JP2010184318A - Water jet processing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a water jet processing device preventing clogging from being generated in a processing water jet nozzle for jetting processing water. <P>SOLUTION: In the water jet processing device, a processing water jet means for jetting the processing water mixed with an abrasive grain to a work retained on a work retaining means is provided with a vessel for storing the processing water mixed with the abrasive grain; a high pressure water feeding means for feeding high pressure water to the vessel; an abrasive grain concentration adjustment means for adjusting an abrasive grain concentration by mixing the processing water mixed with the abrasive grain fed from the vessel with the high pressure water fed from the high pressure water feeding means; and a processing water jet nozzle provided with a jet port for jetting the processing water in which the abrasive grain concentration is adjusted in the abrasive grain concentration adjustment means. The abrasive grain concentration adjustment means is provided with a mixing chamber for mixing the processing water mixed with the abrasive grain fed from the vessel with the high pressure water fed from the high pressure water feeding means, and a mesh filter having a mesh larger than a particle size of the abrasive grain and smaller than an inner diameter of the jet port of the processing water jet nozzle is arranged in the mixing chamber. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a water jet machining apparatus for cutting a workpiece such as a semiconductor wafer by jetting high-pressure machining water.

  In the semiconductor device manufacturing process, circuits such as ICs and LSIs are formed in a large number of regions arranged in a lattice pattern on the surface of a substantially disc-shaped semiconductor wafer, and each region where the circuits are formed is defined on a predetermined street. Each semiconductor chip is manufactured by dicing along a planned cutting line. The semiconductor chip thus divided is packaged and widely used in electric devices such as mobile phones and personal computers.

  Electric devices such as mobile phones and personal computers are required to be lighter and smaller, and a package technology that can reduce the size of a semiconductor chip package called a chip size package (CSP) has been developed. As one of the CSP technologies, a package technology called Quad Flat Non-Lead Package (QFN) has been put into practical use. This packaging technology called QFN is a method in which a plurality of connection terminals corresponding to the connection terminals of the semiconductor chip are formed and a plurality of metal plates such as a copper plate are formed in a grid pattern with division lines divided for each semiconductor chip. Semiconductor chips are arranged in a matrix, and a CSP substrate is formed by integrating a metal plate and a semiconductor chip by a resin portion obtained by molding resin from the back side of the semiconductor chip. The CSP substrate is cut along a division planned line to be divided into individually packaged chip size packages (CSP).

  The CSP substrate is generally cut by a precision cutting device. The cutting apparatus includes a cutting blade having an annular abrasive grain layer, and moves the CSP substrate along the planned division line by rotating the cutting blade along the planned division line of the CSP substrate. Cut and divide into individual chip size packages (CSP). However, when the CSP substrate is cut with a cutting blade, there is a problem that burrs are generated in the connection terminals, and the adjacent connection terminals are short-circuited to deteriorate the quality and reliability of the chip size package (CSP).

In addition, when a workpiece such as a semiconductor wafer is cut by a cutting blade, not only the CSP substrate, there is a problem that fine cutting waste adheres to the surface of the workpiece and is contaminated.
As a cutting technique for solving such problems in cutting with a cutting blade, a processing water jet nozzle that uses high-pressure processing water in which abrasive grains such as diamond, silica, and garnet are mixed into the workpiece held by the workpiece holding means. Water jet cutting has been proposed in which a workpiece is cut by spraying from a water jet. (For example, refer to Patent Document 1.)

JP 2005-231000 A

  In the water jet cutting process, processing water in which abrasive grains having a particle size of about 50 μm are mixed with pure water is ejected from a processing water jet nozzle having a jet port having a diameter of about 200 μm at a pressure of about 80 MPa. Disconnect.

  Thus, if dust is mixed in the processing water or a plurality of abrasive grains mixed in the processing water are combined, the processing water jet nozzle may be clogged and proper processing may not be performed. .

  The present invention has been made in view of the above-mentioned facts, and a main technical problem thereof is to provide a water jet machining apparatus that prevents clogging of a machining water jet nozzle that jets machining water.

In order to solve the above main technical problem, according to the present invention, a workpiece holding means for holding a workpiece, and a processing water in which abrasive grains are mixed in the workpiece held by the workpiece holding means. Processing water jetting means for jetting
The working water jetting means includes a vessel for containing working water mixed with abrasive grains, high pressure water supplying means for supplying high pressure water to the vessel, working water mixed with abrasive grains sent from the vessel, An abrasive concentration adjusting means for adjusting the abrasive concentration by mixing the high-pressure water sent from the high-pressure water supply means, and a spout for ejecting processing water whose abrasive concentration is adjusted by the abrasive concentration adjusting means. In the water jet processing apparatus comprising the processing water injection nozzle provided,
The abrasive concentration adjusting means includes a mixing chamber for mixing the processing water mixed with the abrasive particles sent from the vessel and the high-pressure water sent from the high-pressure water supply means, and the mixing chamber has abrasive grains. A mesh filter having a mesh larger than the particle diameter of the processed water spray nozzle and smaller than the inner diameter of the nozzle is disposed.
A water jet machining apparatus characterized by that.

  The abrasive concentration adjusting means includes a processing water inflow passage for flowing processing water sent from the vessel into the mixing chamber, a high pressure water inflow passage for feeding high pressure water sent from the high pressure water supply means into the mixing chamber, A machining water outflow passage for flowing out the processing water whose abrasive concentration is adjusted in the chamber, and the mesh filter is formed in a cylindrical shape and has an inlet at one end thereof. An opening is provided in the passage.

  The water jet processing apparatus according to the present invention is configured as described above, and the mixing chamber of the abrasive concentration adjusting means for adjusting the concentration of the abrasive by mixing the processing water mixed with the abrasive and the high-pressure water includes Since a mesh filter having a mesh smaller than the inner diameter of the nozzle of the machining water injection nozzle for injecting machining water having a grain size adjusted to be larger than the particle size is disposed, dust is mixed into the machining water or abrasive When the grains are bonded, they are captured by the mesh filter, so that the clogging of the processed water injection nozzle does not occur.

1 is a perspective view of a water jet machining apparatus configured according to the present invention. The block diagram of a structure of the process water injection means which comprises the water jet processing apparatus shown in FIG. The longitudinal cross-sectional view of the abrasive-grain density adjustment means which comprises the process water injection means shown in FIG. FIG. 4 is a cross-sectional view of the abrasive concentration adjusting means shown in FIG. 3. The perspective view of the mesh filter which comprises the abrasive grain density | concentration adjustment means shown in FIG. The perspective view of the CSP board | substrate as a to-be-processed object. Sectional drawing of the CSP board | substrate shown in FIG. The perspective view of the 1st workpiece holding jig | tool for hold | maintaining the CSP board | substrate as a workpiece and mounting on the workpiece holding table of a water jet processing apparatus. The perspective view of the 2nd workpiece holding jig for hold | maintaining the CSP board | substrate as a workpiece and mounting on the workpiece holding table of a water jet processing apparatus.

  Hereinafter, preferred embodiments of a water jet machining apparatus according to the present invention will be described in more detail with reference to the accompanying drawings.

  FIG. 1 is a perspective view of a main part of a water jet machining apparatus configured according to the present invention. The water jet machining apparatus shown in FIG. 1 includes a stationary base 2, a first movable base 3, a second movable base 4, and a third movable base 5. A pair of guide rails 21, 21 extending in parallel along the direction indicated by the arrow X is provided on the side surface on the near side of the stationary base 2.

  A first movable base 3 is slidably mounted on the stationary base 2 along the pair of guide rails 21 and 21. That is, as shown in FIG. 1, one surface of the first movable base 3 facing the first movable base 3 is fitted to a pair of guide rails 21, 21 provided on the stationary base 2. A pair of guided grooves 31, 31 are provided, and the first movable base 3 is a stationary base by fitting the pair of guided grooves 31, 31 to the pair of guide rails 21, 21. 2 is slidably mounted in a direction indicated by an arrow X along a pair of guide rails 21 and 21. A pair of guide rails 32, 32 extending in parallel with the direction indicated by the arrow Z are provided on the other surface of the first movable base 3.

  The water jet machining apparatus in the illustrated embodiment is a first for moving the first movable base 3 in the direction indicated by the arrow X along the pair of guide rails 21, 21 provided on the stationary base 2. The moving means 30 is provided. The first moving means 30 includes a male screw rod 301 disposed between the pair of guide rails 21 and 21 in parallel with the guide rail, and a pulse motor 302 for driving the male screw rod 301 to rotate. It is out. The male screw rod 301 is screwed into the female screw 33 provided on the first movable base 3, and one end of the male screw rod 301 is rotatably supported by a bearing member 303 provided on the stationary base 2. The drive shaft of the pulse motor 302 is connected to the other end of the male screw rod 301. Therefore, the first movable base 3 is moved to the pair of guide rails 21, 21 provided on the stationary base 2 by driving the pulse motor 302 forward or backward and driving the male screw rod 301 forward or backward. Along the direction indicated by the arrow X.

  A second movable base 4 is slidably mounted on the first movable base 3 along the pair of guide rails 32 and 32. That is, one side surface of the second movable base 4 facing the first movable base 3 is slidably fitted to a pair of guide rails 32, 32 provided on the first movable base 3. A pair of guided grooves 41, 41 is provided. By fitting the pair of guided grooves 41, 41 to the pair of guide rails 32, 32, the second movable base 4 is the first A pair of guide rails 32, 32 provided on the movable base 3 is slidably mounted in the direction indicated by the arrow Z. The second movable base 4 includes a pair of guide rails 42 and 42 provided on a side surface perpendicular to the one side surface and extending parallel to the direction indicated by the arrow Y.

  The water jet machining apparatus in the illustrated embodiment moves the second movable base 4 along the pair of guide rails 32, 32 provided on the first movable base 3 in the direction indicated by the arrow Z. The second moving means 40 is provided. The second moving means 40 includes a male screw rod 401 disposed between the pair of guide rails 32 and 32 in parallel with the guide rail, and a pulse motor 402 for driving the male screw rod 401 to rotate. It is out. The male screw rod 401 is screwed into the female screw 43 provided on the second movable base 4, and one end of the male screw rod 401 is rotatably supported by a bearing member 403 provided on the first movable base 3. Yes. The drive shaft of the pulse motor 402 is connected to the other end of the male screw rod 401. Therefore, by driving the pulse motor 402 forward or backward and driving the male screw rod 401 forward or backward, the second movable base 4 is provided with a pair of guide rails 32 provided on the first movable base 3. , 32 in the direction indicated by the arrow Z.

  A third movable base 5 is slidably mounted on the second movable base 4 along the pair of guide rails 42 and 42. In other words, one side surface of the third movable base 5 facing the second movable base 4 is slidably fitted to a pair of guide rails 42 and 42 provided on the second movable base 4. A pair of guided grooves 51, 51 (only one of the upper side is shown in FIG. 1) is provided, and the pair of guided grooves 51, 51 are formed on the pair of guide rails 42, 42. By fitting, the third movable base 5 is slidably mounted on the second movable base 4 along the pair of guide rails 42 and 42 in the direction indicated by the arrow Y.

  In the illustrated embodiment, the water jet machining apparatus moves the third movable base 5 in the direction indicated by the arrow Y along the pair of guide rails 42 and 42 provided on the second movable base 4. The third moving means 50 is provided. The third moving means 50 includes a male screw rod 501 disposed between the pair of guide rails 42 and 42 in parallel with the guide rail, and a pulse motor 502 for driving the male screw rod 501 to rotate. It is out. The male screw rod 501 is screwed into a female screw (not shown) provided on the third movable base 5, and one end of the male screw rod 501 is rotatable to a bearing member 503 provided on the second movable base 4. It is supported by. The drive shaft of the pulse motor 502 is connected to the other end of the male screw rod 501. Therefore, by driving the pulse motor 502 forward or backward and driving the male screw rod 501 forward or backward, the third movable base 5 is connected to the pair of guide rails 42 provided on the third movable base 4. , 42 along the direction indicated by the arrow Y.

  On the other surface of the third movable base 5 is mounted a workpiece holding table 6 as a workpiece holding means extending in the direction indicated by the arrow X. The workpiece holding table 6 is formed with a rectangular opening 61, and four positioning pins 62 project from the upper surface around the opening 61. The water jet machining apparatus in the illustrated embodiment includes a catch tank 60 that is disposed below the workpiece holding table 6 and contains water for buffering used machining water, which will be described later.

  The water jet machining apparatus in the illustrated embodiment includes a machining water jetting unit 7 that jets machining water in which abrasive grains are mixed into the workpiece held on the workpiece holding table 6 as the workpiece holding unit described above. It has. The processed water injection means 7 will be described with reference to FIG. 2 includes a vessel 71 for storing machining water mixed with abrasive grains, a high-pressure water supply means 72 for supplying high-pressure water to the vessel 71, and abrasive grains sent from the vessel 71. The abrasive concentration adjusting means 73 for adjusting the abrasive concentration by mixing the mixed processing water and the high-pressure water sent from the high-pressure water supply means 72, and the abrasive concentration is adjusted in the abrasive concentration adjusting means 73. A machining water jet nozzle 74 for ejecting machining water is provided.

  The vessel 71 is provided with a high-pressure water introduction pipe 711 and a processing water discharge pipe 712. The vessel 71 thus configured contains processing water 700 mixed with abrasive grains such as diamond, silica, garnet and the like. Note that the particle size of the abrasive grains mixed in the processing water 700 is set to 50 μm or less in the illustrated embodiment.

  The high-pressure water introduction pipe 711 disposed in the vessel 71 is connected to the high-pressure water supply means 72 via the first high-pressure water supply pipe 75. The high pressure water supply means 72 is connected to an abrasive concentration adjusting means 73 described later via a second high pressure water supply pipe 76. A first processed water on-off valve 77 and a second processed water on-off valve 78 are disposed on the first high-pressure water supply pipe 75 and the second high-pressure water supply pipe 76, respectively. The first machining water on-off valve 77 and the second machining water on-off valve 78 are closed when they are de-energized (OFF), and are opened when energized (ON). ing.

  An abrasive concentration adjusting means 73 that adjusts the abrasive concentration by mixing the processing water mixed with the abrasive particles sent from the vessel 71 and the high-pressure water sent from the high-pressure water supply means 72 is shown in FIGS. Will be described with reference to FIG. The abrasive concentration adjusting means 73 in the illustrated embodiment includes a housing 730 formed in a rectangular parallelepiped shape from a metal material such as stainless steel. The housing 730 is formed with a processing water inflow passage 731, a high pressure water inflow passage 732, a processing water outflow passage 733, and a mixing chamber 734. The high-pressure water inflow passage 732 and the processing water outflow passage 733 are formed in a straight line and communicate with the mixing chamber 734. Further, the processing water inflow passage 731 is formed perpendicular to the high pressure water inflow passage 732 and the processing water outflow passage 733 and communicates with the mixing chamber 734. The abrasive concentration adjusting means 73 configured in this way has the machining water inflow passage 731 connected to the machining water discharge pipe 712 and the high pressure water inflow passage 732 via the second high pressure water supply pipe 76. The processing water outflow passage 733 is connected to the processing water injection nozzle 74 via the processing water delivery pipe 79. The housing 730 is provided with a female screw hole 735 communicating with the mixing chamber 734 at an upper portion facing the processing water inflow passage 731.

  The abrasive concentration adjusting unit 73 in the illustrated embodiment includes a mesh filter 736 disposed in the mixing chamber 734. As shown in FIG. 5, the mesh filter 736 includes a filter 736a formed in a cylindrical shape, a closing plate 736b for closing the upper end of the filter 736a, and an annular member 736c attached to the lower end of the filter 736a. Yes. The filter 736a is configured with a mesh (100 μm in the illustrated embodiment) that is larger than the particle size of the abrasive grains mixed in the processing water and smaller than the inner diameter of the nozzle 74 outlet. The closing plate 736b and the annular member 736c are formed of a metal material such as stainless steel, and are attached to the upper end and the lower end of the filter 736a by welding, respectively. An opening 736d of the annular member 736c attached to the lower end of the filter 736a functions as an inlet of the mesh filter 736. The cylindrical mesh filter 736 thus configured has an opening 736d of an annular member 736c that functions as an inflow port in the mixing chamber 734 formed in the housing 730 as shown in FIG. Arranged. Then, a fixing bolt 737 is screwed into a female screw hole 735 provided in the upper portion of the housing 730, and a tip of the fixing bolt 737 is brought into contact with the closing plate 736 b of the mesh filter 736 to fix the mesh filter 736.

  Returning to FIG. 2 and continuing the description, the processing water injection nozzle 74 connected to the processing water outflow passage 733 of the abrasive concentration adjusting means 73 via the processing water delivery pipe 79 is ground by the abrasive concentration adjusting means 73. A jet outlet 741 for jetting the processed water whose grain concentration is adjusted is provided. The inner diameter of the jet port 741 is set to 120 to 150 μm in the illustrated embodiment. The machining water injection nozzle 74 configured in this way is mounted on a nozzle support member 70 fixed to the stationary base 2 as shown in FIG.

The machining water injection means 7 in the illustrated embodiment is configured as described above, and the operation thereof will be described below mainly with reference to FIG.
In order to operate the processing water injection means 7, the high-pressure water supply means 72 is operated, and the first water on-off valve 77 and the second water on-off valve 78 are energized (ON) to open the circuit. When the first water on-off valve 77 is opened, high pressure water is supplied from the high pressure water supply means 72 to the vessel 71 through the first high pressure water supply pipe 75 and the high pressure water introduction pipe 711 provided in the vessel 71. When high pressure water is supplied to the vessel 71, the inside of the vessel 71 becomes high pressure (for example, 80 Mpa), and the processing water 700 stored in the vessel 71 and having a high abrasive concentration mixed with abrasive grains is pushed out through the processing water discharge pipe 712. . On the other hand, when the second water on-off valve 78 is opened, high-pressure water flows from the high-pressure water supply means 72 through the second high-pressure water supply pipe 76 into the high-pressure water inflow passage 732 of the abrasive grain concentration adjusting means 73. Flows into the mixing chamber 734. As a result, the processing water having a high abrasive concentration flowing into the mixing chamber 734 from the processing water discharge pipe 712 through the processing water inflow passage 731 passes through the opening 736d (inlet) of the annular member 736c constituting the mesh filter 736. 736, mixed with high-pressure water to obtain an appropriate abrasive concentration, filtered by a filter 736a, outflowed into the processing water outflow passage 733, and injected from the processing water injection nozzle 74 through the processing water delivery pipe 79. . In this way, the processing water having an appropriate abrasive grain concentration is filtered by the filter 736a of the mesh filter 736. Therefore, when dust is mixed in the processing water or the abrasive grains are combined, they are captured by the filter 736a. Therefore, the processing water jet nozzle 74 is not clogged. Further, since the filter 736a is formed in a cylindrical shape, the abrasive grains are agitated in the filter 736a, and the filter 736a itself is not easily clogged, and the dust that does not pass through the filter 736a and the combined abrasive grains are processed water inflow passages. 731 and the processed water discharge pipe 712 are returned to the vessel 71.

Next, the water jet processing which cut | disconnects the CSP board | substrate as a to-be-processed object with the water jet processing apparatus mentioned above is demonstrated.
First, a CSP substrate as a workpiece will be described with reference to FIGS.
In the CSP substrate 10 shown in FIGS. 6 and 7, three blocks 10a, 10b, and 10c are continuously formed on a metal plate 100. On the surface 100a of the three blocks 10a, 10b, and 10c constituting the CSP substrate 10, a plurality of first division planned lines 101 extending in a predetermined direction, respectively, and a direction orthogonal to the first division planned lines 101 Are formed in a lattice shape. A chip size package (CSP) 103 is arranged in each of a plurality of regions partitioned by the first planned division line 101 and the second planned division line 102, and this chip size package (CSP) 103 is divided into each block 10a, 10b and 10c are molded by synthetic resin portions 110a, 110b and 110c from the back side of the metal plate 100. The outer peripheral portion of the metal plate 100 constituting the CSP substrate 10 is formed to protrude outward from the three blocks 10a, 10b, and 10c, and a plurality of positioning holes 104 are formed in the protruding portions on both sides in the longitudinal direction. Is provided. The CSP substrate 10 formed in this way is divided into chip size packages (CSPs) 103 cut along the first planned division line 101 and the second planned division line 102 and individually packaged.

  The CSP substrate 10 described above is held by the first workpiece holding jig 12a shown in FIG. 8 and the second workpiece holding jig 12b shown in FIG. 9, and the workpiece holding of the water jet machining apparatus is performed. It is held on the table 6. The first workpiece holding jig 12a shown in FIG. 8 and the second workpiece holding jig 12b shown in FIG. 9 are the same except for a first through groove and a second through groove which will be described later. Since it is a structure, the same code | symbol is attached | subjected and demonstrated to the same member. The first workpiece holding jig 12a shown in FIG. 8 and the second workpiece holding jig 12b shown in FIG. 9 are each composed of a lower clamping plate 13 and an upper clamping plate 14, and one side is on one side. The two hinges 15 and 15 are hinged to each other.

  The lower clamping plate 13 constituting the first workpiece holding jig 12a and the second workpiece holding jig 12b is made of a plate material formed in a rectangular shape by metal or synthetic resin, Is formed with a rectangular recess 130 into which the CSP board 10 is fitted. A plurality of positioning pins 131 into which a plurality of positioning holes 104 formed in the electrode plate 100 of the CSP substrate 10 are fitted are disposed on both sides in the longitudinal direction of the rectangular recess 130. Further, at the four corners of the lower clamping plate 13, for positioning that is fitted with four positioning pins 62 arranged on the first workpiece holding table 6a and the second workpiece holding table 6b. The four holes 132 are provided. And in the rectangular recessed part 130 of the lower clamping board 13 which comprises the 1st workpiece holding jig 12a shown in FIG. 8, the 1st division line corresponding to the 1st division | segmentation line 101 of the said CSP board | substrate 10 is carried out. A through-groove 133a and a second through-groove 134a that alternately communicates with the adjacent first through-groove 133a at one end and the other end of the first through-groove 133a are formed. Further, in the rectangular recess 130 of the lower holding plate 13 constituting the second workpiece holding jig 12b shown in FIG. 9, a first division line 102 corresponding to the second scheduled division line 102 of the CSP substrate 10 is provided. A through-groove 133b and a second through-groove 134b that alternately communicates with the adjacent first through-groove 133b at one end and the other end of the first through-groove 133b are formed.

  An opening 141 is provided in each of the upper holding plates 14 constituting the first workpiece holding jig 12a and the second workpiece holding jig 12b. The opening 141 is similar in shape to the CSP substrate 10 and is formed to have a slightly smaller size than the CSP substrate 10.

  In order to cut the CSP substrate 10 along the first scheduled dividing line 101 and the second scheduled divided line 102, first, the CSP substrate 10 is mounted on the lower clamping plate 13 of the first workpiece holding jig 12a. Put. At this time, the CSP substrate 10 is fitted into the rectangular recess 130 and the plurality of positioning holes 104 formed in the electrode plate 100 are fitted into the plurality of positioning pins 131 provided in the lower holding plate 13. . Then, the upper clamping plate 14 is overlapped to engage the engagement piece 16 with the engagement recess 133. When the CSP substrate 10 is set on the first workpiece holding jig 12a in this way, the first workpiece holding jig 12a on which the CSP substrate 10 is set is placed on the workpiece holding table 6. Place. At this time, the four pin holes 132 provided in the lower holding plate 13 of the first workpiece holding jig 12 a are fitted with the four positioning pins 62 provided in the workpiece holding table 6. Thus, the first workpiece holding jig 12a on which the CSP substrate 10 is set is held at a predetermined position of the workpiece holding table 6.

  If the first workpiece holding jig 12a on which the CSP substrate 10 is set is held at a predetermined position of the workpiece holding table 6 in the water jet machining apparatus, the control means 9 includes the first moving means 30 and The CSP substrate held on the workpiece holding table 6 by operating the third moving means 50 and moving the first movable base 3 and the third movable base 5 in the directions indicated by the arrows X and Y. 10 is moved to a machining area below the machining water injection nozzle 74, and a predetermined machining start position is positioned immediately below the machining water injection nozzle 74. Then, the control means 9 operates the second moving means 40 to move the second movable base 4 in the direction indicated by the arrow Z, and moves the machining water spray nozzle 74 upward from the surface of the CSP substrate 10 at a predetermined interval ( For example, it is positioned at a predetermined position where 50 μm) is placed.

  Next, the high-pressure water supply means 72 of the processed water injection means 7 is operated, and the first water on-off valve 77 and the second water on-off valve 78 are energized (ON) to open the circuit, as described above. The processing water whose abrasive grain concentration is appropriately adjusted is sprayed from the spray nozzle 74 and the third moving means 50 and the first moving means 30 are operated to operate the third movable base 5 and the first movable base. By sequentially moving the table 3 in the directions indicated by the arrows Y and X, the workpiece holding table 6, that is, the CSP substrate 10, is clamped below the first workpiece holding jig 12 a with respect to the machining water jet nozzle 74. The first through groove 133a and the second through groove 134a formed in the plate 13 are moved. As a result, the CSP substrate 10 is formed on the lower clamping plate 13 of the first workpiece holding jig 12a along all of the first scheduled dividing line 101 and a part of the second scheduled dividing line 102 (see FIG. The first through groove 133a and the second through groove 134a) are cut (first cutting step).

  In this first cutting step, the processing water whose abrasive grain concentration is properly adjusted from the processing water injection nozzle 74 is a mesh filter disposed in the mixing chamber 734 of the abrasive concentration adjusting means 73 as described above. 736a is filtered by the filter 736a, so that when the dust is mixed in the processing water or the abrasive grains are combined, it is captured by the filter 736a, so that the processing water injection nozzle 74 is clogged. Absent. Accordingly, the CSP substrate 70 can be accurately cut along all of the first planned division line 101 and a part of the second planned division line 102. At the time of cutting, the high-pressure processing water penetrates the CSP substrate 10, but the high-pressure processing water after cutting passes through the first through-groove 133 a and the second through-groove 134 a formed in the lower holding plate 13. As a result, it flows into the catch tank 60 through the opening 61 of the workpiece holding table 6, and its momentum is relieved by the buffering water accommodated in the catch tank 60.

  If the 1st cutting process mentioned above was implemented, the 1st workpiece holding jig 12a which clamps the CSP board | substrate 10 in which the 1st cutting process was implemented will be removed from the workpiece holding table 6. FIG. Then, the CSP substrate 10 sandwiched by the first workpiece holding jig 12a is set on the second workpiece holding jig 12b. The CSP substrate 10 is set in the same manner as the setting to the first workpiece holding jig 12a.

  If the CSP substrate 10 is set on the second workpiece holding jig 12b, the second workpiece holding jig 12b on which the CSP substrate 10 is set is placed on the workpiece holding table 6. Similar to the first workpiece holding jig 12a, the workpiece holding table 6 is held at a predetermined position. Next, the first moving means 30 and the third moving means 50 are operated to move the first movable base 3 and the third movable base 5 in the directions indicated by arrows X and Y, and The CSP substrate 10 held on the workpiece holding table 6 is moved to a machining area below the machining water jet nozzle 74, and a predetermined machining start position is positioned immediately below the machining water jet nozzle 74, for example. Then, the second moving means 40 is operated to move the second movable base 4 in the direction indicated by the arrow Z, and the machining water spray nozzle 74 is moved upward from the surface of the CSP substrate 10 at a predetermined interval (for example, 50 μm). Position it at the specified position.

  Next, the high-pressure water supply means 72 of the processed water injection means 7 is operated, and the first water on-off valve 77 and the second water on-off valve 78 are energized (ON) to open the circuit, as described above. The processing water whose abrasive grain concentration is appropriately adjusted is sprayed from the spray nozzle 74 and the third moving means 50 and the first moving means 30 are operated to operate the third movable base 5 and the first movable base. By sequentially moving the table 3 in the directions indicated by the arrows Y and X, the workpiece holding table 6, that is, the CSP substrate 10 is held under the second workpiece holding jig 12 b against the machining water jet nozzle 74. The first through groove 133b and the second through groove 134b formed in the plate 13 are moved. As a result, the CSP substrate 10 is formed on the lower clamping plate 13 of the second workpiece holding jig 12b along all of the second scheduled dividing line 102 and a part of the first scheduled dividing line 101 (see FIG. The first through groove 133b and the second through groove 134b) are cut (second cutting step).

  In this second cutting step, the processing water in which the abrasive concentration injected from the processing water injection nozzle 74 is appropriately adjusted is the mesh disposed in the mixing chamber 734 of the abrasive concentration adjusting means 73 as described above. Since it is filtered by the filter 736a of the filter 736, when the dust is mixed in the processing water or the abrasive grains are combined, it is captured by the filter 736a, and the processing water injection nozzle 74 is clogged. There is no. Therefore, the CSP substrate 70 can be accurately cut along all of the second scheduled division line 102 and a part of the first scheduled division line 101. At the time of cutting, the high-pressure processing water penetrates the CSP substrate 10, but the high-pressure processing water after cutting passes through the first through-groove 133 b and the second through-groove 134 b formed in the lower clamping plate 13. As a result, it flows into the catch tank 60 through the opening 61 of the workpiece holding table 6, and its momentum is relieved by the buffering water accommodated in the catch tank 60.

  If the 2nd cutting process mentioned above was implemented, the 2nd workpiece holding jig | tool 12b which clamps the CSP board | substrate 10 in which the 2nd cutting process was implemented will be removed from the workpiece holding table 6. FIG. By performing the first cutting step and the second cutting step as described above, the CSP substrate 10 is cut along the first division planned line 101 and the second division planned line 102, and the individual Divided into chip size packages (CSP).

2: stationary base 3: first movable base 30: first moving means 4: second possible base 40: second moving means 5: third movable base 50: third moving means 6: Workpiece holding table 60: Catch tank 7: Processing water injection means 71: Vessel 72: High pressure water supply means 73: Abrasive grain concentration adjusting means 730: Housing 731: Work water inflow passage 732: High pressure water inflow passage 733: Process water outflow passage 734: Mixing chamber 736: Mesh filter 74: Process water injection nozzle 10: CSP substrate (workpiece)
12a: first workpiece holding jig 12b: second workpiece holding jig

Claims (2)

A workpiece holding means for holding the workpiece, and a processing water injection means for injecting processing water in which abrasive grains are mixed into the workpiece held by the workpiece holding means;
The working water jetting means includes a vessel for containing working water mixed with abrasive grains, high pressure water supplying means for supplying high pressure water to the vessel, working water mixed with abrasive grains sent from the vessel, An abrasive concentration adjusting means for adjusting the abrasive concentration by mixing the high-pressure water sent from the high-pressure water supply means, and a spout for ejecting processing water whose abrasive concentration is adjusted by the abrasive concentration adjusting means. In the water jet processing apparatus comprising the processing water injection nozzle provided,
The abrasive concentration adjusting means includes a mixing chamber for mixing the processing water mixed with the abrasive particles sent from the vessel and the high-pressure water sent from the high-pressure water supply means, and the mixing chamber has abrasive grains. A mesh filter having a mesh larger than the particle diameter of the processed water spray nozzle and smaller than the inner diameter of the nozzle is disposed.
A water jet machining apparatus characterized by that. The abrasive concentration adjusting means includes a processing water inflow passage through which the processing water sent from the vessel flows into the mixing chamber, and a high-pressure water inflow through which high-pressure water sent from the high-pressure water supply means flows into the mixing chamber. A passage and a processing water outflow passage for flowing out the processing water whose abrasive concentration is adjusted in the mixing chamber;
The water jet machining apparatus according to claim 1, wherein the mesh filter is formed in a cylindrical shape and includes an inflow port at one end, and the inflow port is opened to the processing water inflow passage.

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