop, it is difficult to be smoothly discharged. It is possible to smoothly discharge the abrasive grains by generating them inside. Since the discharged abrasive grains are in a state of being mixed with water, it is possible to suppress the dust particles from being scattered and to prevent environmental degradation.

  In the above embodiment, the abrasive grains are dropped from the capsule 100 into the water storage tank 82, but the abrasive grain introduction pipe that is buried in the water in the water storage tank 82 in the abrasive grain discharge pipe 115 connected to the mixed water discharge section 113. When the abrasive grains are introduced into the water storage tank 82 so as not to touch the outside through the abrasive grain introduction tube, the dust particles of the abrasive grains can be reliably suppressed.

1 is an overall perspective view of a water jet machining apparatus according to an embodiment of the present invention. It is a top view of the CSP board | substrate which is a workpiece. It is a perspective view which shows the jig | tool for a Y direction cutting | disconnection for hold | maintaining a CSP board | substrate to the holding table of a water jet processing apparatus. It is a perspective view which shows the jig | tool for a X direction cutting | disconnection for hold | maintaining a CSP board | substrate to the holding table of a water jet processing apparatus. It is a perspective view which shows the structure of a buffer tank. It is a disassembled perspective view of the capsule for abrasive grain supply. It is a perspective view of the capsule for abrasive grain supply, and the stand for mounting. It is a side view which shows the abrasive grain discharge | emission effect | action of the capsule for abrasive grain supply.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Water jet processing apparatus 2 ... Injection nozzle 10 ... Holding table (holding means)
60 ... CSP substrate (workpiece)
DESCRIPTION OF SYMBOLS 80 ... Buffer tank 100 ... Capsule for abrasive grain supply 101 ... Capsule main body 110 ... Lid body 113 ... Mixed water discharge part 114 ... Water supply stopper (water supply part)

Claims (1)

Holding means for holding a workpiece, processing water jetting means for performing processing by jetting processing water, which is a mixture of abrasive grains and water, to the workpiece held by the holding means from the jet nozzle, and the jet nozzle A capsule for supplying abrasive grains used in a water jet machining apparatus configured at least from a buffer tank that receives processing water penetrating through a workpiece and is disposed immediately below the damping tank,
A cylindrical capsule body having an opening on one end side that is an abrasive grain accommodation port, the other end being closed, a lid that closes the opening, a water supply unit formed on the lid, and A mixed water discharge unit,
The water supply part is formed on the outer peripheral part of the lid body and supplies water along the cylindrical inner wall of the capsule body to generate a tornado state,
The capsule for supplying abrasive grains, wherein the mixed water discharge portion is formed at the center of the lid so as to coincide with the rotation center of the tornado state.

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